EP20K100TC144-3 - APEX 20K 100K Gates FPGA 144TQFP | Intel
MPN: EP20K100TC144-3 ⚠ Waktu Beli TerakhirEP20K100TC144-3 Ringkasan
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the digital logic hierarchy, an FPGA sits above fixed-function ASICs in flexibility and below microprocessors in software programmability. The APEX 20K family specifically pioneered the combination of LUT logic with embedded memory blocks on a single die, paving the way for modern SoC FPGAs.
Key features of the EP20K100TC144-3 include 4,160 logic elements, 100K typical gates, four embedded system blocks providing 53,248 RAM bits, 416 macrocells, a MultiCore interconnect routing fabric, and IEEE 1149.1 JTAG boundary-scan support. The device is in-system programmable via the IEEE 1532 / 1149.1 interface, allowing rapid prototyping and field upgrades. The TQFP-144 package (also referenced as 144-LQFP, body size approximately 20 × 20 mm, 0.5 mm pitch) provides 101 usable I/O lines with multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
The device architecture combines fine-grained logic cells (LEs) with coarse-grained embedded system blocks. Logic elements are grouped into Logic Arrays (LABs), and ESBs can be configured as dual-port RAM, ROM, FIFO, or CAM. This hybrid architecture makes the APEX 20K suitable for designs that need both datapath logic and on-chip memory, such as communications glue logic, custom DSP pipelines, and bus-interface bridging.
Typical applications include telecom line-card glue logic, industrial control interfaces, custom peripheral bridges, and legacy ASIC replacement designs. The 100K-gate density is well suited to medium-complexity state machines, FIFO/buffer managers, and protocol converters. Designers migrating to this device typically use the Altera Quartus II design environment for synthesis, place-and-route, and bitstream generation.
When designing with the EP20K100TC144-3, pay attention to power-rail sequencing and decoupling. The 2.5 V core and 3.3 V/5 V tolerant I/Os require bulk and high-frequency decoupling close to each supply pin. Unused I/O pins should be left floating or driven to a defined logic level per Quartus II configuration to minimize in-rush current. Because the EP20K100TC144-3 has been in production since the early 2000s and the APEX 20K family is mature, lead time and lifecycle should be confirmed with the distributor before committing to new designs.
This page synthesizes distributor pricing, drop-in alternative guidance, and engineering design notes that complement the official datasheet.
Alternatif penggantian untuk EP20K100TC144-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP20K100TC144-3 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Family, Operating Temperature, Speed Grade, Core Voltage.
EP20K100TC144-1
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP20K100TC144-2
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP20K200TC144-3
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP20K100EFC144-3
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP20K100CT144C7
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100FC144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100TC144-3 Rating Maksimal & Karakteristik Listrik
| Series | APEX 20K |
| Family | APEX 20K (APEX 20KE-compatible die) |
| Logic Elements / Cells | 4,160 |
| Macrocells | 416 |
| Typical Gates | 100,000 |
| Number of I/O | 101 |
| Number of Logic Blocks/Elements | 4,160 |
| Total RAM Bits | 53,248 |
| Voltage - Supply | 2.5 V core |
| Suhu Kerja | 0 °C to 85 °C (Commercial) |
| Tipe Mounting | Surface Mount |
| Paket | 144-LQFP / TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Propagation Delay | 1.6 ns |
| Maximum Internal Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -3 |
| In-System Programmability | IEEE 1149.1 / 1532 JTAG |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Konfigurasi Pin EP20K100TC144-3
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | I/O — User I/O pin (bank 1) |
| Pin produk 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | GND — Ground |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | I/O — User I/O pin (bank 1) |
| Pin produk 12 | I/O — User I/O pin (bank 1) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | TDI — JTAG test data input |
| Pin produk 15 | TMS — JTAG test mode select |
| Pin produk 16 | TCK — JTAG test clock |
| Pin produk 17 | I/O — User I/O pin (bank 1) |
| Pin produk 18 | I/O — User I/O pin (bank 1) |
| Pin produk 19 | I/O — User I/O pin (bank 1) |
| Pin produk 20 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 21 | GND — Ground |
| Pin produk 22 | I/O — User I/O pin (bank 2) |
| Pin produk 23 | I/O — User I/O pin (bank 2) |
| Pin produk 24 | I/O — User I/O pin (bank 2) |
| Pin produk 25 | I/O — User I/O pin (bank 2) |
| Pin produk 26 | I/O — User I/O pin (bank 2) |
| Pin produk 27 | I/O — User I/O pin (bank 2) |
| Pin produk 28 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 29 | I/O — User I/O pin (bank 2) |
| Pin produk 30 | GND — Ground |
| Pin produk 31 | I/O — User I/O pin (bank 2) |
| Pin produk 32 | I/O — User I/O pin (bank 2) |
| Pin produk 33 | I/O — User I/O pin (bank 2) |
| Pin produk 34 | I/O — User I/O pin (bank 2) |
| Pin produk 35 | I/O — User I/O pin (bank 2) |
| Pin produk 36 | I/O — User I/O pin (bank 2) |
| Pin produk 37 | I/O — User I/O pin (bank 2) |
| Pin produk 38 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 39 | GND — Ground |
| Pin produk 40 | I/O — User I/O pin (bank 3) |
| Pin produk 41 | I/O — User I/O pin (bank 3) |
| Pin produk 42 | I/O — User I/O pin (bank 3) |
| Pin produk 43 | I/O — User I/O pin (bank 3) |
| Pin produk 44 | I/O — User I/O pin (bank 3) |
| Pin produk 45 | I/O — User I/O pin (bank 3) |
| Pin produk 46 | I/O — User I/O pin (bank 3) |
| Pin produk 47 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 48 | I/O — User I/O pin (bank 3) |
| Pin produk 49 | GND — Ground |
| Pin produk 50 | I/O — User I/O pin (bank 3) |
| Pin produk 51 | I/O — User I/O pin (bank 3) |
| Pin produk 52 | I/O — User I/O pin (bank 3) |
| Pin produk 53 | I/O — User I/O pin (bank 3) |
| Pin produk 54 | I/O — User I/O pin (bank 3) |
| Pin produk 55 | I/O — User I/O pin (bank 3) |
| Pin produk 56 | I/O — User I/O pin (bank 3) |
| Pin produk 57 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 58 | GND — Ground |
| Pin produk 59 | I/O — User I/O pin (bank 4) |
| Pin produk 60 | I/O — User I/O pin (bank 4) |
| Pin produk 61 | I/O — User I/O pin (bank 4) |
| Pin produk 62 | I/O — User I/O pin (bank 4) |
| Pin produk 63 | I/O — User I/O pin (bank 4) |
| Pin produk 64 | I/O — User I/O pin (bank 4) |
| Pin produk 65 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 66 | I/O — User I/O pin (bank 4) |
| Pin produk 67 | GND — Ground |
| Pin produk 68 | I/O — User I/O pin (bank 4) |
| Pin produk 69 | I/O — User I/O pin (bank 4) |
| Pin produk 70 | I/O — User I/O pin (bank 4) |
| Pin produk 71 | I/O — User I/O pin (bank 4) |
| Pin produk 72 | I/O — User I/O pin (bank 4) |
| Pin produk 73 | I/O — User I/O pin (bank 4) |
| Pin produk 74 | TDO — JTAG test data output |
| Pin produk 75 | I/O — User I/O pin (bank 4) |
| Pin produk 76 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 77 | GND — Ground |
| Pin produk 78 | I/O — User I/O pin (bank 5) |
| Pin produk 79 | I/O — User I/O pin (bank 5) |
| Pin produk 80 | I/O — User I/O pin (bank 5) |
| Pin produk 81 | I/O — User I/O pin (bank 5) |
| Pin produk 82 | I/O — User I/O pin (bank 5) |
| Pin produk 83 | I/O — User I/O pin (bank 5) |
| Pin produk 84 | I/O — User I/O pin (bank 5) |
| Pin produk 85 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk 86 | I/O — User I/O pin (bank 5) |
| Pin produk 87 | GND — Ground |
| Pin produk 88 | I/O — User I/O pin (bank 5) |
| Pin produk 89 | I/O — User I/O pin (bank 5) |
| Pin produk 90 | I/O — User I/O pin (bank 5) |
| Pin produk 91 | I/O — User I/O pin (bank 5) |
| Pin produk 92 | I/O — User I/O pin (bank 5) |
| Pin produk 93 | I/O — User I/O pin (bank 5) |
| Pin produk 94 | nCONFIG — Configuration control (active low) |
| Pin produk 95 | nSTATUS — Configuration status (active low) |
| Pin produk 96 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 97 | GND — Ground |
| Pin produk 98 | I/O — User I/O pin (bank 6) |
| Pin produk 99 | I/O — User I/O pin (bank 6) |
| Pin produk 100 | I/O — User I/O pin (bank 6) |
| Pin produk 101 | I/O — User I/O pin (bank 6) |
| Pin produk 102 | I/O — User I/O pin (bank 6) |
| Pin produk 103 | I/O — User I/O pin (bank 6) |
| Pin produk 104 | I/O — User I/O pin (bank 6) |
| Pin produk 105 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk 106 | I/O — User I/O pin (bank 6) |
| Pin produk 107 | GND — Ground |
| Pin produk 108 | I/O — User I/O pin (bank 6) |
| Pin produk 109 | I/O — User I/O pin (bank 6) |
| Pin produk 110 | I/O — User I/O pin (bank 6) |
| Pin produk 111 | I/O — User I/O pin (bank 6) |
| Pin produk 112 | I/O — User I/O pin (bank 6) |
| Pin produk 113 | I/O — User I/O pin (bank 6) |
| Pin produk 114 | CONF_DONE — Configuration done indicator |
| Pin produk 115 | DCLK — Configuration clock |
| Pin produk 116 | DATA0 — Configuration data input |
| Pin produk 117 | I/O — User I/O pin (bank 7) |
| Pin produk 118 | I/O — User I/O pin (bank 7) |
| Pin produk 119 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 120 | GND — Ground |
| Pin produk 121 | I/O — User I/O pin (bank 7) |
| Pin produk 122 | I/O — User I/O pin (bank 7) |
| Pin produk 123 | I/O — User I/O pin (bank 7) |
| Pin produk 124 | I/O — User I/O pin (bank 7) |
| Pin produk 125 | I/O — User I/O pin (bank 7) |
| Pin produk 126 | I/O — User I/O pin (bank 7) |
| Pin produk 127 | I/O — User I/O pin (bank 7) |
| Pin produk 128 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk 129 | I/O — User I/O pin (bank 7) |
| Pin produk 130 | GND — Ground |
| Pin produk 131 | I/O — User I/O pin (bank 7) |
| Pin produk 132 | I/O — User I/O pin (bank 7) |
| Pin produk 133 | I/O — User I/O pin (bank 7) |
| Pin produk 134 | I/O — User I/O pin (bank 7) |
| Pin produk 135 | I/O — User I/O pin (bank 7) |
| Pin produk 136 | I/O — User I/O pin (bank 7) |
| Pin produk 137 | I/O — User I/O pin (bank 8) |
| Pin produk 138 | I/O — User I/O pin (bank 8) |
| Pin produk 139 | I/O — User I/O pin (bank 8) |
| Pin produk 140 | I/O — User I/O pin (bank 8) |
| Pin produk 141 | I/O — User I/O pin (bank 8) |
| Pin produk 142 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 143 | GND — Ground |
| Pin produk 144 | I/O — User I/O pin (bank 8) |
Aplikasi Umum
EP20K100TC144-3 cocok untuk 7 aplikasis: Telecom Line-Card Glue Logic, Industrial Control Interface Bridging, Legacy ASIC Replacement, Custom DSP Pipeline Implementation, Custom Peripheral Bus Bridge, Test and Measurement Instrumentation Front-End, Aerospace and Defense Avionics Interface.
Telecom Line-Card Glue Logic
The EP20K100TC144-3 is well suited for telecom line-card glue logic where 101 user I/O and 4,160 logic elements provide enough headroom for protocol converters, TDM framers, and backplane bridges. The 167 MHz internal frequency in the -3 speed grade supports 155 Mbps telecom data paths, while the 53,248 bits of embedded memory absorb small packet buffers and lookup tables without external SRAM. Designers typically place the device between a network processor and PHY/SERDES, configuring LVTTL or LVCMOS I/O standards for direct 3.3 V interfacing. Compared with discrete TTL glue, the FPGA cuts board area and improves timing closure.
Direkomendasikan
Industrial Control Interface Bridging
In industrial control systems, the EP20K100TC144-3 bridges legacy parallel buses (ISA, HPI, VME) to modern serial protocols such as SPI, I2C, and UART. Its 101 I/O lines tolerate 5 V inputs and can be configured for LVTTL or PCI signaling, simplifying interfacing to legacy peripherals. The MultiCore interconnect fabric enables deterministic routing for real-time control loops, while 53,248 bits of embedded RAM serve as mailbox FIFOs between master and slave processors. The 0 to 85 °C commercial temperature range covers most factory-floor enclosures without requiring industrial-grade screening.
Direkomendasikan
Legacy ASIC Replacement
Designers often use the EP20K100TC144-3 as a drop-in replacement for end-of-life ASICs in long-lifecycle industrial, military, and aerospace programs. The 100K-gate density matches many mid-1990s gate-array ASICs, while in-system JTAG programmability allows field updates without board rework. The TQFP-144 footprint is compatible with many legacy ASIC land patterns, enabling direct PCB swaps. The 53,248-bit on-chip memory replaces small external SRAM/ROM, and the 2.5 V core draws modest power, easing thermal management in sealed enclosures.
Direkomendasikan
Custom DSP Pipeline Implementation
The EP20K100TC144-3 supports custom DSP pipelines such as FIR filters, correlators, and CRC engines. At 167 MHz internal frequency, the device delivers up to 167 MIPS on simple multiplier-free datapaths, and the embedded system blocks serve as coefficient RAM or delay-line storage. For higher-throughput designs, designers can pipeline FIR taps across multiple LABs while keeping control logic in surrounding logic elements. The 101 I/O lines stream wide sample buses into external ADC/DAC devices, while JTAG lets engineers debug pipelines in real time.
Direkomendasikan
Custom Peripheral Bus Bridge
The EP20K100TC144-3 is commonly used as a peripheral bus bridge that converts one bus standard (PCI, VME, ISA, or proprietary) to another (PCI Express soft-IP, SPI, I2C, or GPIO). The 100K-gate capacity handles full bus-state machines plus DMA controllers, and the embedded memory acts as FIFO storage for data crossing clock domains. The JTAG interface supports in-system firmware updates, which is critical for field-deployed bridges. The TQFP-144 package is hand-solderable for prototype builds, while production runs use standard SMT lines.
Direkomendasikan
Test and Measurement Instrumentation Front-End
In bench-top test equipment, the EP20K100TC144-3 implements custom waveform generators, pattern generators, and protocol-analyzer front ends. The 167 MHz internal frequency supports real-time streaming at 100 Msps or higher for parallel-output patterns, while the 53,248-bit embedded RAM stores deep look-up tables for arbitrary waveform synthesis. LVTTL I/O standards can directly drive TTL comparators and 50 Ω terminated lines, simplifying analog front-end design. Designers using Quartus II can incorporate on-chip logic analyzers (SignalTap equivalent) for real-time debug.
Direkomendasikan
Aerospace and Defense Avionics Interface
The EP20K100TC144-3 has historically been qualified for aerospace and defense programs where long-lifecycle support and MIL-spec reliability are required. Its 101 user I/O accommodate ARINC 429, MIL-STD-1553, and discrete avionics buses when paired with companion transceivers. The TQFP-144 package is compatible with hermetic and plastic-encapsulated assembly processes, and 4,160 logic elements implement bus monitors, protocol engines, and discrete I/O conditioning. Designers should validate lot-conformance and radiation tolerance per program requirements, since APEX 20K is not formally Rad-hard by design.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP20K100TC144-3 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP20K100TC144-1 | EP20K100TC144-2 | EP20K200TC144-3 | EP20K100EFC144-3 | EP20K100CT144C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (144-LQFP) | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20KE | APEX 20K (C-grade) |
| Logic Elements | 4,160 | 4,160 (same die) | 4,160 (same die) | 8,320 | 4,160 (APEX 20KE) | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 | 100,000 |
| Maximum Internal Frequency | 167 MHz | ~120 MHz (-28%) | ~145 MHz (-13%) | 167 MHz (same) | ~150 MHz (-10%) | ~120 MHz (-28%) |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 106,496 | 53,248 (with ESB enhancements) | 53,248 |
| Number of User I/O | 101 | 101 | 101 | 101 (max for TQFP-144) | 101 | 101 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -3 | -3 | C7 |
Diferensiator Kunci
- Highest speed grade (-3) within the APEX 20K 100K-gate TQFP-144 family (vsEP20K100TC144-1)
- Pin-to-pin upgrade path to 200K-gate APEX 20K in the same TQFP-144 footprint (vsEP20K200TC144-3)
- Same TQFP-144 footprint as APEX 20KE with richer ESB features (vsEP20K100EFC144-3)
Catatan Desain
Estimated: at 100% utilization across 4,160 logic elements switching simultaneously at 167 MHz, the EP20K100TC144-3 core current can reach 0.4 A on the 2.5 V rail (roughly 1 W). Use a low-impedance 2.5 V LDO or switching regulator and place a 100 µF bulk plus 0.1 µF and 0.01 µF ceramic decoupling network within 5 mm of every VCCINT pin. VCCIO pins per bank require their own decoupling matched to the I/O standard and toggle rate; bank-powered I/O can add another 0.2 to 0.5 W at full LVCMOS-33 drive.
The 144-pin TQFP package has 0.5 mm lead pitch; follow JEDEC IPC-7351 land-pattern guidelines for TQFP-144 to avoid solder bridging. Use a 4-layer PCB with continuous ground and power planes, and route JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance away from clock and switching I/O. Decoupling capacitors should be placed on the same side as the FPGA, between the pin and the nearest via to the power plane, with via count scaled to peak transient current.
Do not assume the bitstream is portable across APEX 20K density or package variants - even pin-compatible parts require recompilation if the die differs (for example EP20K100EFC144-3 vs EP20K100TC144-3). Always confirm that the JTAG chain order, configuration scheme (PS, AS, JTAG), and nCONFIG/nSTATUS pull-up values match the chosen configuration EPC or enhanced device. For multi-rail sequencing, bring up VCCINT first, then VCCIO, then drive nCONFIG high to avoid partial-configuration latch-up.
Estimated: at 1 W total power dissipation and a 144-TQFP theta_JA of approximately 35 °C/W (still air, JEDEC EIA/JESD51-2 4-layer board), junction temperature rise is roughly 35 °C above ambient. Within the 0 to 85 °C commercial range, this provides ~50 °C margin. For sealed enclosures, designers should add a thermal copper pour under the exposed pad area or upgrade to an FBGA package with lower theta_JA for higher-power designs.
Informasi Konformitas
RoHS and REACH compliant per distributor listings. AEC-Q100 not applicable (commercial-grade FPGA; not qualified to automotive stress standards). Lead-free reflow-compatible. Halogen-free status not explicitly disclosed in available distributor data.
