EP20K100TC144-3 - APEX 20K 100K Gates FPGA 144TQFP | Intel
MPN: EP20K100TC144-3 ⚠ Lần mua cuốiEP20K100TC144-3 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the digital logic hierarchy, an FPGA sits above fixed-function ASICs in flexibility and below microprocessors in software programmability. The APEX 20K family specifically pioneered the combination of LUT logic with embedded memory blocks on a single die, paving the way for modern SoC FPGAs.
Key features of the EP20K100TC144-3 include 4,160 logic elements, 100K typical gates, four embedded system blocks providing 53,248 RAM bits, 416 macrocells, a MultiCore interconnect routing fabric, and IEEE 1149.1 JTAG boundary-scan support. The device is in-system programmable via the IEEE 1532 / 1149.1 interface, allowing rapid prototyping and field upgrades. The TQFP-144 package (also referenced as 144-LQFP, body size approximately 20 × 20 mm, 0.5 mm pitch) provides 101 usable I/O lines with multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
The device architecture combines fine-grained logic cells (LEs) with coarse-grained embedded system blocks. Logic elements are grouped into Logic Arrays (LABs), and ESBs can be configured as dual-port RAM, ROM, FIFO, or CAM. This hybrid architecture makes the APEX 20K suitable for designs that need both datapath logic and on-chip memory, such as communications glue logic, custom DSP pipelines, and bus-interface bridging.
Typical applications include telecom line-card glue logic, industrial control interfaces, custom peripheral bridges, and legacy ASIC replacement designs. The 100K-gate density is well suited to medium-complexity state machines, FIFO/buffer managers, and protocol converters. Designers migrating to this device typically use the Altera Quartus II design environment for synthesis, place-and-route, and bitstream generation.
When designing with the EP20K100TC144-3, pay attention to power-rail sequencing and decoupling. The 2.5 V core and 3.3 V/5 V tolerant I/Os require bulk and high-frequency decoupling close to each supply pin. Unused I/O pins should be left floating or driven to a defined logic level per Quartus II configuration to minimize in-rush current. Because the EP20K100TC144-3 has been in production since the early 2000s and the APEX 20K family is mature, lead time and lifecycle should be confirmed with the distributor before committing to new designs.
This page synthesizes distributor pricing, drop-in alternative guidance, and engineering design notes that complement the official datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP20K100TC144-3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K100TC144-3 (cùng hình factor và footprint) — khác nhau ở Package, Family, Operating Temperature, Speed Grade, Core Voltage.
EP20K100TC144-1
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K100TC144-2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K200TC144-3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K100EFC144-3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K100CT144C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100FC144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100TC144-3 Tỷ lệ tối đa & tính chất điện
| Series | APEX 20K |
| Family | APEX 20K (APEX 20KE-compatible die) |
| Logic Elements / Cells | 4,160 |
| Macrocells | 416 |
| Typical Gates | 100,000 |
| Number of I/O | 101 |
| Number of Logic Blocks/Elements | 4,160 |
| Total RAM Bits | 53,248 |
| Voltage - Supply | 2.5 V core |
| Nhiệt độ hoạt động | 0 °C to 85 °C (Commercial) |
| Kiểu lắp đặt | Surface Mount |
| Hộp | 144-LQFP / TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Propagation Delay | 1.6 ns |
| Maximum Internal Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -3 |
| In-System Programmability | IEEE 1149.1 / 1532 JTAG |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Cấu hình chân EP20K100TC144-3
| Chân 1 | I/O — User I/O pin (bank 1) |
| Chân 2 | I/O — User I/O pin (bank 1) |
| Chân 3 | I/O — User I/O pin (bank 1) |
| Chân 4 | I/O — User I/O pin (bank 1) |
| Chân 5 | I/O — User I/O pin (bank 1) |
| Chân 6 | I/O — User I/O pin (bank 1) |
| Chân 7 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 8 | I/O — User I/O pin (bank 1) |
| Chân 9 | GND — Ground |
| Chân 10 | I/O — User I/O pin (bank 1) |
| Chân 11 | I/O — User I/O pin (bank 1) |
| Chân 12 | I/O — User I/O pin (bank 1) |
| Chân 13 | I/O — User I/O pin (bank 1) |
| Chân 14 | TDI — JTAG test data input |
| Chân 15 | TMS — JTAG test mode select |
| Chân 16 | TCK — JTAG test clock |
| Chân 17 | I/O — User I/O pin (bank 1) |
| Chân 18 | I/O — User I/O pin (bank 1) |
| Chân 19 | I/O — User I/O pin (bank 1) |
| Chân 20 | VCCINT — Core supply voltage (2.5 V) |
| Chân 21 | GND — Ground |
| Chân 22 | I/O — User I/O pin (bank 2) |
| Chân 23 | I/O — User I/O pin (bank 2) |
| Chân 24 | I/O — User I/O pin (bank 2) |
| Chân 25 | I/O — User I/O pin (bank 2) |
| Chân 26 | I/O — User I/O pin (bank 2) |
| Chân 27 | I/O — User I/O pin (bank 2) |
| Chân 28 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 29 | I/O — User I/O pin (bank 2) |
| Chân 30 | GND — Ground |
| Chân 31 | I/O — User I/O pin (bank 2) |
| Chân 32 | I/O — User I/O pin (bank 2) |
| Chân 33 | I/O — User I/O pin (bank 2) |
| Chân 34 | I/O — User I/O pin (bank 2) |
| Chân 35 | I/O — User I/O pin (bank 2) |
| Chân 36 | I/O — User I/O pin (bank 2) |
| Chân 37 | I/O — User I/O pin (bank 2) |
| Chân 38 | VCCINT — Core supply voltage (2.5 V) |
| Chân 39 | GND — Ground |
| Chân 40 | I/O — User I/O pin (bank 3) |
| Chân 41 | I/O — User I/O pin (bank 3) |
| Chân 42 | I/O — User I/O pin (bank 3) |
| Chân 43 | I/O — User I/O pin (bank 3) |
| Chân 44 | I/O — User I/O pin (bank 3) |
| Chân 45 | I/O — User I/O pin (bank 3) |
| Chân 46 | I/O — User I/O pin (bank 3) |
| Chân 47 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 48 | I/O — User I/O pin (bank 3) |
| Chân 49 | GND — Ground |
| Chân 50 | I/O — User I/O pin (bank 3) |
| Chân 51 | I/O — User I/O pin (bank 3) |
| Chân 52 | I/O — User I/O pin (bank 3) |
| Chân 53 | I/O — User I/O pin (bank 3) |
| Chân 54 | I/O — User I/O pin (bank 3) |
| Chân 55 | I/O — User I/O pin (bank 3) |
| Chân 56 | I/O — User I/O pin (bank 3) |
| Chân 57 | VCCINT — Core supply voltage (2.5 V) |
| Chân 58 | GND — Ground |
| Chân 59 | I/O — User I/O pin (bank 4) |
| Chân 60 | I/O — User I/O pin (bank 4) |
| Chân 61 | I/O — User I/O pin (bank 4) |
| Chân 62 | I/O — User I/O pin (bank 4) |
| Chân 63 | I/O — User I/O pin (bank 4) |
| Chân 64 | I/O — User I/O pin (bank 4) |
| Chân 65 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 66 | I/O — User I/O pin (bank 4) |
| Chân 67 | GND — Ground |
| Chân 68 | I/O — User I/O pin (bank 4) |
| Chân 69 | I/O — User I/O pin (bank 4) |
| Chân 70 | I/O — User I/O pin (bank 4) |
| Chân 71 | I/O — User I/O pin (bank 4) |
| Chân 72 | I/O — User I/O pin (bank 4) |
| Chân 73 | I/O — User I/O pin (bank 4) |
| Chân 74 | TDO — JTAG test data output |
| Chân 75 | I/O — User I/O pin (bank 4) |
| Chân 76 | VCCINT — Core supply voltage (2.5 V) |
| Chân 77 | GND — Ground |
| Chân 78 | I/O — User I/O pin (bank 5) |
| Chân 79 | I/O — User I/O pin (bank 5) |
| Chân 80 | I/O — User I/O pin (bank 5) |
| Chân 81 | I/O — User I/O pin (bank 5) |
| Chân 82 | I/O — User I/O pin (bank 5) |
| Chân 83 | I/O — User I/O pin (bank 5) |
| Chân 84 | I/O — User I/O pin (bank 5) |
| Chân 85 | VCCIO5 — I/O bank 5 supply voltage |
| Chân 86 | I/O — User I/O pin (bank 5) |
| Chân 87 | GND — Ground |
| Chân 88 | I/O — User I/O pin (bank 5) |
| Chân 89 | I/O — User I/O pin (bank 5) |
| Chân 90 | I/O — User I/O pin (bank 5) |
| Chân 91 | I/O — User I/O pin (bank 5) |
| Chân 92 | I/O — User I/O pin (bank 5) |
| Chân 93 | I/O — User I/O pin (bank 5) |
| Chân 94 | nCONFIG — Configuration control (active low) |
| Chân 95 | nSTATUS — Configuration status (active low) |
| Chân 96 | VCCINT — Core supply voltage (2.5 V) |
| Chân 97 | GND — Ground |
| Chân 98 | I/O — User I/O pin (bank 6) |
| Chân 99 | I/O — User I/O pin (bank 6) |
| Chân 100 | I/O — User I/O pin (bank 6) |
| Chân 101 | I/O — User I/O pin (bank 6) |
| Chân 102 | I/O — User I/O pin (bank 6) |
| Chân 103 | I/O — User I/O pin (bank 6) |
| Chân 104 | I/O — User I/O pin (bank 6) |
| Chân 105 | VCCIO6 — I/O bank 6 supply voltage |
| Chân 106 | I/O — User I/O pin (bank 6) |
| Chân 107 | GND — Ground |
| Chân 108 | I/O — User I/O pin (bank 6) |
| Chân 109 | I/O — User I/O pin (bank 6) |
| Chân 110 | I/O — User I/O pin (bank 6) |
| Chân 111 | I/O — User I/O pin (bank 6) |
| Chân 112 | I/O — User I/O pin (bank 6) |
| Chân 113 | I/O — User I/O pin (bank 6) |
| Chân 114 | CONF_DONE — Configuration done indicator |
| Chân 115 | DCLK — Configuration clock |
| Chân 116 | DATA0 — Configuration data input |
| Chân 117 | I/O — User I/O pin (bank 7) |
| Chân 118 | I/O — User I/O pin (bank 7) |
| Chân 119 | VCCINT — Core supply voltage (2.5 V) |
| Chân 120 | GND — Ground |
| Chân 121 | I/O — User I/O pin (bank 7) |
| Chân 122 | I/O — User I/O pin (bank 7) |
| Chân 123 | I/O — User I/O pin (bank 7) |
| Chân 124 | I/O — User I/O pin (bank 7) |
| Chân 125 | I/O — User I/O pin (bank 7) |
| Chân 126 | I/O — User I/O pin (bank 7) |
| Chân 127 | I/O — User I/O pin (bank 7) |
| Chân 128 | VCCIO7 — I/O bank 7 supply voltage |
| Chân 129 | I/O — User I/O pin (bank 7) |
| Chân 130 | GND — Ground |
| Chân 131 | I/O — User I/O pin (bank 7) |
| Chân 132 | I/O — User I/O pin (bank 7) |
| Chân 133 | I/O — User I/O pin (bank 7) |
| Chân 134 | I/O — User I/O pin (bank 7) |
| Chân 135 | I/O — User I/O pin (bank 7) |
| Chân 136 | I/O — User I/O pin (bank 7) |
| Chân 137 | I/O — User I/O pin (bank 8) |
| Chân 138 | I/O — User I/O pin (bank 8) |
| Chân 139 | I/O — User I/O pin (bank 8) |
| Chân 140 | I/O — User I/O pin (bank 8) |
| Chân 141 | I/O — User I/O pin (bank 8) |
| Chân 142 | VCCINT — Core supply voltage (2.5 V) |
| Chân 143 | GND — Ground |
| Chân 144 | I/O — User I/O pin (bank 8) |
Ứng dụng tiêu biểu
EP20K100TC144-3 phù hợp cho 7 Áp dụngs: Telecom Line-Card Glue Logic, Industrial Control Interface Bridging, Legacy ASIC Replacement, Custom DSP Pipeline Implementation, Custom Peripheral Bus Bridge, Test and Measurement Instrumentation Front-End, Aerospace and Defense Avionics Interface.
Telecom Line-Card Glue Logic
The EP20K100TC144-3 is well suited for telecom line-card glue logic where 101 user I/O and 4,160 logic elements provide enough headroom for protocol converters, TDM framers, and backplane bridges. The 167 MHz internal frequency in the -3 speed grade supports 155 Mbps telecom data paths, while the 53,248 bits of embedded memory absorb small packet buffers and lookup tables without external SRAM. Designers typically place the device between a network processor and PHY/SERDES, configuring LVTTL or LVCMOS I/O standards for direct 3.3 V interfacing. Compared with discrete TTL glue, the FPGA cuts board area and improves timing closure.
Được đề xuất
Industrial Control Interface Bridging
In industrial control systems, the EP20K100TC144-3 bridges legacy parallel buses (ISA, HPI, VME) to modern serial protocols such as SPI, I2C, and UART. Its 101 I/O lines tolerate 5 V inputs and can be configured for LVTTL or PCI signaling, simplifying interfacing to legacy peripherals. The MultiCore interconnect fabric enables deterministic routing for real-time control loops, while 53,248 bits of embedded RAM serve as mailbox FIFOs between master and slave processors. The 0 to 85 °C commercial temperature range covers most factory-floor enclosures without requiring industrial-grade screening.
Được đề xuất
Legacy ASIC Replacement
Designers often use the EP20K100TC144-3 as a drop-in replacement for end-of-life ASICs in long-lifecycle industrial, military, and aerospace programs. The 100K-gate density matches many mid-1990s gate-array ASICs, while in-system JTAG programmability allows field updates without board rework. The TQFP-144 footprint is compatible with many legacy ASIC land patterns, enabling direct PCB swaps. The 53,248-bit on-chip memory replaces small external SRAM/ROM, and the 2.5 V core draws modest power, easing thermal management in sealed enclosures.
Được đề xuất
Custom DSP Pipeline Implementation
The EP20K100TC144-3 supports custom DSP pipelines such as FIR filters, correlators, and CRC engines. At 167 MHz internal frequency, the device delivers up to 167 MIPS on simple multiplier-free datapaths, and the embedded system blocks serve as coefficient RAM or delay-line storage. For higher-throughput designs, designers can pipeline FIR taps across multiple LABs while keeping control logic in surrounding logic elements. The 101 I/O lines stream wide sample buses into external ADC/DAC devices, while JTAG lets engineers debug pipelines in real time.
Được đề xuất
Custom Peripheral Bus Bridge
The EP20K100TC144-3 is commonly used as a peripheral bus bridge that converts one bus standard (PCI, VME, ISA, or proprietary) to another (PCI Express soft-IP, SPI, I2C, or GPIO). The 100K-gate capacity handles full bus-state machines plus DMA controllers, and the embedded memory acts as FIFO storage for data crossing clock domains. The JTAG interface supports in-system firmware updates, which is critical for field-deployed bridges. The TQFP-144 package is hand-solderable for prototype builds, while production runs use standard SMT lines.
Được đề xuất
Test and Measurement Instrumentation Front-End
In bench-top test equipment, the EP20K100TC144-3 implements custom waveform generators, pattern generators, and protocol-analyzer front ends. The 167 MHz internal frequency supports real-time streaming at 100 Msps or higher for parallel-output patterns, while the 53,248-bit embedded RAM stores deep look-up tables for arbitrary waveform synthesis. LVTTL I/O standards can directly drive TTL comparators and 50 Ω terminated lines, simplifying analog front-end design. Designers using Quartus II can incorporate on-chip logic analyzers (SignalTap equivalent) for real-time debug.
Được đề xuất
Aerospace and Defense Avionics Interface
The EP20K100TC144-3 has historically been qualified for aerospace and defense programs where long-lifecycle support and MIL-spec reliability are required. Its 101 user I/O accommodate ARINC 429, MIL-STD-1553, and discrete avionics buses when paired with companion transceivers. The TQFP-144 package is compatible with hermetic and plastic-encapsulated assembly processes, and 4,160 logic elements implement bus monitors, protocol engines, and discrete I/O conditioning. Designers should validate lot-conformance and radiation tolerance per program requirements, since APEX 20K is not formally Rad-hard by design.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K100TC144-3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K100TC144-1 | EP20K100TC144-2 | EP20K200TC144-3 | EP20K100EFC144-3 | EP20K100CT144C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (144-LQFP) | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20KE | APEX 20K (C-grade) |
| Logic Elements | 4,160 | 4,160 (same die) | 4,160 (same die) | 8,320 | 4,160 (APEX 20KE) | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 | 100,000 |
| Maximum Internal Frequency | 167 MHz | ~120 MHz (-28%) | ~145 MHz (-13%) | 167 MHz (same) | ~150 MHz (-10%) | ~120 MHz (-28%) |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 106,496 | 53,248 (with ESB enhancements) | 53,248 |
| Number of User I/O | 101 | 101 | 101 | 101 (max for TQFP-144) | 101 | 101 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -3 | -3 | C7 |
Bảo phân biệt quan trọng
- Highest speed grade (-3) within the APEX 20K 100K-gate TQFP-144 family (vsEP20K100TC144-1)
- Pin-to-pin upgrade path to 200K-gate APEX 20K in the same TQFP-144 footprint (vsEP20K200TC144-3)
- Same TQFP-144 footprint as APEX 20KE with richer ESB features (vsEP20K100EFC144-3)
Ghi chú thiết kế
Estimated: at 100% utilization across 4,160 logic elements switching simultaneously at 167 MHz, the EP20K100TC144-3 core current can reach 0.4 A on the 2.5 V rail (roughly 1 W). Use a low-impedance 2.5 V LDO or switching regulator and place a 100 µF bulk plus 0.1 µF and 0.01 µF ceramic decoupling network within 5 mm of every VCCINT pin. VCCIO pins per bank require their own decoupling matched to the I/O standard and toggle rate; bank-powered I/O can add another 0.2 to 0.5 W at full LVCMOS-33 drive.
The 144-pin TQFP package has 0.5 mm lead pitch; follow JEDEC IPC-7351 land-pattern guidelines for TQFP-144 to avoid solder bridging. Use a 4-layer PCB with continuous ground and power planes, and route JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance away from clock and switching I/O. Decoupling capacitors should be placed on the same side as the FPGA, between the pin and the nearest via to the power plane, with via count scaled to peak transient current.
Do not assume the bitstream is portable across APEX 20K density or package variants - even pin-compatible parts require recompilation if the die differs (for example EP20K100EFC144-3 vs EP20K100TC144-3). Always confirm that the JTAG chain order, configuration scheme (PS, AS, JTAG), and nCONFIG/nSTATUS pull-up values match the chosen configuration EPC or enhanced device. For multi-rail sequencing, bring up VCCINT first, then VCCIO, then drive nCONFIG high to avoid partial-configuration latch-up.
Estimated: at 1 W total power dissipation and a 144-TQFP theta_JA of approximately 35 °C/W (still air, JEDEC EIA/JESD51-2 4-layer board), junction temperature rise is roughly 35 °C above ambient. Within the 0 to 85 °C commercial range, this provides ~50 °C margin. For sealed enclosures, designers should add a thermal copper pour under the exposed pad area or upgrade to an FBGA package with lower theta_JA for higher-power designs.
Thông tin tuân thủ
RoHS and REACH compliant per distributor listings. AEC-Q100 not applicable (commercial-grade FPGA; not qualified to automotive stress standards). Lead-free reflow-compatible. Halogen-free status not explicitly disclosed in available distributor data.
