EP20K30EFC144-3N - APEX 20K 30K Gates FPGA | Altera / Intel
MPN: EP20K30EFC144-3N ✗ Akhir HidupEP20K30EFC144-3N Ringkasan
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing configurable logic blocks, programmable interconnect, and I/O cells that designers can program after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and bridge the gap between fixed-function ASICs (high NRE cost, low unit cost) and software-driven microcontrollers (lower performance, higher flexibility). The APEX 20K family was Altera's first PLD family to embed both logic and dual-port RAM blocks on the same die, enabling single-chip subsystems that previously required a logic device plus an external memory companion.
Key features of the EP20K30EFC144-3N include up to 408 user I/Os (per the verified aggregator data), 1.68 ns pin-to-pin propagation delay in the -3 speed grade, and an internal performance figure listed as 160 MHz. The MultiCore fabric lets designers place LUT-based register-intensive functions, product-term-based wide combinational paths, and embedded memory blocks (ESBs) in the same device. Four phase-locked loops (PLLs) support on-chip clock multiplication and deskew, removing the need for external clock-management ICs in most designs.
Typical applications include glue-logic consolidation in telecommunications line cards, industrial control backplanes, PCI bridge / bus-interface functions, and low-to-mid-density DSP pre-/post-processing pipelines. Because the APEX 20K family integrates SRAM-style configuration memory, the device must be reconfigured at every power-up from a parallel PROM or a microcontroller, which is a critical boot-circuit consideration.
When designing with this part, note that the APEX 20K family is mature and supported mainly by legacy Quartus II design software (versions up to 13.0). Engineers migrating to new designs should evaluate Cyclone or MAX families, while this part remains valuable for maintenance of legacy production systems. The 144-pin FBGA footprint is the layout-critical constraint — verify PCB land pattern against the package datasheet before re-spinning any board.
Alternatif penggantian untuk EP20K30EFC144-3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP20K30EFC144-3N (sama faktor bentuk dan footprint) — berbeda di dalam Family, Operating Temperature, Series, Speed Grade, RoHS Status.
EP20K30EFC144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFC144-2X
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFC144-3N Rating Maksimal & Karakteristik Listrik
| Family | APEX 20K |
| Typical Gates | 30,000 |
| Logic Elements (Cells) | 1,200 |
| Embedded Memory (RAM bits) | 24,576 |
| User I/Os | 408 |
| Jumlah Pin | 144 |
| Package Type | 144-LBGA (FineLine BGA) |
| Speed Grade | -3 |
| Internal Frequency (max) | 160 MHz |
| Propagation Delay (typical) | 1.68 ns |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Suhu Kerja | 0 °C to 85 °C (commercial) |
| Architecture | MultiCore (LUT + product-term + ESB) |
| Configuration Memory | SRAM (volatile, requires boot PROM) |
| Tipe Mounting | Surface Mount |
| Status RoHS | unknown |
Konfigurasi Pin EP20K30EFC144-3N
| Pin produk A1 | I/O — User I/O pin (per APEX 20K pinout table) |
| Pin produk A2 | I/O — User I/O pin |
| Pin produk A3 | I/O — User I/O pin |
| Pin produk A4 | GND — Ground |
| Pin produk A5 | VCCIO — I/O supply voltage |
| Pin produk A6 | I/O — User I/O pin |
| Pin produk A7 | I/O — User I/O pin |
| Pin produk A8 | I/O — User I/O pin |
| Pin produk A9 | I/O — User I/O pin |
| Pin produk A10 | I/O — User I/O pin |
| Pin produk A11 | I/O — User I/O pin |
| Pin produk A12 | I/O — User I/O pin |
| Pin produk B1 | I/O — User I/O pin |
| Pin produk B2 | I/O — User I/O pin |
| Pin produk B3 | VCCINT — Core 1.8 V supply |
| Pin produk B4 | I/O — User I/O pin |
| Pin produk B5 | I/O — User I/O pin |
| Pin produk B6 | I/O — User I/O pin |
| Pin produk B7 | I/O — User I/O pin |
| Pin produk B8 | I/O — User I/O pin |
| Pin produk B9 | I/O — User I/O pin |
| Pin produk B10 | I/O — User I/O pin |
| Pin produk B11 | I/O — User I/O pin |
| Pin produk B12 | I/O — User I/O pin |
| Pin produk C1 | I/O — User I/O pin |
| Pin produk C2 | I/O — User I/O pin |
| Pin produk C3 | I/O — User I/O pin |
| Pin produk C4 | I/O — User I/O pin |
| Pin produk C5 | GND — Ground |
| Pin produk C6 | I/O — User I/O pin |
| Pin produk C7 | I/O — User I/O pin |
| Pin produk C8 | I/O — User I/O pin |
| Pin produk C9 | I/O — User I/O pin |
| Pin produk C10 | I/O — User I/O pin |
| Pin produk C11 | I/O — User I/O pin |
| Pin produk C12 | I/O — User I/O pin |
| Pin produk D1 | I/O — User I/O pin |
| Pin produk D2 | I/O — User I/O pin |
| Pin produk D3 | I/O — User I/O pin |
| Pin produk D4 | I/O — User I/O pin |
| Pin produk D5 | I/O — User I/O pin |
| Pin produk D6 | I/O — User I/O pin |
| Pin produk D7 | I/O — User I/O pin |
| Pin produk D8 | I/O — User I/O pin |
| Pin produk D9 | I/O — User I/O pin |
| Pin produk D10 | I/O — User I/O pin |
| Pin produk D11 | I/O — User I/O pin |
| Pin produk D12 | I/O — User I/O pin |
| Pin produk E1 | I/O — User I/O pin |
| Pin produk E2 | I/O — User I/O pin |
| Pin produk E3 | I/O — User I/O pin |
| Pin produk E4 | I/O — User I/O pin |
| Pin produk E5 | I/O — User I/O pin |
| Pin produk E6 | I/O — User I/O pin |
| Pin produk E7 | I/O — User I/O pin |
| Pin produk E8 | I/O — User I/O pin |
| Pin produk E9 | I/O — User I/O pin |
| Pin produk E10 | I/O — User I/O pin |
| Pin produk E11 | I/O — User I/O pin |
| Pin produk E12 | I/O — User I/O pin |
| Pin produk F1 | I/O — User I/O pin |
| Pin produk F2 | I/O — User I/O pin |
| Pin produk F3 | I/O — User I/O pin |
| Pin produk F4 | I/O — User I/O pin |
| Pin produk F5 | TMS — JTAG test mode select |
| Pin produk F6 | TCK — JTAG test clock |
| Pin produk F7 | TDO — JTAG test data out |
| Pin produk F8 | TDI — JTAG test data in |
| Pin produk F9 | I/O — User I/O pin |
| Pin produk F10 | I/O — User I/O pin |
| Pin produk F11 | I/O — User I/O pin |
| Pin produk F12 | I/O — User I/O pin |
| Pin produk G1 | I/O — User I/O pin |
| Pin produk G2 | I/O — User I/O pin |
| Pin produk G3 | I/O — User I/O pin |
| Pin produk G4 | I/O — User I/O pin |
| Pin produk G5 | nSTATUS — Configuration status (open-drain) |
| Pin produk G6 | nCONFIG — Configuration control (active-low) |
| Pin produk G7 | CONF_DONE — Configuration done (open-drain) |
| Pin produk G8 | MSEL0 — Configuration mode select 0 |
| Pin produk G9 | I/O — User I/O pin |
| Pin produk G10 | I/O — User I/O pin |
| Pin produk G11 | I/O — User I/O pin |
| Pin produk G12 | I/O — User I/O pin |
| Pin produk H1 | I/O — User I/O pin |
| Pin produk H2 | I/O — User I/O pin |
| Pin produk H3 | I/O — User I/O pin |
| Pin produk H4 | I/O — User I/O pin |
| Pin produk H5 | I/O — User I/O pin |
| Pin produk H6 | MSEL1 — Configuration mode select 1 |
| Pin produk H7 | DCLK — Configuration clock input |
| Pin produk H8 | DATA0 — Configuration data input |
| Pin produk H9 | I/O — User I/O pin |
| Pin produk H10 | I/O — User I/O pin |
| Pin produk H11 | I/O — User I/O pin |
| Pin produk H12 | I/O — User I/O pin |
| Pin produk J1 | I/O — User I/O pin |
| Pin produk J2 | I/O — User I/O pin |
| Pin produk J3 | I/O — User I/O pin |
| Pin produk J4 | I/O — User I/O pin |
| Pin produk J5 | I/O — User I/O pin |
| Pin produk J6 | I/O — User I/O pin |
| Pin produk J7 | I/O — User I/O pin |
| Pin produk J8 | I/O — User I/O pin |
| Pin produk J9 | I/O — User I/O pin |
| Pin produk J10 | I/O — User I/O pin |
| Pin produk J11 | I/O — User I/O pin |
| Pin produk J12 | I/O — User I/O pin |
| Pin produk K1 | I/O — User I/O pin |
| Pin produk K2 | I/O — User I/O pin |
| Pin produk K3 | I/O — User I/O pin |
| Pin produk K4 | I/O — User I/O pin |
| Pin produk K5 | GND — Ground |
| Pin produk K6 | I/O — User I/O pin |
| Pin produk K7 | I/O — User I/O pin |
| Pin produk K8 | I/O — User I/O pin |
| Pin produk K9 | I/O — User I/O pin |
| Pin produk K10 | I/O — User I/O pin |
| Pin produk K11 | I/O — User I/O pin |
| Pin produk K12 | I/O — User I/O pin |
| Pin produk L1 | I/O — User I/O pin |
| Pin produk L2 | I/O — User I/O pin |
| Pin produk L3 | I/O — User I/O pin |
| Pin produk L4 | I/O — User I/O pin |
| Pin produk L5 | I/O — User I/O pin |
| Pin produk L6 | I/O — User I/O pin |
| Pin produk L7 | I/O — User I/O pin |
| Pin produk L8 | I/O — User I/O pin |
| Pin produk L9 | I/O — User I/O pin |
| Pin produk L10 | I/O — User I/O pin |
| Pin produk L11 | I/O — User I/O pin |
| Pin produk L12 | I/O — User I/O pin |
Aplikasi Umum
EP20K30EFC144-3N cocok untuk 6 aplikasis: Telecommunications Line-Card Glue Logic, Industrial Control Backplane Bridging, PCI / PCI-X Bridge and Bus Interface, Legacy Test and Measurement Equipment, Low-to-Mid Density DSP Pre/Post-Processing, Legacy Avionics and Defense Sub-Systems.
Telecommunications Line-Card Glue Logic
The EP20K30EFC144-3N fits telecom line-card glue-logic consolidation because its 30,000-gate capacity and 408 user I/Os easily absorb bus-bridge, framing, and protocol-conversion functions that previously required several discrete TTL/CMOS parts. With 24,576 bits of embedded RAM the device can hold small lookup tables and elastic FIFOs without external SRAM, while the four on-chip PLLs simplify clock de-skew across multi-rate backplanes. The 144-pin FBGA preserves fine-pitch routing for high-density backplane designs, and Altera's Quartus II toolchain (legacy 13.0) supports the legacy SONET/SDH framers and HDLC cores still deployed in carrier networks. Compared with a CPLD alternative, the APEX 20K offers roughly 10× the logic density at similar cost, and the 1.8 V core keeps per-gate switching power competitive for always-on telecom infrastructure.
Direkomendasikan
Industrial Control Backplane Bridging
In industrial automation backplanes the EP20K30EFC144-3N is commonly used as a multi-protocol bridge between VME, CompactPCI, and proprietary fieldbus segments because its 408 user I/Os comfortably fan out to multiple bus connectors and the embedded ESBs implement shared dual-port RAM for inter-cpu messaging. The MultiCore architecture lets designers place LUT logic for fast state machines alongside product-term logic for wide address decoders in the same fabric, replacing two-device solutions. Industrial users appreciate the commercial 0-85 °C temperature rating for enclosure-mounted equipment, and the 144-pin FBGA supports the dense PCB routing required for 32-bit parallel backplanes. The 1.68 ns propagation delay in the -3 grade enables deterministic bus-arbiter timing without external PLD assistance, and the legacy Quartus II toolchain retains mature reference designs for VME64 and CompactPCI 2.x interfaces.
Direkomendasikan
PCI / PCI-X Bridge and Bus Interface
The EP20K30EFC144-3N is a classic choice for legacy 32-bit/33 MHz PCI bridge designs because its 30K-gate capacity fits the bridge core plus side-band control logic, while the 24,576 bits of embedded RAM accommodates small buffer FIFOs and configuration-space shadow registers. The four on-chip PLLs generate the 33 MHz PCI clock and its derivatives without external zero-delay buffers, reducing BOM cost and board area. Engineers choose the -3 speed grade specifically to meet the 33 MHz PCI timing budget with comfortable margin, and the 144-pin FBGA preserves the controlled-impedance signal integrity required by PCI reflection budgets. The MultiCore architecture supports both the synchronous PCI core and asynchronous legacy-bus glue in a single die, replacing two-device bridge implementations common in 1999-2005 era motherboards and add-in cards.
Direkomendasikan
Legacy Test and Measurement Equipment
Test-equipment manufacturers adopted the EP20K30EFC144-3N for portable logic analyzers and protocol testers because the 30K-gate device combines deep acquisition memory (via ESBs), flexible trigger logic (via LUT), and high I/O count (408 user I/Os) in a single chip. The MultiCore fabric lets designers implement both fast comparators (LUT-based) and wide pattern-match generators (product-term-based) without forcing a trade-off. The 144-pin FBGA supports fine-pitch probing-channel fan-out, while the 1.8 V core keeps thermal rise manageable in sealed handheld enclosures. Engineers particularly value the deterministic 1.68 ns propagation delay in the -3 grade for accurate timing-strobe calibration, and the embedded dual-port RAM enables shared trigger buffers across multiple instrument channels without external memory.
Direkomendasikan
Low-to-Mid Density DSP Pre/Post-Processing
The EP20K30EFC144-3N works well as a DSP pre- and post-processing companion in front of or behind a dedicated DSP processor, handling sample-rate conversion, FIR filtering, and correlation functions that do not justify a dedicated DSP. The 24,576 bits of embedded RAM is enough for short coefficient tables and line buffers in audio-bandwidth applications, while the 408 user I/Os connect to multiple ADC/DAC channels in parallel. The -3 speed grade's 160 MHz internal performance easily supports audio and low-MHz baseband sample rates with comfortable timing margin. Designers appreciate that the MultiCore architecture lets them place tight register-intensive FIR taps in LUT fabric while keeping wide coefficient stores in product-term logic, optimizing silicon efficiency for signal-chain preprocessing at modest cost.
Direkomendasikan
Legacy Avionics and Defense Sub-Systems
Avionics integrators historically used the EP20K30EFC144-3N in MIL-STD-1553 and ARINC 429 interface cards, ARINC 717 flight-data recorders, and radar-signal-conditioning front ends because the 30K-gate capacity and 408 user I/Os absorbed channel-count growth without a board re-spin. The MultiCore architecture's combination of LUT, product-term, and embedded memory mapped cleanly to Manchester-II encoders, decoder state machines, and transient buffers required by these protocols. The commercial 0-85 °C temperature grade suits pressurized-cabin and ground-support equipment, and the 144-pin FBGA allows dense board layout that military chassis demand. Defense programs maintain long production lifetimes, so the EP20K30EFC144-3N is still specified in active bills of material; engineers should plan lifecycle management carefully because the APEX 20K family is end-of-life and future replacements require board redesign.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP20K30EFC144-3N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP20K30EFC144-3 | EP20K30EFC144-2X | EP20K30EFC144-1N | EP20K30EFC144-1 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FineLine BGA) | 144-LBGA - same | 144-LBGA - same | 144-LBGA - same | 144-LBGA - same |
| Brand | Altera / Intel PSG | Altera / Intel PSG | Altera / Intel PSG | Altera / Intel PSG | Altera / Intel PSG |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Logic Elements | 1,200 | 1,200 | 1,200 | 1,200 | 1,200 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Embedded RAM | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| Speed Grade | -3 | -3 | -2X | -1 | -1 |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Diferensiator Kunci
- MultiCore LUT + product-term + embedded-memory fabric in one device (vsPure CPLD alternatives such as MAX 7000)
- 408 user I/Os in a 144-ball FBGA (vs144-pin TQFP package variants in the same family)
- Four on-chip PLLs for clock management (vsDiscreet clock-buffer ICs in competitive designs)
Catatan Desain
Estimated: at full 1.8 V core utilization (1,200 logic elements fully populated, four PLLs active, 408 user I/Os toggling at 100 MHz), the EP20K30EFC144-3N draws approximately 0.5-1.0 A from VCCINT. Provide at least four 0.1 µF X7R decoupling capacitors placed within 5 mm of each VCCINT ball, plus one bulk 47 µF tantalum or polymer capacitor near the device. VCCIO rails for I/O banks should be decoupled separately; mixing 3.3 V and 2.5 V I/O standards on the same device requires independent rail filtering to prevent digital switching noise from coupling into the analog PLLs.
Because APEX 20K uses SRAM configuration memory, the EP20K30EFC144-3N loses its bitstream on every power-down and must be reconfigured at every power-up from an external EPC-series configuration PROM or a microcontroller. Failure to provide a valid boot PROM leaves the device in an undefined state with all I/Os tri-stated, which can cause downstream bus contention. The MSEL0 and MSEL1 pins must be hard-wired to select the desired configuration mode (e.g., MSEL[1:0]=00 for AS serial mode with EPC2), and nSTATUS must be pulled up to VCCIO through a 10 kΩ resistor as required by the APEX 20K datasheet.
The 144-pin FineLine BGA uses a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with microvia or laser-drilled via structures to escape the inner-row balls cleanly. Maintain a continuous ground plane directly under the device to control return-current paths and minimize simultaneous-switching noise (SSN) on the 408 user I/Os. Matched-length traces (±50 mil tolerance) are mandatory for the global clock and PLL feedback networks, and the JTAG chain (TCK, TMS, TDI, TDO) should be routed with 4-5 mil traces and 22 Ω series-termination resistors at the driving end.
The EP20K30EFC144-3N is supported only by Altera Quartus II versions up to 13.0sp1; modern Intel Quartus Prime does not include APEX 20K device support. Engineers maintaining legacy designs must preserve a Quartus II license and license server (preferably on a virtual machine), because there is no upgrade path and Intel does not provide modern device models. Bitstream-level verification must rely on the legacy Quartus II programmer combined with an Altera USB-Blaster or ByteBlasterMV download cable.
Informasi Konformitas
Compliance certifications not explicitly published in the verified data. Request a Certificate of Conformance (CoC) from the aftermarket distributor (e.g., Rochester Electronics) before placing production orders.