EP20K30EFI144-2X - APEX 20KE FPGA 1200 Cells 93 I/O 144-BGA | Intel
MPN: EP20K30EFI144-2X ✗ Akhir HidupEP20K30EFI144-2X Ringkasan
What is an APEX 20KE FPGA? The APEX (Advanced Programmable Element Matrix) 20KE family is a multi-vendor-compatible programmable logic architecture combining look-up table (LUT)-based logic elements with embedded system blocks (ESBs) that double as RAM, ROM, or product-term logic. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor integrated circuit family, sitting between ASICs and discrete logic in flexibility and density. APEX 20KE parts were widely deployed in telecom, networking, and DSP applications in the late 1990s and early 2000s.
Key features of the EP20K30EFI144-2X include 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, 93 maximum user I/O, and 1.8 V core operation. The device supports in-system programmability via IEEE 1149.1 JTAG, multi-vendor I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), and dedicated clock and PLL resources. The 144-ball FineLine BGA package provides a compact footprint while preserving sufficient I/O count for typical glue-logic and DSP datapath designs.
Architecturally, the APEX 20KE combines a MegaLAB structure with embedded system blocks, allowing designers to trade logic density against memory width. The LUT-based logic elements support cascade chains for wide datapaths, while the ESBs can be configured as dual-port RAM or FIFO buffers. Hardware multipliers are not present in the 20KE family, so DSP functions are typically implemented using LUT-based multiplication or external co-processors.
Typical applications for the EP20K30EFI144-2X include telecom interface cards, protocol bridging logic, low-density DSP preprocessing, industrial control state machines, and PCI bus interface glue logic. The industrial temperature grade makes it suitable for factory automation and outdoor telecom equipment. Note that the APEX 20KE family is end-of-life; modern Cyclone IV/V or Lattice ECP5 devices are recommended for new designs.
When designing with this part, plan the I/O bank VCCIO assignments carefully because mixed-voltage standards require multiple supply rails. The Quartus II design tool (legacy versions supporting APEX 20KE) is required for bitstream generation. JTAG programming via a ByteBlaster or USB-Blaster download cable is the standard configuration path.
Alternatif penggantian untuk EP20K30EFI144-2X — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP20K30EFI144-2X (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Family, Operating Temperature, Series, Typical Gates.
EP20K30EFC144-2X
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFI144-2XN
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP20K30EFC144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30EFI144-2X Rating Maksimal & Karakteristik Listrik
| Series | APEX 20KE |
| Family | APEX 20KE Field Programmable Gate Array |
| Logic Elements / Cells | 1200 |
| Macrocells | 192 |
| Embedded RAM Bits | 24576 |
| Number of I/O | 93 |
| Maximum User I/O | 93 |
| Paket | 144-BGA (FineLine BGA) |
| Jumlah Pin | 144 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature Grade | Industrial (E suffix) |
| Speed Grade | -2 |
| Tipe Mounting | Surface Mount |
Konfigurasi Pin EP20K30EFI144-2X
| Pin produk A1 | I/O — User I/O pin (bank 1) |
| Pin produk A2 | I/O — User I/O pin (bank 1) |
| Pin produk A3 | I/O — User I/O pin (bank 1) |
| Pin produk A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk A5 | I/O — User I/O pin (bank 1) |
| Pin produk A6 | I/O — User I/O pin (bank 1) |
| Pin produk A7 | I/O — User I/O pin (bank 1) |
| Pin produk A8 | GND — Ground |
| Pin produk A9 | I/O — User I/O pin (bank 2) |
| Pin produk A10 | I/O — User I/O pin (bank 2) |
| Pin produk A11 | I/O — User I/O pin (bank 2) |
| Pin produk A12 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk B1 | I/O — User I/O pin (bank 1) |
| Pin produk B2 | GND — Ground |
| Pin produk B3 | I/O — User I/O pin (bank 1) |
| Pin produk B4 | I/O — User I/O pin (bank 1) |
| Pin produk B5 | I/O — User I/O pin (bank 1) |
| Pin produk B6 | GND — Ground |
| Pin produk B7 | I/O — User I/O pin (bank 1) |
| Pin produk B8 | I/O — User I/O pin (bank 1) |
| Pin produk B9 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk B10 | I/O — User I/O pin (bank 2) |
| Pin produk B11 | I/O — User I/O pin (bank 2) |
| Pin produk B12 | I/O — User I/O pin (bank 2) |
| Pin produk C1 | I/O — User I/O pin (bank 1) |
| Pin produk C2 | I/O — User I/O pin (bank 1) |
| Pin produk C3 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk C4 | I/O — User I/O pin (bank 1) |
| Pin produk C5 | GND — Ground |
| Pin produk C6 | I/O — User I/O pin (bank 1) |
| Pin produk C7 | I/O — User I/O pin (bank 1) |
| Pin produk C8 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk C9 | I/O — User I/O pin (bank 2) |
| Pin produk C10 | GND — Ground |
| Pin produk C11 | I/O — User I/O pin (bank 2) |
| Pin produk C12 | I/O — User I/O pin (bank 2) |
| Pin produk D1 | I/O — User I/O pin (bank 3) |
| Pin produk D2 | I/O — User I/O pin (bank 3) |
| Pin produk D3 | I/O — User I/O pin (bank 3) |
| Pin produk D4 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk D5 | I/O — User I/O pin (bank 3) |
| Pin produk D6 | I/O — User I/O pin (bank 3) |
| Pin produk D7 | I/O — User I/O pin (bank 3) |
| Pin produk D8 | GND — Ground |
| Pin produk D9 | I/O — User I/O pin (bank 4) |
| Pin produk D10 | I/O — User I/O pin (bank 4) |
| Pin produk D11 | I/O — User I/O pin (bank 4) |
| Pin produk D12 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk E1 | I/O — User I/O pin (bank 3) |
| Pin produk E2 | GND — Ground |
| Pin produk E3 | I/O — User I/O pin (bank 3) |
| Pin produk E4 | I/O — User I/O pin (bank 3) |
| Pin produk E5 | I/O — User I/O pin (bank 3) |
| Pin produk E6 | GND — Ground |
| Pin produk E7 | I/O — User I/O pin (bank 3) |
| Pin produk E8 | I/O — User I/O pin (bank 3) |
| Pin produk E9 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk E10 | I/O — User I/O pin (bank 4) |
| Pin produk E11 | I/O — User I/O pin (bank 4) |
| Pin produk E12 | I/O — User I/O pin (bank 4) |
| Pin produk F1 | I/O — User I/O pin (bank 3) |
| Pin produk F2 | I/O — User I/O pin (bank 3) |
| Pin produk F3 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk F4 | I/O — User I/O pin (bank 3) |
| Pin produk F5 | GND — Ground |
| Pin produk F6 | I/O — User I/O pin (bank 3) |
| Pin produk F7 | I/O — User I/O pin (bank 3) |
| Pin produk F8 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk F9 | I/O — User I/O pin (bank 4) |
| Pin produk F10 | GND — Ground |
| Pin produk F11 | I/O — User I/O pin (bank 4) |
| Pin produk F12 | I/O — User I/O pin (bank 4) |
| Pin produk G1 | I/O — User I/O pin (bank 5) |
| Pin produk G2 | I/O — User I/O pin (bank 5) |
| Pin produk G3 | I/O — User I/O pin (bank 5) |
| Pin produk G4 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk G5 | I/O — User I/O pin (bank 5) |
| Pin produk G6 | I/O — User I/O pin (bank 5) |
| Pin produk G7 | I/O — User I/O pin (bank 5) |
| Pin produk G8 | GND — Ground |
| Pin produk G9 | I/O — User I/O pin (bank 6) |
| Pin produk G10 | I/O — User I/O pin (bank 6) |
| Pin produk G11 | I/O — User I/O pin (bank 6) |
| Pin produk G12 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk H1 | I/O — User I/O pin (bank 5) |
| Pin produk H2 | GND — Ground |
| Pin produk H3 | I/O — User I/O pin (bank 5) |
| Pin produk H4 | I/O — User I/O pin (bank 5) |
| Pin produk H5 | I/O — User I/O pin (bank 5) |
| Pin produk H6 | GND — Ground |
| Pin produk H7 | I/O — User I/O pin (bank 5) |
| Pin produk H8 | I/O — User I/O pin (bank 5) |
| Pin produk H9 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk H10 | I/O — User I/O pin (bank 6) |
| Pin produk H11 | I/O — User I/O pin (bank 6) |
| Pin produk H12 | I/O — User I/O pin (bank 6) |
| Pin produk J1 | I/O — User I/O pin (bank 7) |
| Pin produk J2 | I/O — User I/O pin (bank 7) |
| Pin produk J3 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk J4 | I/O — User I/O pin (bank 7) |
| Pin produk J5 | GND — Ground |
| Pin produk J6 | I/O — User I/O pin (bank 7) |
| Pin produk J7 | I/O — User I/O pin (bank 7) |
| Pin produk J8 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk J9 | I/O — User I/O pin (bank 8) |
| Pin produk J10 | GND — Ground |
| Pin produk J11 | I/O — User I/O pin (bank 8) |
| Pin produk J12 | I/O — User I/O pin (bank 8) |
| Pin produk K1 | I/O — User I/O pin (bank 7) |
| Pin produk K2 | I/O — User I/O pin (bank 7) |
| Pin produk K3 | I/O — User I/O pin (bank 7) |
| Pin produk K4 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk K5 | I/O — User I/O pin (bank 7) |
| Pin produk K6 | I/O — User I/O pin (bank 7) |
| Pin produk K7 | I/O — User I/O pin (bank 7) |
| Pin produk K8 | GND — Ground |
| Pin produk K9 | I/O — User I/O pin (bank 8) |
| Pin produk K10 | I/O — User I/O pin (bank 8) |
| Pin produk K11 | I/O — User I/O pin (bank 8) |
| Pin produk K12 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk L1 | TCK — JTAG Test Clock |
| Pin produk L2 | TDO — JTAG Test Data Out |
| Pin produk L3 | TMS — JTAG Test Mode Select |
| Pin produk L4 | TDI — JTAG Test Data In |
| Pin produk L5 | nCONFIG — Configuration control (active low) |
| Pin produk L6 | nSTATUS — Configuration status (active low) |
| Pin produk L7 | DCLK — Configuration clock input |
| Pin produk L8 | DATA0 — Configuration data input |
| Pin produk L9 | MSEL0 — Configuration mode select 0 |
| Pin produk L10 | MSEL1 — Configuration mode select 1 |
| Pin produk L11 | CLK0 — Clock input 0 (dedicated) |
| Pin produk L12 | CLK1 — Clock input 1 (dedicated) |
Aplikasi Umum
EP20K30EFI144-2X cocok untuk 6 aplikasis: Telecom Interface Cards, PCI Bus Interface Glue Logic, Industrial Control State Machines, Low-Density DSP Preprocessing, Networking Protocol Bridging, Legacy Test and Measurement Instrumentation.
Telecom Interface Cards
The EP20K30EFI144-2X's 1200 logic elements and 93 user I/O make it suitable for telecom interface cards implementing protocol bridges, framing logic, and low-density SERDES control planes. Its 24576 embedded RAM bits provide buffering for cell/packet payloads in ATM or Ethernet-over-SDH designs. The 1.8 V core and multi-standard I/O (LVTTL, LVCMOS, HSTL, GTL+) simplify interfacing to legacy telecom ASICs. Industrial temperature grade supports outdoor enclosures.
Direkomendasikan
PCI Bus Interface Glue Logic
The EP20K30EFI144-2X integrates well into PCI 32-bit/33 MHz bus designs by providing target/master state machines, address decoding, and interrupt handling in a single 144-FBGA device. PCI-compliant I/O standards are supported natively through dedicated VCCIO banks. The 1200 logic cells are sufficient for typical bridge functions between a host CPU and peripheral ASICs, reducing board area and BOM cost versus discrete logic.
Direkomendasikan
Industrial Control State Machines
The EP20K30EFI144-2X is widely deployed in factory automation PLCs, motor controllers, and process control systems because of its industrial temperature rating and deterministic LUT-based logic. The 192 macrocells and embedded RAM blocks allow multi-axis state machine sequencing, encoder interface logic, and PWM generation in one device. Field programmability supports late-stage customization without ASIC redesign cycles.
Direkomendasikan
Low-Density DSP Preprocessing
The EP20K30EFI144-2X handles low-density DSP preprocessing tasks such as FIR filtering, fixed-point arithmetic, and data routing before downstream processors. While the APEX 20KE family lacks hardware multipliers, 1200 cells suffice for 8-bit or 16-bit preprocessing in audio or video pipelines. The embedded system blocks (ESBs) double as fast dual-port RAM for coefficient storage, eliminating external SRAM.
Direkomendasikan
Networking Protocol Bridging
The EP20K30EFI144-2X provides cost-effective bridging between Ethernet, HDLC, Frame Relay, and proprietary protocols in legacy router and switch line cards. The 1200 cells support protocol encapsulation, header parsing, and forwarding tables, while the embedded RAM caches routing entries for fast lookups. Multiple VCCIO banks connect directly to 3.3 V and 5 V PHYs without level shifters.
Direkomendasikan
Legacy Test and Measurement Instrumentation
The EP20K30EFI144-2X is commonly found in legacy oscilloscopes, logic analyzers, and signal generators as timing control, trigger logic, and display interface glue. The JTAG interface simplifies firmware updates in production. Industrial temperature grade supports lab and field environments. Note: new designs should consider Cyclone IV GX or Lattice ECP5 for modern instrumentation platforms.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP20K30EFI144-2X — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP20K30EFC144-2X | EP20K30EFC144-1 | EP20K30EFI144-2XN | EP20K30EFC144-3 | EP20K30EFC144-1N | EP20K30EFC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-FBGA | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Logic Elements | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Embedded RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Maximum User I/O | 93 | 93 | 93 | 93 | 93 | 93 | 93 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
Diferensiator Kunci
- Same 144-FBGA footprint across entire speed grade and Pb-free matrix (vsEP20K30EFC144-2X vs EP20K30EFC144-3)
- Industrial temperature grade with Pb-free availability (vsEP20K30EFI144-2X vs EP20K30EFC144-2X)
- Mid-density APEX 20KE position with 93 I/O in compact FBGA (vsEP20K30EFI144-2X vs EP20K100EFC324-2X)
Catatan Desain
Estimated: VCCINT must be regulated to 1.8 V ±5% with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per VCCINT ball. Each VCCIO bank can be set independently to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V via LVTTL/LVCMOS/PCI/HSTL/GTL+ I/O standards. Place one 0.1 µF ceramic per VCCIO ball and one 10 µF bulk per bank to suppress switching transients during configuration. Multiple ground balls must be connected to a low-impedance ground plane.
The 144-FBGA package requires 1.0 mm ball pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for best thermal cycling reliability. Use 4-6 layer PCB with continuous ground planes beneath the BGA for VCCINT/GND return paths. Via-in-pad with filled and plated-over copper is recommended for inner balls to escape routing. Reflow profile must not exceed 220 °C peak (SnPb) or 245 °C peak (Pb-free) per JEDEC J-STD-020.
Do not leave MSEL0/MSEL1 floating: tie them high or low to select the configuration mode (AS, PS, JTAG). nCONFIG must be held high via 10 kΩ pull-up; nSTATUS requires 10 kΩ pull-up. During multi-device configuration, all EP20K30E devices must share DCLK and DATA0. The legacy Quartus II (v9.0 or earlier) toolchain is mandatory - Quartus Prime does not support APEX 20KE bitstream generation.
Differential clock inputs (CLK0/CLK1) require 50 Ω controlled-impedance routing and AC termination if driving from a non-TTL source. Series dampen resistors (33 Ω) on high-speed I/O signals crossing bank boundaries reduce reflections. JTAG chain (TCK/TMS/TDI/TDO) should be buffered if the chain exceeds 4 devices; otherwise TDO fanout degradation can cause configuration failures.
Informasi Konformitas
Compliance data not provided in Verified Web Data. The -N suffix variants (e.g., EP20K30EFI144-2XN) are by convention Pb-free; however, explicit RoHS/REACH declarations should be requested from Intel/Avnet for production use. APEX 20KE FPGAs are obsolete and not AEC-Q100 qualified.