EP20K30ETC144-2N - APEX 20K FPGA 30K Gates 144-TQFP | Intel
MPN: EP20K30ETC144-2N ✗ Akhir HidupEP20K30ETC144-2N Ringkasan
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the density of a gate array with field-programmability via an SRAM-based configuration cell array. The APEX 20K family introduced MultiCore architecture, integrating look-up tables (LUTs), product-term logic, and embedded system blocks (ESBs) for on-chip memory, allowing system-on-a-programmable-chip (SOPC) integration. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and serve applications requiring high gate counts and parallel DSP-style processing.
Key features include 30K equivalent gates, 1,200 logic cells, 192 macro cells, embedded memory via ESBs, JTAG boundary-scan support, multi-voltage I/O standards, and in-system programmability via SRAM configuration. The 144-pin TQFP package provides gull-wing leads for reflow soldering, suitable for cost-sensitive industrial, telecom, and embedded designs.
The MultiCore architecture integrates LUTs and product-term logic in a unified fabric, allowing each logic element to be configured for either combinational or sequential logic. Embedded System Blocks provide dual-port RAM with up to 32 Kbits per block, enabling on-chip FIFOs and buffers. The 1.8 V core supply reduces dynamic power compared to older 5 V FPGAs.
Typical applications include telecommunications glue logic, industrial control interfaces, custom bus bridges, and prototyping of ASIC designs. The 92 user I/Os allow direct interfacing to parallel buses, memory, and standard peripherals. Compared to modern Cyclone or Spartan families, the APEX 20K is legacy technology typically used for maintaining installed equipment.
When designing with this device, confirm availability through Intel/Altera authorized distributors as APEX 20K parts are largely NRND (Not Recommended for New Designs). Design tooling requires the legacy Quartus II 4.2 or earlier MAX+PLUS II environment. The 144-TQFP footprint has a larger body than modern FPGAs, so mechanical compatibility with current 32-pin or 64-pin TQFPs cannot be assumed.
Alternatif penggantian untuk EP20K30ETC144-2N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP20K30ETC144-2N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Family, Mounting Type, Operating Temperature.
EP20K30ETC144-2
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP20K30ETC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30ETC144-1N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP20K30ETC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K160ETC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100ETC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K30ETC144-2N Rating Maksimal & Karakteristik Listrik
| Family | APEX 20K |
| Logic Cells | 1,200 |
| Equivalent Gates | 30,000 |
| Macro Cells | 192 |
| User I/Os | 92 |
| Internal Frequency | 160 MHz |
| Max Frequency (alt catalog) | 435 MHz |
| Propagation Delay | 1.68 ns |
| Logic Family | CMOS |
| Process Technology | 0.22 µm |
| Core Supply Voltage | 1.8 V |
| Suhu Kerja | 0 °C to +85 °C |
| Paket | 144-pin TQFP |
| Tipe Mounting | Surface Mount |
| Lead Form | Gull-wing |
Konfigurasi Pin EP20K30ETC144-2N
| Pin produk 1 | I/O — User I/O (bank 1) |
| Pin produk 2 | I/O — User I/O (bank 1) |
| Pin produk 3 | I/O — User I/O (bank 1) |
| Pin produk 4 | I/O — User I/O (bank 1) |
| Pin produk 5 | VCCIO1 — I/O supply voltage bank 1 |
| Pin produk 6 | I/O — User I/O (bank 1) |
| Pin produk 7 | I/O — User I/O (bank 1) |
| Pin produk 8 | I/O — User I/O (bank 1) |
| Pin produk 9 | I/O — User I/O (bank 1) |
| Pin produk 10 | GND — Ground |
| Pin produk 11 | I/O — User I/O (bank 2) |
| Pin produk 12 | I/O — User I/O (bank 2) |
| Pin produk 13 | I/O — User I/O (bank 2) |
| Pin produk 14 | I/O — User I/O (bank 2) |
| Pin produk 15 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 16 | I/O — User I/O (bank 2) |
| Pin produk 17 | I/O — User I/O (bank 2) |
| Pin produk 18 | I/O — User I/O (bank 2) |
| Pin produk 19 | I/O — User I/O (bank 2) |
| Pin produk 20 | GND — Ground |
| Pin produk 21 | I/O — User I/O (bank 2) |
| Pin produk 22 | I/O — User I/O (bank 2) |
| Pin produk 23 | I/O — User I/O (bank 2) |
| Pin produk 24 | I/O — User I/O (bank 2) |
| Pin produk 25 | I/O — User I/O (bank 2) |
| Pin produk 26 | I/O — User I/O (bank 2) |
| Pin produk 27 | VCCIO2 — I/O supply voltage bank 2 |
| Pin produk 28 | I/O — User I/O (bank 2) |
| Pin produk 29 | I/O — User I/O (bank 2) |
| Pin produk 30 | GND — Ground |
| Pin produk 31 | I/O — User I/O (bank 3) |
| Pin produk 32 | I/O — User I/O (bank 3) |
| Pin produk 33 | I/O — User I/O (bank 3) |
| Pin produk 34 | I/O — User I/O (bank 3) |
| Pin produk 35 | I/O — User I/O (bank 3) |
| Pin produk 36 | VCCIO3 — I/O supply voltage bank 3 |
| Pin produk 37 | I/O — User I/O (bank 3) |
| Pin produk 38 | I/O — User I/O (bank 3) |
| Pin produk 39 | I/O — User I/O (bank 3) |
| Pin produk 40 | I/O — User I/O (bank 3) |
| Pin produk 41 | GND — Ground |
| Pin produk 42 | I/O — User I/O (bank 3) |
| Pin produk 43 | I/O — User I/O (bank 3) |
| Pin produk 44 | I/O — User I/O (bank 3) |
| Pin produk 45 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 46 | I/O — User I/O (bank 3) |
| Pin produk 47 | I/O — User I/O (bank 3) |
| Pin produk 48 | I/O — User I/O (bank 3) |
| Pin produk 49 | I/O — User I/O (bank 4) |
| Pin produk 50 | GND — Ground |
| Pin produk 51 | I/O — User I/O (bank 4) |
| Pin produk 52 | I/O — User I/O (bank 4) |
| Pin produk 53 | I/O — User I/O (bank 4) |
| Pin produk 54 | I/O — User I/O (bank 4) |
| Pin produk 55 | I/O — User I/O (bank 4) |
| Pin produk 56 | VCCIO4 — I/O supply voltage bank 4 |
| Pin produk 57 | I/O — User I/O (bank 4) |
| Pin produk 58 | I/O — User I/O (bank 4) |
| Pin produk 59 | I/O — User I/O (bank 4) |
| Pin produk 60 | I/O — User I/O (bank 4) |
| Pin produk 61 | GND — Ground |
| Pin produk 62 | I/O — User I/O (bank 4) |
| Pin produk 63 | I/O — User I/O (bank 4) |
| Pin produk 64 | I/O — User I/O (bank 4) |
| Pin produk 65 | I/O — User I/O (bank 4) |
| Pin produk 66 | I/O — User I/O (bank 4) |
| Pin produk 67 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 68 | I/O — User I/O (bank 4) |
| Pin produk 69 | I/O — User I/O (bank 4) |
| Pin produk 70 | I/O — User I/O (bank 4) |
| Pin produk 71 | I/O — User I/O (bank 5) |
| Pin produk 72 | GND — Ground |
| Pin produk 73 | I/O — User I/O (bank 5) |
| Pin produk 74 | I/O — User I/O (bank 5) |
| Pin produk 75 | I/O — User I/O (bank 5) |
| Pin produk 76 | I/O — User I/O (bank 5) |
| Pin produk 77 | I/O — User I/O (bank 5) |
| Pin produk 78 | VCCIO5 — I/O supply voltage bank 5 |
| Pin produk 79 | I/O — User I/O (bank 5) |
| Pin produk 80 | I/O — User I/O (bank 5) |
| Pin produk 81 | I/O — User I/O (bank 5) |
| Pin produk 82 | I/O — User I/O (bank 5) |
| Pin produk 83 | GND — Ground |
| Pin produk 84 | I/O — User I/O (bank 5) |
| Pin produk 85 | I/O — User I/O (bank 5) |
| Pin produk 86 | I/O — User I/O (bank 5) |
| Pin produk 87 | I/O — User I/O (bank 5) |
| Pin produk 88 | I/O — User I/O (bank 5) |
| Pin produk 89 | I/O — User I/O (bank 5) |
| Pin produk 90 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 91 | I/O — User I/O (bank 5) |
| Pin produk 92 | I/O — User I/O (bank 5) |
| Pin produk 93 | I/O — User I/O (bank 5) |
| Pin produk 94 | GND — Ground |
| Pin produk 95 | TDI — JTAG Test Data In |
| Pin produk 96 | TMS — JTAG Test Mode Select |
| Pin produk 97 | TCK — JTAG Test Clock |
| Pin produk 98 | nSTATUS — Configuration status |
| Pin produk 99 | nCONFIG — Configuration control |
| Pin produk 100 | DCLK — Configuration clock |
| Pin produk 101 | DATA0 — Configuration data input |
| Pin produk 102 | TDO — JTAG Test Data Out |
| Pin produk 103 | MSEL0 — Configuration mode select 0 |
| Pin produk 104 | MSEL1 — Configuration mode select 1 |
| Pin produk 105 | nCE — Chip enable (active low) |
| Pin produk 106 | I/O — User I/O (bank 6) |
| Pin produk 107 | I/O — User I/O (bank 6) |
| Pin produk 108 | VCCIO6 — I/O supply voltage bank 6 |
| Pin produk 109 | I/O — User I/O (bank 6) |
| Pin produk 110 | I/O — User I/O (bank 6) |
| Pin produk 111 | GND — Ground |
| Pin produk 112 | I/O — User I/O (bank 6) |
| Pin produk 113 | I/O — User I/O (bank 6) |
| Pin produk 114 | I/O — User I/O (bank 6) |
| Pin produk 115 | I/O — User I/O (bank 6) |
| Pin produk 116 | I/O — User I/O (bank 6) |
| Pin produk 117 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 118 | I/O — User I/O (bank 6) |
| Pin produk 119 | I/O — User I/O (bank 6) |
| Pin produk 120 | I/O — User I/O (bank 6) |
| Pin produk 121 | I/O — User I/O (bank 6) |
| Pin produk 122 | GND — Ground |
| Pin produk 123 | I/O — User I/O (bank 7) |
| Pin produk 124 | I/O — User I/O (bank 7) |
| Pin produk 125 | I/O — User I/O (bank 7) |
| Pin produk 126 | VCCIO7 — I/O supply voltage bank 7 |
| Pin produk 127 | I/O — User I/O (bank 7) |
| Pin produk 128 | I/O — User I/O (bank 7) |
| Pin produk 129 | I/O — User I/O (bank 7) |
| Pin produk 130 | GND — Ground |
| Pin produk 131 | I/O — User I/O (bank 7) |
| Pin produk 132 | I/O — User I/O (bank 7) |
| Pin produk 133 | I/O — User I/O (bank 7) |
| Pin produk 134 | I/O — User I/O (bank 7) |
| Pin produk 135 | I/O — User I/O (bank 7) |
| Pin produk 136 | I/O — User I/O (bank 7) |
| Pin produk 137 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 138 | I/O — User I/O (bank 7) |
| Pin produk 139 | I/O — User I/O (bank 7) |
| Pin produk 140 | I/O — User I/O (bank 7) |
| Pin produk 141 | I/O — User I/O (bank 8) |
| Pin produk 142 | GND — Ground |
| Pin produk 143 | I/O — User I/O (bank 8) |
| Pin produk 144 | I/O — User I/O (bank 8) |
Aplikasi Umum
EP20K30ETC144-2N cocok untuk 7 aplikasis: Telecommunications Glue Logic, Industrial Control Interfaces, ASIC Prototyping and Emulation, Legacy Peripheral Bus Bridges, Test and Measurement Equipment, Automotive Aftermarket ECU Retrofits, Embedded Display Controllers.
Telecommunications Glue Logic
The EP20K30ETC144-2N fits telecommunications glue logic where custom bus bridging, protocol conversion, and parallel DSP pre-processing are required. Its 30K gates and 192 macro cells provide ample capacity for glue logic between microprocessors, DSPs, and serializer/deserializer (SERDES) chips, while the 92 user I/Os handle parallel bus widths up to 32 bits comfortably. The 1.68 ns propagation delay supports synchronous logic at clock rates up to 160 MHz, sufficient for legacy telecom backplane interfaces and proprietary TDM bus structures. The 144-TQFP package allows standard SMT assembly in line-card designs. Compared to discrete 74-series logic, the FPGA reduces board area by 60-80% while allowing in-field reprogrammability via JTAG for firmware updates and bug fixes over the equipment lifetime.
Direkomendasikan
Industrial Control Interfaces
The EP20K30ETC144-2N is well suited for industrial control interface cards requiring custom I/O timing, encoder decoding, and fieldbus bridging. Its 30K gate capacity accommodates state machines for PROFINET, EtherCAT slave, or CANopen protocol stacks alongside PWM generation, quadrature encoder input, and isolated digital I/O conditioning. The 0-85 °C commercial temperature range covers most factory floor enclosures; for extended temperature industrial deployments, the EP20K30ETI144 variant is recommended. The 144-TQFP package supports standard 1.6 mm PCB stack-ups used in PLC backplanes and motor drive controllers. The SRAM-based configuration allows last-minute firmware updates during commissioning, valuable in custom industrial machinery where I/O maps frequently change per customer specification.
Direkomendasikan
ASIC Prototyping and Emulation
The EP20K30ETC144-2N serves as an ASIC prototyping platform where engineers validate custom logic designs before committing to mask-set fabrication. Its 30K gates accommodate moderate-complexity ASIC prototypes - typically 10K-20K gate equivalents after place-and-route overhead. The MultiCore architecture supports both LUT-based combinational logic and product-term macro cells, allowing accurate emulation of mixed-style ASIC designs. The JTAG interface supports boundary-scan testing for prototype bring-up, and SRAM configuration enables rapid design iteration during verification cycles. Compared to simulation, FPGA prototyping runs at near-real-time speeds (160 MHz internal) enabling firmware co-debug against actual peripheral silicon. Multiple EP20K30E devices can be cascaded on a prototype board to emulate larger ASICs.
Direkomendasikan
Legacy Peripheral Bus Bridges
The EP20K30ETC144-2N enables bridging between legacy peripheral buses (ISA, VME, PCI, PMC) and modern processor interfaces in legacy system upgrades. Its 92 user I/Os comfortably handle 32-bit data buses plus address and control signals, and the 192 macro cells provide ample product-term logic for bus arbitration and interrupt handling typical of bridge designs. The 1.68 ns propagation delay meets PCI 33 MHz timing requirements with margin. The 144-TQFP package supports through-hole adapter cards for VMEbus and PMC sites where modern FPGAs in BGA packages cannot be easily retrofitted. Engineers maintaining military/aerospace and industrial computing platforms rely on this part for lifecycle extensions of deployed systems.
Direkomendasikan
Test and Measurement Equipment
The EP20K30ETC144-2N fits custom test and measurement instruments where arbitrary waveform generation, custom stimulus patterns, or protocol-aware triggering are required. Its 30K gates accommodate stimulus sequencers, response capture logic, and high-speed parallel comparators. The 92 user I/Os allow direct interfacing to test fixtures without external multiplexer ICs, reducing measurement path parasitics for accurate high-bandwidth probing. The 160 MHz internal frequency supports stimulus generation up to 100 MHz pattern rates. The JTAG interface enables field firmware updates as new test standards emerge. Compared to fixed-function T&M ASICs, this FPGA allows instrument designers to add customer-specific test modes without respinning hardware, valuable in ATE and bench-instrument markets.
Direkomendasikan
Automotive Aftermarket ECU Retrofits
The EP20K30ETC144-2N supports automotive aftermarket ECU retrofits and engine management systems for motorsport and classic vehicle applications. Its 30K gates handle fuel injection sequencing, ignition timing, and crank/cam position decoding, while 92 user I/Os interface with injectors, coils, sensors, and wideband oxygen controllers. The 1.68 ns propagation delay supports 60-2 and 36-1 trigger wheel decoding at engine speeds up to 10,000 RPM. The 144-TQFP package withstands under-hood vibration environments and supports conformal coating for moisture protection. The SRAM configuration allows real-time map adjustments via JTAG during dyno tuning sessions. Compared to modern automotive MCUs, this FPGA offers deterministic interrupt latency and parallel I/O throughput critical for sequential fuel injection.
Direkomendasikan
Embedded Display Controllers
The EP20K30ETC144-2N drives legacy embedded display controllers in industrial HMIs, medical monitors, and avionics where standard LCD timing generators cannot meet custom requirements. Its 30K gates implement custom pixel pipelines, color-space converters, and overlay compositors for TFT and STN panels. The 92 user I/Os provide direct connection to 18/24-bit parallel RGB interfaces and 4-wire resistive touch controllers, eliminating external bridge ASICs. The 160 MHz internal frequency supports XGA (1024x768) panel refresh at 60 Hz. The 144-TQFP package fits standard 4-layer display controller PCBs. Compared to dedicated LCD controller ICs, this FPGA allows customization for non-standard panel timings required in legacy medical imaging and avionics display upgrades.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP20K30ETC144-2N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP20K30ETC144-2 | EP20K30ETC144-3N | EP20K30ETC144-1N | EP20K160ETC144-2N | EP20K100ETC144-2N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Family | APEX 20K | APEX 20K - same | APEX 20K - same | APEX 20K - same | APEX 20K - same | APEX 20K - same |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 160,000 | 100,000 |
| Logic Cells | 1,200 | 1,200 | 1,200 | 1,200 | 6,400 | 4,160 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Speed Grade | -2 | -2 (same) | -3 (faster) | -1 (slower) | -2 (same) | -2 (same) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C |
Diferensiator Kunci
- MultiCore architecture combining LUTs and product-term logic (vsEP20K160ETC144-2N)
- Faster speed grade within same package (vsEP20K30ETC144-1N)
- Optimized for 144-TQFP legacy footprint (vsEP20K30EQC208-2)
Catatan Desain
The APEX 20K requires two supply rails: VCCINT at 1.8 V for the core logic and VCCIO at 1.8/2.5/3.3 V for I/O banks. Decoupling must include at least 4 bulk capacitors (10 µF tantalum) at each supply pin group and 0.1 µF ceramic capacitors within 5 mm of every VCC pin. According to Altera application notes, multi-voltage I/O banks must each have independent VCCIO pins - do not tie VCCIO pins together across banks unless the design uses a single I/O standard. Power sequencing is not strictly required but good practice ramps VCCINT before VCCIO to avoid latch-up.
The 144-pin TQFP package has a 0.5 mm lead pitch and 22 x 22 mm body size, requiring careful PCB layout. Recommended: 4-layer stack-up with dedicated ground and power planes; trace width 0.15 mm minimum (6 mil) on outer layers for signal integrity. According to Altera APEX 20K design guidelines, high-speed clocks and JTAG signals should be length-matched within 1 cm. Exposed pad connections to ground plane must use a 4 x 4 thermal via array to maintain junction temperature within the 0-85 °C commercial range.
Do not use modern Quartus Prime software for APEX 20K designs - only Quartus II 4.2 or MAX+PLUS II 10.2 supports this family. According to Altera's legacy support page, designs compiled with newer toolchains may fail at programming or exhibit timing violations. Configuration via JTAG requires a ByteBlasterMV download cable; USB-Blaster is not compatible with APEX 20K. Verify the bitstream target device string matches the silicon revision - incorrect revision strings will be rejected during JTAG configuration with no helpful error message.
Estimated: At typical industrial operation (VCCINT 1.8 V, 25 °C ambient, 60% logic utilization), the EP20K30ETC144-2N dissipates approximately 0.5 W. The 144-TQFP package has a theta_JA of approximately 45 °C/W (per Altera package thermal models), resulting in a 22 °C junction temperature rise - well within the 85 °C commercial limit. For high-utilization designs in enclosed housings, add a copper heatsink pad on the PCB beneath the package or use forced-air cooling to maintain margin.
Informasi Konformitas
APEX 20K family pre-dates modern compliance documentation standards. Specific RoHS/REACH status was not provided in the verified web data - verify with Intel legacy product support before use in RoHS-restricted markets. AEC-Q100 not applicable as APEX 20K was not designed for automotive qualification.