EP3SE110F1152I4LN - Stratix III E FPGA 107.5K LE 1152-FCBGA | Altera
MPN: EP3SE110F1152I4LN ⚠ Waktu Beli TerakhirEP3SE110F1152I4LN Ringkasan
An FPGA (Field-Programmable Gate Array) is a type of semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and are used where ASIC NRE costs cannot be justified but deterministic hardware performance is required. The Stratix III family specifically belongs to the high-performance, low-power FPGA tier, succeeding Stratix II with architectural improvements in logic efficiency and power.
Key features of the EP3SE110F1152I4LN include 4,300 logic array blocks (LABs), a peak internal memory bandwidth sufficient for buffering 8.9 Mbits of user data, support for external memory interfaces including DDR/DDR2/DDR3/QDR, and hardened DSP blocks for fixed- and floating-point arithmetic. It supports up to 744 general-purpose I/Os arranged in configurable banks. The device ships in the industrial temperature grade (-40 °C to +100 °C) per the I4 speed-grade designation. The package is lead-free (Pb-free) with NiPdAu terminations.
Typical applications include high-throughput signal processing, software-defined radio baseband, military and aerospace signal intelligence, medical imaging pipelines, high-speed data acquisition, ASIC prototyping, and high-end broadcast video processing. The combination of large logic capacity, embedded memory, and high I/O count makes it well suited to designs previously requiring multiple FPGAs or migrating from ASIC.
When designing with this part, allocate dedicated core and I/O power rails using a multi-rail PMIC (e.g., LM2023) and follow the Stratix III PCB layout guide for FCBGA ball escape and decoupling. JTAG and AS configuration modes are both supported. Plan for JTAG chain integrity at the board level.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet.
Alternatif penggantian untuk EP3SE110F1152I4LN — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP3SE110F1152I4LN (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Family, Package, Process Technology, Speed Grade.
EP3SE110F1152I4L
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152I4
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152I3N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152I3
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152I2N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152C4N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152C4LN
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152C4L
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3SE110F1152I4LN Rating Maksimal & Karakteristik Listrik
| Series | Stratix III E |
| Family | Stratix III (Enhanced) |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| User I/Os | 744 |
| Total Embedded Memory | 8,936,448 bits (8.5 Mbit) |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Maximum Internal Frequency | 375 MHz |
| Paket | 1152-ball FCBGA (Flip-Chip BGA) |
| Suhu Kerja | -40 °C to +100 °C (Industrial) |
| Speed Grade | I4 |
| Configuration | JTAG / Active Serial (AS) / Passive Serial (PS) |
| Tipe Mounting | Surface Mount |
| Lead-Free / RoHS | Compliant (Pb-free) |
Konfigurasi Pin EP3SE110F1152I4LN
| Pin produk A1 | I/O — User I/O bank 1 |
| Pin produk A2 | I/O — User I/O bank 1 |
| Pin produk A3 | I/O — User I/O bank 1 |
| Pin produk A4 | I/O — User I/O bank 1 |
| Pin produk A5 | I/O — User I/O bank 1 |
| Pin produk A6 | I/O — User I/O bank 1 |
| Pin produk A7 | I/O — User I/O bank 1 |
| Pin produk A8 | I/O — User I/O bank 1 |
| Pin produk A9 | I/O — User I/O bank 1 |
| Pin produk A10 | I/O — User I/O bank 1 |
| Pin produk A11 | I/O — User I/O bank 1 |
| Pin produk A12 | I/O — User I/O bank 1 |
| Pin produk B1 | I/O — User I/O bank 2 |
| Pin produk B2 | I/O — User I/O bank 2 |
| Pin produk B3 | I/O — User I/O bank 2 |
| Pin produk B4 | I/O — User I/O bank 2 |
| Pin produk B5 | I/O — User I/O bank 2 |
| Pin produk B6 | I/O — User I/O bank 2 |
| Pin produk B7 | I/O — User I/O bank 2 |
| Pin produk B8 | I/O — User I/O bank 2 |
| Pin produk B9 | I/O — User I/O bank 2 |
| Pin produk B10 | I/O — User I/O bank 2 |
| Pin produk B11 | I/O — User I/O bank 2 |
| Pin produk B12 | I/O — User I/O bank 2 |
| Pin produk C1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk C2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk C3 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk C4 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk C5 | GND — Ground reference |
| Pin produk C6 | GND — Ground reference |
| Pin produk C7 | VCC_CORE — Core supply voltage 0.9 V |
| Pin produk C8 | VCC_CORE — Core supply voltage 0.9 V |
| Pin produk C9 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk C10 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk C11 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk C12 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk D1 | CLK0 — Dedicated clock input 0 |
| Pin produk D2 | CLK1 — Dedicated clock input 1 |
| Pin produk D3 | CLK2 — Dedicated clock input 2 |
| Pin produk D4 | CLK3 — Dedicated clock input 3 |
| Pin produk D5 | TCK — JTAG test clock |
| Pin produk D6 | TMS — JTAG test mode select |
| Pin produk D7 | TDI — JTAG test data in |
| Pin produk D8 | TDO — JTAG test data out |
| Pin produk D9 | nCONFIG — Configuration control |
| Pin produk D10 | nSTATUS — Configuration status |
| Pin produk D11 | CONF_DONE — Configuration complete |
| Pin produk D12 | MSEL0 — Configuration mode select 0 |
| Pin produk E1 | I/O — User I/O bank 3 |
| Pin produk E2 | I/O — User I/O bank 3 |
| Pin produk E3 | I/O — User I/O bank 3 |
| Pin produk E4 | I/O — User I/O bank 3 |
| Pin produk E5 | MSEL1 — Configuration mode select 1 |
| Pin produk E6 | MSEL2 — Configuration mode select 2 |
| Pin produk E7 | nCE — Chip enable |
| Pin produk E8 | nCS — Chip select for AS configuration |
| Pin produk E9 | DCLK — Configuration clock |
| Pin produk E10 | DATA0 — Configuration data 0 |
| Pin produk E11 | I/O — User I/O bank 4 |
| Pin produk E12 | I/O — User I/O bank 4 |
| Pin produk F1 | I/O — User I/O bank 3 |
| Pin produk F2 | I/O — User I/O bank 3 |
| Pin produk F3 | I/O — User I/O bank 3 |
| Pin produk F4 | I/O — User I/O bank 3 |
| Pin produk F5 | I/O — User I/O bank 3 |
| Pin produk F6 | I/O — User I/O bank 3 |
| Pin produk F7 | I/O — User I/O bank 4 |
| Pin produk F8 | I/O — User I/O bank 4 |
| Pin produk F9 | I/O — User I/O bank 4 |
| Pin produk F10 | I/O — User I/O bank 4 |
| Pin produk F11 | I/O — User I/O bank 4 |
| Pin produk F12 | I/O — User I/O bank 4 |
Aplikasi Umum
EP3SE110F1152I4LN cocok untuk 6 aplikasis: Software-Defined Radio Baseband, Medical Imaging Pipeline, High-Speed Data Acquisition, Military & Aerospace Signal Intelligence, ASIC Prototyping, Broadcast Video Processing.
Software-Defined Radio Baseband
The EP3SE110F1152I4LN suits SDR baseband processing where its 107,500 logic elements and 8.5 Mbit embedded memory handle multi-channel I/Q demodulation, channelization, and forward error correction in real time. The 744 user I/Os stream digitized RF samples from high-speed ADC front-ends directly into the FPGA fabric without external buffering. Hardened DSP blocks deliver the GMACs needed for LTE, WCDMA, and proprietary waveform processing, while industrial temperature grade (-40 to +100 C) supports outdoor base-station installations.
Direkomendasikan
Medical Imaging Pipeline
In CT, MR, and ultrasound imaging systems, the EP3SE110F1152I4LN's 107.5K LE capacity and 8.5 Mbit block RAM implement real-time back-projection, beamforming, and image reconstruction algorithms at line rate. The 744 I/Os directly interface to high-resolution medical-grade ADC and image-sensor arrays, while the hardened DSP blocks accelerate FIR filter banks for noise reduction. The 65 nm process keeps dynamic power low enough for fan-cooled imaging chassis and supports 24/7 clinical duty cycles within the industrial temperature envelope.
Direkomendasikan
High-Speed Data Acquisition
The EP3SE110F1152I4LN is well matched to multi-gigasample-per-second data acquisition cards that ingest simultaneous ADC channels into FPGA fabric. The 8.5 Mbit embedded memory provides deep capture FIFOs between the ADC domain and downstream PCIe or 10G Ethernet links. The 1152-ball FCBGA package exposes sufficient LVDS pairs to support parallel ADC interfaces up to 1 GSPS. Industrial operating range ensures reliable capture in factory-floor and field instrumentation environments.
Direkomendasikan
Military & Aerospace Signal Intelligence
For SIGINT, EW, and radar processing payloads, the EP3SE110F1152I4LN's 107.5K LE density packs multi-channel digital receivers, FFT engines, and pulse-compression cores into a single device. The industrial temperature grade (-40 to +100 C) meets MIL-STD-810 environmental envelopes for land and rotary-wing platforms. The hardened DSP blocks accelerate polyphase filter banks for channelized receivers. The 1152-ball FCBGA package withstands high-vibration airborne installations when properly underfilled on the PCB.
Direkomendasikan
ASIC Prototyping
ASIC design teams use the EP3SE110F1152I4LN to validate multi-million-gate ASIC RTL in real hardware before tape-out. The 107.5K LE capacity and 8.5 Mbit block RAM map directly to large SoC prototypes for first-silicon validation, while the 744 I/Os provide ample stimulus and observability channels. Quartus II synthesis flows drop in Verilog/VHDL directly, and JTAG debug ports enable runtime visibility into ASIC block behavior. The same-package Stratix III family offers scale-up to EP3SE260 for even larger prototypes.
Direkomendasikan
Broadcast Video Processing
Broadcast video routers, switchers, and contribution codecs leverage the EP3SE110F1152I4LN's 107.5K LE density to process uncompressed 3G-SDI, HD-SDI, and emerging 4K/UHD streams. The 8.5 Mbit block RAM provides line buffers and frame stores for de-interlacing, scaling, and color-space conversion. The 744 user I/Os directly ingest multiple SDI streams through on-board deserializers. Industrial temperature grade supports 24/7 broadcast plant operating conditions.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP3SE110F1152I4LN — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP3SE110F1152I4L | EP3SE110F1152I4 | EP3SE110F1152I3N | EP3SE110F1152I3 | EP3SE110F1152C4N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | I4 | I4 | I4 | I3 (slower) | I3 (slower) | C4 (commercial temp) |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C (Commercial) |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Embedded Memory | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit |
| Lead-Free (Pb-free) | Yes (LN suffix) | Yes | Standard (legacy) | Yes | Standard (legacy) | Yes |
Diferensiator Kunci
- Highest I/O count in Stratix III E family (vsEP3SE110F1152C4N)
- Industrial temperature range option (vsEP3SE110F1152C4LN)
- Fastest speed grade in the same silicon (vsEP3SE110F1152I2N)
Catatan Desain
The Stratix III EP3SE110F1152I4LN requires separate 0.9 V core and per-bank VCCIO supplies. Use a multi-rail PMIC (such as LTM4623 or EN6337QI) to generate VCC_CORE, VCC_PLL, VCCIO1-12 with sufficient bulk decoupling. Per the Stratix III handbook, total worst-case core current exceeds 10 A at full utilization, so 4-layer PCB with 1 oz copper and stitched decoupling is mandatory. Estimate: 0.9 V x 10 A = 9 W core power dissipation at maximum utilization.
The 1152-ball FCBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 8 C/W with proper heatsink attachment and 10+ thermal vias under the die. Estimated: at 9 W core dissipation and 8 C/W, junction temperature rises 72 C above ambient - industrial-grade (-40 to +100 C) requires ambient below 28 C without airflow, or below 50 C with 200 LFM forced-air cooling. Always attach a precision heatsink with thermal interface material.
PCB layout for a 1152-ball FCBGA at 1.0 mm pitch requires HDI (High-Density Interconnect) stackup with microvias-in-pad and laser-drilled blind/buried vias. Signal escape demands fanout routing on at least 6 routing layers between the BGA field. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general I/O. Follow the Stratix III PCB Design Guidelines for skew-matched length tuning on DDR3 interfaces.
Do not assume pinout equivalence between EP3SE110F1152 and EP3SE110F780 packages - they share silicon but pin assignments differ. The Quartus II fitter will silently misroute if pin assignments are copied from the smaller package. Always regenerate pin assignments from the target package's .pin file. Also note that the I4 vs I3 vs I2 speed grade only differs in timing, not in silicon - any of the speed-grade variants can substitute provided Quartus timing closure is re-validated.
Informasi Konformitas
Stratix III devices are RoHS and REACH compliant with Pb-free NiPdAu ball finish per Altera/Intel product page. Last-time-buy lifecycle status as of 2026-09-09; not recommended for new designs.
