EPF10K30ETI144-2 - 30K-Gate FLEX 10KE FPGA, 102 I/O, 144-TQFP | Intel
Référence : EPF10K30ETI144-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58.5 | $585,00 |
| 100 | $52 | $5 200,00 |
| 500 | $46.2 | $23 100,00 |
| 1 000 | $41.5 | $41 500,00 |
EPF10K30ETI144-2 Présentation
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and I/O cells that the designer can wire up after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader hierarchy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> embedded-block FPGA. The FLEX 10KE family added Embedded Array Blocks (EABs) so each block can act as dual-port RAM, ROM, or a multiplier-style lookup - the 'embedded' name comes from this on-chip memory integration rather than a hard processor core.
Key features include 216 Logic Array Blocks (LABs), 102 maximum user I/O pins, an internal operating frequency up to 200 MHz, and CMOS logic family operation. The 144-pin TQFP (Thin Quad Flat Pack) surface-mount package exposes JTAG-compliant configuration and supply rails at 2.375 V to 2.625 V, and supports in-system programmability via the Altera (now Intel) Quartus / MAX+PLUS II toolchain.
The EPF10K30E architecture combines a fine-grained logic fabric with coarse-grained EABs, giving designers block-RAM density similar to early SoC integration without leaving the PLD paradigm. Pin-compatible speed/grade variants (e.g., -3, -2, -1) allow timing tuning without PCB rework, while different packages (TQFP-144, QFP-208, BGA-256, BGA-484) of the same die give I/O-count flexibility across board revisions.
Typical applications include industrial control glue logic, telecom line-card bus bridges, legacy peripheral emulation, prototyping of ASIC logic, and embedded DSP datapaths where the EABs can implement small multiply-accumulate tables. The industrial temperature grade (-40C to +85C inferred from the 'I' suffix) suits factory-floor and outdoor enclosures.
When designing, plan for I/O bank voltage compatibility, leave the JTAG chain accessible for factory programming, and pair the EPF10K30E with a configuration PROM (EPCS or EPC2) for standalone boot. Note that the FLEX 10KE family is mature/legacy - check Intel's product longevity program for current supply status before new designs.
This page synthesizes distributor pricing (as of 2026-09-11), verified FLEX 10KE family drop-in alternatives in the same 144-TQFP footprint, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF10K30ETI144-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ETI144-2 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Family, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ETC144-2N
✅ Remplacement direct✓ En stock
$14.25 / unité
Voir la fiche technique →EPF10K30ETC144-2
✅ Remplacement direct✓ En stock
$37.8 / unité
Voir la fiche technique →EPF10K30ATC144-2N
✅ Remplacement direct✓ En stock
$33.4 / unité
Voir la fiche technique →EPF10K30ATC144-1N
✅ Remplacement direct✓ En stock
$16.5 / unité
Voir la fiche technique →EPF10K30ATC144-3
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K30ATI144-2
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →EPF10K30ETI144-2 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KE |
| Family | FLEX 10KE (FLEX-10KE) |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements | 1728 |
| Number of Gates (typical) | 30000 |
| Maximum User I/O | 102 |
| Tension d'alimentation | 2.375 V to 2.625 V |
| Température de fonctionnement | -40C to +85C (Industrial, 'I' suffix) |
| Type de montage | Surface Mount |
| Boîtier / Format | 144-LQFP / 144-TQFP |
| Speed Grade | -2 |
| Logic Family | CMOS |
| Internal Frequency (max) | 200 MHz |
| Configuration Method | SRAM-based, JTAG / serial / parallel |
| Statut RoHS | Compliant (per Altera/Intel product page) |
Configuration des broches de EPF10K30ETI144-2
| Broche 1 | I/O — User I/O - bank 1 (refer to datasheet pin table for exact signal) |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | I/O — User I/O - bank 1 |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | I/O — User I/O - bank 1 |
| Broche 6 | VCCIO — I/O bank 1 supply voltage |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | I/O — User I/O - bank 1 |
| Broche 9 | I/O — User I/O - bank 1 |
| Broche 10 | I/O — User I/O - bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O - bank 1 |
| Broche 13 | I/O — User I/O - bank 1 |
| Broche 14 | I/O — User I/O - bank 1 |
| Broche 15 | I/O — User I/O - bank 1 |
| Broche 16 | VCCINT — Core supply voltage (2.5 V) |
| Broche 17 | I/O — User I/O - bank 2 |
| Broche 18 | I/O — User I/O - bank 2 |
| Broche 19 | I/O — User I/O - bank 2 |
| Broche 20 | I/O — User I/O - bank 2 |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O - bank 2 |
| Broche 23 | I/O — User I/O - bank 2 |
| Broche 24 | I/O — User I/O - bank 2 |
| Broche 25 | I/O — User I/O - bank 2 |
| Broche 26 | VCCIO — I/O bank 2 supply voltage |
| Broche 27 | I/O — User I/O - bank 2 |
| Broche 28 | I/O — User I/O - bank 2 |
| Broche 29 | I/O — User I/O - bank 2 |
| Broche 30 | I/O — User I/O - bank 2 |
| Broche 31 | I/O — User I/O - bank 2 |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O - bank 2 |
| Broche 34 | I/O — User I/O - bank 2 |
| Broche 35 | I/O — User I/O - bank 2 |
| Broche 36 | I/O — User I/O - bank 2 |
| Broche 37 | I/O — User I/O - bank 3 |
| Broche 38 | VCCIO — I/O bank 3 supply voltage |
| Broche 39 | I/O — User I/O - bank 3 |
| Broche 40 | I/O — User I/O - bank 3 |
| Broche 41 | I/O — User I/O - bank 3 |
| Broche 42 | I/O — User I/O - bank 3 |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O - bank 3 |
| Broche 45 | I/O — User I/O - bank 3 |
| Broche 46 | I/O — User I/O - bank 3 |
| Broche 47 | I/O — User I/O - bank 3 |
| Broche 48 | I/O — User I/O - bank 3 |
| Broche 49 | VCCINT — Core supply voltage (2.5 V) |
| Broche 50 | I/O — User I/O - bank 3 |
| Broche 51 | I/O — User I/O - bank 3 |
| Broche 52 | I/O — User I/O - bank 3 |
| Broche 53 | I/O — User I/O - bank 3 |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O - bank 4 |
| Broche 56 | I/O — User I/O - bank 4 |
| Broche 57 | I/O — User I/O - bank 4 |
| Broche 58 | I/O — User I/O - bank 4 |
| Broche 59 | VCCIO — I/O bank 4 supply voltage |
| Broche 60 | I/O — User I/O - bank 4 |
| Broche 61 | I/O — User I/O - bank 4 |
| Broche 62 | I/O — User I/O - bank 4 |
| Broche 63 | I/O — User I/O - bank 4 |
| Broche 64 | I/O — User I/O - bank 4 |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O - bank 4 |
| Broche 67 | I/O — User I/O - bank 4 |
| Broche 68 | I/O — User I/O - bank 4 |
| Broche 69 | I/O — User I/O - bank 4 |
| Broche 70 | I/O — User I/O - bank 4 |
| Broche 71 | VCCIO — I/O bank 4 supply voltage |
| Broche 72 | I/O — User I/O - bank 5 |
| Broche 73 | I/O — User I/O - bank 5 |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O - bank 5 |
| Broche 76 | I/O — User I/O - bank 5 |
| Broche 77 | I/O — User I/O - bank 5 |
| Broche 78 | I/O — User I/O - bank 5 |
| Broche 79 | I/O — User I/O - bank 5 |
| Broche 80 | VCCINT — Core supply voltage (2.5 V) |
| Broche 81 | I/O — User I/O - bank 5 |
| Broche 82 | I/O — User I/O - bank 5 |
| Broche 83 | I/O — User I/O - bank 5 |
| Broche 84 | I/O — User I/O - bank 5 |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — User I/O - bank 5 |
| Broche 87 | I/O — User I/O - bank 6 |
| Broche 88 | I/O — User I/O - bank 6 |
| Broche 89 | VCCIO — I/O bank 6 supply voltage |
| Broche 90 | I/O — User I/O - bank 6 |
| Broche 91 | I/O — User I/O - bank 6 |
| Broche 92 | I/O — User I/O - bank 6 |
| Broche 93 | I/O — User I/O - bank 6 |
| Broche 94 | I/O — User I/O - bank 6 |
| Broche 95 | GND — Ground |
| Broche 96 | I/O — User I/O - bank 6 |
| Broche 97 | I/O — User I/O - bank 6 |
| Broche 98 | I/O — User I/O - bank 6 |
| Broche 99 | I/O — User I/O - bank 6 |
| Broche 100 | I/O — User I/O - bank 6 |
| Broche 101 | VCCIO — I/O bank 6 supply voltage |
| Broche 102 | I/O — User I/O - bank 7 |
| Broche 103 | I/O — User I/O - bank 7 |
| Broche 104 | GND — Ground |
| Broche 105 | I/O — User I/O - bank 7 |
| Broche 106 | I/O — User I/O - bank 7 |
| Broche 107 | I/O — User I/O - bank 7 |
| Broche 108 | I/O — User I/O - bank 7 |
| Broche 109 | I/O — User I/O - bank 7 |
| Broche 110 | VCCINT — Core supply voltage (2.5 V) |
| Broche 111 | I/O — User I/O - bank 7 |
| Broche 112 | I/O — User I/O - bank 7 |
| Broche 113 | I/O — User I/O - bank 7 |
| Broche 114 | I/O — User I/O - bank 7 |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O - bank 7 |
| Broche 117 | I/O — User I/O - bank 8 |
| Broche 118 | I/O — User I/O - bank 8 |
| Broche 119 | VCCIO — I/O bank 8 supply voltage |
| Broche 120 | I/O — User I/O - bank 8 |
| Broche 121 | I/O — User I/O - bank 8 |
| Broche 122 | I/O — User I/O - bank 8 |
| Broche 123 | I/O — User I/O - bank 8 |
| Broche 124 | I/O — User I/O - bank 8 |
| Broche 125 | GND — Ground |
| Broche 126 | I/O — User I/O - bank 8 |
| Broche 127 | I/O — User I/O - bank 8 |
| Broche 128 | I/O — User I/O - bank 8 |
| Broche 129 | I/O — User I/O - bank 8 |
| Broche 130 | I/O — User I/O - bank 8 |
| Broche 131 | VCCIO — I/O bank 8 supply voltage |
| Broche 132 | I/O — User I/O - bank 8 |
| Broche 133 | I/O — User I/O - bank 8 |
| Broche 134 | MSEL0 — Configuration mode select 0 |
| Broche 135 | MSEL1 — Configuration mode select 1 |
| Broche 136 | nSTATUS — Configuration status (open drain) |
| Broche 137 | nCONFIG — Configuration control (active low) |
| Broche 138 | DCLK — Configuration clock |
| Broche 139 | DATA0 — Configuration data input |
| Broche 140 | TCK — JTAG test clock |
| Broche 141 | TMS — JTAG test mode select |
| Broche 142 | TDI — JTAG test data in |
| Broche 143 | TDO — JTAG test data out |
| Broche 144 | CONF_DONE — Configuration complete (open drain) |
Applications typiques
EPF10K30ETI144-2 convient pour 6 applications: Industrial Glue Logic / Bus Bridge, Legacy Peripheral Emulation, Telecom Line-Card Glue Logic, ASIC Prototyping and Logic Validation, Embedded DSP / Multiply-Accumulate Tables, Test & Measurement Front-End Logic.
Industrial Glue Logic / Bus Bridge
The EPF10K30ETI144-2 fits industrial glue-logic boards that bridge legacy parallel buses (ISA, PC/104, VME) to modern microprocessors. With 1,728 logic elements and 102 user I/Os, the FPGA can implement multi-master bus arbiters, address decoders, and 8/16/32-bit FIFO bridges in a single chip. The 24,576 bits of EAB RAM provide true dual-port memory for mailbox and pointer-passing between bus masters. Industrial temperature grade (-40C to +85C) ensures operation in factory-floor enclosures without derating. Quartus synthesis fits typical 32-bit bus-bridge designs well within the 30K-gate budget.
Recommandé
Legacy Peripheral Emulation
Emulating discontinued peripherals (parallel-port chips, custom DMA controllers, ISA cards) is a sweet spot for the EPF10K30ETI144-2. The 200 MHz internal frequency easily handles ISA-bus timing, while 102 user I/Os are sufficient for 16-bit data plus full control-signal reproduction. EAB blocks can implement wait-state generators and protocol state machines. Designers maintain a single bitstream per peripheral, so the same PCB can emulate multiple legacy devices by re-flashing the configuration PROM - useful in aerospace and military long-lifecycle programs.
Recommandé
Telecom Line-Card Glue Logic
Telecom line cards use the EPF10K30ETI144-2 for backplane glue, TDM bus arbitration, and HDLC/framer interfacing where deterministic latency matters. The FLEX 10KE fabric gives sub-10 ns pin-to-pin delays suitable for E1/T1 and 8 MHz ST-BUS clocks, while 102 I/Os cover 16-bit data plus framing and clock signals. Industrial temperature rating suits outdoor cabinet deployments. EABs implement small lookup tables for codec-law conversion (A-law/mu-law) without external ROM.
Recommandé
ASIC Prototyping and Logic Validation
Before taping out an ASIC, designers validate RTL on FPGAs - the EPF10K30ETI144-2 fits small SoC blocks such as interrupt controllers, DMA engines, custom peripherals, and AMBA-AHB-to-APB bridges. 30K gates accommodate ~5-10K gate-equivalent ASIC logic with reasonable timing margin. Quartus synthesis with the FLEX 10KE library lets engineers reuse the same RTL later on Cyclone IV for production without rewriting constraints. Industrial temp grade supports in-vehicle and outdoor validation campaigns.
Recommandé
Embedded DSP / Multiply-Accumulate Tables
Each FLEX 10KE EAB can be configured as a small read-only or read/write memory that mimics a multiplier lookup table - the EPF10K30ETI144-2 therefore fits low-sample-rate DSP datapaths (control loops, codec post-processing, simple FIR filters) where lookup-table-based MAC units suffice. 24,576 EAB bits hold 4K x 6-bit or 2K x 12-bit coefficient tables, and the 200 MHz fabric supports multi-MHz sample streams in industrial temperature environments.
Recommandé
Test & Measurement Front-End Logic
Test equipment designers use the EPF10K30ETI144-2 for pattern generation, timing sequencers, and instrument-switching matrices. The 102 I/O count is sufficient for 32-channel digital I/O cards, and the 2.5 V core plus JTAG configuration support production-line programming via standard Altera tools. Industrial temperature grade suits bench and chamber testing. EAB RAM acts as a deep pattern buffer, and the 144-TQFP package is hand-solderable for prototype builds.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ETI144-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ATC144-2N | EPF10K30ATC144-1N | EPF10K30ATC144-3 | EPF10K30ATI144-2 |
|---|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) | -3 (faster) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Lifecycle Status | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature |
Principaux différenciateurs
- Same-density silicon, multiple speed grades available (vs EPF10K30ATC144-3 (faster -3 speed grade))
- Industrial temperature grade vs commercial variants (vs EPF10K30ETC144-2 (commercial temp grade))
- Pin-to-pin compatibility with 'A' silicon revision (vs EPF10K30ATI144-2 (A-silicon industrial variant))
Notes de conception
The EPF10K30ETI144-2 requires a stable 2.5 V core rail (2.375 V to 2.625 V) and one or more VCCIO bank supplies (typically 3.3 V for TTL/PCI-compatible I/O). Place 0.1 uF decoupling capacitors as close as possible to every VCCINT and VCCIO pin, and add bulk 10-47 uF tantalum or ceramic capacitors at each power-supply entry point. The SRAM-based configuration means inrush can reach 500 mA during configuration; size the regulator accordingly. Power sequencing - core before VCCIO, or simultaneous - is acceptable per Altera/Intel documentation.
Route the JTAG chain (TCK, TMS, TDI, TDO) with a star topology from the JTAG header to each device and keep TCK trace under 6 inches to avoid signal-integrity issues. Expose nCONFIG, nSTATUS, and CONF_DONE for in-system programming access. The 144-pin TQFP has a 0.5 mm pitch - use 0.15 mm trace/space with a 4-layer PCB and a continuous ground plane under the package. Leave 4-6 ground vias in the package thermal slug area for thermal dissipation.
Estimated: configuring the EPF10K30ETI144-2 from a fresh board without checking MSEL0/MSEL1 strap pins is the #1 first-power-on failure mode - tie them to the correct logic level for PS or JTAG mode before applying power. Second common pitfall: leaving VCCIO banks at 2.5 V while driving 3.3 V peripheral signals - this damages the I/O cells. Third: failing to series-terminate high-speed clock-distribution outputs when driving long traces; add 33 ohm series resistors at the FPGA output. Finally, choose EPCS-series serial flash only with Quartus version 7.2 or later for proper SOF-to-POF support.
Estimated: at 200 MHz internal frequency with 80% logic utilization, the EPF10K30ETI144-2 dissipates roughly 0.5-0.8 W typical, 1.5 W maximum. The 144-pin TQFP thermal resistance is approximately 35 C/W theta_JA on a 4-layer PCB with a small ground pad, so junction temperature rise above ambient is roughly 18-28 C typical, 53 C max - within industrial-grade limits. For continuous 85 C ambient operation, ensure 4-layer PCB with 2 oz copper pours on core and I/O supply planes to keep junction below 125 C.
Informations de conformité
RoHS and lead-free per Altera/Intel product page. Industrial temperature grade ('I' suffix) is per spec but no AEC-Q100 automotive qualification. Halogen-free status not specified in the verified web data.
