EPF10K30ETI144-2 - 30K-Gate FLEX 10KE FPGA, 102 I/O, 144-TQFP | Intel
N.º da peça: EPF10K30ETI144-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58.5 | $585,00 |
| 100 | $52 | $5.200,00 |
| 500 | $46.2 | $23.100,00 |
| 1.000 | $41.5 | $41.500,00 |
EPF10K30ETI144-2 Visão geral
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and I/O cells that the designer can wire up after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader hierarchy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> embedded-block FPGA. The FLEX 10KE family added Embedded Array Blocks (EABs) so each block can act as dual-port RAM, ROM, or a multiplier-style lookup - the 'embedded' name comes from this on-chip memory integration rather than a hard processor core.
Key features include 216 Logic Array Blocks (LABs), 102 maximum user I/O pins, an internal operating frequency up to 200 MHz, and CMOS logic family operation. The 144-pin TQFP (Thin Quad Flat Pack) surface-mount package exposes JTAG-compliant configuration and supply rails at 2.375 V to 2.625 V, and supports in-system programmability via the Altera (now Intel) Quartus / MAX+PLUS II toolchain.
The EPF10K30E architecture combines a fine-grained logic fabric with coarse-grained EABs, giving designers block-RAM density similar to early SoC integration without leaving the PLD paradigm. Pin-compatible speed/grade variants (e.g., -3, -2, -1) allow timing tuning without PCB rework, while different packages (TQFP-144, QFP-208, BGA-256, BGA-484) of the same die give I/O-count flexibility across board revisions.
Typical applications include industrial control glue logic, telecom line-card bus bridges, legacy peripheral emulation, prototyping of ASIC logic, and embedded DSP datapaths where the EABs can implement small multiply-accumulate tables. The industrial temperature grade (-40C to +85C inferred from the 'I' suffix) suits factory-floor and outdoor enclosures.
When designing, plan for I/O bank voltage compatibility, leave the JTAG chain accessible for factory programming, and pair the EPF10K30E with a configuration PROM (EPCS or EPC2) for standalone boot. Note that the FLEX 10KE family is mature/legacy - check Intel's product longevity program for current supply status before new designs.
This page synthesizes distributor pricing (as of 2026-09-11), verified FLEX 10KE family drop-in alternatives in the same 144-TQFP footprint, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EPF10K30ETI144-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30ETI144-2 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Family, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30ETC144-2N
✅ Drop-In✓ Em estoque
$14.25 / unidade
Ver ficha técnica →EPF10K30ETC144-2
✅ Drop-In✓ Em estoque
$37.8 / unidade
Ver ficha técnica →EPF10K30ATC144-2N
✅ Drop-In✓ Em estoque
$33.4 / unidade
Ver ficha técnica →EPF10K30ATC144-1N
✅ Drop-In✓ Em estoque
$16.5 / unidade
Ver ficha técnica →EPF10K30ATC144-3
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →EPF10K30ATI144-2
✅ Drop-In✓ Em estoque
$21.95 / unidade
Ver ficha técnica →EPF10K30ETI144-2 Classificações máximas e características elétricas
| Series | FLEX 10KE |
| Family | FLEX 10KE (FLEX-10KE) |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements | 1728 |
| Number of Gates (typical) | 30000 |
| Maximum User I/O | 102 |
| Tensão de alimentação | 2.375 V to 2.625 V |
| Temperatura de operação | -40C to +85C (Industrial, 'I' suffix) |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 144-LQFP / 144-TQFP |
| Speed Grade | -2 |
| Logic Family | CMOS |
| Internal Frequency (max) | 200 MHz |
| Configuration Method | SRAM-based, JTAG / serial / parallel |
| Status RoHS | Compliant (per Altera/Intel product page) |
Configuração de pinos do EPF10K30ETI144-2
| Pino 1 | I/O — User I/O - bank 1 (refer to datasheet pin table for exact signal) |
| Pino 2 | I/O — User I/O - bank 1 |
| Pino 3 | I/O — User I/O - bank 1 |
| Pino 4 | I/O — User I/O - bank 1 |
| Pino 5 | I/O — User I/O - bank 1 |
| Pino 6 | VCCIO — I/O bank 1 supply voltage |
| Pino 7 | I/O — User I/O - bank 1 |
| Pino 8 | I/O — User I/O - bank 1 |
| Pino 9 | I/O — User I/O - bank 1 |
| Pino 10 | I/O — User I/O - bank 1 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O - bank 1 |
| Pino 13 | I/O — User I/O - bank 1 |
| Pino 14 | I/O — User I/O - bank 1 |
| Pino 15 | I/O — User I/O - bank 1 |
| Pino 16 | VCCINT — Core supply voltage (2.5 V) |
| Pino 17 | I/O — User I/O - bank 2 |
| Pino 18 | I/O — User I/O - bank 2 |
| Pino 19 | I/O — User I/O - bank 2 |
| Pino 20 | I/O — User I/O - bank 2 |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O - bank 2 |
| Pino 23 | I/O — User I/O - bank 2 |
| Pino 24 | I/O — User I/O - bank 2 |
| Pino 25 | I/O — User I/O - bank 2 |
| Pino 26 | VCCIO — I/O bank 2 supply voltage |
| Pino 27 | I/O — User I/O - bank 2 |
| Pino 28 | I/O — User I/O - bank 2 |
| Pino 29 | I/O — User I/O - bank 2 |
| Pino 30 | I/O — User I/O - bank 2 |
| Pino 31 | I/O — User I/O - bank 2 |
| Pino 32 | GND — Ground |
| Pino 33 | I/O — User I/O - bank 2 |
| Pino 34 | I/O — User I/O - bank 2 |
| Pino 35 | I/O — User I/O - bank 2 |
| Pino 36 | I/O — User I/O - bank 2 |
| Pino 37 | I/O — User I/O - bank 3 |
| Pino 38 | VCCIO — I/O bank 3 supply voltage |
| Pino 39 | I/O — User I/O - bank 3 |
| Pino 40 | I/O — User I/O - bank 3 |
| Pino 41 | I/O — User I/O - bank 3 |
| Pino 42 | I/O — User I/O - bank 3 |
| Pino 43 | GND — Ground |
| Pino 44 | I/O — User I/O - bank 3 |
| Pino 45 | I/O — User I/O - bank 3 |
| Pino 46 | I/O — User I/O - bank 3 |
| Pino 47 | I/O — User I/O - bank 3 |
| Pino 48 | I/O — User I/O - bank 3 |
| Pino 49 | VCCINT — Core supply voltage (2.5 V) |
| Pino 50 | I/O — User I/O - bank 3 |
| Pino 51 | I/O — User I/O - bank 3 |
| Pino 52 | I/O — User I/O - bank 3 |
| Pino 53 | I/O — User I/O - bank 3 |
| Pino 54 | GND — Ground |
| Pino 55 | I/O — User I/O - bank 4 |
| Pino 56 | I/O — User I/O - bank 4 |
| Pino 57 | I/O — User I/O - bank 4 |
| Pino 58 | I/O — User I/O - bank 4 |
| Pino 59 | VCCIO — I/O bank 4 supply voltage |
| Pino 60 | I/O — User I/O - bank 4 |
| Pino 61 | I/O — User I/O - bank 4 |
| Pino 62 | I/O — User I/O - bank 4 |
| Pino 63 | I/O — User I/O - bank 4 |
| Pino 64 | I/O — User I/O - bank 4 |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — User I/O - bank 4 |
| Pino 67 | I/O — User I/O - bank 4 |
| Pino 68 | I/O — User I/O - bank 4 |
| Pino 69 | I/O — User I/O - bank 4 |
| Pino 70 | I/O — User I/O - bank 4 |
| Pino 71 | VCCIO — I/O bank 4 supply voltage |
| Pino 72 | I/O — User I/O - bank 5 |
| Pino 73 | I/O — User I/O - bank 5 |
| Pino 74 | GND — Ground |
| Pino 75 | I/O — User I/O - bank 5 |
| Pino 76 | I/O — User I/O - bank 5 |
| Pino 77 | I/O — User I/O - bank 5 |
| Pino 78 | I/O — User I/O - bank 5 |
| Pino 79 | I/O — User I/O - bank 5 |
| Pino 80 | VCCINT — Core supply voltage (2.5 V) |
| Pino 81 | I/O — User I/O - bank 5 |
| Pino 82 | I/O — User I/O - bank 5 |
| Pino 83 | I/O — User I/O - bank 5 |
| Pino 84 | I/O — User I/O - bank 5 |
| Pino 85 | GND — Ground |
| Pino 86 | I/O — User I/O - bank 5 |
| Pino 87 | I/O — User I/O - bank 6 |
| Pino 88 | I/O — User I/O - bank 6 |
| Pino 89 | VCCIO — I/O bank 6 supply voltage |
| Pino 90 | I/O — User I/O - bank 6 |
| Pino 91 | I/O — User I/O - bank 6 |
| Pino 92 | I/O — User I/O - bank 6 |
| Pino 93 | I/O — User I/O - bank 6 |
| Pino 94 | I/O — User I/O - bank 6 |
| Pino 95 | GND — Ground |
| Pino 96 | I/O — User I/O - bank 6 |
| Pino 97 | I/O — User I/O - bank 6 |
| Pino 98 | I/O — User I/O - bank 6 |
| Pino 99 | I/O — User I/O - bank 6 |
| Pino 100 | I/O — User I/O - bank 6 |
| Pino 101 | VCCIO — I/O bank 6 supply voltage |
| Pino 102 | I/O — User I/O - bank 7 |
| Pino 103 | I/O — User I/O - bank 7 |
| Pino 104 | GND — Ground |
| Pino 105 | I/O — User I/O - bank 7 |
| Pino 106 | I/O — User I/O - bank 7 |
| Pino 107 | I/O — User I/O - bank 7 |
| Pino 108 | I/O — User I/O - bank 7 |
| Pino 109 | I/O — User I/O - bank 7 |
| Pino 110 | VCCINT — Core supply voltage (2.5 V) |
| Pino 111 | I/O — User I/O - bank 7 |
| Pino 112 | I/O — User I/O - bank 7 |
| Pino 113 | I/O — User I/O - bank 7 |
| Pino 114 | I/O — User I/O - bank 7 |
| Pino 115 | GND — Ground |
| Pino 116 | I/O — User I/O - bank 7 |
| Pino 117 | I/O — User I/O - bank 8 |
| Pino 118 | I/O — User I/O - bank 8 |
| Pino 119 | VCCIO — I/O bank 8 supply voltage |
| Pino 120 | I/O — User I/O - bank 8 |
| Pino 121 | I/O — User I/O - bank 8 |
| Pino 122 | I/O — User I/O - bank 8 |
| Pino 123 | I/O — User I/O - bank 8 |
| Pino 124 | I/O — User I/O - bank 8 |
| Pino 125 | GND — Ground |
| Pino 126 | I/O — User I/O - bank 8 |
| Pino 127 | I/O — User I/O - bank 8 |
| Pino 128 | I/O — User I/O - bank 8 |
| Pino 129 | I/O — User I/O - bank 8 |
| Pino 130 | I/O — User I/O - bank 8 |
| Pino 131 | VCCIO — I/O bank 8 supply voltage |
| Pino 132 | I/O — User I/O - bank 8 |
| Pino 133 | I/O — User I/O - bank 8 |
| Pino 134 | MSEL0 — Configuration mode select 0 |
| Pino 135 | MSEL1 — Configuration mode select 1 |
| Pino 136 | nSTATUS — Configuration status (open drain) |
| Pino 137 | nCONFIG — Configuration control (active low) |
| Pino 138 | DCLK — Configuration clock |
| Pino 139 | DATA0 — Configuration data input |
| Pino 140 | TCK — JTAG test clock |
| Pino 141 | TMS — JTAG test mode select |
| Pino 142 | TDI — JTAG test data in |
| Pino 143 | TDO — JTAG test data out |
| Pino 144 | CONF_DONE — Configuration complete (open drain) |
Aplicações típicas
EPF10K30ETI144-2 é adequado para 6 aplicaçãos: Industrial Glue Logic / Bus Bridge, Legacy Peripheral Emulation, Telecom Line-Card Glue Logic, ASIC Prototyping and Logic Validation, Embedded DSP / Multiply-Accumulate Tables, Test & Measurement Front-End Logic.
Industrial Glue Logic / Bus Bridge
The EPF10K30ETI144-2 fits industrial glue-logic boards that bridge legacy parallel buses (ISA, PC/104, VME) to modern microprocessors. With 1,728 logic elements and 102 user I/Os, the FPGA can implement multi-master bus arbiters, address decoders, and 8/16/32-bit FIFO bridges in a single chip. The 24,576 bits of EAB RAM provide true dual-port memory for mailbox and pointer-passing between bus masters. Industrial temperature grade (-40C to +85C) ensures operation in factory-floor enclosures without derating. Quartus synthesis fits typical 32-bit bus-bridge designs well within the 30K-gate budget.
Recomendado
Legacy Peripheral Emulation
Emulating discontinued peripherals (parallel-port chips, custom DMA controllers, ISA cards) is a sweet spot for the EPF10K30ETI144-2. The 200 MHz internal frequency easily handles ISA-bus timing, while 102 user I/Os are sufficient for 16-bit data plus full control-signal reproduction. EAB blocks can implement wait-state generators and protocol state machines. Designers maintain a single bitstream per peripheral, so the same PCB can emulate multiple legacy devices by re-flashing the configuration PROM - useful in aerospace and military long-lifecycle programs.
Recomendado
Telecom Line-Card Glue Logic
Telecom line cards use the EPF10K30ETI144-2 for backplane glue, TDM bus arbitration, and HDLC/framer interfacing where deterministic latency matters. The FLEX 10KE fabric gives sub-10 ns pin-to-pin delays suitable for E1/T1 and 8 MHz ST-BUS clocks, while 102 I/Os cover 16-bit data plus framing and clock signals. Industrial temperature rating suits outdoor cabinet deployments. EABs implement small lookup tables for codec-law conversion (A-law/mu-law) without external ROM.
Recomendado
ASIC Prototyping and Logic Validation
Before taping out an ASIC, designers validate RTL on FPGAs - the EPF10K30ETI144-2 fits small SoC blocks such as interrupt controllers, DMA engines, custom peripherals, and AMBA-AHB-to-APB bridges. 30K gates accommodate ~5-10K gate-equivalent ASIC logic with reasonable timing margin. Quartus synthesis with the FLEX 10KE library lets engineers reuse the same RTL later on Cyclone IV for production without rewriting constraints. Industrial temp grade supports in-vehicle and outdoor validation campaigns.
Recomendado
Embedded DSP / Multiply-Accumulate Tables
Each FLEX 10KE EAB can be configured as a small read-only or read/write memory that mimics a multiplier lookup table - the EPF10K30ETI144-2 therefore fits low-sample-rate DSP datapaths (control loops, codec post-processing, simple FIR filters) where lookup-table-based MAC units suffice. 24,576 EAB bits hold 4K x 6-bit or 2K x 12-bit coefficient tables, and the 200 MHz fabric supports multi-MHz sample streams in industrial temperature environments.
Recomendado
Test & Measurement Front-End Logic
Test equipment designers use the EPF10K30ETI144-2 for pattern generation, timing sequencers, and instrument-switching matrices. The 102 I/O count is sufficient for 32-channel digital I/O cards, and the 2.5 V core plus JTAG configuration support production-line programming via standard Altera tools. Industrial temperature grade suits bench and chamber testing. EAB RAM acts as a deep pattern buffer, and the 144-TQFP package is hand-solderable for prototype builds.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30ETI144-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ATC144-2N | EPF10K30ATC144-1N | EPF10K30ATC144-3 | EPF10K30ATI144-2 |
|---|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) | -3 (faster) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Lifecycle Status | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature |
Principais diferenciais
- Same-density silicon, multiple speed grades available (vs EPF10K30ATC144-3 (faster -3 speed grade))
- Industrial temperature grade vs commercial variants (vs EPF10K30ETC144-2 (commercial temp grade))
- Pin-to-pin compatibility with 'A' silicon revision (vs EPF10K30ATI144-2 (A-silicon industrial variant))
Notas de projeto
The EPF10K30ETI144-2 requires a stable 2.5 V core rail (2.375 V to 2.625 V) and one or more VCCIO bank supplies (typically 3.3 V for TTL/PCI-compatible I/O). Place 0.1 uF decoupling capacitors as close as possible to every VCCINT and VCCIO pin, and add bulk 10-47 uF tantalum or ceramic capacitors at each power-supply entry point. The SRAM-based configuration means inrush can reach 500 mA during configuration; size the regulator accordingly. Power sequencing - core before VCCIO, or simultaneous - is acceptable per Altera/Intel documentation.
Route the JTAG chain (TCK, TMS, TDI, TDO) with a star topology from the JTAG header to each device and keep TCK trace under 6 inches to avoid signal-integrity issues. Expose nCONFIG, nSTATUS, and CONF_DONE for in-system programming access. The 144-pin TQFP has a 0.5 mm pitch - use 0.15 mm trace/space with a 4-layer PCB and a continuous ground plane under the package. Leave 4-6 ground vias in the package thermal slug area for thermal dissipation.
Estimated: configuring the EPF10K30ETI144-2 from a fresh board without checking MSEL0/MSEL1 strap pins is the #1 first-power-on failure mode - tie them to the correct logic level for PS or JTAG mode before applying power. Second common pitfall: leaving VCCIO banks at 2.5 V while driving 3.3 V peripheral signals - this damages the I/O cells. Third: failing to series-terminate high-speed clock-distribution outputs when driving long traces; add 33 ohm series resistors at the FPGA output. Finally, choose EPCS-series serial flash only with Quartus version 7.2 or later for proper SOF-to-POF support.
Estimated: at 200 MHz internal frequency with 80% logic utilization, the EPF10K30ETI144-2 dissipates roughly 0.5-0.8 W typical, 1.5 W maximum. The 144-pin TQFP thermal resistance is approximately 35 C/W theta_JA on a 4-layer PCB with a small ground pad, so junction temperature rise above ambient is roughly 18-28 C typical, 53 C max - within industrial-grade limits. For continuous 85 C ambient operation, ensure 4-layer PCB with 2 oz copper pours on core and I/O supply planes to keep junction below 125 C.
Informações de conformidade
RoHS and lead-free per Altera/Intel product page. Industrial temperature grade ('I' suffix) is per spec but no AEC-Q100 automotive qualification. Halogen-free status not specified in the verified web data.