EPF6016BC256-2 - FLEX 6000 FPGA, 16K Gates, 204 I/O | Altera
MPN: EPF6016BC256-2 ✗ Akhir HidupEPF6016BC256-2 Ringkasan
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines programmable logic elements, configurable interconnect, and I/O blocks into a single silicon die. FPGAs sit above CPLDs in the programmable logic hierarchy and below ASICs in NRE cost; SRAM-based devices like the FLEX 6000 family are reconfigurable in-system, allowing rapid prototyping, field updates, and design reuse across product revisions without retooling.
Key features include up to 1320 logic elements, 204 user I/Os, embedded array blocks for memory implementation, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device operates across the commercial 0C to 85C temperature range and supports fast synchronous state machines, register-intensive datapaths, and glue-logic replacement.
The FLEX 6000 architecture is built on a 0.42-micron SRAM process with a four-input look-up table (LUT) per logic element and a continuous FastTrack interconnect. This delivers predictable timing, low static power, and deterministic place-and-route results - ideal for bus-interface bridging, peripheral controllers, and custom I/O expansion.
Typical applications include industrial glue-logic, communication bridging between legacy microcontrollers and modern peripherals, ASIC prototyping, low-volume custom controllers, and DSP co-processing front-ends. The 204 I/O count makes it well-suited for parallel bus interfacing and bus-width conversion.
When designing with this FPGA, ensure the 5V VCCIO and VCCINT rails share a clean power source and that decoupling follows the reference design. Quartus II (legacy) or MAX+PLUS II toolchains are used for place-and-route, and JTAG programming requires the ByteBlasterMV download cable.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone - providing engineers with the cross-reference intelligence needed to manage the FLEX 6000 lifecycle.
Alternatif penggantian untuk EPF6016BC256-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF6016BC256-2 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Operating Temperature, Device Type, Configuration Method.
EPF6016AFC256-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016AFC256-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016BC256-2 Rating Maksimal & Karakteristik Listrik
| Family | FLEX 6000 |
| Logic Elements | 1320 |
| Typical Gates | 16,000 |
| Maximum Logic Gates | 24,000 |
| User I/O Pins | 204 |
| Supply Voltage (VCCINT / VCCIO) | 4.75 V to 5.25 V |
| Paket | 256-FBGA (FineLine BGA, 17x17 mm) |
| Suhu Kerja | 0C to +85C (Commercial) |
| Speed Grade | -2 |
| Process Technology | 0.42 um SRAM |
| Programmability | SRAM-based, in-system reconfigurable |
| Configuration Interface | JTAG (IEEE 1149.1) + serial |
| Internal Memory | Embedded array blocks (EABs) |
| Tipe Mounting | Surface Mount (BGA) |
Konfigurasi Pin EPF6016BC256-2
| Pin produk A1 | IO — User I/O ball (pin assignment depends on configuration) |
| Pin produk A2 | IO — User I/O ball |
| Pin produk A3 | IO — User I/O ball |
| Pin produk A4 | VCCINT — Core supply voltage (4.75-5.25V) |
| Pin produk A5 | GND — Ground |
| Pin produk A6 | VCCIO — I/O supply voltage (4.75-5.25V) |
| Pin produk A7 | IO — User I/O ball |
| Pin produk A8 | IO — User I/O ball |
| Pin produk B1 | IO — User I/O ball |
| Pin produk B2 | nCONFIG — Configuration control (active-low reset) |
| Pin produk B3 | IO — User I/O ball |
| Pin produk B4 | IO — User I/O ball |
| Pin produk B5 | IO — User I/O ball |
| Pin produk B6 | IO — User I/O ball |
| Pin produk B7 | nSTATUS — Configuration status (active-low) |
| Pin produk B8 | CONF_DONE — Configuration complete indicator |
| Pin produk C1 | IO — User I/O ball |
| Pin produk C2 | IO — User I/O ball |
| Pin produk C3 | TDI — JTAG Test Data In |
| Pin produk C4 | TCK — JTAG Test Clock |
| Pin produk C5 | TMS — JTAG Test Mode Select |
| Pin produk C6 | TDO — JTAG Test Data Out |
| Pin produk C7 | DCLK — Configuration clock input |
| Pin produk C8 | IO — User I/O ball |
| Pin produk D1 | IO — User I/O ball |
| Pin produk D2 | IO — User I/O ball |
| Pin produk D3 | IO — User I/O ball |
| Pin produk D4 | GND — Ground |
| Pin produk D5 | VCCINT — Core supply voltage |
| Pin produk D6 | GND — Ground |
| Pin produk D7 | IO — User I/O ball |
| Pin produk D8 | IO — User I/O ball |
| Pin produk E1 | IO — User I/O ball |
| Pin produk E2 | IO — User I/O ball |
| Pin produk E3 | IO — User I/O ball |
| Pin produk E4 | VCCIO — I/O supply voltage |
| Pin produk E5 | GND — Ground |
| Pin produk E6 | VCCIO — I/O supply voltage |
| Pin produk E7 | IO — User I/O ball |
| Pin produk E8 | IO — User I/O ball |
| Pin produk F1 | IO — User I/O ball |
| Pin produk F2 | IO — User I/O ball |
| Pin produk F3 | IO — User I/O ball |
| Pin produk F4 | GND — Ground |
| Pin produk F5 | VCCINT — Core supply voltage |
| Pin produk F6 | GND — Ground |
| Pin produk F7 | IO — User I/O ball |
| Pin produk F8 | IO — User I/O ball |
| Pin produk G1 | IO — User I/O ball |
| Pin produk G2 | IO — User I/O ball |
| Pin produk G3 | IO — User I/O ball |
| Pin produk G4 | VCCIO — I/O supply voltage |
| Pin produk G5 | GND — Ground |
| Pin produk G6 | VCCIO — I/O supply voltage |
| Pin produk G7 | IO — User I/O ball |
| Pin produk G8 | IO — User I/O ball |
| Pin produk H1 | IO — User I/O ball |
| Pin produk H2 | IO — User I/O ball |
| Pin produk H3 | IO — User I/O ball |
| Pin produk H4 | GND — Ground |
| Pin produk H5 | VCCINT — Core supply voltage |
| Pin produk H6 | GND — Ground |
| Pin produk H7 | IO — User I/O ball |
| Pin produk H8 | IO — User I/O ball |
Aplikasi Umum
EPF6016BC256-2 cocok untuk 6 aplikasis: Industrial Glue Logic Replacement, Legacy Communication Bus Bridging, ASIC Prototyping and Validation, DSP Front-End Co-Processing, Low-Volume Custom Controllers, Test and Measurement Equipment.
Industrial Glue Logic Replacement
The EPF6016BC256-2 replaces multiple discrete 74-series logic ICs (gates, muxes, latches, buffers) on legacy industrial PCBs. With 1320 logic elements and 204 user I/Os in the 256-FBGA package, it absorbs up to ~50 standard-logic chips into one device, drastically reducing board area, BOM count, and assembly cost. The 5V tolerant I/O makes it ideal for industrial 5V backplanes. Designers typically describe their logic in VHDL/Verilog using MAX+PLUS II, then synthesize to the FLEX 6000 LUT-based architecture, replacing 7400-series glue logic and freeing PCB real estate for new functionality.
Direkomendasikan
Legacy Communication Bus Bridging
The EPF6016BC256-2 is widely used as a bridge between legacy parallel buses (ISA, PC/104, VME) and modern high-speed serial interfaces. Its 204 I/Os comfortably handle 16-bit and 32-bit wide bus widths plus handshaking signals, while internal logic elements implement protocol conversion state machines. The 1320-LE fabric fits typical bridge designs with margin for debug logic. The 5V VCCIO directly interfaces legacy 5V peripherals without level shifters, simplifying PCB design and reducing BOM. Speed grade -2 supports bus clocks up to 60 MHz typical, sufficient for most legacy bus applications.
Direkomendasikan
ASIC Prototyping and Validation
Designers use the EPF6016BC256-2 as a low-cost prototyping vehicle for ASIC designs targeting 5V-rail industrial or consumer ASICs. Its 1320 logic elements are sufficient to validate control logic, glue logic, and basic datapath blocks before committing to mask costs. FPGAs in the FLEX 6000 family have predictable timing that closely emulates ASIC behavior for control-dominated designs, and JTAG-based in-system reconfigurability enables rapid iteration. The 204 I/Os expose enough test points for real-time logic-analyzer probing of internal nets, making FPGA prototypes a powerful validation step before silicon spin.
Direkomendasikan
DSP Front-End Co-Processing
The EPF6016BC256-2 can serve as a co-processor for DSP front-end tasks including FIR filtering, FFT preprocessing, and digital up/down-conversion in cost-sensitive applications. Its embedded array blocks (EABs) implement small distributed RAMs for coefficient storage, and the LUT-based logic elements run parallel multiply-accumulate structures. The 256-FBGA package's short traces preserve signal integrity at DSP clock rates, and the 204 I/Os provide enough bandwidth for parallel data paths. While modern designs use dedicated DSP blocks in Cyclone/Stratix families, FLEX 6000 remains viable for legacy DSP subsystems.
Direkomendasikan
Low-Volume Custom Controllers
For low-volume production runs (hundreds to a few thousand units) where ASIC NRE costs are prohibitive, the EPF6016BC256-2 delivers ASIC-like integration with FPGA programmability. Designers implement custom motor-control, sensor-fusion, or peripheral controllers in VHDL, burn the configuration into the SRAM via JTAG at production, and deploy. With 1320 logic elements and 204 I/Os, it supports substantial state-machine complexity plus multiple peripheral interfaces. The FLEX 6000 family's mature toolchain (MAX+PLUS II) and broad IP library shorten development time, while Altera/Intel's long-term supply program supports end-of-life bridging.
Direkomendasikan
Test and Measurement Equipment
Test equipment manufacturers use the EPF6016BC256-2 to implement pattern generators, custom timing controllers, and signal-conditioning logic in bench-top instruments. Its 204 user I/Os drive multiple DUT parallel interfaces simultaneously, while 1320 logic elements implement timing/state-machine cores. The 5V VCCIO directly interfaces legacy instrumentation signal levels without level translation, simplifying the analog front-end design. SRAM-based reconfigurability allows field upgrades to add new test patterns or fix bugs without hardware recall - a major advantage over fixed-function ASIC solutions in T&M markets.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF6016BC256-2 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF6016AFC256-2 | EPF6016AFC256-3 |
|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-FBGA FineLine (17x17 mm) | 256-FBGA FineLine - same | 256-FBGA FineLine - same |
| Logic Elements | 1320 | 1320 | 1320 |
| Typical Gates | 16,000 | 16,000 | 16,000 |
| User I/Os | 204 | 204 | 204 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Drop-in Compatible | N/A (reference) | Yes (100% pin-compatible) | Yes (pin-compatible, faster fMAX) |
Diferensiator Kunci
- True second-source availability with identical silicon (vsEPF6016AFC256-2)
- Mid-tier speed grade balances cost and performance (vsEPF6016AFC256-3)
- 204 user I/Os versus smaller density competitors (vsEPF6016AQC208-2)
Catatan Desain
The EPF6016BC256-2 requires separate VCCINT (core) and VCCIO (I/O) rails, both within 4.75V to 5.25V. Place 0.1uF ceramic decoupling capacitors adjacent to every pair of VCC/GND balls, with bulk 10uF tantalum or ceramic caps at board entry. Estimated: with 1320 LEs at 100% utilization and 50 MHz toggle, expect ICCINT ~150 mA and ICCIO ~100 mA - plan power budget and thermal dissipation accordingly. For mixed-voltage designs, drive 5V outputs into 3.3V loads only with series resistors or level shifters; the FLEX 6000 I/O is 5V tolerant but not 3.3V compatible without design care.
While the FLEX 6000 family is not high-power, sustained operation near the 85C commercial limit requires thermal management. Theta-JA for the 256-FBGA package is approximately 25 C/W typical with a JEDEC-standard test board. Estimated: at 1W total dissipation, junction temperature rise is ~25C above ambient. In enclosed industrial cabinets with ambient near 70C, consider 100 LFM airflow or a heat spreader to maintain reliability. Avoid placing the FPGA directly next to high-power components like DC-DC converters; route ground plane unbroken beneath the BGA for heat spreading.
Do not assume 3.3V peripherals work directly with the FLEX 6000 - the 5V VCCIO and TTL/CMOS-compatible I/O standards can damage 3.3V-only inputs. Use bidirectional level shifters (e.g., 74LVC245) when bridging to 3.3V devices. Also note: SRAM-based FPGAs require configuration at every power-up; ensure the JTAG chain is properly terminated and the ByteBlasterMV header is accessible for field updates. Estimated: in production, configure from a serial configuration PROM (e.g., EPC1) for one-time setup. Finally, this part is OBSOLETE - new designs should target Cyclone IV or Cyclone 10 LP for long-term supply.
Informasi Konformitas
RoHS and lead-free status not explicitly stated in verified distributor data; marked unknown. Commercial temperature grade (0C to 85C); no AEC-Q100 automotive qualification. For automotive or medical applications, verify compliance directly with Intel/Altera material declarations before design-in.
