EPF6016BC256-2 - FLEX 6000 FPGA, 16K Gates, 204 I/O | Altera
MPN: EPF6016BC256-2 ✗ Cuối đờiEPF6016BC256-2 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines programmable logic elements, configurable interconnect, and I/O blocks into a single silicon die. FPGAs sit above CPLDs in the programmable logic hierarchy and below ASICs in NRE cost; SRAM-based devices like the FLEX 6000 family are reconfigurable in-system, allowing rapid prototyping, field updates, and design reuse across product revisions without retooling.
Key features include up to 1320 logic elements, 204 user I/Os, embedded array blocks for memory implementation, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device operates across the commercial 0C to 85C temperature range and supports fast synchronous state machines, register-intensive datapaths, and glue-logic replacement.
The FLEX 6000 architecture is built on a 0.42-micron SRAM process with a four-input look-up table (LUT) per logic element and a continuous FastTrack interconnect. This delivers predictable timing, low static power, and deterministic place-and-route results - ideal for bus-interface bridging, peripheral controllers, and custom I/O expansion.
Typical applications include industrial glue-logic, communication bridging between legacy microcontrollers and modern peripherals, ASIC prototyping, low-volume custom controllers, and DSP co-processing front-ends. The 204 I/O count makes it well-suited for parallel bus interfacing and bus-width conversion.
When designing with this FPGA, ensure the 5V VCCIO and VCCINT rails share a clean power source and that decoupling follows the reference design. Quartus II (legacy) or MAX+PLUS II toolchains are used for place-and-route, and JTAG programming requires the ByteBlasterMV download cable.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone - providing engineers with the cross-reference intelligence needed to manage the FLEX 6000 lifecycle.
Bộ thay thế dễ dàng lắp đặt cho EPF6016BC256-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF6016BC256-2 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Device Type, Configuration Method.
EPF6016AFC256-2
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Xem tài liệu →EPF6016BC256-2 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 6000 |
| Logic Elements | 1320 |
| Typical Gates | 16,000 |
| Maximum Logic Gates | 24,000 |
| User I/O Pins | 204 |
| Supply Voltage (VCCINT / VCCIO) | 4.75 V to 5.25 V |
| Hộp | 256-FBGA (FineLine BGA, 17x17 mm) |
| Nhiệt độ hoạt động | 0C to +85C (Commercial) |
| Speed Grade | -2 |
| Process Technology | 0.42 um SRAM |
| Programmability | SRAM-based, in-system reconfigurable |
| Configuration Interface | JTAG (IEEE 1149.1) + serial |
| Internal Memory | Embedded array blocks (EABs) |
| Kiểu lắp đặt | Surface Mount (BGA) |
Cấu hình chân EPF6016BC256-2
| Chân A1 | IO — User I/O ball (pin assignment depends on configuration) |
| Chân A2 | IO — User I/O ball |
| Chân A3 | IO — User I/O ball |
| Chân A4 | VCCINT — Core supply voltage (4.75-5.25V) |
| Chân A5 | GND — Ground |
| Chân A6 | VCCIO — I/O supply voltage (4.75-5.25V) |
| Chân A7 | IO — User I/O ball |
| Chân A8 | IO — User I/O ball |
| Chân B1 | IO — User I/O ball |
| Chân B2 | nCONFIG — Configuration control (active-low reset) |
| Chân B3 | IO — User I/O ball |
| Chân B4 | IO — User I/O ball |
| Chân B5 | IO — User I/O ball |
| Chân B6 | IO — User I/O ball |
| Chân B7 | nSTATUS — Configuration status (active-low) |
| Chân B8 | CONF_DONE — Configuration complete indicator |
| Chân C1 | IO — User I/O ball |
| Chân C2 | IO — User I/O ball |
| Chân C3 | TDI — JTAG Test Data In |
| Chân C4 | TCK — JTAG Test Clock |
| Chân C5 | TMS — JTAG Test Mode Select |
| Chân C6 | TDO — JTAG Test Data Out |
| Chân C7 | DCLK — Configuration clock input |
| Chân C8 | IO — User I/O ball |
| Chân D1 | IO — User I/O ball |
| Chân D2 | IO — User I/O ball |
| Chân D3 | IO — User I/O ball |
| Chân D4 | GND — Ground |
| Chân D5 | VCCINT — Core supply voltage |
| Chân D6 | GND — Ground |
| Chân D7 | IO — User I/O ball |
| Chân D8 | IO — User I/O ball |
| Chân E1 | IO — User I/O ball |
| Chân E2 | IO — User I/O ball |
| Chân E3 | IO — User I/O ball |
| Chân E4 | VCCIO — I/O supply voltage |
| Chân E5 | GND — Ground |
| Chân E6 | VCCIO — I/O supply voltage |
| Chân E7 | IO — User I/O ball |
| Chân E8 | IO — User I/O ball |
| Chân F1 | IO — User I/O ball |
| Chân F2 | IO — User I/O ball |
| Chân F3 | IO — User I/O ball |
| Chân F4 | GND — Ground |
| Chân F5 | VCCINT — Core supply voltage |
| Chân F6 | GND — Ground |
| Chân F7 | IO — User I/O ball |
| Chân F8 | IO — User I/O ball |
| Chân G1 | IO — User I/O ball |
| Chân G2 | IO — User I/O ball |
| Chân G3 | IO — User I/O ball |
| Chân G4 | VCCIO — I/O supply voltage |
| Chân G5 | GND — Ground |
| Chân G6 | VCCIO — I/O supply voltage |
| Chân G7 | IO — User I/O ball |
| Chân G8 | IO — User I/O ball |
| Chân H1 | IO — User I/O ball |
| Chân H2 | IO — User I/O ball |
| Chân H3 | IO — User I/O ball |
| Chân H4 | GND — Ground |
| Chân H5 | VCCINT — Core supply voltage |
| Chân H6 | GND — Ground |
| Chân H7 | IO — User I/O ball |
| Chân H8 | IO — User I/O ball |
Ứng dụng tiêu biểu
EPF6016BC256-2 phù hợp cho 6 Áp dụngs: Industrial Glue Logic Replacement, Legacy Communication Bus Bridging, ASIC Prototyping and Validation, DSP Front-End Co-Processing, Low-Volume Custom Controllers, Test and Measurement Equipment.
Industrial Glue Logic Replacement
The EPF6016BC256-2 replaces multiple discrete 74-series logic ICs (gates, muxes, latches, buffers) on legacy industrial PCBs. With 1320 logic elements and 204 user I/Os in the 256-FBGA package, it absorbs up to ~50 standard-logic chips into one device, drastically reducing board area, BOM count, and assembly cost. The 5V tolerant I/O makes it ideal for industrial 5V backplanes. Designers typically describe their logic in VHDL/Verilog using MAX+PLUS II, then synthesize to the FLEX 6000 LUT-based architecture, replacing 7400-series glue logic and freeing PCB real estate for new functionality.
Được đề xuất
Legacy Communication Bus Bridging
The EPF6016BC256-2 is widely used as a bridge between legacy parallel buses (ISA, PC/104, VME) and modern high-speed serial interfaces. Its 204 I/Os comfortably handle 16-bit and 32-bit wide bus widths plus handshaking signals, while internal logic elements implement protocol conversion state machines. The 1320-LE fabric fits typical bridge designs with margin for debug logic. The 5V VCCIO directly interfaces legacy 5V peripherals without level shifters, simplifying PCB design and reducing BOM. Speed grade -2 supports bus clocks up to 60 MHz typical, sufficient for most legacy bus applications.
Được đề xuất
ASIC Prototyping and Validation
Designers use the EPF6016BC256-2 as a low-cost prototyping vehicle for ASIC designs targeting 5V-rail industrial or consumer ASICs. Its 1320 logic elements are sufficient to validate control logic, glue logic, and basic datapath blocks before committing to mask costs. FPGAs in the FLEX 6000 family have predictable timing that closely emulates ASIC behavior for control-dominated designs, and JTAG-based in-system reconfigurability enables rapid iteration. The 204 I/Os expose enough test points for real-time logic-analyzer probing of internal nets, making FPGA prototypes a powerful validation step before silicon spin.
Được đề xuất
DSP Front-End Co-Processing
The EPF6016BC256-2 can serve as a co-processor for DSP front-end tasks including FIR filtering, FFT preprocessing, and digital up/down-conversion in cost-sensitive applications. Its embedded array blocks (EABs) implement small distributed RAMs for coefficient storage, and the LUT-based logic elements run parallel multiply-accumulate structures. The 256-FBGA package's short traces preserve signal integrity at DSP clock rates, and the 204 I/Os provide enough bandwidth for parallel data paths. While modern designs use dedicated DSP blocks in Cyclone/Stratix families, FLEX 6000 remains viable for legacy DSP subsystems.
Được đề xuất
Low-Volume Custom Controllers
For low-volume production runs (hundreds to a few thousand units) where ASIC NRE costs are prohibitive, the EPF6016BC256-2 delivers ASIC-like integration with FPGA programmability. Designers implement custom motor-control, sensor-fusion, or peripheral controllers in VHDL, burn the configuration into the SRAM via JTAG at production, and deploy. With 1320 logic elements and 204 I/Os, it supports substantial state-machine complexity plus multiple peripheral interfaces. The FLEX 6000 family's mature toolchain (MAX+PLUS II) and broad IP library shorten development time, while Altera/Intel's long-term supply program supports end-of-life bridging.
Được đề xuất
Test and Measurement Equipment
Test equipment manufacturers use the EPF6016BC256-2 to implement pattern generators, custom timing controllers, and signal-conditioning logic in bench-top instruments. Its 204 user I/Os drive multiple DUT parallel interfaces simultaneously, while 1320 logic elements implement timing/state-machine cores. The 5V VCCIO directly interfaces legacy instrumentation signal levels without level translation, simplifying the analog front-end design. SRAM-based reconfigurability allows field upgrades to add new test patterns or fix bugs without hardware recall - a major advantage over fixed-function ASIC solutions in T&M markets.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF6016BC256-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF6016AFC256-2 | EPF6016AFC256-3 |
|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-FBGA FineLine (17x17 mm) | 256-FBGA FineLine - same | 256-FBGA FineLine - same |
| Logic Elements | 1320 | 1320 | 1320 |
| Typical Gates | 16,000 | 16,000 | 16,000 |
| User I/Os | 204 | 204 | 204 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Drop-in Compatible | N/A (reference) | Yes (100% pin-compatible) | Yes (pin-compatible, faster fMAX) |
Bảo phân biệt quan trọng
- True second-source availability with identical silicon (vsEPF6016AFC256-2)
- Mid-tier speed grade balances cost and performance (vsEPF6016AFC256-3)
- 204 user I/Os versus smaller density competitors (vsEPF6016AQC208-2)
Ghi chú thiết kế
The EPF6016BC256-2 requires separate VCCINT (core) and VCCIO (I/O) rails, both within 4.75V to 5.25V. Place 0.1uF ceramic decoupling capacitors adjacent to every pair of VCC/GND balls, with bulk 10uF tantalum or ceramic caps at board entry. Estimated: with 1320 LEs at 100% utilization and 50 MHz toggle, expect ICCINT ~150 mA and ICCIO ~100 mA - plan power budget and thermal dissipation accordingly. For mixed-voltage designs, drive 5V outputs into 3.3V loads only with series resistors or level shifters; the FLEX 6000 I/O is 5V tolerant but not 3.3V compatible without design care.
While the FLEX 6000 family is not high-power, sustained operation near the 85C commercial limit requires thermal management. Theta-JA for the 256-FBGA package is approximately 25 C/W typical with a JEDEC-standard test board. Estimated: at 1W total dissipation, junction temperature rise is ~25C above ambient. In enclosed industrial cabinets with ambient near 70C, consider 100 LFM airflow or a heat spreader to maintain reliability. Avoid placing the FPGA directly next to high-power components like DC-DC converters; route ground plane unbroken beneath the BGA for heat spreading.
Do not assume 3.3V peripherals work directly with the FLEX 6000 - the 5V VCCIO and TTL/CMOS-compatible I/O standards can damage 3.3V-only inputs. Use bidirectional level shifters (e.g., 74LVC245) when bridging to 3.3V devices. Also note: SRAM-based FPGAs require configuration at every power-up; ensure the JTAG chain is properly terminated and the ByteBlasterMV header is accessible for field updates. Estimated: in production, configure from a serial configuration PROM (e.g., EPC1) for one-time setup. Finally, this part is OBSOLETE - new designs should target Cyclone IV or Cyclone 10 LP for long-term supply.
Thông tin tuân thủ
RoHS and lead-free status not explicitly stated in verified distributor data; marked unknown. Commercial temperature grade (0C to 85C); no AEC-Q100 automotive qualification. For automotive or medical applications, verify compliance directly with Intel/Altera material declarations before design-in.
