EPF6024AQI240-2N - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Altera
MPN: EPF6024AQI240-2N ✗ Akhir HidupEPF6024AQI240-2N Ringkasan
A FLEX 6000-series FPGA is a SRAM-based programmable logic device that combines look-up-table (LUT) based logic elements with a continuous routing architecture, sitting in the broader taxonomy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> logic IC -> integrated circuit (IC) -> semiconductor. Unlike mask-programmed gate arrays, FPGAs are reprogrammable in-system, allowing iterative hardware design and in-field firmware updates.
Key features include 1,960 logic elements, 199 user I/O pins, 4 dedicated inputs, embedded SRAM-based configuration memory, and an industrial operating temperature range of -40C to +85C. The 'AQI240' suffix denotes the plastic QFP package and industrial temperature grade, while '-2N' indicates the speed grade and lead-free (Pb-free) finish.
Technically, the device uses a 5.0V-tolerant CMOS SRAM configuration cell with an EEPROM-less, ISP-capable architecture that loads bitstreams from external PROMs or microcontrollers. Its continuous routing fabric and FastTrack interconnect minimize routing congestion, while per-LE flip-flops and dedicated carry chains support efficient arithmetic and state-machine implementation.
Typical applications include industrial glue logic, peripheral bus bridges (ISA-to-PCI glue, UART expansion), motor-control co-processors, telecom line cards, and legacy embedded-system replacement. The wide 199 I/O count makes it suitable for parallel-bus interfaces and high-pin-count control planes.
When designing with this device, ensure an external configuration memory (EPC1/EPC2 or compatible PROM) is provided for SRAM cell loading on power-up, and respect the JTAG boundary-scan chain (IEEE 1149.1) for in-system programming. Plan PCB thermal dissipation because PQFP-240 packages have higher junction-to-ambient thermal resistance than BGA equivalents.
This page synthesizes distributor pricing, same-brand Altera/Intel drop-in alternatives (all in the FLEX 6000 family), and practical design notes not found in the manufacturer datasheet alone.
Alternatif penggantian untuk EPF6024AQI240-2N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF6024AQI240-2N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Configuration Method, Process Technology, Operating Temperature, Speed Grade.
EPF6024AQI240-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024AQI240-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024AQI240-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024AQC240-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024AQC240-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024AQI240-2N Rating Maksimal & Karakteristik Listrik
| Product Type | FPGA (Field-Programmable Gate Array) |
| Series | FLEX 6000 |
| Logic Elements | 1,960 |
| Typical Gate Count | 24,000 gates |
| User I/O Pins | 199 |
| Dedicated Inputs | 4 |
| Maximum Internal Clock Frequency | 153 MHz |
| Paket | 240-pin PQFP (QFP-240, 0.500 mm pitch) |
| Rentang Suhu Kerja | -40C to +85C (industrial) |
| Configuration Memory | SRAM (external PROMs: EPC1/EPC2 or compatible) |
| Process Technology | CMOS SRAM-based |
| Tipe Mounting | Surface Mount (Gull-wing) |
| JEDEC Package Code | S-PQFP-G240 |
Konfigurasi Pin EPF6024AQI240-2N
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
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| Pin produk 48 | I/O — User I/O pin (bank 1) |
| Pin produk 49 | I/O — User I/O pin (bank 1) |
| Pin produk 50 | I/O — User I/O pin (bank 1) |
| Pin produk 51 | I/O — User I/O pin (bank 1) |
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| Pin produk 56 | I/O — User I/O pin (bank 1) |
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| Pin produk 58 | I/O — User I/O pin (bank 1) |
| Pin produk 59 | I/O — User I/O pin (bank 1) |
| Pin produk 60 | I/O — User I/O pin (bank 1) |
| Pin produk 61 | GND — Ground |
| Pin produk 62 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 63 | VCCINT — Internal core supply voltage |
| Pin produk 64 | I/O — User I/O pin (bank 2) |
| Pin produk 65 | I/O — User I/O pin (bank 2) |
| Pin produk 66 | I/O — User I/O pin (bank 2) |
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| Pin produk 117 | I/O — User I/O pin (bank 2) |
| Pin produk 118 | I/O — User I/O pin (bank 2) |
| Pin produk 119 | I/O — User I/O pin (bank 2) |
| Pin produk 120 | I/O — User I/O pin (bank 2) |
| Pin produk 121 | GND — Ground |
| Pin produk 122 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 123 | VCCINT — Internal core supply voltage |
| Pin produk 124 | I/O — User I/O pin (bank 3) |
| Pin produk 125 | I/O — User I/O pin (bank 3) |
| Pin produk 126 | I/O — User I/O pin (bank 3) |
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| Pin produk 153 | I/O — User I/O pin (bank 3) |
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| Pin produk 176 | I/O — User I/O pin (bank 3) |
| Pin produk 177 | I/O — User I/O pin (bank 3) |
| Pin produk 178 | I/O — User I/O pin (bank 3) |
| Pin produk 179 | I/O — User I/O pin (bank 3) |
| Pin produk 180 | I/O — User I/O pin (bank 3) |
| Pin produk 181 | GND — Ground |
| Pin produk 182 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 183 | VCCINT — Internal core supply voltage |
| Pin produk 184 | DCLK — Configuration clock (Dedicated input) |
| Pin produk 185 | DATA0 — Configuration data input (Dedicated input) |
| Pin produk 186 | nCONFIG — Configuration start (Dedicated input, active-low) |
| Pin produk 187 | nSTATUS — Configuration status (Dedicated input) |
| Pin produk 188 | CONF_DONE — Configuration complete (Dedicated input) |
| Pin produk 189 | I/O — User I/O pin (bank 4) |
| Pin produk 190 | I/O — User I/O pin (bank 4) |
| Pin produk 191 | I/O — User I/O pin (bank 4) |
| Pin produk 192 | I/O — User I/O pin (bank 4) |
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| Pin produk 197 | I/O — User I/O pin (bank 4) |
| Pin produk 198 | I/O — User I/O pin (bank 4) |
| Pin produk 199 | I/O — User I/O pin (bank 4) |
| Pin produk 200 | I/O — User I/O pin (bank 4) |
| Pin produk 201 | I/O — User I/O pin (bank 4) |
| Pin produk 202 | I/O — User I/O pin (bank 4) |
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| Pin produk 238 | I/O — User I/O pin (bank 4) |
| Pin produk 239 | I/O — User I/O pin (bank 4) |
| Pin produk 240 | I/O — User I/O pin (bank 4) |
Aplikasi Umum
EPF6024AQI240-2N cocok untuk 6 aplikasis: Industrial Glue Logic, Peripheral Bus Bridge (ISA-to-PCI, UART Expansion), Telecom Line Card Glue Logic, Motor Control Co-Processor, Legacy Embedded System Replacement, Test & Measurement Front-End Logic.
Industrial Glue Logic
The EPF6024AQI240-2N is well suited to industrial glue logic because it offers 1,960 LEs and 199 user I/O pins in a single 240-PQFP package, allowing it to replace multiple discrete 74-series logic ICs and small PAL/GAL devices on a compact board. The 153 MHz internal Fmax (speed grade -2) easily handles typical glue-logic toggle rates of 25-100 MHz for control-plane signals, while the -40C to +85C industrial temperature range supports factory-floor and outdoor enclosures without thermal derating. Power sequencing and reset distribution are simplified by integrating the logic in reprogrammable SRAM, which also enables late-stage design changes via in-system JTAG programming. Designers should pair the device with an EPC1 or EPC2 configuration PROM and respect the FLEX 6000 I/O standard drive-strength settings.
Direkomendasikan
Peripheral Bus Bridge (ISA-to-PCI, UART Expansion)
The 1,960 logic elements and 199 I/O pins of the EPF6024AQI240-2N are sufficient to implement a transparent bus-bridge state machine between legacy ISA buses and PCI peripherals, or to multiplex multiple UART channels in industrial backplanes. The high I/O count allows parallel capture of address/data buses (e.g., 16-bit address + 16-bit data + 8 control lines) without external bus transceivers, reducing BOM and signal-integrity risk on long ribbon cables. The -2 speed grade supports up to 33 MHz PCI bus operation when timing closure is met. Trade-off: PQFP-240 has longer lead inductance than BGA equivalents, so designers must keep bus traces short and use series damping where bus speeds exceed 25 MHz to control reflections.
Direkomendasikan
Telecom Line Card Glue Logic
In telecom line cards, the EPF6024AQI240-2N serves as glue logic between framers, TDM switches, and control processors, taking advantage of its 199 I/O count to absorb the wide parallel bus widths common in T1/E1 and SONET framing circuits. The 153 MHz Fmax supports TDM bit-clock rates up to 77 MHz in double-data-rate mode, sufficient for STS-1/STS-3 framing glue. The industrial -40C to +85C temperature range meets NEBS-style thermal envelopes for central-office deployment. Designers should add proper bus-termination resistors and verify FLEX 6000 I/O VCCIO bank compatibility with the surrounding 3.3V or 5V devices, since mixed-voltage interfaces may require level-shifters on bank boundaries.
Direkomendasikan
Motor Control Co-Processor
The EPF6024AQI240-2N functions as a real-time co-processor next to a microcontroller in industrial motor drives, offloading PWM generation, encoder quadrature decoding, and Hall-sensor processing. Its 1,960 LEs are sufficient to implement a 3-phase space-vector modulator and quadrature decoder at PWM frequencies of 10-20 kHz with sub-microsecond latency. The 199 I/O count accommodates 6 PWM outputs, 6 Hall-sensor inputs, 2 quadrature encoder inputs, and 30+ GPIO for fault handling and status LEDs. Designers should allocate adequate FPGA logic for dead-time insertion and shoot-through protection, and respect FLEX 6000 I/O current-limit specifications when driving IGBT gate drivers directly.
Direkomendasikan
Legacy Embedded System Replacement
The EPF6024AQI240-2N is widely used as a drop-in replacement for aging discrete-PAL or masked-ASIC designs in long-lifecycle embedded systems such as avionics, military radios, and industrial process controllers. Its 240-PQFP package matches legacy footprints from the late 1990s, while its SRAM-based reprogrammability allows bug fixes without board respins. The -2 speed grade covers the 25-50 MHz operating frequencies typical of these legacy systems, and the industrial temperature rating maintains compliance with original equipment specifications. Designers porting from PALs should regenerate the logic using Altera MAX+PLUS II or Quartus legacy-support tools, and verify that the new bitstream fits within the 1,960-LE capacity before committing to layout.
Direkomendasikan
Test & Measurement Front-End Logic
In test and measurement equipment, the EPF6024AQI240-2N can implement the front-end sequencing, channel multiplexing, and trigger logic between analog front ends and an instrument controller. Its 199 I/O count easily supports 32+ channel multiplexers, handshaking signals, and trigger distribution, while the 153 MHz Fmax enables pattern generation at rates up to 100 MHz with proper pipelining. The industrial temperature range accommodates lab and field environments. Designers should keep high-speed analog signals away from the PQFP lead frame to minimize coupling, and use FLEX 6000 I/O banks to group logic-level standards (LVTTL vs LVCMOS) for cleaner signal integrity.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF6024AQI240-2N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF6024AQI240-2 | EPF6024AQI240-1N | EPF6024AQI240-1 | EPF6024AQC240-2N | EPF6024AQC240-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-PQFP (0.500 mm pitch) | 240-PQFP (same) | 240-PQFP (same) | 240-PQFP (same) | 240-PQFP (same) | 240-PQFP (same) |
| Logic Elements | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs |
| User I/O Pins | 199 | 199 | 199 | 199 | 199 | 199 |
| Speed Grade | -2 (~153 MHz Fmax) | -2 (same) | -1 (~125 MHz) | -1 (~125 MHz) | -2 (same) | -2 (same) |
| Operating Temperature | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C |
| Lead-Free Finish | Yes (-N suffix) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (limited stock) | Obsolete |
Diferensiator Kunci
- Higher Fmax at -2 speed grade (vsEPF6024AQI240-1N)
- Industrial temperature range qualification (vsEPF6024AQC240-2N)
- Lead-free (-N) finish (vsEPF6024AQI240-2 (without -N))
Catatan Desain
The EPF6024AQI240-2N requires both VCCINT (core supply, [DATA_NEEDED: V]) and VCCIO (per-bank I/O supply, [DATA_NEEDED: V]) rails. Both supplies must ramp together within the datasheet-specified monotonicity window to avoid incomplete configuration. Decouple each VCCIO bank pin with a 0.1 uF ceramic cap placed within 5 mm of the package lead, and add a bulk 10-100 uF tantalum or polymer cap at each supply pin pair. Use a star-ground topology with the FPGA ground pins tied to a low-impedance ground plane to minimize switching noise on the internal logic.
The 240-PQFP package has a junction-to-ambient thermal resistance (theta_JA) in the 30-45 C/W range depending on PCB copper area and airflow. At typical FLEX 6000 core currents of 50-150 mA, dissipation is well below 1 W and no heatsink is required, but the PQFP body must still be soldered with adequate copper land area on the PCB. Estimated: with 1 square inch of 2-oz copper pour, theta_JA drops to approximately 35 C/W, giving a 5C rise above ambient at 150 mA core current - well within the 85C industrial ceiling.
Route all 199 user I/O signals with 50 ohm controlled impedance if any signal exceeds 25 MHz, and keep high-speed traces away from the PQFP lead frame to reduce coupling. Place the configuration PROM (EPC1/EPC2) within 50 mm of the FPGA's DCLK/DATA0 pins, and route the configuration signals as a short point-to-point pair with ground shielding. Add a JTAG header (TCK, TMS, TDI, TDO, GND, VCCIO) for in-system programming per IEEE 1149.1, with TMS and TDI pulled up to VCCIO through 10 kohm resistors.
Do not confuse the EPF6024AQI240-2N (industrial temp) with the EPF6024AQC240-2N (commercial temp) - using a C-grade part in an industrial product will fail temperature testing. Also do not exceed the maximum I/O count of 199 by enabling JTAG USERCODE or other features that steal I/O pins - always check the Quartus fitter report. Finally, ensure the configuration bitstream is compiled for the correct device (EPF6024A) and speed grade (-2); using a -1 or -3 bitstream on a -2 device causes configuration errors at power-on.
Informasi Konformitas
Lead-free finish is denoted by the -N suffix per Altera/Intel nomenclature. RoHS compliance inferred from the lead-free finish; the formal RoHS certificate should be verified against the lot date code. The FLEX 6000 family is not AEC-Q100 qualified for automotive - choose a Cyclone or MAX variant for new automotive designs.