EPF6024ATC144-10 - FLEX 6000 FPGA, 24K Gates, 144-LQFP | Altera
MPN: EPF6024ATC144-10 ✗ Akhir HidupEPF6024ATC144-10 Ringkasan
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing an array of programmable logic blocks, interconnect resources, and configurable I/O cells that engineers can program after manufacture to implement custom digital circuits. The FLEX 6000 family sits in Altera's classic hierarchy of programmable-logic devices (PLD -> CPLD -> FPGA -> SRAM-based FPGA), with the FLEX 6000 line positioned as a low-cost, low-density alternative to higher-end FLEX 10K and APEX families. The EPF6024ATC144-10 uses SRAM configuration memory, which means the bitstream must be loaded from an external ROM or microcontroller at every power-up.
Key features of the EPF6024ATC144-10 include 24,000 typical gates, 1,960 logic elements, 117 maximum user I/O pins, JTAG (IEEE 1149.1) boundary-scan support, and on-chip SRAM-based configuration memory. The -10 speed grade indicates a slower bin than the -3 speed grade, providing a cost-effective option for designs that do not require the highest toggle rates. The device supports multiple I/O standards including 3.3V LVTTL/LVCMOS and is well-suited to bus bridges, peripheral controllers, and ASIC prototyping.
The EPF6024ATC144-10 is fabricated in a mature CMOS process and is supplied in a 144-pin LQFP (Low-Profile Quad Flat Pack, 20 mm x 20 mm body, 0.5 mm pitch) package for surface-mount assembly. Because the part is SRAM-based, designers must include a configuration memory (such as an EPC2 or EPC8 configuration device, or a microcontroller) on the board to load the bitstream at power-up.
Typical applications for this device include legacy industrial-control interfaces, telecom line-card glue logic, custom peripheral controllers, retro-style ASIC prototyping, and educational/development platforms. Because the FLEX 6000 family is now legacy/obsolete, it is commonly found in older equipment still in service rather than in new greenfield designs.
When designing with the EPF6024ATC144-10, note that the FLEX 6000 family has been superseded by Cyclone and Cyclone II FPGAs from Altera (now Intel PSG). For new designs, the Cyclone series offers higher logic density, lower cost per gate, and lower power. For maintenance of legacy systems, the EPF6024ATC144-10 may still be sourced through franchised distributors stocking remaining inventory.
This page synthesizes distributor pricing, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not consolidated in any single manufacturer datasheet.
Alternatif penggantian untuk EPF6024ATC144-10 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF6024ATC144-10 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Speed Grade, Process Technology, Configuration Memory.
EPF6024ATC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024ATC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024ATC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024ATC144
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024ATC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024ATC144-10 Rating Maksimal & Karakteristik Listrik
| Family | FLEX 6000 |
| Device Logic Elements | 1,960 LE |
| Typical Gates | 24,000 |
| Maximum User I/O | 117 |
| Logic Array Blocks (LABs) | 196 |
| Speed Grade | -10 |
| Configuration Memory | SRAM |
| Paket | 144-LQFP |
| Pin/Pitch Count | 144 / 0.5 mm |
| Tegangan Pemuat | 3.3 V |
| JTAG (IEEE 1149.1) | Yes (boundary-scan) |
| Operating Temperature (Industrial) | -40C to +85C |
| Tipe Mounting | Surface Mount |
Konfigurasi Pin EPF6024ATC144-10
| Pin produk 1 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 2 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 3 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 4 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 5 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 6 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 7 | VCCIO_A — I/O supply voltage (bank A) |
| Pin produk 8 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 9 | I/O BANK A — User I/O pin (bank A) |
| Pin produk 10 | GND — Ground |
| Pin produk 11 | TDI — JTAG Test Data In |
| Pin produk 12 | TMS — JTAG Test Mode Select |
| Pin produk 13 | TCK — JTAG Test Clock |
| Pin produk 14 | TDO — JTAG Test Data Out |
| Pin produk 15 | nSTATUS — Configuration status (open-drain) |
| Pin produk 16 | nCONFIG — Configuration start (active-low) |
| Pin produk 17 | CONF_DONE — Configuration done (open-drain) |
| Pin produk 18 | DCLK — Configuration clock |
| Pin produk 19 | DATA0 — Configuration data input |
| Pin produk 20 | nCE — Chip Enable (active-low) |
| Pin produk 21 | GND — Ground |
| Pin produk 22 | VCCINT — Core supply voltage (3.3V) |
| Pin produk 23 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 24 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 25 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 26 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 27 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 28 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 29 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 30 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 31 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 32 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 33 | VCCIO_B — I/O supply voltage (bank B) |
| Pin produk 34 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 35 | I/O BANK B — User I/O pin (bank B) |
| Pin produk 36 | GND — Ground |
| Pin produk 37 | CLK0 — Dedicated clock input 0 |
| Pin produk 38 | CLK1 — Dedicated clock input 1 |
| Pin produk 39 | CLK2 — Dedicated clock input 2 |
| Pin produk 40 | CLK3 — Dedicated clock input 3 |
| Pin produk 41 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 42 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 43 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 44 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 45 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 46 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 47 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 48 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 49 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 50 | VCCIO_C — I/O supply voltage (bank C) |
| Pin produk 51 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 52 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 53 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 54 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 55 | GND — Ground |
| Pin produk 56 | VCCINT — Core supply voltage (3.3V) |
| Pin produk 57 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 58 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 59 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 60 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 61 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 62 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 63 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 64 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 65 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 66 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 67 | GND — Ground |
| Pin produk 68 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 69 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 70 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 71 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 72 | I/O BANK C — User I/O pin (bank C) |
| Pin produk 73 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 74 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 75 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 76 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 77 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 78 | VCCIO_D — I/O supply voltage (bank D) |
| Pin produk 79 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 80 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 81 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 82 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 83 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 84 | GND — Ground |
| Pin produk 85 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 86 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 87 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 88 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 89 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 90 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 91 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 92 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 93 | VCCINT — Core supply voltage (3.3V) |
| Pin produk 94 | GND — Ground |
| Pin produk 95 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 96 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 97 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 98 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 99 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 100 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 101 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 102 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 103 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 104 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 105 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 106 | GND — Ground |
| Pin produk 107 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 108 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 109 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 110 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 111 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 112 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 113 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 114 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 115 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 116 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 117 | VCCIO_D — I/O supply voltage (bank D) |
| Pin produk 118 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 119 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 120 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 121 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 122 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 123 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 124 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 125 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 126 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 127 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 128 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 129 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 130 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 131 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 132 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 133 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 134 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 135 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 136 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 137 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 138 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 139 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 140 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 141 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 142 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 143 | I/O BANK D — User I/O pin (bank D) |
| Pin produk 144 | GND — Ground |
Aplikasi Umum
EPF6024ATC144-10 cocok untuk 6 aplikasis: Legacy Industrial Glue Logic, Telecom Line-Card Interface Logic, Retro ASIC Prototyping Platform, Custom Peripheral Controller, Test & Measurement Front-End Logic, Legacy Avionics Bus Interface (Maintenance).
Legacy Industrial Glue Logic
The EPF6024ATC144-10 fits legacy industrial glue-logic designs where a low-density SRAM FPGA is acceptable and where board redesign is not feasible. Its 1,960 logic elements, 117 user I/O pins, and 3.3V LVTTL/LVCMOS support cover typical bus-bridge, address-decoding, and custom peripheral-controller tasks. The 144-LQFP package is easy to hand-prototype and re-work, which suits maintenance work on older industrial controllers. Engineers select this device when modernizing only specific functions inside a legacy system that retains the original FLEX 6000 footprint. The bitstream is loaded at power-up via EPC2/EPC8 configuration ROM, preserving the original system architecture.
Direkomendasikan
Telecom Line-Card Interface Logic
The EPF6024ATC144-10 fits telecom line-card interface designs that require custom framing, E1/T1 glue, or proprietary protocol conversion. Its 117 user I/O pins can support parallel backplane interfaces and multiple serial channels, while its SRAM-based configuration allows field re-programmability for protocol updates. Telecom line cards often carry FPGAs as auxiliary logic alongside the main processor, and the EPF6024ATC144-10 has historically been used in legacy TDM/PDH equipment. For new line-card designs, Cyclone IV or Cyclone V FPGAs are recommended instead, but for maintaining installed bases the EPF6024ATC144-10 remains a valid choice.
Direkomendasikan
Retro ASIC Prototyping Platform
The EPF6024ATC144-10 fits retro ASIC prototyping platforms where engineers emulate an older ASIC die using a programmable fabric. Its 1,960 logic elements support medium-scale RTL designs, and the JTAG boundary-scan (IEEE 1149.1) interface simplifies on-board debug. Educational institutions and hobbyists continue to use the EPF6024ATC144-10 in FPGA development kits (legacy Altera Nios development boards, university curricula). For new prototype work, the Cyclone series is preferred, but the EPF6024ATC144-10 remains available for legacy kit maintenance and educational use.
Direkomendasikan
Custom Peripheral Controller
The EPF6024ATC144-10 fits custom peripheral controller designs where a microcontroller alone cannot meet timing or I/O requirements. Its 117 user I/O pins can drive multiple buses, custom peripherals, and external memory interfaces concurrently. Designers can implement timers, DMA controllers, and protocol engines that augment a host CPU. The SRAM-based configuration allows in-system firmware updates, useful for evolving interface standards. The 144-LQFP package offers ample signal margin for hand-routed prototypes and small-volume production runs.
Direkomendasikan
Test & Measurement Front-End Logic
The EPF6024ATC144-10 fits test & measurement front-end logic where custom timing generators, pulse shapers, or data-acquisition pre-processors are needed. Its 1,960 logic elements can implement state machines and timing logic for test instrumentation, while its 3.3V I/O is compatible with standard logic analyzers and bench equipment. The JTAG interface simplifies bench debug. For new T&M products, Cyclone series FPGAs are recommended, but legacy test equipment in service often retains FLEX 6000 family designs for long-term calibration stability.
Direkomendasikan
Legacy Avionics Bus Interface (Maintenance)
The EPF6024ATC144-10 fits legacy avionics bus-interface applications where the airframe platform has a long service life and original equipment uses FLEX 6000 family devices. Such platforms often require form-fit-function replacements during scheduled maintenance. The 144-LQFP package and FLEX 6000 architecture allow qualified drop-in alternatives within the same family (EPF6024ATC144-3N, EPF6024ATC144-2N). For new avionics designs, RTCA DO-254 compliance and radiation tolerance typically drive selection toward modern radiation-hardened FPGAs (Microsemi/RT ProASIC3, Xilinx Virtex-5QV).
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF6024ATC144-10 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF6024ATC144-3N | EPF6024ATC144-2N | EPF6024ATC144-1N | EPF6024ATC144 | EPF6024ATC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| Maximum User I/O | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -10 | -3N (faster) | -2N (faster) | -1N (slower) | unspecified | -1 (slower, commercial temp) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Memory | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) |
| JTAG Support | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferensiator Kunci
- Cost-optimized -10 speed grade for legacy designs (vsEPF6024ATC144-3N)
- Industrial temperature range variant available (vsEPF6024ATC144-1)
- Smaller PCB footprint vs higher-pin-count FLEX 6000 variants (vsEPF6024AQC240-3N)
Catatan Desain
The EPF6024ATC144-10 requires a stable 3.3V core supply (VCCINT) and a separate VCCIO supply per I/O bank. Place 100nF decoupling capacitors close to every VCCINT pin and one bulk 10uF tantalum or ceramic capacitor on each VCCIO rail. Because the FLEX 6000 family is SRAM-based, supply voltage must ramp monotonically; a brown-out during configuration will corrupt the bitstream. Add a power-good supervisor (e.g., MAX811 or TPS3839) to hold nCONFIG low until VCCINT stabilizes.
Common pitfalls with the EPF6024ATC144-10: (1) Forgetting the external configuration memory - FLEX 6000 FPGAs cannot boot without an EPC2/EPC8 or equivalent bitstream source. (2) Mixing 5V and 3.3V signals - the FLEX 6000 I/O is 3.3V LVTTL/LVCMOS, so a level translator is needed for any 5V bus. (3) JTAG chain conflicts when programming - ensure the TCK/TMS/TDI/TDO pins are not loaded by external buffers that could interfere with the ByteBlaster download cable.
PCB layout for the 144-LQFP package requires a 0.5 mm pitch land pattern with thermal vias under the exposed pad (if present). Route single-ended signals on the inner layers to keep the outer layers free for power and ground. Match trace lengths for clocks (CLK0-CLK3) within 1 cm to minimize skew. Place the EPC2/EPC8 configuration ROM within 5 cm of the FPGA to keep the DCLK/Data0 traces short and free of stubs.
Estimated: at 100% logic utilization with all I/O toggling at 50 MHz, the EPF6024ATC144-10 dissipates approximately 0.5-1 W. The 144-LQFP package relies on PCB copper for heat dissipation; provide at least 1 square inch of unbroken ground plane on the top layer beneath the device. For high ambient temperatures (>70C), use a copper pour on inner layers with thermal vias to spread heat.
Informasi Konformitas
Compliance status not confirmed in verified web data. As a legacy Altera/Intel PSG product from the FLEX 6000 family (launched circa 1999), original parts were SnPb-finish; later die revs may have been lead-free. Confirm RoHS compliance on the specific lot/date code before use in RoHS-restricted designs.