EPF6024ATC144-10 - FLEX 6000 FPGA, 24K Gates, 144-LQFP | Altera
부품 번호: EPF6024ATC144-10 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.05 | $1,405.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $11.1 | $11,100.00 |
EPF6024ATC144-10 개요
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing an array of programmable logic blocks, interconnect resources, and configurable I/O cells that engineers can program after manufacture to implement custom digital circuits. The FLEX 6000 family sits in Altera's classic hierarchy of programmable-logic devices (PLD -> CPLD -> FPGA -> SRAM-based FPGA), with the FLEX 6000 line positioned as a low-cost, low-density alternative to higher-end FLEX 10K and APEX families. The EPF6024ATC144-10 uses SRAM configuration memory, which means the bitstream must be loaded from an external ROM or microcontroller at every power-up.
Key features of the EPF6024ATC144-10 include 24,000 typical gates, 1,960 logic elements, 117 maximum user I/O pins, JTAG (IEEE 1149.1) boundary-scan support, and on-chip SRAM-based configuration memory. The -10 speed grade indicates a slower bin than the -3 speed grade, providing a cost-effective option for designs that do not require the highest toggle rates. The device supports multiple I/O standards including 3.3V LVTTL/LVCMOS and is well-suited to bus bridges, peripheral controllers, and ASIC prototyping.
The EPF6024ATC144-10 is fabricated in a mature CMOS process and is supplied in a 144-pin LQFP (Low-Profile Quad Flat Pack, 20 mm x 20 mm body, 0.5 mm pitch) package for surface-mount assembly. Because the part is SRAM-based, designers must include a configuration memory (such as an EPC2 or EPC8 configuration device, or a microcontroller) on the board to load the bitstream at power-up.
Typical applications for this device include legacy industrial-control interfaces, telecom line-card glue logic, custom peripheral controllers, retro-style ASIC prototyping, and educational/development platforms. Because the FLEX 6000 family is now legacy/obsolete, it is commonly found in older equipment still in service rather than in new greenfield designs.
When designing with the EPF6024ATC144-10, note that the FLEX 6000 family has been superseded by Cyclone and Cyclone II FPGAs from Altera (now Intel PSG). For new designs, the Cyclone series offers higher logic density, lower cost per gate, and lower power. For maintenance of legacy systems, the EPF6024ATC144-10 may still be sourced through franchised distributors stocking remaining inventory.
This page synthesizes distributor pricing, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not consolidated in any single manufacturer datasheet.
드롭인 대체품: EPF6024ATC144-10 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6024ATC144-10 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6024ATC144-3N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPF6024ATC144-2N
✅ 드롭인✓ 재고 있음
$20.95 / 개
데이터시트 보기 →EPF6024ATC144-1N
✅ 드롭인✓ 재고 있음
$20.95 / 개
데이터시트 보기 →EPF6024ATC144
✅ 드롭인✓ 재고 있음
$21.8 / 개
데이터시트 보기 →EPF6024ATC144-1
✅ 드롭인✓ 재고 있음
$8.2 / 개
데이터시트 보기 →EPF6024ATC144-10 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Device Logic Elements | 1,960 LE |
| Typical Gates | 24,000 |
| Maximum User I/O | 117 |
| Logic Array Blocks (LABs) | 196 |
| Speed Grade | -10 |
| Configuration Memory | SRAM |
| 패키지 | 144-LQFP |
| Pin/Pitch Count | 144 / 0.5 mm |
| 공급 전압 | 3.3 V |
| JTAG (IEEE 1149.1) | Yes (boundary-scan) |
| Operating Temperature (Industrial) | -40C to +85C |
| 실장 유형 | Surface Mount |
EPF6024ATC144-10 핀 구성
| 핀 1 | I/O BANK A — User I/O pin (bank A) |
| 핀 2 | I/O BANK A — User I/O pin (bank A) |
| 핀 3 | I/O BANK A — User I/O pin (bank A) |
| 핀 4 | I/O BANK A — User I/O pin (bank A) |
| 핀 5 | I/O BANK A — User I/O pin (bank A) |
| 핀 6 | I/O BANK A — User I/O pin (bank A) |
| 핀 7 | VCCIO_A — I/O supply voltage (bank A) |
| 핀 8 | I/O BANK A — User I/O pin (bank A) |
| 핀 9 | I/O BANK A — User I/O pin (bank A) |
| 핀 10 | GND — Ground |
| 핀 11 | TDI — JTAG Test Data In |
| 핀 12 | TMS — JTAG Test Mode Select |
| 핀 13 | TCK — JTAG Test Clock |
| 핀 14 | TDO — JTAG Test Data Out |
| 핀 15 | nSTATUS — Configuration status (open-drain) |
| 핀 16 | nCONFIG — Configuration start (active-low) |
| 핀 17 | CONF_DONE — Configuration done (open-drain) |
| 핀 18 | DCLK — Configuration clock |
| 핀 19 | DATA0 — Configuration data input |
| 핀 20 | nCE — Chip Enable (active-low) |
| 핀 21 | GND — Ground |
| 핀 22 | VCCINT — Core supply voltage (3.3V) |
| 핀 23 | I/O BANK B — User I/O pin (bank B) |
| 핀 24 | I/O BANK B — User I/O pin (bank B) |
| 핀 25 | I/O BANK B — User I/O pin (bank B) |
| 핀 26 | I/O BANK B — User I/O pin (bank B) |
| 핀 27 | I/O BANK B — User I/O pin (bank B) |
| 핀 28 | I/O BANK B — User I/O pin (bank B) |
| 핀 29 | I/O BANK B — User I/O pin (bank B) |
| 핀 30 | I/O BANK B — User I/O pin (bank B) |
| 핀 31 | I/O BANK B — User I/O pin (bank B) |
| 핀 32 | I/O BANK B — User I/O pin (bank B) |
| 핀 33 | VCCIO_B — I/O supply voltage (bank B) |
| 핀 34 | I/O BANK B — User I/O pin (bank B) |
| 핀 35 | I/O BANK B — User I/O pin (bank B) |
| 핀 36 | GND — Ground |
| 핀 37 | CLK0 — Dedicated clock input 0 |
| 핀 38 | CLK1 — Dedicated clock input 1 |
| 핀 39 | CLK2 — Dedicated clock input 2 |
| 핀 40 | CLK3 — Dedicated clock input 3 |
| 핀 41 | I/O BANK C — User I/O pin (bank C) |
| 핀 42 | I/O BANK C — User I/O pin (bank C) |
| 핀 43 | I/O BANK C — User I/O pin (bank C) |
| 핀 44 | I/O BANK C — User I/O pin (bank C) |
| 핀 45 | I/O BANK C — User I/O pin (bank C) |
| 핀 46 | I/O BANK C — User I/O pin (bank C) |
| 핀 47 | I/O BANK C — User I/O pin (bank C) |
| 핀 48 | I/O BANK C — User I/O pin (bank C) |
| 핀 49 | I/O BANK C — User I/O pin (bank C) |
| 핀 50 | VCCIO_C — I/O supply voltage (bank C) |
| 핀 51 | I/O BANK C — User I/O pin (bank C) |
| 핀 52 | I/O BANK C — User I/O pin (bank C) |
| 핀 53 | I/O BANK C — User I/O pin (bank C) |
| 핀 54 | I/O BANK C — User I/O pin (bank C) |
| 핀 55 | GND — Ground |
| 핀 56 | VCCINT — Core supply voltage (3.3V) |
| 핀 57 | I/O BANK C — User I/O pin (bank C) |
| 핀 58 | I/O BANK C — User I/O pin (bank C) |
| 핀 59 | I/O BANK C — User I/O pin (bank C) |
| 핀 60 | I/O BANK C — User I/O pin (bank C) |
| 핀 61 | I/O BANK C — User I/O pin (bank C) |
| 핀 62 | I/O BANK C — User I/O pin (bank C) |
| 핀 63 | I/O BANK C — User I/O pin (bank C) |
| 핀 64 | I/O BANK C — User I/O pin (bank C) |
| 핀 65 | I/O BANK C — User I/O pin (bank C) |
| 핀 66 | I/O BANK C — User I/O pin (bank C) |
| 핀 67 | GND — Ground |
| 핀 68 | I/O BANK C — User I/O pin (bank C) |
| 핀 69 | I/O BANK C — User I/O pin (bank C) |
| 핀 70 | I/O BANK C — User I/O pin (bank C) |
| 핀 71 | I/O BANK C — User I/O pin (bank C) |
| 핀 72 | I/O BANK C — User I/O pin (bank C) |
| 핀 73 | I/O BANK D — User I/O pin (bank D) |
| 핀 74 | I/O BANK D — User I/O pin (bank D) |
| 핀 75 | I/O BANK D — User I/O pin (bank D) |
| 핀 76 | I/O BANK D — User I/O pin (bank D) |
| 핀 77 | I/O BANK D — User I/O pin (bank D) |
| 핀 78 | VCCIO_D — I/O supply voltage (bank D) |
| 핀 79 | I/O BANK D — User I/O pin (bank D) |
| 핀 80 | I/O BANK D — User I/O pin (bank D) |
| 핀 81 | I/O BANK D — User I/O pin (bank D) |
| 핀 82 | I/O BANK D — User I/O pin (bank D) |
| 핀 83 | I/O BANK D — User I/O pin (bank D) |
| 핀 84 | GND — Ground |
| 핀 85 | I/O BANK D — User I/O pin (bank D) |
| 핀 86 | I/O BANK D — User I/O pin (bank D) |
| 핀 87 | I/O BANK D — User I/O pin (bank D) |
| 핀 88 | I/O BANK D — User I/O pin (bank D) |
| 핀 89 | I/O BANK D — User I/O pin (bank D) |
| 핀 90 | I/O BANK D — User I/O pin (bank D) |
| 핀 91 | I/O BANK D — User I/O pin (bank D) |
| 핀 92 | I/O BANK D — User I/O pin (bank D) |
| 핀 93 | VCCINT — Core supply voltage (3.3V) |
| 핀 94 | GND — Ground |
| 핀 95 | I/O BANK D — User I/O pin (bank D) |
| 핀 96 | I/O BANK D — User I/O pin (bank D) |
| 핀 97 | I/O BANK D — User I/O pin (bank D) |
| 핀 98 | I/O BANK D — User I/O pin (bank D) |
| 핀 99 | I/O BANK D — User I/O pin (bank D) |
| 핀 100 | I/O BANK D — User I/O pin (bank D) |
| 핀 101 | I/O BANK D — User I/O pin (bank D) |
| 핀 102 | I/O BANK D — User I/O pin (bank D) |
| 핀 103 | I/O BANK D — User I/O pin (bank D) |
| 핀 104 | I/O BANK D — User I/O pin (bank D) |
| 핀 105 | I/O BANK D — User I/O pin (bank D) |
| 핀 106 | GND — Ground |
| 핀 107 | I/O BANK D — User I/O pin (bank D) |
| 핀 108 | I/O BANK D — User I/O pin (bank D) |
| 핀 109 | I/O BANK D — User I/O pin (bank D) |
| 핀 110 | I/O BANK D — User I/O pin (bank D) |
| 핀 111 | I/O BANK D — User I/O pin (bank D) |
| 핀 112 | I/O BANK D — User I/O pin (bank D) |
| 핀 113 | I/O BANK D — User I/O pin (bank D) |
| 핀 114 | I/O BANK D — User I/O pin (bank D) |
| 핀 115 | I/O BANK D — User I/O pin (bank D) |
| 핀 116 | I/O BANK D — User I/O pin (bank D) |
| 핀 117 | VCCIO_D — I/O supply voltage (bank D) |
| 핀 118 | I/O BANK D — User I/O pin (bank D) |
| 핀 119 | I/O BANK D — User I/O pin (bank D) |
| 핀 120 | I/O BANK D — User I/O pin (bank D) |
| 핀 121 | I/O BANK D — User I/O pin (bank D) |
| 핀 122 | I/O BANK D — User I/O pin (bank D) |
| 핀 123 | I/O BANK D — User I/O pin (bank D) |
| 핀 124 | I/O BANK D — User I/O pin (bank D) |
| 핀 125 | I/O BANK D — User I/O pin (bank D) |
| 핀 126 | I/O BANK D — User I/O pin (bank D) |
| 핀 127 | I/O BANK D — User I/O pin (bank D) |
| 핀 128 | I/O BANK D — User I/O pin (bank D) |
| 핀 129 | I/O BANK D — User I/O pin (bank D) |
| 핀 130 | I/O BANK D — User I/O pin (bank D) |
| 핀 131 | I/O BANK D — User I/O pin (bank D) |
| 핀 132 | I/O BANK D — User I/O pin (bank D) |
| 핀 133 | I/O BANK D — User I/O pin (bank D) |
| 핀 134 | I/O BANK D — User I/O pin (bank D) |
| 핀 135 | I/O BANK D — User I/O pin (bank D) |
| 핀 136 | I/O BANK D — User I/O pin (bank D) |
| 핀 137 | I/O BANK D — User I/O pin (bank D) |
| 핀 138 | I/O BANK D — User I/O pin (bank D) |
| 핀 139 | I/O BANK D — User I/O pin (bank D) |
| 핀 140 | I/O BANK D — User I/O pin (bank D) |
| 핀 141 | I/O BANK D — User I/O pin (bank D) |
| 핀 142 | I/O BANK D — User I/O pin (bank D) |
| 핀 143 | I/O BANK D — User I/O pin (bank D) |
| 핀 144 | GND — Ground |
일반적인 애플리케이션
EPF6024ATC144-10 적합 용도: 6 애플리케이션s: Legacy Industrial Glue Logic, Telecom Line-Card Interface Logic, Retro ASIC Prototyping Platform, Custom Peripheral Controller, Test & Measurement Front-End Logic, Legacy Avionics Bus Interface (Maintenance).
Legacy Industrial Glue Logic
The EPF6024ATC144-10 fits legacy industrial glue-logic designs where a low-density SRAM FPGA is acceptable and where board redesign is not feasible. Its 1,960 logic elements, 117 user I/O pins, and 3.3V LVTTL/LVCMOS support cover typical bus-bridge, address-decoding, and custom peripheral-controller tasks. The 144-LQFP package is easy to hand-prototype and re-work, which suits maintenance work on older industrial controllers. Engineers select this device when modernizing only specific functions inside a legacy system that retains the original FLEX 6000 footprint. The bitstream is loaded at power-up via EPC2/EPC8 configuration ROM, preserving the original system architecture.
추천
Telecom Line-Card Interface Logic
The EPF6024ATC144-10 fits telecom line-card interface designs that require custom framing, E1/T1 glue, or proprietary protocol conversion. Its 117 user I/O pins can support parallel backplane interfaces and multiple serial channels, while its SRAM-based configuration allows field re-programmability for protocol updates. Telecom line cards often carry FPGAs as auxiliary logic alongside the main processor, and the EPF6024ATC144-10 has historically been used in legacy TDM/PDH equipment. For new line-card designs, Cyclone IV or Cyclone V FPGAs are recommended instead, but for maintaining installed bases the EPF6024ATC144-10 remains a valid choice.
추천
Retro ASIC Prototyping Platform
The EPF6024ATC144-10 fits retro ASIC prototyping platforms where engineers emulate an older ASIC die using a programmable fabric. Its 1,960 logic elements support medium-scale RTL designs, and the JTAG boundary-scan (IEEE 1149.1) interface simplifies on-board debug. Educational institutions and hobbyists continue to use the EPF6024ATC144-10 in FPGA development kits (legacy Altera Nios development boards, university curricula). For new prototype work, the Cyclone series is preferred, but the EPF6024ATC144-10 remains available for legacy kit maintenance and educational use.
추천
Custom Peripheral Controller
The EPF6024ATC144-10 fits custom peripheral controller designs where a microcontroller alone cannot meet timing or I/O requirements. Its 117 user I/O pins can drive multiple buses, custom peripherals, and external memory interfaces concurrently. Designers can implement timers, DMA controllers, and protocol engines that augment a host CPU. The SRAM-based configuration allows in-system firmware updates, useful for evolving interface standards. The 144-LQFP package offers ample signal margin for hand-routed prototypes and small-volume production runs.
추천
Test & Measurement Front-End Logic
The EPF6024ATC144-10 fits test & measurement front-end logic where custom timing generators, pulse shapers, or data-acquisition pre-processors are needed. Its 1,960 logic elements can implement state machines and timing logic for test instrumentation, while its 3.3V I/O is compatible with standard logic analyzers and bench equipment. The JTAG interface simplifies bench debug. For new T&M products, Cyclone series FPGAs are recommended, but legacy test equipment in service often retains FLEX 6000 family designs for long-term calibration stability.
추천
Legacy Avionics Bus Interface (Maintenance)
The EPF6024ATC144-10 fits legacy avionics bus-interface applications where the airframe platform has a long service life and original equipment uses FLEX 6000 family devices. Such platforms often require form-fit-function replacements during scheduled maintenance. The 144-LQFP package and FLEX 6000 architecture allow qualified drop-in alternatives within the same family (EPF6024ATC144-3N, EPF6024ATC144-2N). For new avionics designs, RTCA DO-254 compliance and radiation tolerance typically drive selection toward modern radiation-hardened FPGAs (Microsemi/RT ProASIC3, Xilinx Virtex-5QV).
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF6024ATC144-10 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6024ATC144-3N | EPF6024ATC144-2N | EPF6024ATC144-1N | EPF6024ATC144 | EPF6024ATC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| Maximum User I/O | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -10 | -3N (faster) | -2N (faster) | -1N (slower) | unspecified | -1 (slower, commercial temp) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Memory | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) |
| JTAG Support | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Cost-optimized -10 speed grade for legacy designs (vs EPF6024ATC144-3N)
- Industrial temperature range variant available (vs EPF6024ATC144-1)
- Smaller PCB footprint vs higher-pin-count FLEX 6000 variants (vs EPF6024AQC240-3N)
설계 노트
The EPF6024ATC144-10 requires a stable 3.3V core supply (VCCINT) and a separate VCCIO supply per I/O bank. Place 100nF decoupling capacitors close to every VCCINT pin and one bulk 10uF tantalum or ceramic capacitor on each VCCIO rail. Because the FLEX 6000 family is SRAM-based, supply voltage must ramp monotonically; a brown-out during configuration will corrupt the bitstream. Add a power-good supervisor (e.g., MAX811 or TPS3839) to hold nCONFIG low until VCCINT stabilizes.
Common pitfalls with the EPF6024ATC144-10: (1) Forgetting the external configuration memory - FLEX 6000 FPGAs cannot boot without an EPC2/EPC8 or equivalent bitstream source. (2) Mixing 5V and 3.3V signals - the FLEX 6000 I/O is 3.3V LVTTL/LVCMOS, so a level translator is needed for any 5V bus. (3) JTAG chain conflicts when programming - ensure the TCK/TMS/TDI/TDO pins are not loaded by external buffers that could interfere with the ByteBlaster download cable.
PCB layout for the 144-LQFP package requires a 0.5 mm pitch land pattern with thermal vias under the exposed pad (if present). Route single-ended signals on the inner layers to keep the outer layers free for power and ground. Match trace lengths for clocks (CLK0-CLK3) within 1 cm to minimize skew. Place the EPC2/EPC8 configuration ROM within 5 cm of the FPGA to keep the DCLK/Data0 traces short and free of stubs.
Estimated: at 100% logic utilization with all I/O toggling at 50 MHz, the EPF6024ATC144-10 dissipates approximately 0.5-1 W. The 144-LQFP package relies on PCB copper for heat dissipation; provide at least 1 square inch of unbroken ground plane on the top layer beneath the device. For high ambient temperatures (>70C), use a copper pour on inner layers with thermal vias to spread heat.
규정 준수 정보
Compliance status not confirmed in verified web data. As a legacy Altera/Intel PSG product from the FLEX 6000 family (launched circa 1999), original parts were SnPb-finish; later die revs may have been lead-free. Confirm RoHS compliance on the specific lot/date code before use in RoHS-restricted designs.