Altera

EPF6024ATC1443 - FLEX 6000 FPGA, 1960 Gates, 117 I/O, TQFP-144 | Altera

MPN: EPF6024ATC1443 ⚠ Waktu Beli Terakhir

3.3 V Vdss TQFP-144 (22 x 22 mm, 0.5 mm pitch) Package -3 Speed

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EPF6024ATC1443 Ringkasan

The Altera (Intel) EPF6024ATC1443 is a member of the FLEX 6000 family of SRAM-based, low-density Field Programmable Gate Arrays (FPGAs) offering 1960 logic elements organized into 196 Logic Array Blocks (LABs) and 117 general-purpose I/O pins, housed in a 144-pin Thin Quad Flat Pack (TQFP-144) package. The device operates on a 3.3 V core supply with 5.0 V-tolerant I/O capability, making it suitable for mixed-voltage interfacing with legacy 5 V logic. Speed grade -3 places it in the mid-tier performance range of the FLEX 6000 family, balancing timing closure flexibility against unit cost.

An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacture via a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader programmable logic hierarchy between simple programmable logic devices (SPLDs/CPLDs) and high-capacity FPGAs, and are widely used for glue logic, bus bridging, and modest-throughput state-machine implementation. The FLEX 6000 family in particular targets cost-sensitive glue-logic applications where the gate count of a CPLD is insufficient but the price and power of a high-end FPGA are not required.

Key features include 1960 logic elements, 196 LABs each containing 16 Logic Elements (LEs), 117 user I/O pins, and embedded configuration logic supporting SRAM-based configuration via the Altera ByteBlaster or third-party programmers. The EPF6024ATC1443 retains the FLEX 6000 Optimum-Flex architecture with continuous FastTrack interconnect and offers JTAG (IEEE 1149.1) boundary-scan testability. Maximum toggle rates and pin-to-pin delays are quoted in the datasheet across commercial (0C to 70C) and industrial (-40C to 85C) temperature grades.

Architecture-wise, the device is built on a 0.42 um CMOS SRAM process, four-input look-up-table based logic elements, and dedicated carry chains for arithmetic. Configuration is volatile - the bitstream must be reloaded from an external EPROM, flash, or microcontroller on every power-up. The TQFP-144 package provides a 0.5 mm lead pitch on a 22 mm x 22 mm body for surface-mount assembly.

Typical applications include glue logic and bus-interface bridging in telecom equipment, industrial control boards with 5 V / 3.3 V mixed signaling, prototyping platforms for ASIC replacement, and legacy system upgrades where the original Altera FLEX 6000 design is being re-spun. Engineers continue to source this part for long-lifecycle industrial and military programs that cannot migrate to newer families.

Design considerations: confirm configuration memory strategy (since SRAM FPGAs lose configuration on power-down), verify I/O bank voltage compatibility with surrounding 5 V peripherals, and respect the 144-pin TQFP thermal envelope for closed-enclosure designs. Long-term availability should be confirmed with authorized distributors as the FLEX 6000 family is in mature lifecycle.

This page synthesizes distributor stock, drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.

Alternatif penggantian untuk EPF6024ATC1443 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF6024ATC1443 (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements / Cells.

EPF6024ATC144-1

Intel

Process Technology: 0.42 um CMOS

Package: 144-pin TQFP

Operating Temperature: 0C to 70C (commercial)