EPF6024ATC1443 - FLEX 6000 FPGA, 1960 Gates, 117 I/O, TQFP-144 | Altera
Référence : EPF6024ATC1443 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.4 | $12,40 |
| 10 | $11.5 | $115,00 |
| 100 | $10.2 | $1 020,00 |
| 500 | $8.95 | $4 475,00 |
| 1 000 | $7.8 | $7 800,00 |
EPF6024ATC1443 Présentation
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacture via a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader programmable logic hierarchy between simple programmable logic devices (SPLDs/CPLDs) and high-capacity FPGAs, and are widely used for glue logic, bus bridging, and modest-throughput state-machine implementation. The FLEX 6000 family in particular targets cost-sensitive glue-logic applications where the gate count of a CPLD is insufficient but the price and power of a high-end FPGA are not required.
Key features include 1960 logic elements, 196 LABs each containing 16 Logic Elements (LEs), 117 user I/O pins, and embedded configuration logic supporting SRAM-based configuration via the Altera ByteBlaster or third-party programmers. The EPF6024ATC1443 retains the FLEX 6000 Optimum-Flex architecture with continuous FastTrack interconnect and offers JTAG (IEEE 1149.1) boundary-scan testability. Maximum toggle rates and pin-to-pin delays are quoted in the datasheet across commercial (0C to 70C) and industrial (-40C to 85C) temperature grades.
Architecture-wise, the device is built on a 0.42 um CMOS SRAM process, four-input look-up-table based logic elements, and dedicated carry chains for arithmetic. Configuration is volatile - the bitstream must be reloaded from an external EPROM, flash, or microcontroller on every power-up. The TQFP-144 package provides a 0.5 mm lead pitch on a 22 mm x 22 mm body for surface-mount assembly.
Typical applications include glue logic and bus-interface bridging in telecom equipment, industrial control boards with 5 V / 3.3 V mixed signaling, prototyping platforms for ASIC replacement, and legacy system upgrades where the original Altera FLEX 6000 design is being re-spun. Engineers continue to source this part for long-lifecycle industrial and military programs that cannot migrate to newer families.
Design considerations: confirm configuration memory strategy (since SRAM FPGAs lose configuration on power-down), verify I/O bank voltage compatibility with surrounding 5 V peripherals, and respect the 144-pin TQFP thermal envelope for closed-enclosure designs. Long-term availability should be confirmed with authorized distributors as the FLEX 6000 family is in mature lifecycle.
This page synthesizes distributor stock, drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Alternatives de remplacement direct pour EPF6024ATC1443 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATC1443 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements / Cells.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144-3
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EPF6024ATC144-3N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF6024ATC144-3S
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF6024ATC144-2
✅ Remplacement direct✓ En stock
$24.95 / unité
Voir la fiche technique →EPF6024ATC144-1
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →EPF6024ATC144-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$20.95 / unité
Voir la fiche technique →EPF6024ATC1443 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements | 1960 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 117 |
| Boîtier | TQFP-144 (22 x 22 mm, 0.5 mm pitch) |
| Speed Grade | -3 |
| Core Voltage | 3.3 V |
| I/O Voltage Tolerance | 5.0 V tolerant |
| Configuration Method | SRAM (volatile) |
| Process Technology | 0.42 um CMOS SRAM |
| Plage de température de fonctionnement | -40C to +85C (industrial) / 0C to 70C (commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Type de montage | Surface Mount |
Configuration des broches de EPF6024ATC1443
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | VCCIO1 — I/O bank 1 supply voltage (3.3 V or 5 V tolerant) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | TMS — JTAG Test Mode Select |
| Broche 15 | TCK — JTAG Test Clock |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | VCCINT — Core supply voltage (3.3 V) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | TDI — JTAG Test Data In |
| Broche 45 | TDO — JTAG Test Data Out |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | VCCINT — Core supply voltage (3.3 V) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 5) |
| Broche 76 | nCONFIG — Configuration control (active-low reset) |
| Broche 77 | nSTATUS — Configuration status (active-low) |
| Broche 78 | CONF_DONE — Configuration complete indicator |
| Broche 79 | I/O — User I/O pin (bank 5) |
| Broche 80 | I/O — User I/O pin (bank 5) |
| Broche 81 | I/O — User I/O pin (bank 5) |
| Broche 82 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | I/O — User I/O pin (bank 5) |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | VCCINT — Core supply voltage (3.3 V) |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | I/O — User I/O pin (bank 5) |
| Broche 94 | I/O — User I/O pin (bank 5) |
| Broche 95 | I/O — User I/O pin (bank 5) |
| Broche 96 | I/O — User I/O pin (bank 5) |
| Broche 97 | I/O — User I/O pin (bank 5) |
| Broche 98 | I/O — User I/O pin (bank 6) |
| Broche 99 | MSEL0 — Configuration mode select bit 0 |
| Broche 100 | MSEL1 — Configuration mode select bit 1 |
| Broche 101 | I/O — User I/O pin (bank 6) |
| Broche 102 | I/O — User I/O pin (bank 6) |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 105 | GND — Ground |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | I/O — User I/O pin (bank 6) |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | VCCINT — Core supply voltage (3.3 V) |
| Broche 115 | I/O — User I/O pin (bank 6) |
| Broche 116 | I/O — User I/O pin (bank 6) |
| Broche 117 | GND — Ground |
| Broche 118 | I/O — User I/O pin (bank 7) |
| Broche 119 | I/O — User I/O pin (bank 7) |
| Broche 120 | I/O — User I/O pin (bank 7) |
| Broche 121 | I/O — User I/O pin (bank 7) |
| Broche 122 | I/O — User I/O pin (bank 7) |
| Broche 123 | I/O — User I/O pin (bank 7) |
| Broche 124 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 125 | I/O — User I/O pin (bank 7) |
| Broche 126 | I/O — User I/O pin (bank 7) |
| Broche 127 | I/O — User I/O pin (bank 7) |
| Broche 128 | I/O — User I/O pin (bank 7) |
| Broche 129 | I/O — User I/O pin (bank 7) |
| Broche 130 | I/O — User I/O pin (bank 7) |
| Broche 131 | I/O — User I/O pin (bank 7) |
| Broche 132 | GND — Ground |
| Broche 133 | I/O — User I/O pin (bank 7) |
| Broche 134 | I/O — User I/O pin (bank 8) |
| Broche 135 | I/O — User I/O pin (bank 8) |
| Broche 136 | I/O — User I/O pin (bank 8) |
| Broche 137 | I/O — User I/O pin (bank 8) |
| Broche 138 | I/O — User I/O pin (bank 8) |
| Broche 139 | VCCINT — Core supply voltage (3.3 V) |
| Broche 140 | I/O — User I/O pin (bank 8) |
| Broche 141 | I/O — User I/O pin (bank 8) |
| Broche 142 | I/O — User I/O pin (bank 8) |
| Broche 143 | I/O — User I/O pin (bank 8) |
| Broche 144 | I/O — User I/O pin (bank 8) |
Applications typiques
EPF6024ATC1443 convient pour 6 applications: Legacy Telecom Glue Logic, Industrial Control Board (5V / 3.3V Mixed Signaling), ASIC Replacement Prototyping, Military / Aerospace Legacy Avionics, Test and Measurement Instrumentation Front-End, Educational and Development Boards.
Legacy Telecom Glue Logic
The EPF6024ATC1443's 1960 logic elements and 117 user I/O make it well-suited for legacy telecom board-level glue logic where bus bridging, address decoding, and protocol conversion sit between older 5 V peripherals and a 3.3 V processor. Its 5 V-tolerant I/O bank simplifies interfacing with legacy TTL/CMOS peripherals, eliminating level shifters that would otherwise consume board area and add propagation delay. The TQFP-144 footprint has been proven in production telecom infrastructure for over two decades, giving long-lifecycle program managers confidence in the silicon supply. Reference designs in the FLEX 6000 datasheet illustrate PCI-to-ISA bridge implementations that consume roughly 60 percent of the device, leaving headroom for status LEDs and watchdog timers.
Recommandé
Industrial Control Board (5V / 3.3V Mixed Signaling)
Industrial control boards frequently mix 5 V sensor signal conditioning with 3.3 V microcontroller or FPGA logic, and the EPF6024ATC1443 handles this directly with its 5 V-tolerant I/O banks and 3.3 V core. The 117 user I/Os comfortably absorb 32-bit parallel sensor buses plus PWM, encoder, and relay-drive signals without multiplexing, simplifying firmware and timing closure. The FLEX 6000 architecture's continuous FastTrack interconnect provides predictable routing delay, which matters for deterministic control loops running in the 10-100 kHz band. The industrial temperature grade (-40C to 85C) supports factory-floor enclosures.
Recommandé
ASIC Replacement Prototyping
Engineering teams transitioning from a mature ASIC to a programmable platform frequently select the EPF6024ATC1443 because its 1960-LE capacity matches the gate-equivalent of mid-complexity ASICs in the 30k-50k gate range. The TQFP-144 package is hand-solderable for early engineering builds, allowing quick PCB revisions before committing to volume assembly. ByteBlaster programming via JTAG lets prototypes iterate in minutes, and the SRAM-based configuration means last-minute design changes cost only a re-synthesized bitstream. The FLEX 6000 architecture's Quartus II support remains usable on legacy tool versions, preserving the original RTL source.
Recommandé
Military / Aerospace Legacy Avionics
Long-life avionics programs (15-25 year support windows) require FPGA silicon that is no longer in active development but remains qualified and procurable. The EPF6024ATC1443 meets this profile, with established reliability data and a stable TQFP-144 package used in deployed systems. Its industrial temperature grade supports the -40C to 85C range typical of military ground-vehicle and avionics line-replaceable units. Procurement must go through authorized distributors with full traceability, and brokers are used only for spot buys with paperwork verification. The device's mature silicon minimizes the risk of last-time-buy surprise discontinuance.
Recommandé
Test and Measurement Instrumentation Front-End
Bench-top and rack-mount test equipment often integrates an FPGA as a flexible timing generator or protocol analyzer, and the EPF6024ATC1443's 1960 LEs comfortably implement multi-channel pattern generators, counter/timers, and parallel data formatters. The 117 user I/O accommodate front-panel BNC fan-out via 74-series buffers and let engineers route signals to backplane connectors without external muxing. The -3 speed grade's tPD is sufficient for sub-50 MHz control-plane logic typical of GPIB and LXI front-panel interfaces. The TQFP-144's 0.5 mm pitch is still hand-reworkable, simplifying field repairs.
Recommandé
Educational and Development Boards
University FPGA courses and embedded-systems training labs benefit from the EPF6024ATC1443's predictable architecture, extensive Altera documentation, and Quartus II tool support. Its 1960-LE capacity exercises meaningful design content (small CPUs, peripheral controllers) while still fitting within student-project timing. The TQFP-144 package on a 0.5 mm pitch is approachable for student assembly with a hot-air station, and the JTAG programming via ByteBlaster is a low-cost entry point. Many legacy Altera University Program boards used the FLEX 6000 family, so educational resources, lab manuals, and reference designs remain abundant.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATC1443 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144-3 | EPF6024ATC144-3N | EPF6024ATC144-3S | EPF6024ATC144-2 | EPF6024ATC144-1 | EPF6024ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 |
| LABs | 196 | 196 | 196 | 196 | 196 | 196 | 196 |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 (standard) | -3 | -3 | -3 | -2 (faster) | -1 (fastest) | -2 (faster) |
Principaux différenciateurs
- Industry-standard TQFP-144 footprint with widest FLEX 6000 I/O count (vs EPF6016ATC144-3)
- Pin-compatible speed-grade flexibility across the EPF6024ATC144 family (vs EPF6024AQI208-3)
- Cost-optimized -3 speed grade for price-sensitive industrial designs (vs EPF6024ATC144-1)
Notes de conception
The EPF6024ATC1443 requires a 3.3 V core supply (VCCINT) and a per-bank I/O supply (VCCIO) that may be 3.3 V or 5 V tolerant. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the package, and bulk-decouple each VCCIO bank with a 10 uF tantalum plus 0.1 uF ceramic. Power-on ramp should be monotonic; consult the FLEX 6000 datasheet for the tRAMP specification.
Because the FLEX 6000 family uses volatile SRAM configuration, the device's I/O pins remain tri-stated until CONF_DONE asserts. If the downstream circuitry cannot tolerate high-impedance inputs at power-up, add 10 kohm pull-ups or pull-downs on critical signal pins. Always include an EPC configuration EPROM (EPC1064, EPC2, etc.) on the board to ensure the device configures on every power-up.
Route JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chain with no stubs; place a 10 kohm pull-up on TCK and TMS per the IEEE 1149.1 specification. Keep configuration-related pins (nCONFIG, nSTATUS, CONF_DONE) short and direct to the configuration EPROM. Maintain a continuous ground plane under the TQFP-144 package and stitch vias around the perimeter at 5 mm spacing for thermal and EMI performance.
Estimated: TQFP-144 with 0.5 mm lead pitch on a 4-layer JEDEC test board typically yields theta_JA around 35-45 C/W. For typical FLEX 6000 designs with 50-70 percent utilization, junction-temperature rise is well below 20 C above ambient, so no heatsink is needed. For sealed enclosures without airflow, validate with a thermal probe on a pilot build.
Informations de conformité
EPF6024ATC1443 belongs to a legacy Altera family; RoHS/REACH status not confirmed in the verified web data. Standard variant likely non-RoHS; -N suffix variants typically indicate lead-free finish. AEC-Q100 not qualified - this is a commercial/industrial FPGA.