EPF6024ATC1443 - FLEX 6000 FPGA, 1960 Gates, 117 I/O, TQFP-144 | Altera
N.º da peça: EPF6024ATC1443 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.4 | $12,40 |
| 10 | $11.5 | $115,00 |
| 100 | $10.2 | $1.020,00 |
| 500 | $8.95 | $4.475,00 |
| 1.000 | $7.8 | $7.800,00 |
EPF6024ATC1443 Visão geral
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacture via a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader programmable logic hierarchy between simple programmable logic devices (SPLDs/CPLDs) and high-capacity FPGAs, and are widely used for glue logic, bus bridging, and modest-throughput state-machine implementation. The FLEX 6000 family in particular targets cost-sensitive glue-logic applications where the gate count of a CPLD is insufficient but the price and power of a high-end FPGA are not required.
Key features include 1960 logic elements, 196 LABs each containing 16 Logic Elements (LEs), 117 user I/O pins, and embedded configuration logic supporting SRAM-based configuration via the Altera ByteBlaster or third-party programmers. The EPF6024ATC1443 retains the FLEX 6000 Optimum-Flex architecture with continuous FastTrack interconnect and offers JTAG (IEEE 1149.1) boundary-scan testability. Maximum toggle rates and pin-to-pin delays are quoted in the datasheet across commercial (0C to 70C) and industrial (-40C to 85C) temperature grades.
Architecture-wise, the device is built on a 0.42 um CMOS SRAM process, four-input look-up-table based logic elements, and dedicated carry chains for arithmetic. Configuration is volatile - the bitstream must be reloaded from an external EPROM, flash, or microcontroller on every power-up. The TQFP-144 package provides a 0.5 mm lead pitch on a 22 mm x 22 mm body for surface-mount assembly.
Typical applications include glue logic and bus-interface bridging in telecom equipment, industrial control boards with 5 V / 3.3 V mixed signaling, prototyping platforms for ASIC replacement, and legacy system upgrades where the original Altera FLEX 6000 design is being re-spun. Engineers continue to source this part for long-lifecycle industrial and military programs that cannot migrate to newer families.
Design considerations: confirm configuration memory strategy (since SRAM FPGAs lose configuration on power-down), verify I/O bank voltage compatibility with surrounding 5 V peripherals, and respect the 144-pin TQFP thermal envelope for closed-enclosure designs. Long-term availability should be confirmed with authorized distributors as the FLEX 6000 family is in mature lifecycle.
This page synthesizes distributor stock, drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Alternativas drop-in para EPF6024ATC1443 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024ATC1443 (mesmo formato e footprint) — diferindo em Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements / Cells.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024ATC144-3
✅ Drop-In✓ Em estoque
$14.1 / unidade
Ver ficha técnica →EPF6024ATC144-3N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF6024ATC144-3S
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EPF6024ATC144-2
✅ Drop-In✓ Em estoque
$24.95 / unidade
Ver ficha técnica →EPF6024ATC144-1
✅ Drop-In✓ Em estoque
$8.2 / unidade
Ver ficha técnica →EPF6024ATC144-2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$20.95 / unidade
Ver ficha técnica →EPF6024ATC1443 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements | 1960 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 117 |
| Encapsulamento | TQFP-144 (22 x 22 mm, 0.5 mm pitch) |
| Speed Grade | -3 |
| Core Voltage | 3.3 V |
| I/O Voltage Tolerance | 5.0 V tolerant |
| Configuration Method | SRAM (volatile) |
| Process Technology | 0.42 um CMOS SRAM |
| Faixa de temperatura de operação | -40C to +85C (industrial) / 0C to 70C (commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EPF6024ATC1443
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | VCCIO1 — I/O bank 1 supply voltage (3.3 V or 5 V tolerant) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | GND — Ground |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | TMS — JTAG Test Mode Select |
| Pino 15 | TCK — JTAG Test Clock |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | VCCINT — Core supply voltage (3.3 V) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | GND — Ground |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | GND — Ground |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | TDI — JTAG Test Data In |
| Pino 45 | TDO — JTAG Test Data Out |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | VCCINT — Core supply voltage (3.3 V) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 4) |
| Pino 55 | GND — Ground |
| Pino 56 | I/O — User I/O pin (bank 4) |
| Pino 57 | I/O — User I/O pin (bank 4) |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 5) |
| Pino 76 | nCONFIG — Configuration control (active-low reset) |
| Pino 77 | nSTATUS — Configuration status (active-low) |
| Pino 78 | CONF_DONE — Configuration complete indicator |
| Pino 79 | I/O — User I/O pin (bank 5) |
| Pino 80 | I/O — User I/O pin (bank 5) |
| Pino 81 | I/O — User I/O pin (bank 5) |
| Pino 82 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 83 | I/O — User I/O pin (bank 5) |
| Pino 84 | I/O — User I/O pin (bank 5) |
| Pino 85 | I/O — User I/O pin (bank 5) |
| Pino 86 | I/O — User I/O pin (bank 5) |
| Pino 87 | GND — Ground |
| Pino 88 | I/O — User I/O pin (bank 5) |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | VCCINT — Core supply voltage (3.3 V) |
| Pino 91 | I/O — User I/O pin (bank 5) |
| Pino 92 | I/O — User I/O pin (bank 5) |
| Pino 93 | I/O — User I/O pin (bank 5) |
| Pino 94 | I/O — User I/O pin (bank 5) |
| Pino 95 | I/O — User I/O pin (bank 5) |
| Pino 96 | I/O — User I/O pin (bank 5) |
| Pino 97 | I/O — User I/O pin (bank 5) |
| Pino 98 | I/O — User I/O pin (bank 6) |
| Pino 99 | MSEL0 — Configuration mode select bit 0 |
| Pino 100 | MSEL1 — Configuration mode select bit 1 |
| Pino 101 | I/O — User I/O pin (bank 6) |
| Pino 102 | I/O — User I/O pin (bank 6) |
| Pino 103 | I/O — User I/O pin (bank 6) |
| Pino 104 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 105 | GND — Ground |
| Pino 106 | I/O — User I/O pin (bank 6) |
| Pino 107 | I/O — User I/O pin (bank 6) |
| Pino 108 | I/O — User I/O pin (bank 6) |
| Pino 109 | I/O — User I/O pin (bank 6) |
| Pino 110 | I/O — User I/O pin (bank 6) |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | I/O — User I/O pin (bank 6) |
| Pino 113 | I/O — User I/O pin (bank 6) |
| Pino 114 | VCCINT — Core supply voltage (3.3 V) |
| Pino 115 | I/O — User I/O pin (bank 6) |
| Pino 116 | I/O — User I/O pin (bank 6) |
| Pino 117 | GND — Ground |
| Pino 118 | I/O — User I/O pin (bank 7) |
| Pino 119 | I/O — User I/O pin (bank 7) |
| Pino 120 | I/O — User I/O pin (bank 7) |
| Pino 121 | I/O — User I/O pin (bank 7) |
| Pino 122 | I/O — User I/O pin (bank 7) |
| Pino 123 | I/O — User I/O pin (bank 7) |
| Pino 124 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 125 | I/O — User I/O pin (bank 7) |
| Pino 126 | I/O — User I/O pin (bank 7) |
| Pino 127 | I/O — User I/O pin (bank 7) |
| Pino 128 | I/O — User I/O pin (bank 7) |
| Pino 129 | I/O — User I/O pin (bank 7) |
| Pino 130 | I/O — User I/O pin (bank 7) |
| Pino 131 | I/O — User I/O pin (bank 7) |
| Pino 132 | GND — Ground |
| Pino 133 | I/O — User I/O pin (bank 7) |
| Pino 134 | I/O — User I/O pin (bank 8) |
| Pino 135 | I/O — User I/O pin (bank 8) |
| Pino 136 | I/O — User I/O pin (bank 8) |
| Pino 137 | I/O — User I/O pin (bank 8) |
| Pino 138 | I/O — User I/O pin (bank 8) |
| Pino 139 | VCCINT — Core supply voltage (3.3 V) |
| Pino 140 | I/O — User I/O pin (bank 8) |
| Pino 141 | I/O — User I/O pin (bank 8) |
| Pino 142 | I/O — User I/O pin (bank 8) |
| Pino 143 | I/O — User I/O pin (bank 8) |
| Pino 144 | I/O — User I/O pin (bank 8) |
Aplicações típicas
EPF6024ATC1443 é adequado para 6 aplicaçãos: Legacy Telecom Glue Logic, Industrial Control Board (5V / 3.3V Mixed Signaling), ASIC Replacement Prototyping, Military / Aerospace Legacy Avionics, Test and Measurement Instrumentation Front-End, Educational and Development Boards.
Legacy Telecom Glue Logic
The EPF6024ATC1443's 1960 logic elements and 117 user I/O make it well-suited for legacy telecom board-level glue logic where bus bridging, address decoding, and protocol conversion sit between older 5 V peripherals and a 3.3 V processor. Its 5 V-tolerant I/O bank simplifies interfacing with legacy TTL/CMOS peripherals, eliminating level shifters that would otherwise consume board area and add propagation delay. The TQFP-144 footprint has been proven in production telecom infrastructure for over two decades, giving long-lifecycle program managers confidence in the silicon supply. Reference designs in the FLEX 6000 datasheet illustrate PCI-to-ISA bridge implementations that consume roughly 60 percent of the device, leaving headroom for status LEDs and watchdog timers.
Recomendado
Industrial Control Board (5V / 3.3V Mixed Signaling)
Industrial control boards frequently mix 5 V sensor signal conditioning with 3.3 V microcontroller or FPGA logic, and the EPF6024ATC1443 handles this directly with its 5 V-tolerant I/O banks and 3.3 V core. The 117 user I/Os comfortably absorb 32-bit parallel sensor buses plus PWM, encoder, and relay-drive signals without multiplexing, simplifying firmware and timing closure. The FLEX 6000 architecture's continuous FastTrack interconnect provides predictable routing delay, which matters for deterministic control loops running in the 10-100 kHz band. The industrial temperature grade (-40C to 85C) supports factory-floor enclosures.
Recomendado
ASIC Replacement Prototyping
Engineering teams transitioning from a mature ASIC to a programmable platform frequently select the EPF6024ATC1443 because its 1960-LE capacity matches the gate-equivalent of mid-complexity ASICs in the 30k-50k gate range. The TQFP-144 package is hand-solderable for early engineering builds, allowing quick PCB revisions before committing to volume assembly. ByteBlaster programming via JTAG lets prototypes iterate in minutes, and the SRAM-based configuration means last-minute design changes cost only a re-synthesized bitstream. The FLEX 6000 architecture's Quartus II support remains usable on legacy tool versions, preserving the original RTL source.
Recomendado
Military / Aerospace Legacy Avionics
Long-life avionics programs (15-25 year support windows) require FPGA silicon that is no longer in active development but remains qualified and procurable. The EPF6024ATC1443 meets this profile, with established reliability data and a stable TQFP-144 package used in deployed systems. Its industrial temperature grade supports the -40C to 85C range typical of military ground-vehicle and avionics line-replaceable units. Procurement must go through authorized distributors with full traceability, and brokers are used only for spot buys with paperwork verification. The device's mature silicon minimizes the risk of last-time-buy surprise discontinuance.
Recomendado
Test and Measurement Instrumentation Front-End
Bench-top and rack-mount test equipment often integrates an FPGA as a flexible timing generator or protocol analyzer, and the EPF6024ATC1443's 1960 LEs comfortably implement multi-channel pattern generators, counter/timers, and parallel data formatters. The 117 user I/O accommodate front-panel BNC fan-out via 74-series buffers and let engineers route signals to backplane connectors without external muxing. The -3 speed grade's tPD is sufficient for sub-50 MHz control-plane logic typical of GPIB and LXI front-panel interfaces. The TQFP-144's 0.5 mm pitch is still hand-reworkable, simplifying field repairs.
Recomendado
Educational and Development Boards
University FPGA courses and embedded-systems training labs benefit from the EPF6024ATC1443's predictable architecture, extensive Altera documentation, and Quartus II tool support. Its 1960-LE capacity exercises meaningful design content (small CPUs, peripheral controllers) while still fitting within student-project timing. The TQFP-144 package on a 0.5 mm pitch is approachable for student assembly with a hot-air station, and the JTAG programming via ByteBlaster is a low-cost entry point. Many legacy Altera University Program boards used the FLEX 6000 family, so educational resources, lab manuals, and reference designs remain abundant.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024ATC1443 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024ATC144-3 | EPF6024ATC144-3N | EPF6024ATC144-3S | EPF6024ATC144-2 | EPF6024ATC144-1 | EPF6024ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 |
| LABs | 196 | 196 | 196 | 196 | 196 | 196 | 196 |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 (standard) | -3 | -3 | -3 | -2 (faster) | -1 (fastest) | -2 (faster) |
Principais diferenciais
- Industry-standard TQFP-144 footprint with widest FLEX 6000 I/O count (vs EPF6016ATC144-3)
- Pin-compatible speed-grade flexibility across the EPF6024ATC144 family (vs EPF6024AQI208-3)
- Cost-optimized -3 speed grade for price-sensitive industrial designs (vs EPF6024ATC144-1)
Notas de projeto
The EPF6024ATC1443 requires a 3.3 V core supply (VCCINT) and a per-bank I/O supply (VCCIO) that may be 3.3 V or 5 V tolerant. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the package, and bulk-decouple each VCCIO bank with a 10 uF tantalum plus 0.1 uF ceramic. Power-on ramp should be monotonic; consult the FLEX 6000 datasheet for the tRAMP specification.
Because the FLEX 6000 family uses volatile SRAM configuration, the device's I/O pins remain tri-stated until CONF_DONE asserts. If the downstream circuitry cannot tolerate high-impedance inputs at power-up, add 10 kohm pull-ups or pull-downs on critical signal pins. Always include an EPC configuration EPROM (EPC1064, EPC2, etc.) on the board to ensure the device configures on every power-up.
Route JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chain with no stubs; place a 10 kohm pull-up on TCK and TMS per the IEEE 1149.1 specification. Keep configuration-related pins (nCONFIG, nSTATUS, CONF_DONE) short and direct to the configuration EPROM. Maintain a continuous ground plane under the TQFP-144 package and stitch vias around the perimeter at 5 mm spacing for thermal and EMI performance.
Estimated: TQFP-144 with 0.5 mm lead pitch on a 4-layer JEDEC test board typically yields theta_JA around 35-45 C/W. For typical FLEX 6000 designs with 50-70 percent utilization, junction-temperature rise is well below 20 C above ambient, so no heatsink is needed. For sealed enclosures without airflow, validate with a thermal probe on a pilot build.
Informações de conformidade
EPF6024ATC1443 belongs to a legacy Altera family; RoHS/REACH status not confirmed in the verified web data. Standard variant likely non-RoHS; -N suffix variants typically indicate lead-free finish. AEC-Q100 not qualified - this is a commercial/industrial FPGA.
