Altera

EPF8282ATC100-2W - 2.5K Logic Elements FLEX 8000 FPGA | Altera

MPN: EPF8282ATC100-2W ✗ Akhir Hidup

100-pin TQFP Package -2 Speed

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EPF8282ATC100-2W Ringkasan

The Altera EPF8282ATC100-2W is a member of the FLEX 8000 family of SRAM-based Field Programmable Gate Arrays (FPGAs) housed in a 100-pin TQFP package. It integrates 2,500 typical gates, 282 logic elements, and 78 user I/O pins, with 208 bits of embedded RAM, providing a versatile platform for glue-logic, bus-interface, and state-machine prototyping on legacy 5V-tolerant systems.

An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells that the user programs after manufacture. FPGAs sit within the broader hierarchy: programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Compared to older PLDs such as PALs and GALs, FPGAs offer far higher logic density, register-rich architectures, and SRAM or antifuse configuration memory. The FLEX 8000 family uses SRAM configuration, which means the device must be reloaded at every power-up from an external EPROM or an Altera EPC1/EPC1064/EPC1213/EPC1441 configuration device.

Key features of the EPF8282ATC100-2W include 2,500 typical gates (5,000 maximum), 282 logic elements, 78 user I/Os, 208 flip-flops, 0.5 micron CMOS SRAM process, 5V tolerant I/O, JTAG boundary-scan support, and an industrial-grade speed grade of -2 (the "W" suffix denotes the wider industrial operating-temperature range). The device supports in-system programmability via the IEEE Std 1149.1 (JTAG) interface and can be cascaded with other FLEX 8000 devices for higher-density designs.

The architecture uses four Logic Array Blocks (LABs) per row, with each LAB containing eight Logic Elements (LEs). Each LE consists of a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade paths. FastTrack Interconnect provides continuous routing rows and columns for predictable timing closure.

Typical applications of the EPF8282ATC100-2W include legacy 5V peripheral glue logic, industrial-control state machines, bus-bridging between microprocessor and peripheral buses, prototyping for ASIC emulation, telecom backplane controllers, and military/aerospace systems that still require FLEX 8000 silicon. When designing with this device, ensure a configuration source (EPC1, EPC1064, or parallel EPROM) is present at every power-up, since SRAM cells lose their pattern when VCC drops below the data-retention threshold.

Alternatif penggantian untuk EPF8282ATC100-2W — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF8282ATC100-2W (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Operating Temperature, Package, Speed Grade, Configuration Memory.

EPF8282ATC100-2

Intel

Process Technology: 0.42 µm CMOS

Operating Temperature: 0 °C to 70 °C (Commercial)

Configuration Memory: SRAM (volatile, requires external boot)