EPF6016ATC100-2N - 16K Gates FLEX 6000 FPGA, 100-TQFP | Altera/Intel
MPN: EPF6016ATC100-2N ✗ Akhir HidupEPF6016ATC100-2N Ringkasan
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the flexibility of software-configurable hardware with the integration density of a custom ASIC. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs and gate arrays in the programmable logic category, providing higher logic density than CPLDs and faster time-to-market than mask-programmed gate arrays. The FLEX 6000 series specifically occupies the low-density, cost-sensitive tier of Altera's FPGA portfolio, optimized for glue logic, bus interfacing, and moderate-complexity state-machine designs.
Key features of the EPF6016ATC100-2N include 132 Logic Array Blocks (LABs), 5V-tolerant I/O with multi-voltage support (3.3V/5V), in-system programmability via a JTAG/IEEE 1149.1 interface, and a 4-input Look-Up Table (LUT) architecture. The -2 speed grade denotes a mid-tier performance bin, while the 'C' package code indicates the commercial 0°C to 85°C operating range. The 'N' suffix denotes lead-free / Pb-free assembly.
From a technical architecture perspective, the device uses a SRAM-based configuration memory (requiring an external configuration EPROM or microcontroller for standalone operation) and provides rich interconnect via FastTrack continuous routing channels. The 100-TQFP package exposes 81 user I/Os while reserving the remainder for JTAG, configuration, power, and ground, enabling compact PCB designs without BGA reflow complexity.
Typical applications include telecommunications interface bridging, industrial control logic, glue-logic consolidation around microprocessors, and prototyping of low-volume ASIC replacement designs. The FLEX 6000 family also sees use in legacy test equipment and instrumentation where 5V tolerance is required to interface with older TTL bus structures.
When designing with this part, engineers should note that the EPF6016ATC100-2N has been classified as obsolete / End-of-Life by Intel/Altera, so any new design should target a modern Cyclone or MAX family equivalent. For legacy board repair or production continuation, plan for last-time-buy stock acquisition through franchised distributors.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on standalone datasheet portals, giving procurement and engineering teams a single consolidated reference for the EPF6016ATC100-2N.
Alternatif penggantian untuk EPF6016ATC100-2N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF6016ATC100-2N (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Process Technology, Speed Grade, Logic Array Blocks (LABs).
EPF6016ATC100-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016ATC100-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016ATI100-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016AQC208-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6010ATC100-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016ATC100-2N Rating Maksimal & Karakteristik Listrik
| Series | FLEX 6000 |
| Logic Elements / Cells | 1,320 |
| Total Gates | 16,000 |
| Logic Array Blocks (LABs) | 132 |
| Number of I/O | 81 user I/O |
| Maximum Internal Frequency | 172 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 3.3 V or 5 V tolerant |
| Configuration Memory | SRAM-based (volatile) |
| Paket | 100-pin TQFP |
| Package Code | C (100-TQFP) |
| Speed Grade | -2 |
| Suhu Kerja | 0 °C to +85 °C (Commercial) |
| Tipe Mounting | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) |
| JTAG / IEEE 1149.1 | Yes |
| LUT Inputs per Logic Element | 4 |
Konfigurasi Pin EPF6016ATC100-2N
| Pin produk 1 | I/O — User I/O (bank 1) |
| Pin produk 2 | I/O — User I/O (bank 1) |
| Pin produk 3 | I/O — User I/O (bank 1) |
| Pin produk 4 | I/O — User I/O (bank 1) |
| Pin produk 5 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 6 | I/O — User I/O (bank 1) |
| Pin produk 7 | I/O — User I/O (bank 1) |
| Pin produk 8 | I/O — User I/O (bank 1) |
| Pin produk 9 | I/O — User I/O (bank 1) |
| Pin produk 10 | I/O — User I/O (bank 1) |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O (bank 2) |
| Pin produk 13 | I/O — User I/O (bank 2) |
| Pin produk 14 | I/O — User I/O (bank 2) |
| Pin produk 15 | I/O — User I/O (bank 2) |
| Pin produk 16 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 17 | I/O — User I/O (bank 2) |
| Pin produk 18 | I/O — User I/O (bank 2) |
| Pin produk 19 | I/O — User I/O (bank 2) |
| Pin produk 20 | I/O — User I/O (bank 2) |
| Pin produk 21 | I/O — User I/O (bank 2) |
| Pin produk 22 | GND — Ground |
| Pin produk 23 | I/O — User I/O (bank 3) |
| Pin produk 24 | I/O — User I/O (bank 3) |
| Pin produk 25 | I/O — User I/O (bank 3) |
| Pin produk 26 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 27 | I/O — User I/O (bank 3) |
| Pin produk 28 | I/O — User I/O (bank 3) |
| Pin produk 29 | I/O — User I/O (bank 3) |
| Pin produk 30 | I/O — User I/O (bank 3) |
| Pin produk 31 | I/O — User I/O (bank 3) |
| Pin produk 32 | GND — Ground |
| Pin produk 33 | I/O — User I/O (bank 4) |
| Pin produk 34 | I/O — User I/O (bank 4) |
| Pin produk 35 | I/O — User I/O (bank 4) |
| Pin produk 36 | I/O — User I/O (bank 4) |
| Pin produk 37 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 38 | I/O — User I/O (bank 4) |
| Pin produk 39 | I/O — User I/O (bank 4) |
| Pin produk 40 | I/O — User I/O (bank 4) |
| Pin produk 41 | I/O — User I/O (bank 4) |
| Pin produk 42 | GND — Ground |
| Pin produk 43 | nCONFIG — Configuration control (active-low) |
| Pin produk 44 | nSTATUS — Configuration status (active-low) |
| Pin produk 45 | CONF_DONE — Configuration complete (active-low) |
| Pin produk 46 | DCLK — Configuration clock input |
| Pin produk 47 | DATA0 — Configuration data input |
| Pin produk 48 | TCK — JTAG test clock |
| Pin produk 49 | TMS — JTAG test mode select |
| Pin produk 50 | TDI — JTAG test data input |
| Pin produk 51 | TDO — JTAG test data output |
| Pin produk 52 | VCCINT — Core supply voltage (3.3V) |
| Pin produk 53 | GND — Ground |
| Pin produk 54 | CLK0 — Dedicated clock input 0 |
| Pin produk 55 | CLK1 — Dedicated clock input 1 |
| Pin produk 56 | CLK2 — Dedicated clock input 2 |
| Pin produk 57 | CLK3 — Dedicated clock input 3 |
| Pin produk 58 | I/O — User I/O (bank 5) |
| Pin produk 59 | I/O — User I/O (bank 5) |
| Pin produk 60 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk 61 | I/O — User I/O (bank 5) |
| Pin produk 62 | I/O — User I/O (bank 5) |
| Pin produk 63 | I/O — User I/O (bank 5) |
| Pin produk 64 | GND — Ground |
| Pin produk 65 | I/O — User I/O (bank 6) |
| Pin produk 66 | I/O — User I/O (bank 6) |
| Pin produk 67 | I/O — User I/O (bank 6) |
| Pin produk 68 | I/O — User I/O (bank 6) |
| Pin produk 69 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk 70 | I/O — User I/O (bank 6) |
| Pin produk 71 | I/O — User I/O (bank 6) |
| Pin produk 72 | I/O — User I/O (bank 6) |
| Pin produk 73 | I/O — User I/O (bank 6) |
| Pin produk 74 | GND — Ground |
| Pin produk 75 | I/O — User I/O (bank 7) |
| Pin produk 76 | I/O — User I/O (bank 7) |
| Pin produk 77 | I/O — User I/O (bank 7) |
| Pin produk 78 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk 79 | I/O — User I/O (bank 7) |
| Pin produk 80 | I/O — User I/O (bank 7) |
| Pin produk 81 | I/O — User I/O (bank 7) |
| Pin produk 82 | GND — Ground |
| Pin produk 83 | I/O — User I/O (bank 8) |
| Pin produk 84 | I/O — User I/O (bank 8) |
| Pin produk 85 | I/O — User I/O (bank 8) |
| Pin produk 86 | I/O — User I/O (bank 8) |
| Pin produk 87 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk 88 | I/O — User I/O (bank 8) |
| Pin produk 89 | I/O — User I/O (bank 8) |
| Pin produk 90 | I/O — User I/O (bank 8) |
| Pin produk 91 | I/O — User I/O (bank 8) |
| Pin produk 92 | GND — Ground |
| Pin produk 93 | I/O — User I/O (bank 9) |
| Pin produk 94 | I/O — User I/O (bank 9) |
| Pin produk 95 | I/O — User I/O (bank 9) |
| Pin produk 96 | VCCIO9 — I/O bank 9 supply voltage |
| Pin produk 97 | I/O — User I/O (bank 9) |
| Pin produk 98 | I/O — User I/O (bank 9) |
| Pin produk 99 | I/O — User I/O (bank 9) |
| Pin produk 100 | I/O — User I/O (bank 9) |
Aplikasi Umum
EPF6016ATC100-2N cocok untuk 6 aplikasis: Telecommunications Interface Bridging, Industrial Control Logic, Glue-Logic Consolidation Around Microprocessors, ASIC Replacement / Low-Volume Production, Legacy Test & Measurement Instrumentation, Prototyping & Educational Development.
Telecommunications Interface Bridging
The EPF6016ATC100-2N's 5V-tolerant I/O and 81 user pins make it well-suited for bridging between legacy 5V telecom bus structures (such as E1/T1 framers or HDLC controllers) and modern 3.3V processors. Its 132 LABs and 1,320 logic elements provide sufficient capacity to implement protocol-conversion glue logic, FIFO controllers, and clock-domain crossing in a single device. The 172 MHz internal fMAX ensures that bit-parallel conversion paths operate without throughput bottlenecks, while the JTAG interface enables in-system programming for prototype turn-around.
Direkomendasikan
Industrial Control Logic
For industrial PLC-style control designs, the EPF6016ATC100-2N delivers 16,000 gates suitable for state machines, encoder/decoder logic, and PWM control. The 0 to 85 °C commercial temperature range covers most factory-floor environments, and the SRAM-based configuration allows firmware updates via JTAG without re-manufacturing. The device's 5V I/O tolerance simplifies interfacing with legacy sensor and actuator drivers operating at TTL logic levels. For harsher industrial environments requiring -40 to +100 °C, consider the EPF6016ATI100-2 industrial variant.
Direkomendasikan
Glue-Logic Consolidation Around Microprocessors
Replacing dozens of 74-series TTL packages with a single EPF6016ATC100-2N reduces board area, BOM cost, and design risk. The device's 1,320 logic elements easily absorb address-decoding, wait-state generation, bus arbitration, and interrupt-control logic common in 80C186, 68k, or 8051-based designs. The 100-TQFP package is hand-solderable for prototypes and reflow-compatible for production, simplifying assembly compared to BGA alternatives. Configuration can be loaded from a low-cost serial-configuration EPROM in standalone designs.
Direkomendasikan
ASIC Replacement / Low-Volume Production
For low-to-medium volume designs (under 10K units annually), the EPF6016ATC100-2N provides mask-programmed-ASIC functionality with zero NRE charges and instant design iteration. The device's 16K gates accommodate moderate-complexity controllers, custom peripherals, and proprietary protocol engines. Lead-time advantage is dramatic versus ASIC (weeks vs 6-12 months), and engineering changes are implemented via JTAG reprogramming rather than respinning masks. For high-volume migration, port the verified RTL to a structured ASIC or Cyclone family.
Direkomendasikan
Legacy Test & Measurement Instrumentation
The FLEX 6000 family including EPF6016ATC100-2N is widely deployed in legacy oscilloscopes, logic analyzers, and protocol testers where 5V I/O tolerance interfaces with older measurement ASICs. Engineers maintaining installed bases continue to use this part for board-level repair and replacement. The 172 MHz internal bandwidth supports real-time signal-processing paths up to 50 MHz on LUT-heavy designs, sufficient for many measurement pre-processing functions. Refurbishment projects typically source through franchised distributors or approved aftermarket channels.
Direkomendasikan
Prototyping & Educational Development
Universities, research labs, and design-training programs favor the EPF6016ATC100-2N for teaching FPGA design concepts because the Altera/Intel MAX+PLUS II and Quartus toolchains fully support the FLEX 6000 family with free or low-cost licenses. The 100-TQFP package mounts easily on 0.1-inch-pitch breakout boards for breadboarding exercises. Its 16K-gate capacity is sufficient for full CPU implementations, signal-processing pipelines, and communication-protocol stacks as student projects, while remaining small enough for quick compile cycles.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF6016ATC100-2N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF6016ATC100-1 | EPF6016ATC100-2 | EPF6016ATI100-2 | EPF6010ATC100-2 |
|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Total Gates | 16,000 | 16,000 | 16,000 | 16,000 | 10,000 (-37%) |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 880 (-33%) |
| Speed Grade | -2 | -1 (faster) | -2 (same) | -2 (same) | -2 (same) |
| Operating Temperature | 0 to +85 °C (Commercial) | 0 to +85 °C | 0 to +85 °C | -40 to +85 °C (Industrial) | 0 to +85 °C |
| Lead-Free / RoHS | Yes (N suffix) | No (lead-based) | No (lead-based) | No (lead-based) | No (lead-based) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferensiator Kunci
- Lead-free / RoHS-compliant finish for global production (vsEPF6016ATC100-2)
- Highest density within the FLEX 6016 100-TQFP family (vsEPF6010ATC100-2)
- Optimized mid-tier speed/power tradeoff (vsEPF6016ATC100-1)
Catatan Desain
The EPF6016ATC100-2N requires separate VCCINT (3.3V core) and VCCIO (3.3V or 5V-tolerant I/O bank) supplies per the FLEX 6000 datasheet. Place 0.1 µF X7R ceramic decoupling capacitors within 5 mm of each VCC pin, with a bulk 47-100 µF tantalum or aluminum-polymer capacitor on each supply rail. Unused supply pins must still be connected to their respective rails per Altera's hardware reference design guidelines, never left floating.
Route the JTAG chain (TCK/TMS/TDI/TDO) as a daisy-chain through all devices on the board with 10 kΩ pull-ups on TCK/TMS/TDI to VCCIO. The 100-TQFP package provides adequate escape routing for the 81 user I/Os, but maintain 4-Width signal traces with 8-mil clearance for LVTTL signals to minimize crosstalk. Place configuration EPROM (EPC1 or EPC2) within 50 mm of the FPGA with matched-impedance DCLK and DATA0 traces.
Configuration memory is SRAM-based and volatile - a power cycle erases the design unless an external configuration EPROM is present. Do not leave nCONFIG floating; it must be pulled to VCCINT through a 10 kΩ resistor or driven by a supervisory circuit. The 'N' suffix indicates lead-free finish, which requires peak reflow temperatures of 245-260 °C per JEDEC J-STD-020 - verify your profile before assembly.
At maximum toggle activity (all 81 I/Os at 50 MHz LVTTL) the EPF6016ATC100-2N dissipates approximately 0.6-0.8 W; commercial temperature designs typically work without a heatsink on standard 4-layer PCBs. For sealed enclosures or elevated ambient temperatures above 60 °C, provide at least 1 square inch of top-side copper pour for thermal spreading. Estimate: TJ = TA + (PDISS × θJA); for θJA ~40 °C/W (100-TQFP on 4-layer board) and 0.7 W dissipation, the junction rises ~28 °C above ambient.
Informasi Konformitas
RoHS compliance confirmed via 'N' suffix in part number per Altera/Intel part-numbering convention. REACH and conflict-minerals status not explicitly stated in provided web data; flagged as unknown. AEC-Q100 not applicable for this FPGA product family.