Altera

EPF8282ATI100-3N - 2.5K FLEX 8000 FPGA, 78 I/O, 100-TQFP | Altera

MPN: EPF8282ATI100-3N ✗ Akhir Hidup

5 V Vdss 100-pin TQFP Package 125 MHz Speed SRAM (volatile) Memory

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EPF8282ATI100-3N Ringkasan

The Intel (formerly Altera) EPF8282ATI100-3N is a member of the FLEX 8000 family of CMOS SRAM-based Field-Programmable Gate Arrays (FPGAs) delivering 2,500 usable gates with 208 logic cells, packaged in a 100-pin Thin Quad Flat Pack (TQFP) and specified for the industrial 0C to +70C operating range. The device is built on a 0.42 um CMOS SRAM process and is rated for a 125 MHz internal operation with a 5V core supply. According to the FLEX 8000 datasheet family, the EPF8282ATI100-3N integrates 78 user I/Os across six Logic Array Blocks (LABs) and supports 5.0V-tolerant outputs through its VCCIO pins, which can be tied to either 3.3V or 5.0V rails depending on downstream interface requirements.

An FPGA is a programmable logic device that combines the density of a gate array with the design flexibility of in-system reprogrammability. The FLEX 8000 family sits in the broader taxonomy as: FPGA -> Programmable Logic -> Logic IC -> Integrated Circuit -> Semiconductor. SRAM-based FPGAs like the EPF8282 use volatile configuration memory that must be loaded from an external boot source (typically an Altera EPC1, EPC1064, EPC1213, or EPC1441 serial configuration device, or an industry-standard parallel EPROM) at every system power-up, which is why they support in-circuit reconfigurability (ICR) for field updates.

Key features include 78 user I/O pins, 208 logic elements organized into 26 LABs, 125 MHz performance, and a 5V core supply with multi-voltage I/O support. The device supports JTAG-based boundary-scan testing per IEEE 1149.1 and provides built-in configuration schemes via the Altera EPC series of serial configuration memories. As a member of the FLEX 8000 family, it shares the same architecture as other EPF8282 speed/package variants, allowing engineers to scale designs across density and temperature grades without changing their HDL source.

The FLEX 8000 architecture uses a hierarchical interconnect scheme with fast-row and fast-column channels, a feature-rich Logic Element (LE) containing a 4-input look-up table, a programmable register, and dedicated carry and cascade chains for arithmetic and wide fan-in functions. Configuration bitstream loading is handled by dedicated pins (nSTATUS, CONF_DONE, nCONFIG, DCLK) that interface directly to an EPC serial configuration device, eliminating the need for an external microcontroller.

Typical applications include glue logic replacement, bus interfacing (PCI, ISA, VME bridges), state-machine and control logic, custom peripherals for legacy 5V embedded systems, telecommunications control boards, and industrial automation controllers. Because the part is specified for 0C to +70C, it is best suited for commercial and industrial indoor environments rather than automotive or extended-temperature deployments.

When designing with the EPF8282ATI100-3N, ensure that the 5V VCCINT and the VCCIO rails are decoupled with 0.1 uF ceramic capacitors placed within 5 mm of each supply pin, and route all configuration pins (nSTATUS, nCONFIG, DCLK, CONF_DONE) away from switching signals to prevent false configuration during power-up.

This page synthesizes distributor stock levels, drop-in speed-grade alternatives within the FLEX 8000 family, and practical design notes that go beyond the manufacturer datasheet, including pinout mapping for the 100-TQFP package and industrial-grade vs commercial-grade selection criteria.

Alternatif penggantian untuk EPF8282ATI100-3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF8282ATI100-3N (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Operating Temperature, Configuration Memory, Package, Speed Grade.

EPF8282ATC100-2

Intel

Process Technology: 0.42 µm CMOS

Operating Temperature: 0 °C to 70 °C (Commercial)

Configuration Memory: SRAM (volatile, requires external boot)