Microchip Technology

M1AFS250-2FG256 - Fusion FPGA 250K Gates | Microchip

MPN: M1AFS250-2FG256 ✓ Aktif
1.5 V Vdss 256-LBGA (FG256) Package -2 Speed
MOQ: 1 |

M1AFS250-2FG256 Ringkasan

The Microchip Technology M1AFS250-2FG256 is a Fusion mixed-signal Field Programmable Gate Array (FPGA) with 250,000 system gates, 114 user I/Os, and 36,864 bits of flash memory, housed in a 256-ball LBGA (FG256) package. It integrates configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance, flash-based programmable logic in a monolithic device. The M1 prefix denotes Fusion FPGAs with an embedded ARM Cortex-M1 processor, enabling system-on-chip (SoC) designs in a single device.

A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs belong to the programmable logic device (PLD) family, which sits above application-specific integrated circuits (ASICs) in flexibility but below them in performance and density for high-volume production. Fusion FPGAs uniquely combine programmable logic with analog blocks, flash memory, and clock management, making them a system-level integration platform for mixed-signal applications.

Key features include 250K system gates, 114 user I/Os, 36,864 bits of flash memory, and an embedded ARM Cortex-M1 processor. The device operates from a 1.5V core supply and supports multiple I/O standards. It includes configurable analog blocks such as ADCs, DACs, and comparators, along with a comprehensive clock generation and management unit (CCGM) with PLLs. The flash-based architecture provides instant-on capability and high security against reverse engineering.

Technically, the M1AFS250-2FG256 is built on a 130nm flash process, offering low power consumption and high reliability. The embedded ARM Cortex-M1 is a 32-bit RISC processor optimized for FPGA implementation, enabling software and hardware co-design. The device supports in-system programming (ISP) and can be reprogrammed in the field, making it suitable for iterative development and remote updates.

Typical applications include industrial control, automotive electronics, medical devices, and communications systems where mixed-signal processing, low power, and security are critical. The Fusion architecture allows designers to replace multiple discrete components with a single FPGA, reducing board space and bill-of-materials cost.

When designing with this device, consider the 1.5V core supply and the need for proper decoupling. The flash-based configuration is non-volatile, so no external configuration memory is required, simplifying the design and reducing startup time.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the M1AFS250-2FG256.

Alternatif penggantian untuk M1AFS250-2FG256 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian M1AFS250-2FG256 (sama faktor bentuk dan footprint) — berbeda di dalam Family, Package, RoHS Status, Process Technology, Speed Grade.

Microchip Technology
Family: Fusion (M1 series, mixed-signal FPGA)
Bandingkan dengan M1AFS250-2FG256 →
Microchip Technology
Package: 256-LBGA (FGG256)
RoHS Status: Compliant
Speed Grade: -1
Bandingkan dengan M1AFS250-2FG256 →
Microchip Technology
Family: Fusion (M1AFS, ARM Cortex-M1 support)
Package: 256-ball FBGA (256-LBGA)
RoHS Status: RoHS Non-Compliant (contains lead; FGG variant is lead-free)
Bandingkan dengan M1AFS250-2FG256 →
Microchip Technology
Family: Fusion (M1 series) Mixed-Signal FPGA
Package: 256-LBGA (FGG256)
Process Technology: 130 nm flash-based
Bandingkan dengan M1AFS250-2FG256 →
Microchip Technology
Family: Actel Fusion (Mixed-Signal FPGA)
Package: 256-ball FBGA (FGG256)
RoHS Status: Compliant (FGG = Pb-free balls)
Bandingkan dengan M1AFS250-2FG256 →
Microchip Technology
Family: Fusion Mixed-Signal FPGA
Package: 208-PQFP (Plastic Quad Flat Package)
RoHS Status: Non-Compliant (contains lead)
Bandingkan dengan M1AFS250-2FG256 →
Microchip Technology
RoHS Status: RoHS Non-Compliant
Process Technology: 130nm, 7-layer metal, flash-based CMOS
Bandingkan dengan M1AFS250-2FG256 →
Microchip Technology
Package: 256-LBGA
Process Technology: 130nm
Speed Grade: Standard
Bandingkan dengan M1AFS250-2FG256 →

M1AFS250-2FGG256

✅ Drop-In
Microchip Technology
📦 256-LBGA (FG256)
Fusion (M1 series) Mixed-Signal FPGA · 250000 gates · 36864 · 114 · ARM Cortex-M1 · 1.5 V · 130 nm flash-based · Flash (in-system programmable, instant-on)

Kontak untuk harga

Lihat Datasheet →

M1AFS250-1FG256

✅ Drop-In
Microchip Technology
📦 256-LBGA (FG256)
Fusion (M1 series, mixed-signal FPGA) · 250000 gates · ARM Cortex-M1 · 114 · 36864 bits · 1.5 V · 130 nm flash-based · 1282.05 MHz (per FindIC spec summary)

Kontak untuk harga

Lihat Datasheet →

M1AFS250-FG256I

✅ Drop-In
Microchip Technology
📦 256-LBGA (FG256)
Fusion · 250000 · 114 · 36864 · 1.425V ~ 1.575V · -40C ~ +100C (TJ) · 256-LBGA

Kontak untuk harga

Lihat Datasheet →

M1AFS250-1FGG256

✅ Drop-In
Microchip Technology
📦 256-LBGA (FG256)
Fusion · 250000 · 6144 · 114 · 36864 · 1.5 V · 350 MHz · 130nm CMOS

Kontak untuk harga

Lihat Datasheet →

M1AFS250-2FG256I

✅ Drop-In
Microchip Technology
📦 256-LBGA (FG256)
Fusion (M1AFS, ARM Cortex-M1 support) · 250K · 114 · 36864 · 1.5 V · 130 nm, 7-layer metal flash-based CMOS · 350 MHz · ARM Cortex-M1 (hard IP)

Kontak untuk harga

Lihat Datasheet →

M1AFS250-2FG256 Rating Maksimal & Karakteristik Listrik

Family Fusion
System Gates 250000
Logic Cells 6144
Number of I/O 114
RAM Bits 36864
Number of Logic Elements 6144
Core Supply Voltage 1.5 V
Paket 256-LBGA (FG256)
Tipe Mounting Surface Mount
Suhu Kerja 0C to +85C
Speed Grade -2
Embedded Processor ARM Cortex-M1
Analog Blocks Configurable ADC/DAC/Comparators
Clock Management CCGM with PLLs
Status RoHS Non-Compliant
Lead Free Status Contains Lead

Konfigurasi Pin M1AFS250-2FG256

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin produk 1 IO — User I/O
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Pin produk 115 VCC — Core supply voltage (1.5V)
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Pin produk 256 GND — Ground

Aplikasi Umum

M1AFS250-2FG256 cocok untuk 6 aplikasis: Industrial Control, Automotive Electronics, Medical Devices, Communications Systems, Aerospace and Defense, IoT and Smart Home.

🏭

Industrial Control

The M1AFS250-2FG256 is ideal for industrial control systems requiring mixed-signal processing, such as motor control, PLCs, and process automation. Its configurable analog blocks (ADC, DAC, comparators) allow direct interfacing with sensors and actuators, while the flash-based FPGA provides instant-on and high reliability in harsh environments. The embedded ARM Cortex-M1 enables software-based control algorithms, and the 250K gates provide ample logic for custom protocols and interfaces. With 114 I/Os, it can connect to multiple peripherals, and the 1.5V core reduces power consumption, making it suitable for power-sensitive industrial applications. The device's security features protect against IP theft, which is critical in industrial settings.

🚗

Automotive Electronics

In automotive electronics, the M1AFS250-2FG256 is used for body control modules, motor control, and sensor fusion. Its configurable analog blocks can interface with temperature, pressure, and position sensors, while the flash-based architecture ensures reliable operation over the automotive temperature range (with the I-suffix variant). The embedded ARM Cortex-M1 allows for flexible software updates, and the 250K gates support complex logic for safety-critical functions. The device's low power consumption is beneficial for battery-powered systems, and its security features protect against unauthorized modifications. The 114 I/Os enable connection to CAN, LIN, and other automotive buses, making it a versatile choice for automotive electronics.

💊

Medical Devices

The M1AFS250-2FG256 is well-suited for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its configurable analog blocks enable precise signal conditioning for biosensors, while the flash-based FPGA provides instant-on and high reliability, which is critical in medical applications. The embedded ARM Cortex-M1 allows for complex signal processing algorithms, and the 250K gates provide ample logic for custom interfaces. The device's low power consumption extends battery life in portable devices, and its security features protect patient data. With 114 I/Os, it can interface with displays, communication modules, and sensors, making it a comprehensive solution for medical electronics.

🌐

Communications Systems

In communications systems, the M1AFS250-2FG256 is used for protocol conversion, signal processing, and interface bridging. Its configurable analog blocks can handle analog front-end tasks, while the flash-based FPGA provides secure and reliable configuration. The embedded ARM Cortex-M1 enables software-defined protocols, and the 250K gates support complex digital logic for data processing. The device's clock management with PLLs ensures precise timing, and its 114 I/Os allow connection to various communication interfaces such as UART, SPI, and I2C. The low power consumption is advantageous for network equipment, and the security features protect against unauthorized access, making it suitable for secure communications.

✈️

Aerospace and Defense

The M1AFS250-2FG256 is used in aerospace and defense applications such as avionics, guidance systems, and secure communications. Its flash-based architecture provides radiation tolerance and high reliability, which are essential in harsh environments. The configurable analog blocks enable sensor interfacing, and the embedded ARM Cortex-M1 supports complex control algorithms. The 250K gates provide ample logic for custom encryption and signal processing, and the device's security features protect against reverse engineering. With 114 I/Os, it can interface with various military-grade peripherals. The low power consumption is beneficial for battery-powered systems, and the instant-on capability ensures rapid startup in critical missions.

🧩

IoT and Smart Home

The M1AFS250-2FG256 is suitable for IoT and smart home devices that require mixed-signal processing, low power, and security. Its configurable analog blocks can interface with sensors for temperature, humidity, and motion, while the flash-based FPGA provides instant-on and low standby power. The embedded ARM Cortex-M1 enables edge computing and protocol handling, and the 250K gates support custom logic for device control. The device's security features protect against unauthorized access, and its 114 I/Os allow connection to Wi-Fi, Bluetooth, and other wireless modules. The low power consumption extends battery life in battery-powered IoT devices, making it an ideal choice for smart home applications.

What is the M1AFS250-2FG256?
The M1AFS250-2FG256 is a Fusion mixed-signal FPGA from Microchip Technology with 250,000 system gates, 114 user I/Os, and an embedded ARM Cortex-M1 processor. It integrates configurable analog, flash memory, and clock management in a 256-ball LBGA package. According to the Microchip product page, it is designed for system-on-chip applications requiring both programmable logic and analog functionality.
What is the price of M1AFS250-2FG256?
As of 2026-08-31, the M1AFS250-2FG256 is priced at approximately $45.32 for a single unit, with volume pricing dropping to $28.75 at 1000 units. These prices are based on distributor data from Octopart and Mouser. For the most current pricing and availability, check XAIPART or authorized distributors like DigiKey and Mouser.
Where can I buy M1AFS250-2FG256?
The M1AFS250-2FG256 is available from authorized distributors including DigiKey, Mouser, and Octopart. You can also purchase it directly from XAIPART, which offers competitive pricing and stock. As of 2026-08-31, DigiKey lists it as active with inventory. For bulk orders, contact XAIPART for volume pricing and lead times.
What is the lead time for M1AFS250-2FG256?
The lead time for M1AFS250-2FG256 varies by distributor and order quantity. As of 2026-08-31, DigiKey shows it as 'ships today' for in-stock items, while larger orders may require 4-6 weeks. XAIPART can provide specific lead times based on your requirements. Contact our sales team for the most accurate delivery estimates.
Is M1AFS250-2FG256 in stock?
As of 2026-08-31, the M1AFS250-2FG256 is in stock at major distributors like DigiKey and Mouser. XAIPART also maintains inventory for immediate shipment. However, stock levels can change rapidly, so it is recommended to check current availability on our website or contact us directly for real-time stock status.
What is the difference between M1AFS250-2FG256 and M1AFS250-1FGG256?
The M1AFS250-2FG256 and M1AFS250-1FGG256 differ in speed grade and package. The -2FG256 has a speed grade of -2 (faster) and uses a 256-LBGA (FG256) package, while the -1FGG256 has a speed grade of -1 (slower) and uses a 256-FBGA (FGG256) package. Both have the same 250K gates and 114 I/Os, but the -2FG256 offers higher performance. The FGG package is lead-free, while FG may contain lead.
What is the difference between M1AFS250-2FG256 and M1AFS250-2FGG256?
The M1AFS250-2FG256 and M1AFS250-2FGG256 are functionally identical, differing only in package finish. The -2FG256 uses a 256-LBGA (FG256) package that may contain lead, while the -2FGG256 uses a 256-FBGA (FGG256) package that is lead-free (RoHS compliant). Both have the same speed grade (-2), 250K gates, and 114 I/Os. Choose the -2FGG256 for RoHS-compliant designs.
What is the best drop-in replacement for M1AFS250-2FG256?
The best drop-in replacement for M1AFS250-2FG256 is the M1AFS250-2FGG256, which is pin-compatible and functionally identical, differing only in lead-free finish. Other drop-in options include the M1AFS250-1FG256 (slower speed grade) and M1AFS250-FG256I (industrial temperature range). All share the same 256-ball package and pinout, making them direct replacements without PCB changes.
Can M1AFS250-1FGG256 replace M1AFS250-2FG256?
Yes, the M1AFS250-1FGG256 can replace the M1AFS250-2FG256 as a drop-in replacement, but with a lower speed grade (-1 vs -2). This means the -1FGG256 has a lower maximum clock frequency, which may affect performance in high-speed designs. The package is different (FGG256 vs FG256), but both are 256-ball with the same pinout, so it is pin-compatible. Verify timing requirements before substitution.
What is the operating temperature range of M1AFS250-2FG256?
The M1AFS250-2FG256 has an operating temperature range of 0C to +85C, which is the commercial temperature grade. For industrial applications requiring -40C to +100C, consider the M1AFS250-2FG256I variant. According to the Microchip datasheet, the temperature range is specified for the commercial grade, and the I-suffix parts are qualified for extended temperature operation.
What are the key specifications of M1AFS250-2FG256 that engineers should know?
Engineers should know that the M1AFS250-2FG256 has 250,000 system gates, 114 user I/Os, 36,864 RAM bits, and an embedded ARM Cortex-M1 processor. It operates from a 1.5V core supply and is housed in a 256-ball LBGA package. The device integrates configurable analog blocks (ADC, DAC, comparators) and clock management with PLLs. It is a flash-based FPGA, providing instant-on and high security.
Is M1AFS250-2FG256 RoHS compliant?
No, the M1AFS250-2FG256 is not RoHS compliant. According to DigChip, it has a RoHS status of 'Non-Compliant' and contains lead. For RoHS-compliant designs, use the M1AFS250-2FGG256, which is lead-free and RoHS compliant. Always verify compliance requirements for your target market before selecting a part.
What is the maximum clock frequency of M1AFS250-2FG256?
The maximum clock frequency of the M1AFS250-2FG256 is not explicitly stated in the provided data, but the -2 speed grade typically supports up to 350 MHz in Fusion FPGAs. According to the M1AFS250-2FGG256YI listing, the maximum clock frequency is 350 MHz. For exact timing specifications, refer to the manufacturer datasheet.
What is the difference between M1AFS250-2FG256 and A3P250-2PQG208?
The M1AFS250-2FG256 is a Fusion mixed-signal FPGA with an embedded ARM Cortex-M1, analog blocks, and flash memory, while the A3P250-2PQG208 is a ProASIC3 FPGA without an embedded processor or analog blocks. The M1AFS250 has 250K gates and 114 I/Os in a 256-LBGA package, while the A3P250 has 250K gates and 68 I/Os in a 208-PQFP package. They are not pin-compatible and serve different application needs.
What is the best Microchip equivalent for M1AFS250-2FG256?
The best Microchip equivalent for M1AFS250-2FG256 is the M1AFS250-2FGG256, which is identical except for lead-free finish. Other Microchip equivalents include the M1AFS250-1FG256 (slower speed) and M1AFS250-FG256I (industrial temperature). All are pin-compatible drop-in replacements. For higher density, consider the M1AFS600 series, but note the package and pinout differences.
What is the power consumption of M1AFS250-2FG256?
The power consumption of the M1AFS250-2FG256 is not explicitly stated in the provided data. However, as a 130nm flash-based FPGA, it typically consumes low power. The core supply is 1.5V, and power depends on logic utilization, clock frequency, and I/O activity. For detailed power estimates, use Microchip's power calculator or refer to the datasheet.

Data referensi engineering untuk M1AFS250-2FG256 — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the M1AFS250-2FG256 when you need a mixed-signal FPGA with an embedded ARM Cortex-M1, configurable analog, and flash-based security. It is ideal for applications requiring both programmable logic and analog interfacing, such as industrial control, automotive, and medical devices. If you do not need the embedded processor or analog blocks, consider the A3P250 series for lower cost. For higher density, select the M1AFS600 or M1AFS1500. For RoHS compliance, use the -2FGG256 variant. For industrial temperature, choose the -2FG256I. All alternatives are pin-compatible drop-in replacements, allowing easy design migration.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini M1AFS250-2FGG256 M1AFS250-1FG256 M1AFS250-FG256I M1AFS250-1FGG256 M1AFS250-2FG256I
Package 256-LBGA (FG256) 256-FBGA (FGG256) - same footprint 256-LBGA (FG256) - same 256-LBGA (FG256) - same 256-FBGA (FGG256) - same footprint 256-LBGA (FG256) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Speed Grade -2 -2 -1 Standard (no speed grade suffix) -1 -2
Temperature Range 0C to +85C 0C to +85C 0C to +85C -40C to +100C 0C to +85C -40C to +100C
RoHS Compliance Non-Compliant Compliant Non-Compliant Non-Compliant Compliant Non-Compliant
Lead Free Contains Lead Lead Free Contains Lead Contains Lead Lead Free Contains Lead
System Gates 250000 250000 250000 250000 250000 250000
Number of I/O 114 114 114 114 114 114

Diferensiator Kunci

  • Embedded ARM Cortex-M1 processor (vsA3P250-2PQG208)
  • Configurable analog blocks (vsA3P250-2PQG208)
  • Flash-based non-volatile configuration (vsXC3S250E-4FT256)

Catatan Desain

The M1AFS250-2FG256 requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor at the power entry point. The flash-based FPGA has low static power, but dynamic power scales with clock frequency and logic utilization. Estimated: for a 100 MHz design with 50% logic utilization, power dissipation is approximately 0.5W, requiring adequate thermal management.

For the 256-ball LBGA package, use a 4-layer or more PCB with a solid ground plane and a dedicated power plane for the 1.5V core. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side of the board directly under the BGA pads to minimize inductance. Follow the manufacturer's layout guidelines for the Fusion FPGA family to ensure signal integrity and reliable operation.

A common pitfall is neglecting the I/O bank voltage (VCCI) requirements. Each I/O bank must be connected to the appropriate VCCI voltage (e.g., 3.3V, 2.5V, 1.8V) matching the interfaced devices. Failure to do so can cause improper logic levels and potential damage. Also, ensure the JTAG pins are properly terminated for programming. The flash-based FPGA does not require external configuration memory, but verify the programming interface is correctly connected. Refer to the Fusion FPGA datasheet for detailed pin assignments.

Informasi Konformitas

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Bebas Logam Lengket
No
Bebas Halogena
Unknown
Mineral Konflik
Unknown

According to DigChip, the M1AFS250-2FG256 is RoHS non-compliant and contains lead. For RoHS-compliant designs, use the M1AFS250-2FGG256 variant.

Data disahkan pada: 2026-08-31 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

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Komponen dan Istilah Terkait

Microchip Technology M1AFS250-2FG256 M1AFS250-2FGG256 M1AFS250-1FG256 M1AFS250-FG256I M1AFS250-1FGG256 M1AFS250-2FG256I FPGA Field Programmable Gate Array Fusion ARM Cortex-M1 LBGA BGA RoHS ADC DAC PLL flash memory mixed-signal system-on-chip
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