M1AFS250-2FGG256 - Fusion FPGA 250K Gates ARM M1 | Microchip
MPN: M1AFS250-2FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $103.9 | $103.90 |
| 10 | $98.7 | $987.00 |
| 100 | $93.51 | $9,351.00 |
| 500 | $88.31 | $44,155.00 |
| 1,000 | $83.12 | $83,120.00 |
Drop-in alternatives for M1AFS250-2FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS250-2FGG256I
✅ Drop-In✓ In Stock
$83.12 / Unit
View Datasheet →M1AFS250-2FG256
✅ Drop-In✓ In Stock
$28.75 / Unit
View Datasheet →M1AFS600-FG256
✅ Drop-In✓ In Stock
$22 / Unit
View Datasheet →M1AFS1500-2FGG256
✅ Drop-In✓ In Stock
$124.5 / Unit
View Datasheet →M7AFS600-FGG256
✅ Drop-In✓ In Stock
$232.4 / Unit
View Datasheet →M1AFS250-2FGG256 Maximum Ratings & Electrical Characteristics
| Family | Fusion (M1 series) Mixed-Signal FPGA |
| System Gates | 250000 gates |
| Registers (D-Flip-Flops) | 36864 |
| User I/O | 114 |
| Embedded Processor | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash-based |
| Configuration Memory | Flash (in-system programmable, instant-on) |
| Analog Features | Configurable analog block, voltage monitoring |
| Clock Management | On-chip clock generation and management circuitry |
| Package | 256-LBGA (FGG256) |
| Mounting Type | Surface Mount |
| Speed Grade | -2 |
M1AFS250-2FGG256 256-lbga (fgg256) Pin Configuration Guide
Complete pinout information for M1AFS250-2FGG256 (256-lbga (fgg256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS250-2FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS250-2FGG256 is suitable for 6 applications: Industrial Control and Monitoring, Power Supply Management and Hot-Swap Control, Embedded Single-Chip CPU+FPGA Systems, Telecom Line Card Supervision, Test and Measurement Equipment, Aerospace and Defense Heritage Systems.
Industrial Control and Monitoring
The M1AFS250-2FGG256 fits industrial control and monitoring systems where a single chip must combine deterministic processing with custom glue logic. Its 250K system gates and 36864 registers provide enough capacity for motor sequencing, sensor polling, and protocol bridging, while the embedded ARM Cortex-M1 runs the management firmware with predictable real-time behavior. The flash-based fabric is instant-on, so safety interlocks and watchdog logic are active before any software boots - a meaningful advantage over SRAM FPGAs that need milliseconds to configure. With 114 user I/Os, the device can drive relays, read encoders, and interface to field buses directly. In a typical topology, the Cortex-M1 handles state machines and diagnostics while fabric logic handles latency-critical pulse I/O, delivering sub-microsecond response that a standalone MCU cannot match.
Recommended
Power Supply Management and Hot-Swap Control
Power-supply management is the flagship application for the Fusion family. The M1AFS250-2FGG256 integrates a configurable analog block with multiple voltage-monitor inputs, so a single device can supervise a dozen rails, sequence power-up ordering, and log faults - eliminating a discrete supervisor IC and a microcontroller. The instant-on flash fabric means monitoring logic is alive within microseconds of power arrival, before the ARM Cortex-M1 software stack initializes, which is critical for hot-swap insertion handling. The 1.5V core keeps device overhead low on efficiency-sensitive backplanes. In a typical design the analog inputs connect through resistor dividers to 12V/5V/3.3V/1.8V rails, the Cortex-M1 implements PMBus-style control policy, and fabric logic implements fast overvoltage/overcurrent trip comparators, achieving trip latencies far below what software polling could achieve.
Recommended
Embedded Single-Chip CPU+FPGA Systems
The M1AFS250-2FGG256 serves space-constrained embedded systems that historically needed two chips: a microcontroller plus a small FPGA. By embedding the ARM Cortex-M1 as a hard core in a 250K-gate flash fabric, one 256-ball package executes control firmware while fabric implements custom interfaces such as UART expansion, PWM banks, data encoders, or proprietary buses. The 130nm flash-based process keeps static power modest for battery-backed or conduction-cooled enclosures. Instant-on configuration removes boot-time gaps: the fabric applies its design at power-up and the processor begins executing immediately, simplifying reset architecture. Integration also improves reliability - fewer solder joints, fewer passives, and one qualification effort. Compared to a discrete MCU+FPGA pairing, this fusion typically saves board area and gives deterministic CPU-to-fabric latency on-chip.
Recommended
Telecom Line Card Supervision
Telecom and datacom line cards demand board-management controllers that monitor voltages, control hot-swap FETs, and report status over management buses. The M1AFS250-2FGG256 addresses this with its integrated analog monitoring, 114 flexible I/Os for FET gate drive and enable sequencing, and hard ARM Cortex-M1 for the management state machine. Flash configuration makes the supervisor active immediately on shelf power, which matters for cards on live backplanes that must signal presence before software loads. The on-chip clock management circuitry generates management-clock domains without extra oscillators, trimming bill-of-material cost. A typical topology sequences four to eight rails with measured slew control on the analog inputs, drives hot-swap MOSFET gates through fabric PWM, and exposes telemetry via a UART or I2C-like fabric master - all within one 250K-gate device.
Recommended
Test and Measurement Equipment
Bench and rack instruments benefit from the M1AFS250-2FGG256's mix of instant-on digital logic, analog monitoring, and embedded processing. Fabric logic implements trigger engines, counters, and capture interfaces with deterministic timing, while the ARM Cortex-M1 runs calibration routines and communicates with a host over serial links. The configurable analog block measures internal supply rails and can monitor external probe supply voltages, supporting self-test routines at power-up. The 36864 registers support moderate datapath buffering, and 114 user I/Os connect front-panel indicators, relays, and sensor front-ends. Because the fabric is flash-based and instant-on, the instrument presents a working safety state before software initialization, which is a common requirement in metrology hardware. For designs needing more capacity, the pin-compatible AFS600 in the same package provides a no-rework upgrade path.
Recommended
Aerospace and Defense Heritage Systems
The Fusion family originated at Actel/Microsemi, whose flash FPGAs carry a strong aerospace and defense heritage due to configuration immunity to radiation-related upsets in the configuration store and inherent readback protection. The M1AFS250-2FGG256 suits heritage upgrades, ground equipment, test sets, and non-flight critical subsystems where a trusted flash-based fabric, instant-on operation, and ARM Cortex-M1 processing in one package simplify design assurance. The monolithic integration reduces part count - a documented reliability advantage in supply-chain-constrained programs. With 114 I/Os it can bridge legacy interfaces (MIL-STD-style discretes, custom serial protocols) to modern management buses. For flight-critical logic, engineers typically move to the RTAX and RTG4 radiation-tolerant families; for ground support equipment and instrumentation sharing the same firmware base, the M1AFS250 provides a low-cost, low-risk companion device.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS250-2FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS250-2FGG256I | M1AFS250-2FG256 | M1AFS600-FG256 | M1AFS1500-2FGG256 | M7AFS600-FGG256 |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256) | 256-LBGA (FGG256) - same | 256-LBGA (FG256) - same footprint | 256-LBGA (FG256) - same footprint, pin compatible | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | 600K | 1.5M | 600K |
| User I/O | 114 | 114 | 114 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | None (AFS standard Fusion) | ARM Cortex-M1 | ARM Cortex-M7 class |
| Speed Grade | -2 | -2 | -2 | Standard | -2 | [DATA_NEEDED] |
| Temperature Grade | Commercial | Industrial (-I) | Commercial | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Configuration Memory | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) |
Key Differentiators
- Integrated ARM Cortex-M1 hard processor (vs M1AFS600-FG256)
- Lowest-cost point of the pin-compatible FG256 Fusion family (vs M1AFS1500-2FGG256)
- Industrial temperature option in identical footprint (vs M1AFS250-2FGG256I)
- Integrated configurable analog and instant-on flash fabric (vs M7AFS600-FGG256)
Design Notes
The M1AFS250-2FGG256 requires a 1.5V core supply; all FPGA I/O banks and the analog block need their own clean rails. Estimated: budget rail sequencing so that core power arrives before or with I/O power to avoid latch-up risk on BGA devices - verify exact ordering against the Microchip Fusion datasheet power-up specification. Use the integrated analog voltage-monitor inputs to supervise the FPGA's own rails as well as board-level rails, which the Fusion family was specifically designed for. Decouple each supply ball with at least 0.1uF ceramic close to the package, plus bulk 10uF per rail.
The 256-ball LBGA (1.0mm pitch class) requires controlled-impedance fanout on at least 4 layers with dedicated ground plane. Use microvias or dog-bone fanout per IPC BGA escape guidelines; keep 114 user I/O breakout symmetric to preserve routing channels toward the center. Since Fusion devices in the same package are pin compatible per the datasheet, reserve routing headroom so the PCB can accept AFS600/AFS1500 in the same footprint without re-spin - place series resistors and stubs tolerant of higher-I/O-count variants.
The M1AFS250 is a mature Microsemi-origin device designed in Libero SoC; do not mix design-tool versions across family members without re-timing. Analog inputs of the Fusion block have specific input ranges - scale measured rails with precision dividers and never exceed the analog pin absolute maximum, or the monitoring feature (the reason many choose Fusion) is destroyed. The FG vs FGG lead-finish suffix matters for reflow profile and RoHS declarations; confirm ordering code before assembly. Finally, retain the industrial -I variant (M1AFS250-2FGG256I) in BOMs for environments below 0C.
Compliance Information
The FGG suffix in Microchip ordering codes conventionally denotes lead-free/RoHS-compliant ball finish, but explicit compliance statements were not present in the retrieved data; verify on the Microchip product page or datasheet before production.
