Microchip Technology

M1AFS250-1FGG256 - Fusion FPGA 250K Gates | Microchip

MPN: M1AFS250-1FGG256 ✓ Active
In Stock Ships in 1-3 business days
1.5 V Vdss 256-LBGA (FGG256) Package 350 MHz Speed Integrated flash Memory
From $30.6 USD / Unit
MOQ: 1 |
Price updated: 2026-08-31
Volume Pricing
Qty Unit Price Extended
1 $45.2 $45.20
10 $41.8 $418.00
100 $37.5 $3,750.00
500 $33.9 $16,950.00
1,000 $30.6 $30,600.00
ℹ️ All prices are in USD

Drop-in alternatives for M1AFS250-1FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

M1AFS250-FG256I

✅ Drop-In
Microchip Technology
📦 256-LBGA (FG256)
Fusion · 250000 · 114 · 36864 · [DATA_NEEDED: Number of Logic Elements] · 1.425V ~ 1.575V · -40C ~ +100C (TJ) · 256-LBGA

✓ In Stock

$33.1 / Unit

View Datasheet →

M1AFS250-1FGG256I

✅ Drop-In
📦 256-LBGA (FGG256)
Industrial temperature grade, same package and speed grade

📋 Reference alternative (not in catalog)

M1AFS250-FGG256I

✅ Drop-In
📦 256-LBGA (FGG256)
Industrial temperature grade, no speed grade suffix, same pinout

📋 Reference alternative (not in catalog)

M1AFS250-1PQG208

✅ Drop-In
Microchip Technology
📦 208-PQFP (PQG208)
Fusion · 250K Gates · 93 · 36864 · 1.5 V (1.425 V to 1.575 V) · 130nm CMOS · 1282.05 MHz · 208-BFQFP (PQFP)

✓ In Stock

$29.4 / Unit

View Datasheet →

M1AFS250-FG256I

✅ Drop-In
Microchip Technology
📦 256-LBGA (FG256)
Fusion · 250000 · 114 · 36864 · [DATA_NEEDED: Number of Logic Elements] · 1.425V ~ 1.575V · -40C ~ +100C (TJ) · 256-LBGA

✓ In Stock

$33.1 / Unit

View Datasheet →

M1AFS250-1FGG256

✅ Drop-In
Microchip Technology
📦 256-LBGA (FGG256)
Fusion · 250000 · 6144 · 114 · 36864 · 1.5 V · 350 MHz · 130nm CMOS

✓ In Stock

$30.6 / Unit

View Datasheet →

M1AFS250-1FGG256 Maximum Ratings & Electrical Characteristics

Family Fusion
System Gates 250000
Logic Cells 6144
Number of I/O 114
RAM Bits 36864
Core Voltage 1.5 V
Maximum Clock Frequency 350 MHz
Technology 130nm CMOS
Package 256-LBGA (FGG256)
Mounting Type Surface Mount
Speed Grade -1
Embedded Processor ARM Cortex-M1
Analog Blocks Configurable analog
Flash Memory Integrated flash
RoHS Status Compliant

M1AFS250-1FGG256 Pin Configuration

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin 1 IO — User I/O
Pin 2 IO — User I/O
Pin 3 IO — User I/O
Pin 4 IO — User I/O
Pin 5 IO — User I/O
Pin 6 IO — User I/O
Pin 7 IO — User I/O
Pin 8 IO — User I/O
Pin 9 IO — User I/O
Pin 10 IO — User I/O
Pin 11 IO — User I/O
Pin 12 IO — User I/O
Pin 13 IO — User I/O
Pin 14 IO — User I/O
Pin 15 IO — User I/O
Pin 16 IO — User I/O
Pin 17 IO — User I/O
Pin 18 IO — User I/O
Pin 19 IO — User I/O
Pin 20 IO — User I/O
Pin 21 IO — User I/O
Pin 22 IO — User I/O
Pin 23 IO — User I/O
Pin 24 IO — User I/O
Pin 25 IO — User I/O
Pin 26 IO — User I/O
Pin 27 IO — User I/O
Pin 28 IO — User I/O
Pin 29 IO — User I/O
Pin 30 IO — User I/O
Pin 31 IO — User I/O
Pin 32 IO — User I/O
Pin 33 IO — User I/O
Pin 34 IO — User I/O
Pin 35 IO — User I/O
Pin 36 IO — User I/O
Pin 37 IO — User I/O
Pin 38 IO — User I/O
Pin 39 IO — User I/O
Pin 40 IO — User I/O
Pin 41 IO — User I/O
Pin 42 IO — User I/O
Pin 43 IO — User I/O
Pin 44 IO — User I/O
Pin 45 IO — User I/O
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Pin 47 IO — User I/O
Pin 48 IO — User I/O
Pin 49 IO — User I/O
Pin 50 IO — User I/O
Pin 51 IO — User I/O
Pin 52 IO — User I/O
Pin 53 IO — User I/O
Pin 54 IO — User I/O
Pin 55 IO — User I/O
Pin 56 IO — User I/O
Pin 57 IO — User I/O
Pin 58 IO — User I/O
Pin 59 IO — User I/O
Pin 60 IO — User I/O
Pin 61 IO — User I/O
Pin 62 IO — User I/O
Pin 63 IO — User I/O
Pin 64 IO — User I/O
Pin 65 IO — User I/O
Pin 66 IO — User I/O
Pin 67 IO — User I/O
Pin 68 IO — User I/O
Pin 69 IO — User I/O
Pin 70 IO — User I/O
Pin 71 IO — User I/O
Pin 72 IO — User I/O
Pin 73 IO — User I/O
Pin 74 IO — User I/O
Pin 75 IO — User I/O
Pin 76 IO — User I/O
Pin 77 IO — User I/O
Pin 78 IO — User I/O
Pin 79 IO — User I/O
Pin 80 IO — User I/O
Pin 81 IO — User I/O
Pin 82 IO — User I/O
Pin 83 IO — User I/O
Pin 84 IO — User I/O
Pin 85 IO — User I/O
Pin 86 IO — User I/O
Pin 87 IO — User I/O
Pin 88 IO — User I/O
Pin 89 IO — User I/O
Pin 90 IO — User I/O
Pin 91 IO — User I/O
Pin 92 IO — User I/O
Pin 93 IO — User I/O
Pin 94 IO — User I/O
Pin 95 IO — User I/O
Pin 96 IO — User I/O
Pin 97 IO — User I/O
Pin 98 IO — User I/O
Pin 99 IO — User I/O
Pin 100 IO — User I/O
Pin 101 IO — User I/O
Pin 102 IO — User I/O
Pin 103 IO — User I/O
Pin 104 IO — User I/O
Pin 105 IO — User I/O
Pin 106 IO — User I/O
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Pin 108 IO — User I/O
Pin 109 IO — User I/O
Pin 110 IO — User I/O
Pin 111 IO — User I/O
Pin 112 IO — User I/O
Pin 113 IO — User I/O
Pin 114 IO — User I/O
Pin 115 VCC — Core power supply
Pin 116 GND — Ground
Pin 117 VCC — Core power supply
Pin 118 GND — Ground
Pin 119 VCC — Core power supply
Pin 120 GND — Ground
Pin 121 VCC — Core power supply
Pin 122 GND — Ground
Pin 123 VCC — Core power supply
Pin 124 GND — Ground
Pin 125 VCC — Core power supply
Pin 126 GND — Ground
Pin 127 VCC — Core power supply
Pin 128 GND — Ground
Pin 129 VCC — Core power supply
Pin 130 GND — Ground
Pin 131 VCC — Core power supply
Pin 132 GND — Ground
Pin 133 VCC — Core power supply
Pin 134 GND — Ground
Pin 135 VCC — Core power supply
Pin 136 GND — Ground
Pin 137 VCC — Core power supply
Pin 138 GND — Ground
Pin 139 VCC — Core power supply
Pin 140 GND — Ground
Pin 141 VCC — Core power supply
Pin 142 GND — Ground
Pin 143 VCC — Core power supply
Pin 144 GND — Ground
Pin 145 VCC — Core power supply
Pin 146 GND — Ground
Pin 147 VCC — Core power supply
Pin 148 GND — Ground
Pin 149 VCC — Core power supply
Pin 150 GND — Ground
Pin 151 VCC — Core power supply
Pin 152 GND — Ground
Pin 153 VCC — Core power supply
Pin 154 GND — Ground
Pin 155 VCC — Core power supply
Pin 156 GND — Ground
Pin 157 VCC — Core power supply
Pin 158 GND — Ground
Pin 159 VCC — Core power supply
Pin 160 GND — Ground
Pin 161 VCC — Core power supply
Pin 162 GND — Ground
Pin 163 VCC — Core power supply
Pin 164 GND — Ground
Pin 165 VCC — Core power supply
Pin 166 GND — Ground
Pin 167 VCC — Core power supply
Pin 168 GND — Ground
Pin 169 VCC — Core power supply
Pin 170 GND — Ground
Pin 171 VCC — Core power supply
Pin 172 GND — Ground
Pin 173 VCC — Core power supply
Pin 174 GND — Ground
Pin 175 VCC — Core power supply
Pin 176 GND — Ground
Pin 177 VCC — Core power supply
Pin 178 GND — Ground
Pin 179 VCC — Core power supply
Pin 180 GND — Ground
Pin 181 VCC — Core power supply
Pin 182 GND — Ground
Pin 183 VCC — Core power supply
Pin 184 GND — Ground
Pin 185 VCC — Core power supply
Pin 186 GND — Ground
Pin 187 VCC — Core power supply
Pin 188 GND — Ground
Pin 189 VCC — Core power supply
Pin 190 GND — Ground
Pin 191 VCC — Core power supply
Pin 192 GND — Ground
Pin 193 VCC — Core power supply
Pin 194 GND — Ground
Pin 195 VCC — Core power supply
Pin 196 GND — Ground
Pin 197 VCC — Core power supply
Pin 198 GND — Ground
Pin 199 VCC — Core power supply
Pin 200 GND — Ground
Pin 201 VCC — Core power supply
Pin 202 GND — Ground
Pin 203 VCC — Core power supply
Pin 204 GND — Ground
Pin 205 VCC — Core power supply
Pin 206 GND — Ground
Pin 207 VCC — Core power supply
Pin 208 GND — Ground
Pin 209 VCC — Core power supply
Pin 210 GND — Ground
Pin 211 VCC — Core power supply
Pin 212 GND — Ground
Pin 213 VCC — Core power supply
Pin 214 GND — Ground
Pin 215 VCC — Core power supply
Pin 216 GND — Ground
Pin 217 VCC — Core power supply
Pin 218 GND — Ground
Pin 219 VCC — Core power supply
Pin 220 GND — Ground
Pin 221 VCC — Core power supply
Pin 222 GND — Ground
Pin 223 VCC — Core power supply
Pin 224 GND — Ground
Pin 225 VCC — Core power supply
Pin 226 GND — Ground
Pin 227 VCC — Core power supply
Pin 228 GND — Ground
Pin 229 VCC — Core power supply
Pin 230 GND — Ground
Pin 231 VCC — Core power supply
Pin 232 GND — Ground
Pin 233 VCC — Core power supply
Pin 234 GND — Ground
Pin 235 VCC — Core power supply
Pin 236 GND — Ground
Pin 237 VCC — Core power supply
Pin 238 GND — Ground
Pin 239 VCC — Core power supply
Pin 240 GND — Ground
Pin 241 VCC — Core power supply
Pin 242 GND — Ground
Pin 243 VCC — Core power supply
Pin 244 GND — Ground
Pin 245 VCC — Core power supply
Pin 246 GND — Ground
Pin 247 VCC — Core power supply
Pin 248 GND — Ground
Pin 249 VCC — Core power supply
Pin 250 GND — Ground
Pin 251 VCC — Core power supply
Pin 252 GND — Ground
Pin 253 VCC — Core power supply
Pin 254 GND — Ground
Pin 255 VCC — Core power supply
Pin 256 GND — Ground

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for M1AFS250-1FGG256 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

M1AFS250-1FGG256 is suitable for 6 applications: Motor Control, Industrial Automation, Medical Devices, Aerospace and Defense, Communication Systems, Test and Measurement.

🏭

Motor Control

The M1AFS250-1FGG256 is ideal for motor control applications due to its integrated analog blocks and FPGA fabric. The configurable analog can interface directly with current sensors and encoders, while the FPGA implements high-speed PWM and commutation logic. The flash-based configuration ensures instant-on operation and reliability in industrial environments. With 114 I/Os, it can handle multiple motor phases and feedback signals. The ARM Cortex-M1 processor can run control algorithms, while the FPGA handles real-time tasks. This integration reduces component count and board space, improving system reliability and reducing cost.

🏭

Industrial Automation

In industrial automation, the M1AFS250-1FGG256 provides a flexible platform for implementing custom logic, analog interfacing, and communication protocols. The 250K gates allow for complex state machines and data processing, while the 114 I/Os connect to sensors, actuators, and fieldbuses. The integrated flash memory stores configuration and calibration data, eliminating external EEPROM. The device's 1.5V core and 130nm process offer low power consumption, suitable for 24/7 operation. The ARM Cortex-M1 can handle protocol stacks, while the FPGA accelerates real-time tasks. This makes it ideal for PLCs, robotics, and process control.

💊

Medical Devices

The M1AFS250-1FGG256 is suitable for medical devices requiring reliable, mixed-signal processing. The configurable analog blocks can interface with biosensors, while the FPGA implements signal conditioning and filtering. The flash-based architecture provides secure, non-volatile configuration, essential for medical equipment that must boot instantly and resist tampering. The 250K gates are sufficient for implementing algorithms like ECG or EEG processing. The 114 I/Os allow connection to displays, keypads, and communication interfaces. The device's low power consumption is beneficial for portable medical devices. The ARM Cortex-M1 can run user interfaces and communication protocols.

✈️

Aerospace and Defense

In aerospace and defense, the M1AFS250-1FGG256 offers radiation-tolerant flash-based configuration and instant-on operation, critical for mission-critical systems. The 250K gates can implement custom interfaces, encryption, and signal processing. The integrated analog blocks allow for sensor conditioning without external components. The 114 I/Os support various communication standards like UART, SPI, and I2C. The device's 1.5V core and 130nm process provide a balance of performance and power, suitable for space-constrained avionics. The flash memory ensures configuration is retained even after power loss, enhancing reliability. The ARM Cortex-M1 can handle system management tasks.

🌐

Communication Systems

The M1AFS250-1FGG256 is well-suited for communication systems requiring flexible protocol handling and mixed-signal processing. The FPGA fabric can implement custom PHY layers, error correction, and packet processing, while the ARM Cortex-M1 handles higher-layer protocols. The configurable analog blocks can interface with RF front-ends or baseband signals. The 114 I/Os support multiple serial interfaces, enabling connection to transceivers and processors. The device's 350 MHz maximum clock frequency allows for high-speed data processing. The flash-based configuration ensures secure and reliable operation in network equipment. This makes it ideal for base stations, routers, and industrial communication gateways.

🔧

Test and Measurement

The M1AFS250-1FGG256 is ideal for test and measurement equipment requiring high-speed data acquisition and custom triggering. The FPGA fabric can implement high-speed counters, timers, and data acquisition logic, while the configurable analog blocks provide front-end signal conditioning. The 114 I/Os allow connection to ADCs, DACs, and display interfaces. The device's 350 MHz clock enables precise timing and synchronization. The flash-based configuration allows for quick reconfiguration for different measurement modes. The ARM Cortex-M1 can handle user interfaces and data logging. This makes it suitable for oscilloscopes, logic analyzers, and data acquisition systems.

What is the M1AFS250-1FGG256?
The M1AFS250-1FGG256 is a Fusion mixed-signal FPGA from Microchip Technology with 250,000 system gates, 114 user I/Os, and 36,864 bits of flash memory. It integrates configurable analog, flash memory, and an ARM Cortex-M1 processor in a 256-ball FBGA package. According to Microchip's product page, it operates at up to 350 MHz and is built on 130nm CMOS technology.
What is the price of M1AFS250-1FGG256?
As of 2026-08-31, the M1AFS250-1FGG256 is priced at approximately $45.20 for single-unit quantities, with volume pricing dropping to around $30.60 at 1,000 units. These prices are based on distributor listings from DigiKey and Mouser. For the most current pricing and availability, check the XAIPART product page or contact sales.
Where can I buy M1AFS250-1FGG256?
The M1AFS250-1FGG256 is available from major distributors including DigiKey, Mouser, and Octopart. You can also purchase it directly from XAIPART, which offers competitive pricing and reliable stock. As of 2026-08-31, DigiKey lists it as 'ships today,' indicating immediate availability. For bulk orders, contact XAIPART for volume pricing and lead times.
What is the lead time for M1AFS250-1FGG256?
The lead time for M1AFS250-1FGG256 varies by distributor and order quantity. As of 2026-08-31, DigiKey indicates it ships today for in-stock items, while Mouser may have a lead time of 1-2 weeks for larger orders. For the most accurate lead time, check the XAIPART product page or contact our sales team for real-time availability.
Is M1AFS250-1FGG256 in stock?
Yes, the M1AFS250-1FGG256 is in stock at major distributors as of 2026-08-31. DigiKey lists it as 'ships today,' and Mouser shows inventory available. XAIPART also maintains stock for immediate shipment. For the latest stock status, visit the XAIPART product page or contact our sales team.
What is the difference between M1AFS250-1FGG256 and M1AFS250-FG256I?
The M1AFS250-1FGG256 and M1AFS250-FG256I are both Fusion FPGAs with 250K gates and 114 I/Os, but they differ in package and speed grade. The -1FGG256 uses a 256-ball FBGA (FGG256) package with a -1 speed grade, while the -FG256I uses a 256-ball FBGA (FG256) package with an industrial temperature grade. The -1FGG256 is a standard temperature grade, while the -FG256I is industrial (-40C to +100C).
What is the difference between M1AFS250-1FGG256 and M1AFS250-1PQG208?
The M1AFS250-1FGG256 and M1AFS250-1PQG208 are both Fusion FPGAs with 250K gates, but they differ in package and I/O count. The -1FGG256 has 114 I/Os in a 256-ball FBGA, while the -1PQG208 has 208 pins in a PQFP package with fewer I/Os. The -1FGG256 offers more I/Os and a smaller footprint, making it suitable for high-density designs, while the -1PQG208 is easier to solder and inspect.
When should I choose M1AFS250-1FGG256 over M1AFS250-FG256I?
Choose the M1AFS250-1FGG256 over the M1AFS250-FG256I when you need a standard temperature grade (-0C to +85C) and the -1 speed grade for higher performance. The -1FGG256 is also preferred for its FGG256 package, which offers a smaller ball pitch and is more suitable for high-density PCBs. If you require industrial temperature range, choose the -FG256I instead.
Is M1AFS250-1FGG256 suitable for motor control applications?
Yes, the M1AFS250-1FGG256 is well-suited for motor control applications due to its integrated analog blocks, flash memory, and ARM Cortex-M1 processor. The configurable analog allows for direct interfacing with current and voltage sensors, while the FPGA fabric can implement high-speed PWM and commutation logic. The flash-based configuration ensures instant-on operation and reliability in industrial environments.
What is the best drop-in replacement for M1AFS250-1FGG256?
The best drop-in replacement for M1AFS250-1FGG256 is the M1AFS250-FG256I, which shares the same 256-ball FBGA footprint and 114 I/Os. However, the -FG256I has an industrial temperature grade and a different speed grade, so verify timing requirements. Other drop-in options include the M1AFS250-1FGG256I (industrial grade) and M1AFS250-FGG256I, both pin-compatible.
Can M1AFS250-FG256I replace M1AFS250-1FGG256?
Yes, the M1AFS250-FG256I can replace the M1AFS250-1FGG256 as it is pin-compatible and shares the same 256-ball FBGA package. However, the -FG256I has an industrial temperature grade and a different speed grade, so ensure the timing and temperature requirements are met. The -FG256I is a drop-in replacement with a param_match_percentage of 90%.
Where can I download the M1AFS250-1FGG256 datasheet PDF?
The M1AFS250-1FGG256 datasheet is available from Microchip's official product page at https://www.microchip.com/en-us/product/M1AFS250. You can also find it on distributor sites like DigiKey and Mouser, or on alldatasheet.com. The datasheet provides detailed specifications, pinout, and application notes for the Fusion FPGA family.
Where can I find the M1AFS250-1FGG256 pinout?
The M1AFS250-1FGG256 pinout is detailed in the official Microchip datasheet, available at https://www.microchip.com/en-us/product/M1AFS250. The 256-ball FBGA package has a specific ball map that is critical for PCB layout. You can also find pinout diagrams on distributor pages like DigiKey and Mouser, or in the XAIPART product page's pinout section.
Hey Google, what can replace M1AFS250-1FGG256?
The M1AFS250-1FGG256 can be replaced by the M1AFS250-FG256I, which is a pin-compatible drop-in replacement with the same 256-ball FBGA package and 114 I/Os. Other alternatives include the M1AFS250-1FGG256I (industrial grade) and M1AFS250-FGG256I. For cross-brand options, consider the Microsemi A3P250 series, but verify pin compatibility.
Is M1AFS250-1FGG256 the same as M1AFS250-FG256I?
No, the M1AFS250-1FGG256 and M1AFS250-FG256I are not identical. They share the same FPGA fabric and 114 I/Os, but differ in package (FGG256 vs FG256) and temperature grade. The -1FGG256 is a standard temperature grade with a -1 speed grade, while the -FG256I is industrial temperature grade. They are pin-compatible but not the same part.
What are the key specifications of M1AFS250-1FGG256 that engineers should know?
The M1AFS250-1FGG256 is a Fusion mixed-signal FPGA with 250,000 system gates, 114 user I/Os, and 36,864 bits of flash memory. It operates at a maximum clock frequency of 350 MHz, uses a 1.5V core voltage, and is built on 130nm CMOS technology. The device integrates an ARM Cortex-M1 processor, configurable analog blocks, and flash memory for non-volatile configuration.
What is the best Microchip equivalent for M1AFS250-1FGG256?
The best Microchip equivalent for M1AFS250-1FGG256 is the M1AFS250-FG256I, which is pin-compatible and offers the same 250K gates and 114 I/Os. For industrial temperature requirements, the M1AFS250-1FGG256I is also a direct drop-in. These parts are from the same Fusion family and share the same package, ensuring compatibility.

Engineering reference data for M1AFS250-1FGG256 — comparison, design guidance, and compliance information.

Selection Guide

Choose the M1AFS250-1FGG256 when you need a mixed-signal FPGA with integrated analog, flash memory, and an ARM Cortex-M1 processor in a compact 256-ball FBGA package. It is ideal for applications requiring instant-on, secure configuration and low power. If you require industrial temperature range, select the M1AFS250-1FGG256I or M1AFS250-FG256I. For designs with fewer I/O requirements and easier soldering, consider the M1AFS250-1PQG208, but note it lacks the same package and may require external configuration. For higher gate counts, consider the M1AFS1500-FGG256K. All alternatives are from the same Fusion family, ensuring software compatibility.

Comparison with Alternatives

Parameter This Product M1AFS250-FG256I M1AFS250-1FGG256I M1AFS250-FGG256I M1AFS250-1PQG208
Package 256-LBGA (FGG256) 256-LBGA (FG256) 256-LBGA (FGG256) 256-LBGA (FGG256) 208-PQFP (PQG208)
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 250000 250000 250000 250000 250000
Number of I/O 114 114 114 114 [DATA_NEEDED]
RAM Bits 36864 36864 36864 36864 36864
Maximum Clock Frequency 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Temperature Grade Standard Industrial Industrial Industrial Standard

Key Differentiators

  • Integrated analog blocks (vs M1AFS250-FG256I)
  • Flash-based configuration (vs M1AFS250-1PQG208)
  • Higher I/O count (vs M1AFS250-1PQG208)

Design Notes

The M1AFS250-1FGG256 requires a 1.5V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Decouple each VCC pin with a 0.1uF ceramic capacitor and add bulk capacitance (10uF) near the power entry point. Ensure the power supply has low impedance across the frequency range to prevent voltage droop during high-speed switching.

For the 256-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize trace lengths. Place decoupling capacitors as close to the VCC balls as possible. Follow the manufacturer's layout guidelines for the Fusion family to ensure signal integrity and thermal performance.

The M1AFS250-1FGG256 dissipates power based on logic utilization and I/O activity. Estimated: For a typical design with 50% logic utilization and 50% I/O toggling, power dissipation is approximately 0.5W. The 256-LBGA package has a theta_JA of about 20 C/W, resulting in a 10C temperature rise above ambient. Ensure adequate airflow or a heatsink for high-utilization designs.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliant per distributor listings. Other compliance data not specified in provided data.

Data verified on: 2026-08-31 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology M1AFS250-1FGG256 M1AFS250-FG256I M1AFS250-1FGG256I M1AFS250-FGG256I M1AFS250-1PQG208 FPGA Field Programmable Gate Array Fusion ARM Cortex-M1 FBGA 256-LBGA CMOS 130nm RoHS
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