M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
MPN: M1AFS250-2FG256I ✓ Active| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for M1AFS250-2FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS250-2FGG256I
✅ Drop-In✓ In Stock
$83.12 / Unit
View Datasheet →M1AFS250-2FGG256
✅ Drop-In✓ In Stock
$83.12 / Unit
View Datasheet →AFS250-2FG256I
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
M1AFS250-1FG256I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$96.5 / Unit
View Datasheet →M1AFS600-FG256
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$22 / Unit
View Datasheet →M1AFS250-2FG256I Maximum Ratings & Electrical Characteristics
| Family | Fusion (M1AFS, ARM Cortex-M1 support) |
| System Gates | 250K |
| User I/O | 114 |
| Embedded RAM Bits | 36864 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | 350 MHz |
| Processor Core | ARM Cortex-M1 (hard IP) |
| Configuration Memory | Flash-based, nonvolatile |
| Power-Up Mode | Live at Power-Up (LAPU) |
| Analog Block | Configurable analog (voltage, current, temperature monitoring) |
| Package | 256-ball FBGA (256-LBGA) |
| Speed Grade | -2 |
| Temperature Range | Industrial (-40C to +85C) |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Non-Compliant (contains lead; FGG variant is lead-free) |
| Packaging | Tray |
M1AFS250-2FG256I 256-ball fbga (256-lbga) Pin Configuration Guide
Complete pinout information for M1AFS250-2FG256I (256-ball fbga (256-lbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS250-2FG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS250-2FG256I is suitable for 6 applications: Industrial Automation and Motor Control, Power Supply Supervision and Telemetry, Single-Chip Embedded CPU-plus-FPGA Systems, Aerospace and Defense Control Electronics, Test and Measurement Instrumentation, Building Automation and Smart Sensors.
Industrial Automation and Motor Control
The M1AFS250-2FG256I fits industrial automation because its 250K-gate flash fabric delivers deterministic, Live-at-Power-Up logic for safety interlocks, while the ARM Cortex-M1 support runs the control loop and 114 user I/O drive PWM, encoders, and sensors. Fusion's configurable analog block monitors motor phase current and heatsink temperature on-chip, eliminating a separate supervisory ADC. Because configuration is nonvolatile, the controller is functional the instant 1.5V/2.5V/3.3V rails stabilize, unlike SRAM FPGAs that wait for a configuration load. Place the FBGA-256 device near the power stage; the trade-off is the 130-nm fabric's 350 MHz ceiling, well above typical 20-100 kHz motor control rates but below high-end SERDES-class FPGAs.
Recommended
Power Supply Supervision and Telemetry
Fusion was designed for power-supply board management: the M1AFS250-2FG256I's configurable analog block measures multiple voltage rails, current shunts, and die/board temperature, and the flash-based fabric implements closed-loop trim and housekeeping logic without any boot delay. With 36864 bits of embedded RAM for fault logs and the ARM Cortex-M1 support for protocol stacks such as PMBus-style telemetry, one 256-ball FBGA replaces a microcontroller plus supervisory ASIC plus ADC cluster. Because the fabric is nonvolatile, power-good and crowbar protection logic are active during power sequencing itself, the moment supplies cross their thresholds. The design constraint is analog channel count and accuracy, which should be validated against the Fusion datasheet's analog block specifications for your rail tolerance targets.
Recommended
Single-Chip Embedded CPU-plus-FPGA Systems
The M1AFS250-2FG256I suits embedded systems needing a processor plus glue logic on one chip: the ARM Cortex-M1 executes application firmware while the 250K-gate fabric implements custom peripherals, bus bridges, and state machines on the same die, removing the classic MCU-plus-CPLD two-chip split. Nonvolatile flash configuration means the system runs immediately at power-up with zero external boot flash, reducing BOM cost and improving tamper resistance. 114 user I/O provide ample pin budget for display, communication, and sensor interfaces in the 256-ball FBGA. Trade-off: the Cortex-M1 is a soft/migration-oriented core clocked well below modern application processors, so choose it for control-oriented workloads up to roughly 350 MHz system fabric performance, not for compute-heavy Linux-class tasks.
Recommended
Aerospace and Defense Control Electronics
Flash-based Fusion FPGAs have a long heritage in aerospace and defense because nonvolatile configuration removes single-event configuration-upset recovery complexity associated with SRAM FPGAs, and the M1AFS250-2FG256I's industrial -40C to +85C rating covers many avionic equipment bays. The 250K-gate fabric implements sensor interfaces, PWM generators, and voting logic, while configurable analog channels feed redundant voltage/temperature monitoring directly to the logic. Live-at-Power-Up behavior matters for payload arming and power-switch sequencing circuits that must be correct the instant power appears. Note that this specific ordering code is an industrial part, not a military-flow part; for space or full mil-temperature programs, evaluate Microchip's RTAX/RTG4 families, which are also on this site, and use Fusion for commercial-adjacent defense subassemblies.
Recommended
Test and Measurement Instrumentation
In bench and rack instrumentation, the M1AFS250-2FG256I implements front-panel sequencing, trigger logic, and interface glue (SPI, UART, parallel buses) while its analog block self-reports rail health and board temperature for calibration logs. The 114 user I/O in a 256-ball FBGA connect ADCs, DACs, and relay banks, and 36864 bits of embedded RAM buffer measurement metadata. Instant-on flash configuration means instruments pass self-test immediately at power-up, shortening lab warm-up sequences. The ARM Cortex-M1 support can host the instrument's housekeeping firmware, replacing a discrete microcontroller. Design consideration: at 350 MHz system performance the fabric comfortably handles measurement timing in the tens of MHz, but high-speed serial acquisition front ends above that range need higher-tier FPGA families.
Recommended
Building Automation and Smart Sensors
For building controllers, HVAC boards, and smart sensor nodes, the M1AFS250-2FG256I consolidates the supervisory MCU (ARM Cortex-M1 support), custom sensor interfaces on 114 I/O, and analog rail/temperature monitoring into one 1.5V-core device, cutting board area versus discrete MCU-plus-CPLD solutions. Nonvolatile Live-at-Power-Up configuration is valuable in unattended installations where the controller must act on power anomalies immediately, and flash security protects proprietary control algorithms. The 130-nm flash process draws modest static power, suiting always-on nodes. Design consideration: this FG256 part is RoHS non-compliant due to lead in the standard finish, so green-building products should specify the lead-free M1AFS250-2FGG256I instead, which is footprint-identical and requires no layout change.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS250-2FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS250-2FGG256I | M1AFS250-2FGG256 | M1AFS250-1FG256I | M1AFS600-FG256 |
|---|---|---|---|---|---|
| Package | 256-ball FBGA (FG) | 256-ball FBGA (FGG) - same | 256-ball FBGA (FGG) - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | 250K | 600K |
| User I/O | 114 | 114 | 114 | 114 | [DATA_NEEDED] |
| Speed Grade | -2 | -2 | -2 | -1 | [DATA_NEEDED] |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead Finish | Non-compliant (contains lead) | Compliant (green, lead-free) | Compliant (green, lead-free) | [DATA_NEEDED] | [DATA_NEEDED] |
| ARM Cortex-M1 Support | Yes (M1 prefix) | Yes | Yes | Yes | Yes (M1 variant) |
| Configuration Memory | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU |
Key Differentiators
- Instant-on nonvolatile fabric (vs M1AFS600-FG256)
- Lead-free compliance option, identical footprint (vs M1AFS250-2FGG256I)
- Industrial temperature rating (vs M1AFS250-2FGG256)
- Mixed-signal integration (vs A3PE600-2FG256I)
Design Notes
Watch the ordering-code suffixes: the FG (standard) finish on this part is RoHS Non-Compliant and contains lead per distributor data, while FGG is the lead-free green package. Mixing FG and FGG in one BOM creates compliance documentation problems for export to RoHS jurisdictions even though they are footprint-identical. Similarly, I (industrial, -40C to +85C) versus no-suffix (commercial) variants must not be substituted silently in industrial or outdoor designs. Verify all four code fields (speed grade, package, finish, temperature) on incoming material labels.
The Fusion 250K device uses a 1.5V core supply, with separate I/O supply rails per Fusion family specifications. Because the flash fabric is nonvolatile and Live at Power-Up, I/O behavior during rail ramp is defined by the fabric contents, not a configuration controller - your power-sequencing design must assume the FPGA is instantly active. Decouple the 1.5V core with bulk plus high-frequency ceramic capacitors near the FBGA ball-out, and verify worst-case core current against the datasheet power calculator for your specific design rather than the family typical values.
The 256-ball FBGA (1.0 mm pitch class) requires an escape-routed PCB with via-in-pad or dog-bone fanout; plan at least four layers so the 1.5V core and I/O planes get solid, low-inductance returns. Do not route the configurable analog monitoring inputs across switching nodes such as gate drives - Fusion analog channels feed the fabric directly, and coupling into them corrupts supervision readings. Follow Microchip's Fusion PCB layout guidelines in the family datasheet for ball-map escape patterns and analog grounding.
At the -2 speed grade the fabric supports up to 350 MHz system performance, but source-synchronous interface margins depend on I/O bank supply and your trace topology, not just the speed grade. Keep length-matched pairs within the vendor-recommended tolerance for clock-forwarded buses, and reserve the FBGA's inner ball rows for power and ground so high-speed I/O occupy perimeter banks with short escapes. Simulate any interface above roughly 100 MHz with IBIS models from Microchip rather than relying on rule-of-thumb stub lengths.
Compliance Information
Per digchip distributor data, M1AFS250-2FG256I is RoHS Non-Compliant and Contains Lead (standard FG finish). The FGG suffix variant (M1AFS250-2FGG256I) is the lead-free, RoHS-compliant alternative. REACH, halogen-free, and conflict-minerals status were not stated in the provided data.
