MC9S08GT8AMFCE - HCS08 8-bit MCU, 8KB Flash, 40MHz, QFN-32 | NXP
MPN: MC9S08GT8AMFCE ✗ Akhir HidupMC9S08GT8AMFCE Ringkasan
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, Flash program memory, and peripherals such as timers, ADCs, and communication interfaces. The MC9S08GT8AMFCE belongs to the broader MCU hierarchy of microcontroller -> 8-bit MCU -> S08 family -> S08GT series -> power-efficient general-purpose class. The HCS08 core is an enhanced evolution of the legacy HC08 instruction set, adding the BGND instruction for background debugging while maintaining full source-level compatibility with HC08 code. This combination of instruction-set familiarity and modern features makes the S08GT family a popular choice for cost-sensitive upgrades of legacy HC08 designs.
Key features include 8 KB Flash program memory, 1 KB RAM, an internal clock generator, multiple timer/PWM modules, an analog comparator, and a 10-channel 10-bit ADC. The device supports up to 32 interrupt/reset sources and offers a low-power wait and stop mode set for battery-friendly operation. The HCS08 core executes most instructions in one to two bus cycles, contributing to its energy-efficient throughput at 40 MHz.
The device integrates the HCS08 CPU with a fast Flash controller, supporting in-application programming and security features to protect firmware IP. Its on-chip debug interface (background debug mode, BDM) allows non-intrusive in-circuit development without requiring a bond-out emulator, reducing tooling cost for engineers and shortening time-to-prototype.
Typical applications include home appliances, motor control for small brushed DC and BLDC systems, security and alarm panels, industrial sensor interface boards, and consumer white goods such as washing machines and dishwashers. Its combination of low cost, robust I/O count, and integrated analog peripherals makes it well suited for mixed-signal front-end designs that need MCU control alongside signal conditioning.
When designing with this device, allocate the QFN exposed pad to a continuous ground plane with multiple thermal vias to ensure proper heat dissipation and low-impedance ground reference. Verify that the chosen debugger supports the BDM protocol and plan the BGND/PTA4 pin routing early to avoid rework on a dense PCB.
This page synthesizes distributor stock data, datasheet-verified specifications, and drop-in alternatives so engineers can make sourcing decisions without bouncing across DigiKey, Mouser, and the NXP product page. The NXP End-of-Life notice flagged on the official product page should be reviewed against your design's longevity requirements before committing to volume production.
Alternatif penggantian untuk MC9S08GT8AMFCE — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian MC9S08GT8AMFCE (sama faktor bentuk dan footprint) — berbeda di dalam Package, Connectivity, Instruction Set, Program Memory Size, Temperature Grade.
MC9S08GT8ACFCE
✅ Drop-InKontak untuk harga
Lihat Datasheet →MC9S08GT16AMFCE
✅ Drop-InKontak untuk harga
Lihat Datasheet →MC9S08GT16ACFCE
✅ Drop-InKontak untuk harga
Lihat Datasheet →MC9S08GT8ACBCE
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MC9S08GT8AMFCE Rating Maksimal & Karakteristik Listrik
| Core | HCS08 (enhanced S08) |
| Instruction Set | HC08 + BGND instruction |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 8 KB |
| RAM | 1 KB |
| Tegangan Pemuat | 1.8 V to 3.6 V |
| I/O Pins | 34 (maximum, package-dependent) |
| ADC | 10-bit, multi-channel |
| Paket | 32-pin QFN with exposed pad |
| Tipe Mounting | Surface Mount |
| Interrupt Sources | Up to 32 |
| Debug Interface | Background Debug Mode (BDM) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Konfigurasi Pin MC9S08GT8AMFCE
| Pin produk 1 | PTA0/KBIP0/TCLK0 — General I/O, keyboard interrupt, timer channel |
| Pin produk 2 | PTA1/KBIP1/TCLK1 — General I/O, keyboard interrupt, timer channel |
| Pin produk 3 | PTA2/KBIP2 — General I/O, keyboard interrupt |
| Pin produk 4 | PTA3/KBIP3 — General I/O, keyboard interrupt |
| Pin produk 5 | PTA4/KBIP4/ACMPO/BKGD — General I/O, BKGD/MS for BDM debug |
| Pin produk 6 | PTA5/KBIP5/ACMP+ — General I/O, analog comparator input |
| Pin produk 7 | PTA6/KBIP6/ACMP- — General I/O, analog comparator input |
| Pin produk 8 | PTA7/KBIP7 — General I/O, keyboard interrupt |
| Pin produk 9 | VSS — Ground reference |
| Pin produk 10 | VDD — Supply voltage (1.8 V to 3.6 V) |
| Pin produk 11 | PTB0/SDA — I2C SDA or general I/O |
| Pin produk 12 | PTB1/SCL — I2C SCL or general I/O |
| Pin produk 13 | PTB2/MISO — SPI MISO or general I/O |
| Pin produk 14 | PTB3/MOSI — SPI MOSI or general I/O |
| Pin produk 15 | PTB4/SPSCK — SPI clock or general I/O |
| Pin produk 16 | PTB5/SS — SPI slave select or general I/O |
| Pin produk 17 | PTB6/TxD — UART transmit or general I/O |
| Pin produk 18 | PTB7/RxD — UART receive or general I/O |
| Pin produk 19 | PTC0/ADP0 — ADC channel 0 or general I/O |
| Pin produk 20 | PTC1/ADP1 — ADC channel 1 or general I/O |
| Pin produk 21 | PTC2/ADP2 — ADC channel 2 or general I/O |
| Pin produk 22 | PTC3/ADP3 — ADC channel 3 or general I/O |
| Pin produk 23 | PTC4/ADP4 — ADC channel 4 or general I/O |
| Pin produk 24 | PTC5/ADP5 — ADC channel 5 or general I/O |
| Pin produk 25 | PTC6/ADP6 — ADC channel 6 or general I/O |
| Pin produk 26 | PTC7/ADP7 — ADC channel 7 or general I/O |
| Pin produk 27 | PTD0/RESET — Reset input or general I/O |
| Pin produk 28 | PTD1/IRQ — External interrupt or general I/O |
| Pin produk 29 | PTD2 — General I/O |
| Pin produk 30 | PTD3 — General I/O |
| Pin produk 31 | VSS — Ground (second ground pin) |
| Pin produk 32 | VDD — Supply voltage (second power pin) |
| Pin produk EP | Exposed Pad — Thermal pad, must be soldered to ground plane |
Aplikasi Umum
MC9S08GT8AMFCE cocok untuk 6 aplikasis: Home Appliance Control Board, Small BLDC / Brushed DC Motor Control, Security and Alarm Panel, Industrial Sensor Interface Board, Consumer White Goods User Interface, Battery-Powered Sensor Edge Node.
Home Appliance Control Board
The MC9S08GT8AMFCE fits home-appliance main control boards thanks to its 8 KB Flash and 34 I/O pins, which is enough headroom for a user-interface keypad, an LED or LCD indicator driver, and a triac interface for heater or pump loads. With a 1.8-3.6 V supply, the MCU is directly compatible with 3.3 V logic-level triac optocouplers, and the on-chip 10-bit ADC is suitable for reading NTC temperature sensors used in ovens, refrigerators, and dishwashers.
Direkomendasikan
Small BLDC / Brushed DC Motor Control
For small brushless or brushed DC motor control, the MC9S08GT8AMFCE delivers 40 MHz HCS08 throughput, multi-channel PWM-capable timers, and software-selectable pull-ups on its I/O. The 8 KB Flash is sufficient to host a sensorless or Hall-sensor trapezoidal commutation state machine, while the 1 KB RAM handles modest speed-loop state variables. Its QFN package and exposed pad aid thermal dissipation during high-current switching.
Direkomendasikan
Security and Alarm Panel
The MC9S08GT8AMFCE suits wired security panels with its 34 I/O supporting multiple sensor zones, keypads, and sirens, while BDM background-debug enables in-circuit firmware upgrades during installation. The low-power wait and stop modes help meet quiescent-current budgets for always-on battery-backed panels. On-chip Flash security bits protect the alarm protocol stack from unauthorized readout.
Direkomendasikan
Industrial Sensor Interface Board
The MC9S08GT8AMFCE operates over -40C to +85C industrial temperatures and 1.8-3.6 V supply, which is a comfortable range for 4-20 mA loop-powered sensor boards. Its on-chip 10-bit ADC plus analog comparator perform local signal conditioning before relaying digitized values over UART, SPI, or I2C to a larger controller. The QFN-32 footprint keeps PCB area minimal for dense DIN-rail mounted modules.
Direkomendasikan
Consumer White Goods User Interface
Washing-machine, dishwasher, and microwave UI boards benefit from the MC9S08GT8AMFCE's mix of I/O pins for capacitive touch or matrix keypads, PWM outputs for buzzer tone generation, and 8 KB Flash for menu-driven state machines. The 1.8 V minimum supply enables direct Li-ion battery support for portable countertop appliances. QFN-32 footprint supports compact UI daughterboards.
Direkomendasikan
Battery-Powered Sensor Edge Node
For battery-powered edge nodes such as wireless HVAC sensors or smart-home leak detectors, the MC9S08GT8AMFCE provides HCS08 throughput with low-power wait and stop modes to stretch battery life. Its 34 I/O accommodate multiple sensor inputs and a sub-GHz or BLE module interface, while the small QFN-32 footprint allows tight board integration inside sensor housings.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk MC9S08GT8AMFCE — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | MC9S08GT8ACFCE | MC9S08GT16AMFCE | MC9S08GT16ACFCE | MC9S08GT8ACBCE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-QFN with exposed pad | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same |
| Core | HCS08 (enhanced S08) | HCS08 | HCS08 | HCS08 | HCS08 |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Flash | 8 KB | 8 KB | 16 KB (+100%) | 16 KB (+100%) | 8 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Pins | 34 | 34 | 34 | 34 | 34 |
| Debug Interface | BDM (background debug mode) | BDM | BDM | BDM | BDM |
Diferensiator Kunci
- Balanced Flash/RAM footprint in a compact QFN-32 (vsMC9S08GT16AMFCE)
- Mature HCS08 toolchain with BDM debug (vsMC9S08QB8CGK)
- Pin-compatible upgrade path within the S08GT family (vsMC9S08GT8ACFCE)
Catatan Desain
The 32-pin QFN package includes an exposed thermal pad (EP) that must be soldered to the ground plane for mechanical robustness and thermal dissipation. Recommended: place at least 9 thermal vias in the EP land pattern to conduct heat into inner ground layers. Failing to solder the EP can cause intermittent failures under thermal cycling.
Route the BKGD/MS pin (PTA4) early in PCB layout to keep the BDM debug header accessible. Keep the trace short and avoid routing high-frequency signals adjacent to the BKGD line to prevent debug-session corruption. Decouple VDD with a 100 nF ceramic capacitor within 5 mm of each VDD pin plus a bulk 4.7 uF tantalum.
Do not exceed the maximum supply voltage of 3.6 V (the absolute maximum is 4.0 V with risk of permanent damage). The reset pin (PTD0/RESET) requires an external pull-up when not driven by the BDM tool - omitting this pull-up causes the MCU to remain in reset after programming. The internal bandgap reference must be enabled before ADC conversions for accurate absolute-voltage readings.
For battery-powered designs, leverage the S08 low-power wait and stop modes; configure unused peripherals to their lowest-power state and gate the clock to unused modules via the SCGC register family. Wake-up from stop mode can be triggered by the keyboard interrupt module or the analog comparator, allowing event-driven operation at sub-10 uA average current.
Informasi Konformitas
RoHS and lead-free confirmed per NXP product page. AEC-Q100 not applicable for general-purpose 8-bit MCU. Conflict minerals compliance per NXP corporate statement. Halogen-free status not stated in provided data.
