MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP
MPN: MPC8360VVAGDGA ✗ Akhir HidupMPC8360VVAGDGA Ringkasan
A communications SoC is a single silicon device that combines a microprocessor core, on-chip peripherals, memory interfaces, and dedicated communications accelerators into one package; in the case of the MPC8360VVAGDGA, that combination targets broadband access, industrial networking, and telecom line-card applications. The MPC8360 sits within the broader taxonomy: microprocessor -> MPU -> application processor -> communications SoC -> PowerQUICC family. By integrating the QUICC Engine and QUICC Engine HDLC/ATM/TDM controllers alongside the e300 core, the device eliminates the need for an external traffic-handling ASIC in many designs.
Key specifications for the MPC8360VVAGDGA include the 400 MHz e300 core frequency, 1.2 V core supply, 1.8/2.5/3.3 V I/O supply, 32-bit architecture with single core, 740-TBGA package, and an operating temperature range of 0C to 105C. On-chip peripherals include DDR1/DDR2 memory controller, 32-bit PCI v2.3 bus, one 10/100/1000 Ethernet MAC (RGMII), one USB 2.0 (host/device), local bus, and serial interfaces (UART, I2C, SPI). The integrated QUICC Engine subsystem offloads HDLC, ATM, and TDM processing from the e300 core, enabling sustained wire-speed handling of multi-channel traffic without CPU intervention.
The architecture combines a Power Architecture e300 superscalar core with a dedicated RISC communications engine, sharing an internal SoC platform bus. This dual-engine topology allows the device to handle routing protocols, encryption, and control-plane tasks on the e300 core while the QUICC Engine simultaneously processes time-critical channelized traffic, achieving deterministic throughput across voice and data workloads.
Typical applications for the MPC8360VVAGDGA include broadband CPE/SME routers, low-end DSLAM line cards, IP-PBX and IP-PSTN gateways, industrial Ethernet gateways, and ATM-to-IP protocol converters. Its integrated 1 GbE MAC plus QUICC Engine makes it well suited for hybrid TDM/IP equipment in legacy telecom infrastructure transitioning toward all-IP.
When designing with this part, note that the NXP product page reports this MPN has reached End of Life; designers should evaluate the pin-compatible MPC8358EVRAGDGA or MPC8360EVVAGDGA variants for new designs and source the MPC8360VVAGDGA from authorized distributors for legacy/field replacement purposes.
This page synthesizes EOL notices, distributor pricing, drop-in compatible variants, and PCB-level design notes that go beyond the information density found in the manufacturer datasheet alone.
Alternatif penggantian untuk MPC8360VVAGDGA — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian MPC8360VVAGDGA (sama faktor bentuk dan footprint) — berbeda di dalam Ethernet, PCI Interface, USB, Mounting Type, Package.
MPC8358EVRAGDGA
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MPC8360EVVAGDGA
✅ Drop-InKontak untuk harga
Lihat Datasheet →MPC8360CVVAGDGA
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MPC8360ECVVAGDGA
✅ Drop-InKontak untuk harga
Lihat Datasheet →MPC8360EZUAJDGA
✅ Drop-InKontak untuk harga
Lihat Datasheet →MPC8360EZUAGDGA
✅ Drop-InKontak untuk harga
Lihat Datasheet →MPC8360CZUAGDGA
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MPC8360VVAGDGA Rating Maksimal & Karakteristik Listrik
| Core Architecture | PowerPC e300 (Power Architecture technology) |
| Core Frequency | 400 MHz |
| Number of Cores | 1 |
| Lebar Bus Data | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) |
| Core Supply Voltage (Vcore) | 1.2 V |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V |
| Rentang Suhu Kerja | 0C to +105C |
| Paket | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) |
| Tipe Mounting | Surface Mount |
| Memory Interface | DDR1 / DDR2 memory controller |
| PCI Interface | 32-bit PCI v2.3 |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) |
| USB | 1 x USB 2.0 (host/device) |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) |
| Serial Interfaces | UART, I2C, SPI, TDM |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) |
MPC8360VVAGDGA 740-tbga (37.5 x 37.5 mm, 1 mm pitch) Diamant Konfigurasi Panduan
Konfigurasi pin untuk MPC8360VVAGDGA (740-tbga (37.5 x 37.5 mm, 1 mm pitch) pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk MPC8360VVAGDGA.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
MPC8360VVAGDGA cocok untuk 6 aplikasis: SME / Broadband CPE Routers, Low-End DSLAM Line Cards, IP-PBX / IP-PSTN Gateways, Industrial Ethernet Gateways, ATM-to-IP Protocol Converters, Telecom Router Control Cards.
SME / Broadband CPE Routers
The MPC8360VVAGDGA's 400 MHz e300 core plus integrated Gigabit Ethernet MAC make it a strong fit for small-to-medium enterprise (SME) routers. With 32-bit DDR1/DDR2 controller and PCI v2.3 bus, it handles a 1 GbE WAN uplink plus multi-port LAN switching via an external GbE switch. Placed on the main control board, the QUICC Engine offloads T1/E1 channelization so the e300 core stays free for routing/firewall/NAT processing, with typical throughput exceeding 800 Mbps on small packet sizes.
Direkomendasikan
Low-End DSLAM Line Cards
In DSLAM line cards, the MPC8360VVAGDGA's QUICC Engine subsystem provides deterministic HDLC/ATM/TDM offload for hundreds of subscriber channels. Its TDM interface supports up to [DATA_NEEDED: TDM channels] per device, while the 32-bit PCI bus aggregates uplink to a control card. Compared to discrete FPGA-based line-card designs, the MPC8360VVAGDGA reduces BOM cost and PCB area while meeting the strict jitter and wander requirements of ITU-T G.823/G.824.
Direkomendasikan
IP-PBX / IP-PSTN Gateways
The MPC8360VVAGDGA's TDM interface paired with 1 GbE MAC and QUICC Engine HDLC offload enables high-density IP-PBX and IP-PSTN gateway designs that bridge legacy TDM PBX trunks to SIP-based VoIP networks. The 400 MHz e300 core comfortably runs an embedded Linux/RTOS VoIP stack (Asterisk, FreeSWITCH) at the same time as the QUICC Engine handles DS0 channelization. The 740-TBGA's 32-bit DDR2 interface supports [DATA_NEEDED: max DDR2 size] for call-detail-record buffers and firmware storage.
Direkomendasikan
Industrial Ethernet Gateways
For industrial Ethernet gateways and protocol converters, the MPC8360VVAGDGA provides the rugged 0C to +105C operating range and the integration that eliminates external bridges between Modbus-TCP, PROFINET, EtherCAT, and legacy serial fieldbuses. The PCI v2.3 bus lets designers add industrial I/O cards (digital I/O, analog I/O, isolated serial) without external glue logic. Estimated: at full utilization the SoC dissipates 4-6 W, requiring a thermal pad or heatsink in sealed enclosures.
Direkomendasikan
ATM-to-IP Protocol Converters
The MPC8360VVAGDGA's combination of QUICC Engine ATM SAR (AAL1/AAL2/AAL5) plus Gigabit Ethernet MAC makes it one of the few commercial SoCs that can be a single-chip ATM-to-IP converter for legacy DSL/cable/UMTS backhaul. The PCI v2.3 bus can host an external T1/E1 framer for the ATM PHY side, while the on-chip GbE MAC terminates the IP/Ethernet side. Designers choose this MPN over the MPC8358E variant when both ATM and TDM are required in the same SKU.
Direkomendasikan
Telecom Router Control Cards
In a multi-slot telecom router chassis the MPC8360VVAGDGA serves as a control card master processor, running routing daemons (RIP/OSPF/BGP), SNMP agents, and CLI management. The PCI v2.3 bus aggregates uplink line cards with deterministic latency; the 32-bit DDR2 controller holds route tables for IPv4/v6 forwarding. Estimated 4-6 W dissipation per chip requires active airflow in the chassis; the 740-TBGA package supports BGA socket assembly for field replacement.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk MPC8360VVAGDGA — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | MPC8358EVRAGDGA | MPC8360EVVAGDGA | MPC8360CVVAGDGA | MPC8360EZUAJDGA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Core Architecture | e300 PowerPC | e300 PowerPC | e300 PowerPC | e300 PowerPC | e300 PowerPC |
| Crypto Engine (SEC) | No | No | Yes (SEC 2.x) | No | Yes (SEC 2.x) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | -40C to +105C (extended) |
| USB 2.0 | 1 (host/device) | 1 (host/device) | 1 (host/device) | 1 (host/device) | 1 (host/device) |
| Ethernet MAC | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) |
Diferensiator Kunci
- Pin-compatible upgrade path with hardware crypto accelerator (vsMPC8358EVRAGDGA)
- End-of-life signal acknowledged on NXP product page (vsMPC8360EZUAJDGA)
- Single-chip ATM + IP + TDM processing (vsMPC8313VRAFFC)
Catatan Desain
Estimated: at 1.2 V core and 400 MHz the e300 core dissipates about 2-3 W; full-chip with DDR/PCI/Ethernet/USB active rises to 4-6 W. In a sealed indoor enclosure without airflow this requires a thermal pad bonded to the BGA's exposed die-side pad (ground) plus copper heatsink. The 0C to +105C junction range means theta_JA must stay below ~15 C/W with the heatsink to handle full 6 W at 25C ambient.
The 740-TBGA at 1.0 mm ball pitch demands 4+2 PCB stack-up with controlled-impedance (50 ohm single-ended, 100 ohm differential) routing for DDR2 SSTL_18 and PCI signals. Use micro-via-in-pad for BGA breakout; follow NXP MPC8360E design-checklist for DDR2 length matching (data/byte-clk +/- 25 mil; DQS to DQ +/- 50 mil). Power islands must be decoupled with 0402/0201 ceramics at 1 uF / 100 nF ratios placed within 50 mil of each BGA ball.
Do not power up without a correct POR sequence: Vcore must reach 1.2 V before 3.3 V I/O rises, otherwise I/O cells can latch-up. The HRESET signal must be held low until both supplies are stable. Designers commonly forget the JTAG TRST pull-down which prevents boundary-scan interference at boot. Reference NXP application note AN3640 for the full POR/Timing diagram.
Informasi Konformitas
Mouser listing specifies 'NO-PB' (non-ENC) variant confirming lead presence; the part is therefore NOT RoHS compliant. Reach and conflict-minerals status inferred from NXP product family compliance; halogen-free status not stated. AEC-Q100 is not applicable (communications SoC).
