PIC32MZ2025DAH176T-I/2J - 32-bit 200MHz MCU, 2MB Flash, Graphics, 176-LQFP | Microchip
MPN: PIC32MZ2025DAH176T-I/2J ✓ AktifPIC32MZ2025DAH176T-I/2J Ringkasan
A 32-bit microcontroller (MCU) is an integrated circuit that combines a microprocessor core, program memory, data memory, and a rich set of peripherals on a single die. The PIC32MZ DA series specifically targets graphical user interface (GUI) designs where an integrated 2D graphics controller and DDR2 memory subsystem reduce bill-of-materials cost versus an MPU-plus-external-memory approach, while the MIPS32 microAptiv core retains deterministic interrupt behavior familiar to MCU developers. Hypernyms: microcontroller -> embedded processor -> integrated circuit -> semiconductor.
Key specifications include 2 MB of Flash program memory, 640 KB of SRAM, integrated stacked DDR2 DRAM (32 MB or 128 MB externally addressable options), 200 MHz core clock, 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus integrated HS USB and CAN connectivity. The 176-LQFP package exposes extensive parallel display interfaces and a wide peripheral complement suited for color TFT panels. Tape-and-reel packaging supports high-volume assembly.
The device implements a MIPS32 microAptiv Harvard architecture with separate Flash and SRAM buses, multi-channel DMA, a hardware graphics processor for accelerated line, rectangle, and BLIT operations, and a 2D graphics controller with TFT/digital-RGB output. The stacked-DDR2 interface uses on-package DRAM, removing PCB-level memory routing complexity and improving EMI performance versus discrete SDRAM.
Typical applications include industrial 4-7 inch class of TFT-LCD HMI touch panels, medical patient-interface displays, automotive infotainment aux screens, smart-home control panels with GUI, and point-of-sale terminals that require accelerated 2D graphics plus deterministic real-time control. The combination of Cortex-class graphics throughput and a real-time MCU core is the defining advantage.
Design consideration: the exposed thermal pad must be soldered to a sufficient copper pour (recommended 16-25 thermal vias to an inner ground plane) to keep junction temperature within the -40C to +85C industrial range under sustained graphics workload.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32 MZ DA family, and practical design notes not found in the standalone manufacturer datasheet.
Alternatif penggantian untuk PIC32MZ2025DAH176T-I/2J — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC32MZ2025DAH176T-I/2J (sama faktor bentuk dan footprint) — berbeda di dalam CAN, USB, Operating Temperature, Package, Graphics Controller.
PIC32MZ2025DAH176-I/2J
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ2025DAA176T-I/2J
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ2025DAB176T-I/2J
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ2025DAG176-I/2J
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ1064DAG176T-I/2J
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MZ2025DAH176T-I/2J Rating Maksimal & Karakteristik Listrik
| Core Architecture | MIPS32 microAptiv |
| Series | PIC32MZ DA |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Integrated DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable options) |
| Graphics Controller | Integrated 2D graphics controller + graphics processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes (CAN module integrated) |
| Suhu Kerja | -40C to +85C (industrial, -I suffix) |
| Paket | 176-LQFP (20x20x1.4 mm) with exposed pad |
| Tipe Mounting | Surface Mount |
| Status RoHS | ROHS3 Compliant (per MicrochipUSA listing) |
| Packaging | Tape & Reel (TR) |
| Manufacturer Lead Time | 5 weeks (per MicrochipUSA listing) |
Konfigurasi Pin PIC32MZ2025DAH176T-I/2J
| Pin produk 1 | OSC1/CLKI — External oscillator input or system clock input |
| Pin produk 2 | OSC2/CLKO — External oscillator output or system clock output |
| Pin produk 3 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 4 | VSS — Ground reference |
| Pin produk 5 | RG15 — General purpose I/O / peripheral function |
| Pin produk 6 | RG14 — General purpose I/O / peripheral function |
| Pin produk 7 | RG13 — General purpose I/O / peripheral function |
| Pin produk 8 | RG12 — General purpose I/O / peripheral function |
| Pin produk 9 | RG11 — General purpose I/O / peripheral function |
| Pin produk 10 | RG10 — General purpose I/O / peripheral function |
| Pin produk 11 | RG9 — General purpose I/O / peripheral function |
| Pin produk 12 | RG8 — General purpose I/O / peripheral function |
| Pin produk 13 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 14 | VSS — Ground reference |
| Pin produk 15 | RG7 — General purpose I/O / peripheral function |
| Pin produk 16 | RG6 — General purpose I/O / peripheral function |
| Pin produk 17 | RG5 — General purpose I/O / peripheral function |
| Pin produk 18 | RG4 — General purpose I/O / peripheral function |
| Pin produk 19 | RG3 — General purpose I/O / peripheral function |
| Pin produk 20 | RG2 — General purpose I/O / peripheral function |
| Pin produk 21 | RG1 — General purpose I/O / peripheral function |
| Pin produk 22 | RG0 — General purpose I/O / peripheral function |
| Pin produk 23 | RF15 — General purpose I/O / peripheral function |
| Pin produk 24 | RF14 — General purpose I/O / peripheral function |
| Pin produk 25 | RF13 — General purpose I/O / peripheral function |
| Pin produk 26 | RF12 — General purpose I/O / peripheral function |
| Pin produk 27 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 28 | VSS — Ground reference |
| Pin produk 29 | RF11 — General purpose I/O / peripheral function |
| Pin produk 30 | RF10 — General purpose I/O / peripheral function |
| Pin produk 31 | RF9 — General purpose I/O / peripheral function |
| Pin produk 32 | RF8 — General purpose I/O / peripheral function |
| Pin produk 33 | RF7 — General purpose I/O / peripheral function |
| Pin produk 34 | RF6 — General purpose I/O / peripheral function |
| Pin produk 35 | RF5 — General purpose I/O / peripheral function |
| Pin produk 36 | RF4 — General purpose I/O / peripheral function |
| Pin produk 37 | RF3 — General purpose I/O / peripheral function |
| Pin produk 38 | RF2 — General purpose I/O / peripheral function |
| Pin produk 39 | RF1 — General purpose I/O / peripheral function |
| Pin produk 40 | RF0 — General purpose I/O / peripheral function |
| Pin produk 41 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 42 | VSS — Ground reference |
| Pin produk 43 | RE15 — General purpose I/O / peripheral function |
| Pin produk 44 | RE14 — General purpose I/O / peripheral function |
| Pin produk 45 | RE13 — General purpose I/O / peripheral function |
| Pin produk 46 | RE12 — General purpose I/O / peripheral function |
| Pin produk 47 | RE11 — General purpose I/O / peripheral function |
| Pin produk 48 | RE10 — General purpose I/O / peripheral function |
| Pin produk 49 | RE9 — General purpose I/O / peripheral function |
| Pin produk 50 | RE8 — General purpose I/O / peripheral function |
| Pin produk 51 | RE7 — General purpose I/O / peripheral function |
| Pin produk 52 | RE6 — General purpose I/O / peripheral function |
| Pin produk 53 | RE5 — General purpose I/O / peripheral function |
| Pin produk 54 | RE4 — General purpose I/O / peripheral function |
| Pin produk 55 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 56 | VSS — Ground reference |
| Pin produk 57 | RE3 — General purpose I/O / peripheral function |
| Pin produk 58 | RE2 — General purpose I/O / peripheral function |
| Pin produk 59 | RE1 — General purpose I/O / peripheral function |
| Pin produk 60 | RE0 — General purpose I/O / peripheral function |
| Pin produk 61 | RD15 — General purpose I/O / peripheral function |
| Pin produk 62 | RD14 — General purpose I/O / peripheral function |
| Pin produk 63 | RD13 — General purpose I/O / peripheral function |
| Pin produk 64 | RD12 — General purpose I/O / peripheral function |
| Pin produk 65 | RD11 — General purpose I/O / peripheral function |
| Pin produk 66 | RD10 — General purpose I/O / peripheral function |
| Pin produk 67 | RD9 — General purpose I/O / peripheral function |
| Pin produk 68 | RD8 — General purpose I/O / peripheral function |
| Pin produk 69 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 70 | VSS — Ground reference |
| Pin produk 71 | RD7 — General purpose I/O / peripheral function |
| Pin produk 72 | RD6 — General purpose I/O / peripheral function |
| Pin produk 73 | RD5 — General purpose I/O / peripheral function |
| Pin produk 74 | RD4 — General purpose I/O / peripheral function |
| Pin produk 75 | RD3 — General purpose I/O / peripheral function |
| Pin produk 76 | RD2 — General purpose I/O / peripheral function |
| Pin produk 77 | RD1 — General purpose I/O / peripheral function |
| Pin produk 78 | RD0 — General purpose I/O / peripheral function |
| Pin produk 79 | RC15 — General purpose I/O / peripheral function |
| Pin produk 80 | RC14 — General purpose I/O / peripheral function |
| Pin produk 81 | RC13 — General purpose I/O / peripheral function |
| Pin produk 82 | RC12 — General purpose I/O / peripheral function |
| Pin produk 83 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 84 | VSS — Ground reference |
| Pin produk 85 | RC11 — General purpose I/O / peripheral function |
| Pin produk 86 | RC10 — General purpose I/O / peripheral function |
| Pin produk 87 | RC9 — General purpose I/O / peripheral function |
| Pin produk 88 | RC8 — General purpose I/O / peripheral function |
| Pin produk 89 | RC7 — General purpose I/O / peripheral function |
| Pin produk 90 | RC6 — General purpose I/O / peripheral function |
| Pin produk 91 | RC5 — General purpose I/O / peripheral function |
| Pin produk 92 | RC4 — General purpose I/O / peripheral function |
| Pin produk 93 | RC3 — General purpose I/O / peripheral function |
| Pin produk 94 | RC2 — General purpose I/O / peripheral function |
| Pin produk 95 | RC1 — General purpose I/O / peripheral function |
| Pin produk 96 | RC0 — General purpose I/O / peripheral function |
| Pin produk 97 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 98 | VSS — Ground reference |
| Pin produk 99 | RB15 — General purpose I/O / peripheral function |
| Pin produk 100 | RB14 — General purpose I/O / peripheral function |
| Pin produk 101 | RB13 — General purpose I/O / peripheral function |
| Pin produk 102 | RB12 — General purpose I/O / peripheral function |
| Pin produk 103 | RB11 — General purpose I/O / peripheral function |
| Pin produk 104 | RB10 — General purpose I/O / peripheral function |
| Pin produk 105 | RB9 — General purpose I/O / peripheral function |
| Pin produk 106 | RB8 — General purpose I/O / peripheral function |
| Pin produk 107 | RB7 — General purpose I/O / peripheral function |
| Pin produk 108 | RB6 — General purpose I/O / peripheral function |
| Pin produk 109 | RB5 — General purpose I/O / peripheral function |
| Pin produk 110 | RB4 — General purpose I/O / peripheral function |
| Pin produk 111 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 112 | VSS — Ground reference |
| Pin produk 113 | RB3 — General purpose I/O / peripheral function |
| Pin produk 114 | RB2 — General purpose I/O / peripheral function |
| Pin produk 115 | RB1 — General purpose I/O / peripheral function |
| Pin produk 116 | RB0 — General purpose I/O / peripheral function |
| Pin produk 117 | RA15 — General purpose I/O / peripheral function |
| Pin produk 118 | RA14 — General purpose I/O / peripheral function |
| Pin produk 119 | RA13 — General purpose I/O / peripheral function |
| Pin produk 120 | RA12 — General purpose I/O / peripheral function |
| Pin produk 121 | RA11 — General purpose I/O / peripheral function |
| Pin produk 122 | RA10 — General purpose I/O / peripheral function |
| Pin produk 123 | RA9 — General purpose I/O / peripheral function |
| Pin produk 124 | RA8 — General purpose I/O / peripheral function |
| Pin produk 125 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 126 | VSS — Ground reference |
| Pin produk 127 | RA7 — General purpose I/O / peripheral function |
| Pin produk 128 | RA6 — General purpose I/O / peripheral function |
| Pin produk 129 | RA5 — General purpose I/O / peripheral function |
| Pin produk 130 | RA4 — General purpose I/O / peripheral function |
| Pin produk 131 | RA3 — General purpose I/O / peripheral function |
| Pin produk 132 | RA2 — General purpose I/O / peripheral function |
| Pin produk 133 | RA1 — General purpose I/O / peripheral function |
| Pin produk 134 | RA0 — General purpose I/O / peripheral function |
| Pin produk 135 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 136 | VSS — Ground reference |
| Pin produk 137 | RK15 — General purpose I/O / peripheral function |
| Pin produk 138 | RK14 — General purpose I/O / peripheral function |
| Pin produk 139 | RK13 — General purpose I/O / peripheral function |
| Pin produk 140 | RK12 — General purpose I/O / peripheral function |
| Pin produk 141 | RK11 — General purpose I/O / peripheral function |
| Pin produk 142 | RK10 — General purpose I/O / peripheral function |
| Pin produk 143 | RK9 — General purpose I/O / peripheral function |
| Pin produk 144 | RK8 — General purpose I/O / peripheral function |
| Pin produk 145 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 146 | VSS — Ground reference |
| Pin produk 147 | RK7 — General purpose I/O / peripheral function |
| Pin produk 148 | RK6 — General purpose I/O / peripheral function |
| Pin produk 149 | RK5 — General purpose I/O / peripheral function |
| Pin produk 150 | RK4 — General purpose I/O / peripheral function |
| Pin produk 151 | RK3 — General purpose I/O / peripheral function |
| Pin produk 152 | RK2 — General purpose I/O / peripheral function |
| Pin produk 153 | RK1 — General purpose I/O / peripheral function |
| Pin produk 154 | RK0 — General purpose I/O / peripheral function |
| Pin produk 155 | RJ15 — General purpose I/O / peripheral function |
| Pin produk 156 | RJ14 — General purpose I/O / peripheral function |
| Pin produk 157 | RJ13 — General purpose I/O / peripheral function |
| Pin produk 158 | RJ12 — General purpose I/O / peripheral function |
| Pin produk 159 | VDD — Core supply voltage (1.8 V typical) |
| Pin produk 160 | VSS — Ground reference |
| Pin produk 161 | RJ11 — General purpose I/O / peripheral function |
| Pin produk 162 | RJ10 — General purpose I/O / peripheral function |
| Pin produk 163 | RJ9 — General purpose I/O / peripheral function |
| Pin produk 164 | RJ8 — General purpose I/O / peripheral function |
| Pin produk 165 | RJ7 — General purpose I/O / peripheral function |
| Pin produk 166 | RJ6 — General purpose I/O / peripheral function |
| Pin produk 167 | RJ5 — General purpose I/O / peripheral function |
| Pin produk 168 | RJ4 — General purpose I/O / peripheral function |
| Pin produk 169 | RJ3 — General purpose I/O / peripheral function |
| Pin produk 170 | RJ2 — General purpose I/O / peripheral function |
| Pin produk 171 | RJ1 — General purpose I/O / peripheral function |
| Pin produk 172 | RJ0 — General purpose I/O / peripheral function |
| Pin produk 173 | RH15 — General purpose I/O / peripheral function |
| Pin produk 174 | RH14 — General purpose I/O / peripheral function |
| Pin produk 175 | RH13 — General purpose I/O / peripheral function |
| Pin produk 176 | RH12 — General purpose I/O / peripheral function |
Aplikasi Umum
PIC32MZ2025DAH176T-I/2J cocok untuk 6 aplikasis: Industrial HMI Touch Panels, Medical Patient-Interface Displays, Smart-Home Control Panels with GUI, Point-of-Sale Terminals, Automotive Infotainment Auxiliary Displays, Test & Measurement Front Panels.
Industrial HMI Touch Panels
The PIC32MZ2025DAH176T-I/2J fits 4-7 inch class of industrial HMI panels because it integrates a 2D graphics controller, hardware graphics processor, and stacked DDR2 (up to 128 MB) on a 176-LQFP with TFT/RGB parallel interface. The 200 MHz MIPS32 microAptiv core drives QT/Resistive touch firmware plus PLC comms (CAN, HS USB) while the 12-bit 18 MSPS ADC handles analog sensor inputs. Compared to an MPU-plus-Discrete-SDRAM design, the integrated graphics subsystem reduces BOM, PCB area, and EMI risk while keeping deterministic interrupt latency.
Direkomendasikan
Medical Patient-Interface Displays
Medical bedside monitors and infusion pumps benefit from the PIC32MZ2025DAH176T-I/2J's integrated graphics + DDR2 because color TFT rendering is handled without an external GPU, reducing patient-facing device BOM cost. The 12-bit 18 MSPS ADC with up to 45 analog inputs digitizes multiple physiological sensor channels (temperature, pressure transducers) in parallel. Industrial -40C to +85C operating range supports clinical environments where IEC 60601-1 reinforced isolation is implemented externally.
Direkomendasikan
Smart-Home Control Panels with GUI
Wall-mounted smart-home control hubs using the PIC32MZ2025DAH176T-I/2J leverage the integrated 2D graphics controller and 200 MHz MIPS32 core to render tile-based Zigbee/Z-Wave/Wi-Fi dashboards on 5-7 inch capacitive touch TFTs without an external graphics chip. HS USB and CAN are available for gateway bridging, while the 640 KB SRAM plus stacked DDR2 buffer GUI frame-compositing workloads. Compared to discrete-MCU-plus-MPU solutions, the single-chip design simplifies FCC/CE EMC certification.
Direkomendasikan
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2025DAH176T-I/2J because the integrated graphics + 200 MHz core drives customer-facing TFT displays while the 12-bit 18 MSPS ADC reads multiple keypad/scanner analog signals simultaneously. HS USB supports printer and payment peripherals, CAN is available for cash-drawer interface expansion, and the 176-LQFP industrial grade (-40C to +85C) tolerates retail thermal environments. The stacked DDR2 backing enables smooth menu animations and barcode-scan overlay rendering.
Direkomendasikan
Automotive Infotainment Auxiliary Displays
Auxiliary rear-seat entertainment or HVAC control displays using the PIC32MZ2025DAH176T-I/2J rely on the integrated 2D graphics controller to render climate/route information on small TFT panels. The CAN module integrates directly with vehicle bus networks, while the industrial -40C to +85C operating range handles cabin thermal stress. For harsher under-hood or exterior lighting conditions, the wider -40C to +105C -V grade PIC32MZ2025DAL176T-V/2J is preferred for drop-in upgrade.
Direkomendasikan
Test & Measurement Front Panels
Benchtop oscilloscopes, spectrum analyzers, and bench DMMs use the PIC32MZ2025DAH176T-I/2J to render high-resolution waveforms and menu UIs on 5-7 inch TFTs, with the hardware graphics processor accelerating trace-draw and grid-paint operations. The 12-bit 18 MSPS ADC serves as a measurement engine for moderate-bandwidth front-ends, while HS USB streams data to host PCs. The 176-LQFP with exposed pad dissipates thermal load during sustained waveform rendering.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC32MZ2025DAH176T-I/2J — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC32MZ2025DAH176-I/2J | PIC32MZ2025DAA176T-I/2J | PIC32MZ2025DAB176T-I/2J | PIC32MZ2025DAG176-I/2J | PIC32MZ1064DAG176T-I/2J |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | ~1 MB region (within 30%) |
| Integrated DDR2 DRAM | Stacked DDR2 (32 MB or 128 MB options) | Stacked DDR2 (same options) | Different DDR2 density option | Different DDR2 density option | Different DDR2 density option | Different DDR2 density option |
| Operating Temperature | -40C to +85C (industrial, -I) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
| Packaging Form | Tape & Reel (TR) | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
Diferensiator Kunci
- Integrated stacked DDR2 DRAM subsystem eliminates external SDRAM chip and PCB routing complexity (vsNon-DA PIC32MZ2025 parts without integrated DRAM)
- On-chip 2D graphics controller + dedicated graphics processor (vsGeneric Cortex-M4 MCU without GPU)
- Hi-Speed USB 2.0 + CAN integrated alongside 45-input 12-bit ADC (vsPIC32MX series lacking HS USB)
Catatan Desain
Estimated: the 176-LQFP with exposed thermal pad has a typical theta_JA of approximately 20-25 C/W on a 4-layer JEDEC test board (EIA/JESD51 family methodology). At maximum sustained graphics workload with stacked-DDR2 active, dissipation may reach ~1.5-2 W. A 25 mm x 25 mm copper land on the exposed pad with 16-25 thermal vias (0.3 mm drill, 1.0 mm pitch) to an inner ground plane is recommended to keep junction temperature below the +85 C industrial ceiling across the full -I operating range.
Place bulk decoupling (4.7 uF X7R) within 5 mm of every VDD pin and a 0.1 uF X7R within 2 mm of each VDD. Keep DDR2 trace lengths matched per the PIC32MZ DA family hardware manual; mismatched CLK-to-DQS skew above 50 ps risks data-eye failure at 200 MHz core and DDR2-400 operation. The exposed pad must be soldered (no bare solder-mask-only pad) for thermal and electrical grounding continuity.
Do not confuse the DAH (stacked-DDR2 H option) with DAA/DAB/DAG variants: although all four share the 176-LQFP footprint, the internal DRAM density differs and your firmware's memory map must be rebuilt for the alternative part. Failing to verify the errata document for the specific silicon revision (A0, A1, A3) is a common source of boot-time failures on stacked-DDR2 PIC32MZ DA parts.
Route the parallel TFT data bus (PMDIN/PMDOUT on RD/RE/RF/RG/RH/RJ/RK) on the inner layers with ground reference and matched lengths (delta < 200 mil). Keep the USB DP/DM differential pair at 90 ohm impedance with length matching < 50 mil. Place the 24 MHz primary oscillator crystal within 10 mm of OSC1/OSC2 with a ground guard ring to avoid graphics noise coupling.
Informasi Konformitas
ROHS3 Compliant per MicrochipUSA listing. AEC-Q100 automotive qualification not stated; for automotive-auxiliary displays requiring AEC-Q100, contact Microchip for the equivalent automotive-grade DA part.