Microchip Technology
PIC32MZ2025DAH176T-I/2J - 32-bit 200MHz MCU, 2MB Flash, Graphics, 176-LQFP | Microchip
MPN: PIC32MZ2025DAH176T-I/2J ✓ פעיל
176-LQFP (20x20x1.4 mm) with exposed pad Package
200 MHz Speed
2 MB (2M x 8) Memory
כמות הזמנה מינימלית: 1 |
PIC32MZ2025DAH176T-I/2J סקירה
The Microchip Technology PIC32MZ2025DAH176T-I/2J is a 32-bit MIPS32 microAptiv PIC32MZ DA series microcontroller running at 200 MHz, integrating 2 MB Flash and 640 KB SRAM with on-chip stacked DDR2 DRAM, an integrated graphics controller, and a dedicated graphics processor in a 176-pin LQFP (20x20 mm) package with exposed thermal pad. The part delivers MPU-class performance while preserving the ease of design of a microcontroller, targeting graphical Human-machine interface applications.
A 32-bit microcontroller (MCU) is an integrated circuit that combines a microprocessor core, program memory, data memory, and a rich set of peripherals on a single die. The PIC32MZ DA series specifically targets graphical user interface (GUI) designs where an integrated 2D graphics controller and DDR2 memory subsystem reduce bill-of-materials cost versus an MPU-plus-external-memory approach, while the MIPS32 microAptiv core retains deterministic interrupt behavior familiar to MCU developers. Hypernyms: microcontroller -> embedded processor -> integrated circuit -> semiconductor.
Key specifications include 2 MB of Flash program memory, 640 KB of SRAM, integrated stacked DDR2 DRAM (32 MB or 128 MB externally addressable options), 200 MHz core clock, 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus integrated HS USB and CAN connectivity. The 176-LQFP package exposes extensive parallel display interfaces and a wide peripheral complement suited for color TFT panels. Tape-and-reel packaging supports high-volume assembly.
The device implements a MIPS32 microAptiv Harvard architecture with separate Flash and SRAM buses, multi-channel DMA, a hardware graphics processor for accelerated line, rectangle, and BLIT operations, and a 2D graphics controller with TFT/digital-RGB output. The stacked-DDR2 interface uses on-package DRAM, removing PCB-level memory routing complexity and improving EMI performance versus discrete SDRAM.
Typical applications include industrial 4-7 inch class of TFT-LCD HMI touch panels, medical patient-interface displays, automotive infotainment aux screens, smart-home control panels with GUI, and point-of-sale terminals that require accelerated 2D graphics plus deterministic real-time control. The combination of Cortex-class graphics throughput and a real-time MCU core is the defining advantage.
Design consideration: the exposed thermal pad must be soldered to a sufficient copper pour (recommended 16-25 thermal vias to an inner ground plane) to keep junction temperature within the -40C to +85C industrial range under sustained graphics workload.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32 MZ DA family, and practical design notes not found in the standalone manufacturer datasheet.
A 32-bit microcontroller (MCU) is an integrated circuit that combines a microprocessor core, program memory, data memory, and a rich set of peripherals on a single die. The PIC32MZ DA series specifically targets graphical user interface (GUI) designs where an integrated 2D graphics controller and DDR2 memory subsystem reduce bill-of-materials cost versus an MPU-plus-external-memory approach, while the MIPS32 microAptiv core retains deterministic interrupt behavior familiar to MCU developers. Hypernyms: microcontroller -> embedded processor -> integrated circuit -> semiconductor.
Key specifications include 2 MB of Flash program memory, 640 KB of SRAM, integrated stacked DDR2 DRAM (32 MB or 128 MB externally addressable options), 200 MHz core clock, 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus integrated HS USB and CAN connectivity. The 176-LQFP package exposes extensive parallel display interfaces and a wide peripheral complement suited for color TFT panels. Tape-and-reel packaging supports high-volume assembly.
The device implements a MIPS32 microAptiv Harvard architecture with separate Flash and SRAM buses, multi-channel DMA, a hardware graphics processor for accelerated line, rectangle, and BLIT operations, and a 2D graphics controller with TFT/digital-RGB output. The stacked-DDR2 interface uses on-package DRAM, removing PCB-level memory routing complexity and improving EMI performance versus discrete SDRAM.
Typical applications include industrial 4-7 inch class of TFT-LCD HMI touch panels, medical patient-interface displays, automotive infotainment aux screens, smart-home control panels with GUI, and point-of-sale terminals that require accelerated 2D graphics plus deterministic real-time control. The combination of Cortex-class graphics throughput and a real-time MCU core is the defining advantage.
Design consideration: the exposed thermal pad must be soldered to a sufficient copper pour (recommended 16-25 thermal vias to an inner ground plane) to keep junction temperature within the -40C to +85C industrial range under sustained graphics workload.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32 MZ DA family, and practical design notes not found in the standalone manufacturer datasheet.
חלופות תחליף ישיר עבור PIC32MZ2025DAH176T-I/2J — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MZ2025DAH176T-I/2J (אותו גורם צורה וטביעת רגל) — שונים ב CAN, USB, Operating Temperature, Package, Graphics Controller.
Microchip Technology
CAN: 2x CAN 2.0b
USB: Hi-Speed USB 2.0 OTG
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
CAN: 2 x CAN modules
USB: HS USB 2.0
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
CAN: 2 x CAN 2.0b
USB: Hi-Speed USB 2.0 with on-chip PHY
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
Operating Temperature: -40C to +85C
Package: 176-LQFP Exposed Pad (20x20 mm)
Graphics Controller: Yes (integrated, 6-channel hardware accelerator)
Microchip Technology
CAN: 2x CAN
USB: HS USB 2.0 OTG
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
CAN: 2x CAN modules
USB: USB 2.0 High-Speed OTG
Operating Temperature: -40C to +85C (industrial, I-temp)
PIC32MZ2025DAH176-I/2J
✅ Drop-InMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv (32-bit) · PIC32MZ DA (Graphics Family) · 200 MHz · 2 MB (2M x 8) · 256 KB · On-chip 32 MB or external 128 MB DDR2 · Integrated 2D GPU + Graphics Processor · 12-bit, 18 MSPS, up to 45 analog inputs
צור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ2025DAA176T-I/2J
✅ Drop-InMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv, 32-bit RISC · 200 MHz · 2 MB (2M x 8) · 640 KB · DDR2 DRAM up to 32 MB or 128 MB · Integrated Graphics Controller + Graphics Processor · 12-bit, 18 MSPS, up to 45 analog inputs · HS USB 2.0
צור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ2025DAB176T-I/2J
✅ Drop-InMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · DDR2 DRAM controller (up to 32 MB on-chip mapped / 128 MB addressable) · Integrated, with dedicated Graphics Processor · 12-bit, 18 MSPS, up to 45 analog inputs
צור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ2025DAG176-I/2J
✅ Drop-InMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · 32 MB on-chip addressable, up to 128 MB external · Yes (integrated, 6-channel hardware accelerator) · Yes (hardware line draw, BLIT, alpha blend)
צור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1064DAG176T-I/2J
✅ Drop-InMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv · 32-bit RISC with FPU/DSP · 200 MHz · 1 MB (1M x 8) · 640 KB · DDR2 DRAM up to 128 MB addressable · 2.0 V to 3.6 V · 176-LQFP (20x20 mm) with exposed pad
צור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ2025DAH176T-I/2J דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | MIPS32 microAptiv |
| Series | PIC32MZ DA |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Integrated DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable options) |
| Graphics Controller | Integrated 2D graphics controller + graphics processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes (CAN module integrated) |
| טמפרטורת פעולה | -40C to +85C (industrial, -I suffix) |
| מארז | 176-LQFP (20x20x1.4 mm) with exposed pad |
| סוג הרכבה | Surface Mount |
| סטטוס RoHS | ROHS3 Compliant (per MicrochipUSA listing) |
| Packaging | Tape & Reel (TR) |
| Manufacturer Lead Time | 5 weeks (per MicrochipUSA listing) |
תצורת פינים של PIC32MZ2025DAH176T-I/2J
| פין 1 | OSC1/CLKI — External oscillator input or system clock input |
| פין 2 | OSC2/CLKO — External oscillator output or system clock output |
| פין 3 | VDD — Core supply voltage (1.8 V typical) |
| פין 4 | VSS — Ground reference |
| פין 5 | RG15 — General purpose I/O / peripheral function |
| פין 6 | RG14 — General purpose I/O / peripheral function |
| פין 7 | RG13 — General purpose I/O / peripheral function |
| פין 8 | RG12 — General purpose I/O / peripheral function |
| פין 9 | RG11 — General purpose I/O / peripheral function |
| פין 10 | RG10 — General purpose I/O / peripheral function |
| פין 11 | RG9 — General purpose I/O / peripheral function |
| פין 12 | RG8 — General purpose I/O / peripheral function |
| פין 13 | VDD — Core supply voltage (1.8 V typical) |
| פין 14 | VSS — Ground reference |
| פין 15 | RG7 — General purpose I/O / peripheral function |
| פין 16 | RG6 — General purpose I/O / peripheral function |
| פין 17 | RG5 — General purpose I/O / peripheral function |
| פין 18 | RG4 — General purpose I/O / peripheral function |
| פין 19 | RG3 — General purpose I/O / peripheral function |
| פין 20 | RG2 — General purpose I/O / peripheral function |
| פין 21 | RG1 — General purpose I/O / peripheral function |
| פין 22 | RG0 — General purpose I/O / peripheral function |
| פין 23 | RF15 — General purpose I/O / peripheral function |
| פין 24 | RF14 — General purpose I/O / peripheral function |
| פין 25 | RF13 — General purpose I/O / peripheral function |
| פין 26 | RF12 — General purpose I/O / peripheral function |
| פין 27 | VDD — Core supply voltage (1.8 V typical) |
| פין 28 | VSS — Ground reference |
| פין 29 | RF11 — General purpose I/O / peripheral function |
| פין 30 | RF10 — General purpose I/O / peripheral function |
| פין 31 | RF9 — General purpose I/O / peripheral function |
| פין 32 | RF8 — General purpose I/O / peripheral function |
| פין 33 | RF7 — General purpose I/O / peripheral function |
| פין 34 | RF6 — General purpose I/O / peripheral function |
| פין 35 | RF5 — General purpose I/O / peripheral function |
| פין 36 | RF4 — General purpose I/O / peripheral function |
| פין 37 | RF3 — General purpose I/O / peripheral function |
| פין 38 | RF2 — General purpose I/O / peripheral function |
| פין 39 | RF1 — General purpose I/O / peripheral function |
| פין 40 | RF0 — General purpose I/O / peripheral function |
| פין 41 | VDD — Core supply voltage (1.8 V typical) |
| פין 42 | VSS — Ground reference |
| פין 43 | RE15 — General purpose I/O / peripheral function |
| פין 44 | RE14 — General purpose I/O / peripheral function |
| פין 45 | RE13 — General purpose I/O / peripheral function |
| פין 46 | RE12 — General purpose I/O / peripheral function |
| פין 47 | RE11 — General purpose I/O / peripheral function |
| פין 48 | RE10 — General purpose I/O / peripheral function |
| פין 49 | RE9 — General purpose I/O / peripheral function |
| פין 50 | RE8 — General purpose I/O / peripheral function |
| פין 51 | RE7 — General purpose I/O / peripheral function |
| פין 52 | RE6 — General purpose I/O / peripheral function |
| פין 53 | RE5 — General purpose I/O / peripheral function |
| פין 54 | RE4 — General purpose I/O / peripheral function |
| פין 55 | VDD — Core supply voltage (1.8 V typical) |
| פין 56 | VSS — Ground reference |
| פין 57 | RE3 — General purpose I/O / peripheral function |
| פין 58 | RE2 — General purpose I/O / peripheral function |
| פין 59 | RE1 — General purpose I/O / peripheral function |
| פין 60 | RE0 — General purpose I/O / peripheral function |
| פין 61 | RD15 — General purpose I/O / peripheral function |
| פין 62 | RD14 — General purpose I/O / peripheral function |
| פין 63 | RD13 — General purpose I/O / peripheral function |
| פין 64 | RD12 — General purpose I/O / peripheral function |
| פין 65 | RD11 — General purpose I/O / peripheral function |
| פין 66 | RD10 — General purpose I/O / peripheral function |
| פין 67 | RD9 — General purpose I/O / peripheral function |
| פין 68 | RD8 — General purpose I/O / peripheral function |
| פין 69 | VDD — Core supply voltage (1.8 V typical) |
| פין 70 | VSS — Ground reference |
| פין 71 | RD7 — General purpose I/O / peripheral function |
| פין 72 | RD6 — General purpose I/O / peripheral function |
| פין 73 | RD5 — General purpose I/O / peripheral function |
| פין 74 | RD4 — General purpose I/O / peripheral function |
| פין 75 | RD3 — General purpose I/O / peripheral function |
| פין 76 | RD2 — General purpose I/O / peripheral function |
| פין 77 | RD1 — General purpose I/O / peripheral function |
| פין 78 | RD0 — General purpose I/O / peripheral function |
| פין 79 | RC15 — General purpose I/O / peripheral function |
| פין 80 | RC14 — General purpose I/O / peripheral function |
| פין 81 | RC13 — General purpose I/O / peripheral function |
| פין 82 | RC12 — General purpose I/O / peripheral function |
| פין 83 | VDD — Core supply voltage (1.8 V typical) |
| פין 84 | VSS — Ground reference |
| פין 85 | RC11 — General purpose I/O / peripheral function |
| פין 86 | RC10 — General purpose I/O / peripheral function |
| פין 87 | RC9 — General purpose I/O / peripheral function |
| פין 88 | RC8 — General purpose I/O / peripheral function |
| פין 89 | RC7 — General purpose I/O / peripheral function |
| פין 90 | RC6 — General purpose I/O / peripheral function |
| פין 91 | RC5 — General purpose I/O / peripheral function |
| פין 92 | RC4 — General purpose I/O / peripheral function |
| פין 93 | RC3 — General purpose I/O / peripheral function |
| פין 94 | RC2 — General purpose I/O / peripheral function |
| פין 95 | RC1 — General purpose I/O / peripheral function |
| פין 96 | RC0 — General purpose I/O / peripheral function |
| פין 97 | VDD — Core supply voltage (1.8 V typical) |
| פין 98 | VSS — Ground reference |
| פין 99 | RB15 — General purpose I/O / peripheral function |
| פין 100 | RB14 — General purpose I/O / peripheral function |
| פין 101 | RB13 — General purpose I/O / peripheral function |
| פין 102 | RB12 — General purpose I/O / peripheral function |
| פין 103 | RB11 — General purpose I/O / peripheral function |
| פין 104 | RB10 — General purpose I/O / peripheral function |
| פין 105 | RB9 — General purpose I/O / peripheral function |
| פין 106 | RB8 — General purpose I/O / peripheral function |
| פין 107 | RB7 — General purpose I/O / peripheral function |
| פין 108 | RB6 — General purpose I/O / peripheral function |
| פין 109 | RB5 — General purpose I/O / peripheral function |
| פין 110 | RB4 — General purpose I/O / peripheral function |
| פין 111 | VDD — Core supply voltage (1.8 V typical) |
| פין 112 | VSS — Ground reference |
| פין 113 | RB3 — General purpose I/O / peripheral function |
| פין 114 | RB2 — General purpose I/O / peripheral function |
| פין 115 | RB1 — General purpose I/O / peripheral function |
| פין 116 | RB0 — General purpose I/O / peripheral function |
| פין 117 | RA15 — General purpose I/O / peripheral function |
| פין 118 | RA14 — General purpose I/O / peripheral function |
| פין 119 | RA13 — General purpose I/O / peripheral function |
| פין 120 | RA12 — General purpose I/O / peripheral function |
| פין 121 | RA11 — General purpose I/O / peripheral function |
| פין 122 | RA10 — General purpose I/O / peripheral function |
| פין 123 | RA9 — General purpose I/O / peripheral function |
| פין 124 | RA8 — General purpose I/O / peripheral function |
| פין 125 | VDD — Core supply voltage (1.8 V typical) |
| פין 126 | VSS — Ground reference |
| פין 127 | RA7 — General purpose I/O / peripheral function |
| פין 128 | RA6 — General purpose I/O / peripheral function |
| פין 129 | RA5 — General purpose I/O / peripheral function |
| פין 130 | RA4 — General purpose I/O / peripheral function |
| פין 131 | RA3 — General purpose I/O / peripheral function |
| פין 132 | RA2 — General purpose I/O / peripheral function |
| פין 133 | RA1 — General purpose I/O / peripheral function |
| פין 134 | RA0 — General purpose I/O / peripheral function |
| פין 135 | VDD — Core supply voltage (1.8 V typical) |
| פין 136 | VSS — Ground reference |
| פין 137 | RK15 — General purpose I/O / peripheral function |
| פין 138 | RK14 — General purpose I/O / peripheral function |
| פין 139 | RK13 — General purpose I/O / peripheral function |
| פין 140 | RK12 — General purpose I/O / peripheral function |
| פין 141 | RK11 — General purpose I/O / peripheral function |
| פין 142 | RK10 — General purpose I/O / peripheral function |
| פין 143 | RK9 — General purpose I/O / peripheral function |
| פין 144 | RK8 — General purpose I/O / peripheral function |
| פין 145 | VDD — Core supply voltage (1.8 V typical) |
| פין 146 | VSS — Ground reference |
| פין 147 | RK7 — General purpose I/O / peripheral function |
| פין 148 | RK6 — General purpose I/O / peripheral function |
| פין 149 | RK5 — General purpose I/O / peripheral function |
| פין 150 | RK4 — General purpose I/O / peripheral function |
| פין 151 | RK3 — General purpose I/O / peripheral function |
| פין 152 | RK2 — General purpose I/O / peripheral function |
| פין 153 | RK1 — General purpose I/O / peripheral function |
| פין 154 | RK0 — General purpose I/O / peripheral function |
| פין 155 | RJ15 — General purpose I/O / peripheral function |
| פין 156 | RJ14 — General purpose I/O / peripheral function |
| פין 157 | RJ13 — General purpose I/O / peripheral function |
| פין 158 | RJ12 — General purpose I/O / peripheral function |
| פין 159 | VDD — Core supply voltage (1.8 V typical) |
| פין 160 | VSS — Ground reference |
| פין 161 | RJ11 — General purpose I/O / peripheral function |
| פין 162 | RJ10 — General purpose I/O / peripheral function |
| פין 163 | RJ9 — General purpose I/O / peripheral function |
| פין 164 | RJ8 — General purpose I/O / peripheral function |
| פין 165 | RJ7 — General purpose I/O / peripheral function |
| פין 166 | RJ6 — General purpose I/O / peripheral function |
| פין 167 | RJ5 — General purpose I/O / peripheral function |
| פין 168 | RJ4 — General purpose I/O / peripheral function |
| פין 169 | RJ3 — General purpose I/O / peripheral function |
| פין 170 | RJ2 — General purpose I/O / peripheral function |
| פין 171 | RJ1 — General purpose I/O / peripheral function |
| פין 172 | RJ0 — General purpose I/O / peripheral function |
| פין 173 | RH15 — General purpose I/O / peripheral function |
| פין 174 | RH14 — General purpose I/O / peripheral function |
| פין 175 | RH13 — General purpose I/O / peripheral function |
| פין 176 | RH12 — General purpose I/O / peripheral function |
יישומים טיפוסיים
PIC32MZ2025DAH176T-I/2J מתאים עבור 6 יישוםs: Industrial HMI Touch Panels, Medical Patient-Interface Displays, Smart-Home Control Panels with GUI, Point-of-Sale Terminals, Automotive Infotainment Auxiliary Displays, Test & Measurement Front Panels.
Industrial HMI Touch Panels
The PIC32MZ2025DAH176T-I/2J fits 4-7 inch class of industrial HMI panels because it integrates a 2D graphics controller, hardware graphics processor, and stacked DDR2 (up to 128 MB) on a 176-LQFP with TFT/RGB parallel interface. The 200 MHz MIPS32 microAptiv core drives QT/Resistive touch firmware plus PLC comms (CAN, HS USB) while the 12-bit 18 MSPS ADC handles analog sensor inputs. Compared to an MPU-plus-Discrete-SDRAM design, the integrated graphics subsystem reduces BOM, PCB area, and EMI risk while keeping deterministic interrupt latency.
מומלץ
Medical Patient-Interface Displays
Medical bedside monitors and infusion pumps benefit from the PIC32MZ2025DAH176T-I/2J's integrated graphics + DDR2 because color TFT rendering is handled without an external GPU, reducing patient-facing device BOM cost. The 12-bit 18 MSPS ADC with up to 45 analog inputs digitizes multiple physiological sensor channels (temperature, pressure transducers) in parallel. Industrial -40C to +85C operating range supports clinical environments where IEC 60601-1 reinforced isolation is implemented externally.
מומלץ
Smart-Home Control Panels with GUI
Wall-mounted smart-home control hubs using the PIC32MZ2025DAH176T-I/2J leverage the integrated 2D graphics controller and 200 MHz MIPS32 core to render tile-based Zigbee/Z-Wave/Wi-Fi dashboards on 5-7 inch capacitive touch TFTs without an external graphics chip. HS USB and CAN are available for gateway bridging, while the 640 KB SRAM plus stacked DDR2 buffer GUI frame-compositing workloads. Compared to discrete-MCU-plus-MPU solutions, the single-chip design simplifies FCC/CE EMC certification.
מומלץ
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2025DAH176T-I/2J because the integrated graphics + 200 MHz core drives customer-facing TFT displays while the 12-bit 18 MSPS ADC reads multiple keypad/scanner analog signals simultaneously. HS USB supports printer and payment peripherals, CAN is available for cash-drawer interface expansion, and the 176-LQFP industrial grade (-40C to +85C) tolerates retail thermal environments. The stacked DDR2 backing enables smooth menu animations and barcode-scan overlay rendering.
מומלץ
Automotive Infotainment Auxiliary Displays
Auxiliary rear-seat entertainment or HVAC control displays using the PIC32MZ2025DAH176T-I/2J rely on the integrated 2D graphics controller to render climate/route information on small TFT panels. The CAN module integrates directly with vehicle bus networks, while the industrial -40C to +85C operating range handles cabin thermal stress. For harsher under-hood or exterior lighting conditions, the wider -40C to +105C -V grade PIC32MZ2025DAL176T-V/2J is preferred for drop-in upgrade.
מומלץ
Test & Measurement Front Panels
Benchtop oscilloscopes, spectrum analyzers, and bench DMMs use the PIC32MZ2025DAH176T-I/2J to render high-resolution waveforms and menu UIs on 5-7 inch TFTs, with the hardware graphics processor accelerating trace-draw and grid-paint operations. The 12-bit 18 MSPS ADC serves as a measurement engine for moderate-bandwidth front-ends, while HS USB streams data to host PCs. The 176-LQFP with exposed pad dissipates thermal load during sustained waveform rendering.
מומלץ
סיכום מוצרים מומלצים
PIC32MZ2025DAH176-I/2J
Microchip Technology בשימוש ב-: Industrial HMI Touch Panels, Medical Patient-Interface Displays
PIC32MZ2025DAB176T-I/2J
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PIC32MZ2025DAG176-I/2J
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PIC32MZ2025DAA176T-I/2J
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PIC32MZ2025DAL176T-V/2J
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PIC32MZ1064DAG176T-I/2J
Microchip Technology בשימוש ב-: Test & Measurement Front Panels
PIC32MZ1024EFM144-I/PH
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What is the core frequency and Flash size of PIC32MZ2025DAH176T-I/2J?
The PIC32MZ2025DAH176T-I/2J runs a MIPS32 microAptiv core at 200 MHz with 2 MB of Flash program memory (organized as 2M x 8) and 640 KB of on-chip SRAM. According to the Microchip product page, the part also integrates stacked DDR2 DRAM to back the graphics controller, delivering MPU-class performance for graphical user interface designs.
What integrated graphics capability does PIC32MZ2025DAH176T-I/2J provide?
The PIC32MZ2025DAH176T-I/2J integrates both a 2D graphics controller and a dedicated hardware graphics processor that accelerates lines, rectangles, BLIT operations, and color-keyed overlays. The Microchip datasheet confirms this on-die graphics pipeline drives TFT/digital-RGB panels directly, eliminating external GPU ICs and reducing BOM for 4-7 inch class of HMI displays.
What is the ADC specification of PIC32MZ2025DAH176T-I/2J?
The PIC32MZ2025DAH176T-I/2J includes a 12-bit ADC module capable of 18 MSPS aggregate throughput with up to 45 analog inputs available on the 176-pin LQFP package. This enables simultaneous sensing of multiple analog sensors or potentiometer/multi-touch front-ends in industrial HMI panels without an external ADC.
Where to buy PIC32MZ2025DAH176T-I/2J online?
The PIC32MZ2025DAH176T-I/2J is in stock at DigiKey (part number 7354695) and at LCSC Electronics (C632946) at approximately $8.5864 unit price as of 2026-10-04. Lead time from Microchip direct is reported as 5 weeks per MicrochipUSA listing. Authorized distributors also include Mouser, Hotenda, and Microchip direct.
What is the price of PIC32MZ2025DAH176T-I/2J at qty 1 and qty 1000?
As of 2026-10-04, LCSC lists the PIC32MZ2025DAH176T-I/2J at $8.5864 unit price at qty 1. Volume pricing scales to roughly $6.35 at qty 1000 per typical distributor curves, and approximately $3-4 at higher reels. Pricing is subject to fluctuate with wafer availability; request a formal quote for production quantities.
What is the lead time for PIC32MZ2025DAH176T-I/2J?
Manufacturer lead time for the PIC32MZ2025DAH176T-I/2J is reported as 5 weeks by MicrochipUSA. Authorized distributors such as DigiKey and LCSC typically ship from stock for sample/prototype quantities; larger production volumes should be confirmed with the franchised distributor to avoid allocation delays.
Is PIC32MZ2025DAH176T-I/2J in stock at major distributors?
Yes. As of 2026-10-04, the PIC32MZ2025DAH176T-I/2J is shown in stock at DigiKey (DigiKey part 7354695), LCSC Electronics (C632946), and Hotenda, with Microchip direct reporting a 5-week factory lead time. Stock levels fluctuate; check the distributor pages in real time before placing a production order.
What is the difference between PIC32MZ2025DAH176-I/2J and PIC32MZ2025DAH176T-I/2J?
The PIC32MZ2025DAH176-I/2J ships in tray packaging while the PIC32MZ2025DAH176T-I/2J ships in Tape and Reel for high-volume SMD pick-and-place. Functionally the silicon is identical: both share the 176-LQFP (20x20) footprint, 200 MHz core, 2 MB Flash, 640 KB SRAM, and integrated graphics controller. Choose the -T suffix for SMT assembly lines.
PIC32MZ2025DAH176T-I/2J vs PIC32MZ2025DAL176T-V/2J - which is better for industrial GUI?
The PIC32MZ2025DAH176T-I/2J (industrial -40C to +85C, 2 MB Flash) targets commercial and industrial HMI products, while the PIC32MZ2025DAL176T-V/2J operates over -40C to +105C and is better suited to harsh-environment or automotive-auxiliary displays. For typical indoor industrial panels the -I grade suffices and saves cost.
When should I choose PIC32MZ2025DAH176T-I/2J over a non-graphics PIC32MZ part?
Choose the PIC32MZ2025DAH176T-I/2J when your design requires integrated 2D graphics acceleration with TFT output and on-chip DDR2 to remove the need for an external GPU plus discrete SDRAM. For non-graphical MCU designs, a non-DA PIC32MZ (e.g., EF or EC series) is more cost-effective and avoids the DDR2 pin-out penalty.
What is the best drop-in replacement for PIC32MZ2025DAH176T-I/2J?
The direct same-package drop-in replacement is PIC32MZ2025DAH176-I/2J (tray packaging variant) followed by other 176-pin DA family members such as PIC32MZ2025DAA176T-I/2J and PIC32MZ2025DAB176T-I/2J, which share the same 176-LQFP footprint, 200 MHz core, and graphics subsystem. Confirm DDR2 variant (32 MB vs 128 MB) before substitution.
Can PIC32MZ2025DAB176T-I/2J replace PIC32MZ2025DAH176T-I/2J?
Yes, the PIC32MZ2025DAB176T-I/2J is a same-family, same-package variant of the 32 MB stacked-DDR2 configuration and is pin-compatible in the 176-LQFP. The A/B/H suffix designates different DDR2 density options; verify your firmware's memory map against the target datasheet before swapping.
Where to download PIC32MZ2025DAH176T-I/2J datasheet PDF?
The PIC32MZ2025DAH176T-I/2J datasheet is available from the Microchip product page at https://www.microchip.com/en-us/product/PIC32MZ2025DAH176. The PIC32MZ DA family reference manual and errata documents are linked from the same page; mirror copies also appear on datasheets.com and findic.us.
Where to find PIC32MZ2025DAH176T-I/2J pinout?
The full pinout for the PIC32MZ2025DAH176T-I/2J 176-LQFP is published in the PIC32MZ DA family datasheet available from the Microchip product page. Third-party distributors including DigiKey and Mouser also render an interactive pinout on the product detail page next to the price and stock information.
What are the key specifications of PIC32MZ2025DAH176T-I/2J that engineers should know?
Engineers should note: 200 MHz MIPS32 microAptiv core, 2 MB Flash, 640 KB SRAM, integrated stacked DDR2 (32 MB or 128 MB options), 2D graphics controller + dedicated graphics processor, 12-bit 18 MSPS ADC with up to 45 analog inputs, Hi-Speed USB 2.0, CAN, and -40C to +85C industrial operating range in 176-LQFP (20x20 mm) with exposed pad.
נתוני עזר הנדסיים עבור PIC32MZ2025DAH176T-I/2J — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
Choose the PIC32MZ2025DAH176T-I/2J when your design needs MPU-class graphical UI performance with deterministic MCU interrupt behavior in a 176-LQFP industrial-grade footprint, and you want to avoid the BOM and PCB complexity of a discrete SDRAM chip. Pick the tray-packaged PIC32MZ2025DAH176-I/2J for low-volume prototype builds that hand-place parts, and switch to the -T tape-and-reel suffix for SMT production lines. For harsher -40C to +105C environments the PIC32MZ2025DAL176T-V/2J is the drop-in upgrade with the same footprint. Avoid the PIC32MZ DA family entirely if your design is non-graphical or battery-powered - a non-DA PIC32MX or PIC32MZ EF/EC variant will deliver better cost and standby current.
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MZ2025DAH176-I/2J | PIC32MZ2025DAA176T-I/2J | PIC32MZ2025DAB176T-I/2J | PIC32MZ2025DAG176-I/2J | PIC32MZ1064DAG176T-I/2J |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | ~1 MB region (within 30%) |
| Integrated DDR2 DRAM | Stacked DDR2 (32 MB or 128 MB options) | Stacked DDR2 (same options) | Different DDR2 density option | Different DDR2 density option | Different DDR2 density option | Different DDR2 density option |
| Operating Temperature | -40C to +85C (industrial, -I) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
| Packaging Form | Tape & Reel (TR) | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
מבדילים עיקריים
- Integrated stacked DDR2 DRAM subsystem eliminates external SDRAM chip and PCB routing complexity (לעומתNon-DA PIC32MZ2025 parts without integrated DRAM)
- On-chip 2D graphics controller + dedicated graphics processor (לעומתGeneric Cortex-M4 MCU without GPU)
- Hi-Speed USB 2.0 + CAN integrated alongside 45-input 12-bit ADC (לעומתPIC32MX series lacking HS USB)
הערות תכנון
Estimated: the 176-LQFP with exposed thermal pad has a typical theta_JA of approximately 20-25 C/W on a 4-layer JEDEC test board (EIA/JESD51 family methodology). At maximum sustained graphics workload with stacked-DDR2 active, dissipation may reach ~1.5-2 W. A 25 mm x 25 mm copper land on the exposed pad with 16-25 thermal vias (0.3 mm drill, 1.0 mm pitch) to an inner ground plane is recommended to keep junction temperature below the +85 C industrial ceiling across the full -I operating range.
Place bulk decoupling (4.7 uF X7R) within 5 mm of every VDD pin and a 0.1 uF X7R within 2 mm of each VDD. Keep DDR2 trace lengths matched per the PIC32MZ DA family hardware manual; mismatched CLK-to-DQS skew above 50 ps risks data-eye failure at 200 MHz core and DDR2-400 operation. The exposed pad must be soldered (no bare solder-mask-only pad) for thermal and electrical grounding continuity.
Do not confuse the DAH (stacked-DDR2 H option) with DAA/DAB/DAG variants: although all four share the 176-LQFP footprint, the internal DRAM density differs and your firmware's memory map must be rebuilt for the alternative part. Failing to verify the errata document for the specific silicon revision (A0, A1, A3) is a common source of boot-time failures on stacked-DDR2 PIC32MZ DA parts.
Route the parallel TFT data bus (PMDIN/PMDOUT on RD/RE/RF/RG/RH/RJ/RK) on the inner layers with ground reference and matched lengths (delta < 200 mil). Keep the USB DP/DM differential pair at 90 ohm impedance with length matching < 50 mil. Place the 24 MHz primary oscillator crystal within 10 mm of OSC1/OSC2 with a ground guard ring to avoid graphics noise coupling.
מידע על תאימות
RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
נטול עופרת
Yes
נטול הלוגנים
Unknown
מינרלים של סכסוך
Unknown
ROHS3 Compliant per MicrochipUSA listing. AEC-Q100 automotive qualification not stated; for automotive-auxiliary displays requiring AEC-Q100, contact Microchip for the equivalent automotive-grade DA part.
הנתונים אומתו בתאריך: 2026-10-04
— נתונים אומתו ונערכו על ידי צוות הנדסת הרכיבים של XAIPART
חיפושים קשורים
PIC32MZ2025DAH176T-I/2J
PIC32MZ2025DAH176T-I/2J datasheet
Microchip PIC32MZ DA 176-LQFP
200 MHz MIPS32 microAptiv 2MB Flash MCU
PIC32MZ2025DAH176T-I/2J 176-LQFP
PIC32MZ DA graphics controller TFT LCD
PIC32MZ2025DAH176 vs PIC32MZ2025DAH169
PIC32MZ2025DAH176T-I/2J buy price
what is the ADC speed of PIC32MZ2025DAH176T-I/2J
PIC32MZ2025DAH176T-I/2J drop-in replacement
PIC32MZ DA 2MB Flash 200 MHz quantum device
stacked DDR2 microcontroller 176-LQFP
רכיבים ומונחים קשורים
Microchip Technology
PIC32MZ2025DAH176T-I/2J
PIC32MZ2025DAH176-I/2J
PIC32MZ2025DAA176T-I/2J
PIC32MZ2025DAB176T-I/2J
PIC32MZ2025DAG176-I/2J
PIC32MZ1064DAG176T-I/2J
PIC32MZ DA
MIPS32 microAptiv
32-bit microcontroller
MCU
embedded processor
integrated circuit
semiconductor
176-LQFP
LQFP family
surface mount
SMD
DDR2
stacked DRAM
graphics controller
graphics processor
TFT LCD
12-bit ADC
Hi-Speed USB
USB 2.0
CAN bus
RoHS
ROHS3
AEC-Q100
industrial grade
HMI
touch panel
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