RC28F128P33B85B - 128Mbit NOR Flash, 52MHz, 85ns, 64-EasyBGA | Intel/Altera
MPN: RC28F128P33B85B ✗ Akhir HidupRC28F128P33B85B Ringkasan
A NOR Flash memory is a non-volatile storage technology that provides random read access at byte or word granularity, in contrast to NAND Flash which is read in large pages. NOR Flash retains code directly executable in-place (XIP), making it the historical choice for boot ROM, firmware storage, and embedded systems where deterministic read latency matters. Within the memory hierarchy, NOR Flash sits above NAND Flash and below SRAM/DRAM, trading higher density for fast random reads and long-term data retention.
Key features of the RC28F128P33B85B include 128 Mbit (16 Mbyte) density, x16 data bus, Common Flash Interface (CFI) for vendor-independent identification, 33-bit hardware ECC, and a uniform 64-Kbyte symmetric block architecture with configurable read-while-write (RWW) capability. The P33 process technology delivers lower power consumption and faster program/erase times than earlier Numonyx/Intel P30 devices.
This part supports simultaneous read-while-write operations, allowing the host CPU to fetch instructions from one bank while another bank is being programmed or erased. The EasyBGA-64 (8x10 mm) package offers a compact footprint suitable for space-limited embedded designs while exposing the full multiplexed address/data bus needed for legacy parallel interfaces.
Typical applications include embedded boot ROM for networking equipment, industrial control firmware storage, automotive telematics and infotainment code storage, and legacy parallel-interface designs that require deterministic read latency. The 52 MHz synchronous burst-read mode also enables higher-throughput data streaming.
When designing with this device, ensure the host platform supports the legacy CFI query protocol and the 33-bit hardware ECC engine for production-grade reliability. Designers transitioning from older Numonyx/Intel P30 devices must verify pinout compatibility, as the EasyBGA ball map differs from earlier TSOP packaging.
This page synthesizes distributor pricing from LCSC, DigiKey Marketplace and Octopart, drop-in package-compatible alternatives from the same P33 family, and practical design considerations not consolidated in the manufacturer datasheet.
Alternatif penggantian untuk RC28F128P33B85B — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
RC28F128P33B85A
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
RC28F128P33T85
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PC28F128P33B85
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PC28F128P33B85E
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
S29GL128P11TFI020
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
W29GL128CL7S
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
RC28F128P33B85B Rating Maksimal & Karakteristik Listrik
| Tipe Memori | NOR Flash |
| Ukuran Memori | 128 Mbit (16 Mbyte) |
| Memory Organization | 8M x 16 |
| Tipe Antarmuka | Parallel CFI |
| Clock Frequency (Synchronous Read) | 52 MHz |
| Initial Access Time | 85 ns |
| Tegangan Pemuat | 2.5 V / 3.3 V (dual-voltage) |
| Program/Erase Technology | StrataFlash P33 (90 nm) |
| Block Architecture | 64-Kbyte uniform symmetric blocks |
| Read-While-Write | Yes (configurable RWW) |
| Hardware ECC | 33-bit on-die ECC |
| Paket | 64-ball EasyBGA (8x10 mm) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | -40C to +85C (industrial) |
| Status RoHS | Compliant |
Konfigurasi Pin RC28F128P33B85B
| Pin produk A1 | NC — No connect (per datasheet EasyBGA-64 ball map) |
| Pin produk A2 | NC — No connect |
| Pin produk A3 | A15 — Address input A15 |
| Pin produk A4 | A14 — Address input A14 |
| Pin produk A5 | A13 — Address input A13 |
| Pin produk A6 | A12 — Address input A12 |
| Pin produk A7 | A11 — Address input A11 |
| Pin produk A8 | A9 — Address input A9 |
| Pin produk B1 | RY/BY# — Ready/Busy output (open drain) |
| Pin produk B2 | WE# — Write Enable (active low) |
| Pin produk B3 | DQ15/A-1 — Data DQ15 / Address -1 (word mode) |
| Pin produk B4 | DQ7 — Data I/O DQ7 |
| Pin produk B5 | DQ5 — Data I/O DQ5 |
| Pin produk B6 | DQ3 — Data I/O DQ3 |
| Pin produk B7 | DQ1 — Data I/O DQ1 |
| Pin produk B8 | VSS — Ground |
| Pin produk C1 | CE# — Chip Enable (active low) |
| Pin produk C2 | OE# — Output Enable (active low) |
| Pin produk C3 | ADV# — Address Valid (active low) |
| Pin produk C4 | DQ13 — Data I/O DQ13 |
| Pin produk C5 | DQ11 — Data I/O DQ11 |
| Pin produk C6 | DQ9 — Data I/O DQ9 |
| Pin produk C7 | VCCQ — I/O supply voltage (2.5V/3.3V) |
| Pin produk C8 | VCC — Core supply voltage |
| Pin produk D1 | WP# — Write Protect (active low) |
| Pin produk D2 | CLK — Synchronous read clock input |
| Pin produk D3 | DQ14 — Data I/O DQ14 |
| Pin produk D4 | DQ12 — Data I/O DQ12 |
| Pin produk D5 | DQ10 — Data I/O DQ10 |
| Pin produk D6 | DQ8 — Data I/O DQ8 |
| Pin produk D7 | DQ6 — Data I/O DQ6 |
| Pin produk D8 | DQ4 — Data I/O DQ4 |
| Pin produk E1 | A22 — Address input A22 |
| Pin produk E2 | A21 — Address input A21 |
| Pin produk E3 | A20 — Address input A20 |
| Pin produk E4 | A19 — Address input A19 |
| Pin produk E5 | A18 — Address input A18 |
| Pin produk E6 | A17 — Address input A17 |
| Pin produk E7 | A16 — Address input A16 |
| Pin produk E8 | A10 — Address input A10 |
| Pin produk F1 | NC — No connect |
| Pin produk F2 | NC — No connect |
| Pin produk F3 | VSS — Ground |
| Pin produk F4 | VSS — Ground |
| Pin produk F5 | VSS — Ground |
| Pin produk F6 | VCC — Core supply voltage |
| Pin produk F7 | VCC — Core supply voltage |
| Pin produk F8 | DQ2 — Data I/O DQ2 |
| Pin produk G1 | NC — No connect |
| Pin produk G2 | NC — No connect |
| Pin produk G3 | A0 — Address input A0 |
| Pin produk G4 | A1 — Address input A1 |
| Pin produk G5 | A2 — Address input A2 |
| Pin produk G6 | A3 — Address input A3 |
| Pin produk G7 | A4 — Address input A4 |
| Pin produk G8 | A5 — Address input A5 |
| Pin produk H1 | NC — No connect |
| Pin produk H2 | NC — No connect |
| Pin produk H3 | VSS — Ground |
| Pin produk H4 | VSS — Ground |
| Pin produk H5 | VSS — Ground |
| Pin produk H6 | VCC — Core supply voltage |
| Pin produk H7 | VCCQ — I/O supply voltage |
| Pin produk H8 | DQ0 — Data I/O DQ0 |
Aplikasi Umum
RC28F128P33B85B cocok untuk 6 aplikasis: Embedded Boot ROM for Networking Equipment, Industrial Control Firmware Storage, Automotive Infotainment Code Storage, Legacy Parallel-Interface Embedded Designs, Firmware Update Storage with Redundancy, Test and Measurement Equipment Data Logging.
Embedded Boot ROM for Networking Equipment
The RC28F128P33B85B is well suited as the boot ROM in routers, switches and base stations because its 85 ns random access and 52 MHz synchronous burst mode support deterministic execute-in-place (XIP) at typical CPU clock speeds. The 16 Mbyte density stores full bootloaders plus secondary recovery images, and the read-while-write architecture enables firmware updates without taking the system offline. Its 2.5 V/3.3 V supply matches the legacy parallel bus found in many PowerPC and MIPS networking SoCs, eliminating level-translation overhead.
Direkomendasikan
Industrial Control Firmware Storage
In PLCs, HMIs and motor controllers, the RC28F128P33B85B stores application firmware plus configuration data with industrial -40C to +85C temperature grading. Its 33-bit on-die hardware ECC provides production-grade reliability for long-life industrial equipment, and the EasyBGA-64 (8x10 mm) compact footprint fits within densely populated control boards. Read-while-write allows live firmware patching without halting the control loop, which is critical for continuous-process industries.
Direkomendasikan
Automotive Infotainment Code Storage
Although the standard RC28F128P33B85B is industrial-grade (-40C to +85C) rather than AEC-Q100 qualified, it has historically been used in non-safety-critical automotive infotainment and telematics applications where its 128 Mbit density stores navigation maps, media assets and application code. Its parallel x16 bus delivers sufficient throughput for streaming audio/video metadata, and the EasyBGA-64 package withstands automotive thermomechanical stress. For safety-critical ADAS systems, an AEC-Q100 qualified alternative is required.
Direkomendasikan
Legacy Parallel-Interface Embedded Designs
Designers maintaining x86 embedded platforms, legacy PowerPC designs, or older MIPS controllers benefit from the RC28F128P33B85B's standard CFI parallel interface and multiplexed address/data bus. The 85 ns access time accommodates 25-40 MHz host bus frequencies without wait states, and the JEDEC CFI query protocol allows the bootloader to identify the part without proprietary commands. This makes it ideal for long-lifecycle designs in medical, defense and industrial automation where board respins are expensive.
Direkomendasikan
Firmware Update Storage with Redundancy
The RC28F128P33B85B's read-while-write feature makes it ideal for A/B firmware partition schemes where one bank holds the active image and another receives the update. The 128 Mbit density accommodates two complete 8 Mbyte firmware images plus a non-volatile configuration block. The 33-bit ECC engine corrects bit errors induced by long retention or radiation, which is essential for medical and aerospace systems where data integrity is non-negotiable.
Direkomendasikan
Test and Measurement Equipment Data Logging
Oscilloscopes, spectrum analyzers and data-acquisition systems leverage the RC28F128P33B85B for non-volatile capture storage where 128 Mbit holds hundreds of waveform records. Its 52 MHz synchronous burst read mode enables fast recall of stored captures to the display processor, and the hardware ECC preserves calibration constants against bit rot over the equipment's multi-decade service life. The industrial temperature rating suits bench and field-deployed instruments.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk RC28F128P33B85B — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | RC28F128P33B85A | RC28F128P33T85 | PC28F128P33B85 | S29GL128P11TFI020 | W29GL128CL7S |
|---|---|---|---|---|---|---|
| Brand | Intel (Rochester) | Micron Technology | Intel | Intel | Cypress Semiconductor | Winbond |
| Package | 64-EasyBGA (8x10) | 64-EasyBGA (8x10) - same | 64-EasyBGA (8x10) - same | 64-EasyBGA (8x10) - same | 64-EasyBGA (8x10) - same | 64-EasyBGA (8x10) - same |
| Memory Density | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit |
| Initial Access Time | 85 ns | 85 ns | 85 ns | 85 ns | 110 ns | 70 ns |
| Organization | 8M x 16 | 8M x 16 | 8M x 16 | 8M x 16 | 16M x 8 / 8M x 16 | 16M x 8 / 8M x 16 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 3.0V | 2.7V to 3.6V |
Diferensiator Kunci
- EasyBGA-64 with 33-bit on-die ECC (vsS29GL128P11TFI020 (Cypress))
- Read-While-Write partition banking (vsW29GL128CL7S (Winbond))
- CFI compliance with Intel legacy command set (vsW29GL128CL7S (Winbond))
Catatan Desain
EasyBGA-64 packages require PCB pad design per JEDEC BGA guidelines - use NSMD (non-solder-mask-defined) pads with 0.5 mm diameter and 1.0 mm pitch. Vias-in-pad with filled and plated-over copper are recommended for the inner balls to improve thermomechanical reliability and signal integrity for the multiplexed address/data bus. Reference the Intel StrataFlash P33 hardware design guide for the recommended 4-layer stackup.
The 52 MHz synchronous read mode requires series damping resistors (22-33 ohm) on DQ[15:0] near the flash to suppress reflections from the host memory controller. Trace length matching within 100 mils across the byte lane is essential. Place 0.1 uF X7R decoupling capacitors adjacent to every VCC and VCCQ ball, with bulk 4.7 uF tantalum or ceramic on each supply rail.
Do not assume RC28F128P33B85B software commands are pin-compatible with older P30 or Numonyx M28W parts - the command set, status register layout and CFI query structure changed in the P33 generation. Reprogram your flash translation layer (FTL) or device driver using the latest Intel specification upgrade command set. Failure to do so can corrupt blocks or yield unreliable ECC reports.
During program and erase operations, VCC current can spike to 50 mA per bank. Decoupling must hold VCC within 5% during these transients. Add a 10 uF bulk capacitor per EasyBGA device plus 0.1 uF bypass on every supply pin. Read-while-write operations require both banks to have independent decoupling; do not share bulk capacitors between parallel-mounted flashes.
Informasi Konformitas
RoHS compliant per LCSC and Lisleapex listings. Industrial temperature grade (-40C to +85C) is not AEC-Q100 qualified; select AEC-Q100 variant for safety-critical automotive.
