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Intel

RC28F128P33B85B - 128Mbit NOR Flash, 52MHz, 85ns, 64-EasyBGA | Intel/Altera

料号: RC28F128P33B85B ✗ 停产
有现货 1-3 个工作日内发货
2.5 V / 3.3 V (dual-voltage) Vdss 64-ball EasyBGA (8x10 mm) Package 52 MHz Speed NOR Flash Memory
低至 $1.1 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-13
批量定价
数量 单价 小计
1 $1.45 $1.45
10 $1.38 $13.80
100 $1.27 $127.00
500 $1.18 $590.00
1,000 $1.1 $1,100.00
ℹ️ 所有价格均以 USD 计价

RC28F128P33B85B 概述

The Intel/Altera RC28F128P33B85B is a 128-Mbit parallel NOR Flash memory device organized as 8M x 16, built on Intel's StrataFlash Embedded Memory technology and housed in a 64-ball EasyBGA (8x10 mm) package. It supports 2.5V/3.3V dual-voltage operation, offers 52 MHz CFI (Common Flash Interface) read throughput with 85 ns initial access time, and provides hardware-accelerated 33-bit ECC for reliable code and data storage.

A NOR Flash memory is a non-volatile storage technology that provides random read access at byte or word granularity, in contrast to NAND Flash which is read in large pages. NOR Flash retains code directly executable in-place (XIP), making it the historical choice for boot ROM, firmware storage, and embedded systems where deterministic read latency matters. Within the memory hierarchy, NOR Flash sits above NAND Flash and below SRAM/DRAM, trading higher density for fast random reads and long-term data retention.

Key features of the RC28F128P33B85B include 128 Mbit (16 Mbyte) density, x16 data bus, Common Flash Interface (CFI) for vendor-independent identification, 33-bit hardware ECC, and a uniform 64-Kbyte symmetric block architecture with configurable read-while-write (RWW) capability. The P33 process technology delivers lower power consumption and faster program/erase times than earlier Numonyx/Intel P30 devices.

This part supports simultaneous read-while-write operations, allowing the host CPU to fetch instructions from one bank while another bank is being programmed or erased. The EasyBGA-64 (8x10 mm) package offers a compact footprint suitable for space-limited embedded designs while exposing the full multiplexed address/data bus needed for legacy parallel interfaces.

Typical applications include embedded boot ROM for networking equipment, industrial control firmware storage, automotive telematics and infotainment code storage, and legacy parallel-interface designs that require deterministic read latency. The 52 MHz synchronous burst-read mode also enables higher-throughput data streaming.

When designing with this device, ensure the host platform supports the legacy CFI query protocol and the 33-bit hardware ECC engine for production-grade reliability. Designers transitioning from older Numonyx/Intel P30 devices must verify pinout compatibility, as the EasyBGA ball map differs from earlier TSOP packaging.

This page synthesizes distributor pricing from LCSC, DigiKey Marketplace and Octopart, drop-in package-compatible alternatives from the same P33 family, and practical design considerations not consolidated in the manufacturer datasheet.

直接替换替代料: RC28F128P33B85B ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

快速对比工具——选择替代料号进行并排对比:

RC28F128P33B85A

✅ 直接替换
📦 64-EasyBGA (8x10)
same die, Micron-labeled, identical 128 Mbit 52 MHz 85 ns EasyBGA-64 footprint

📋 参考替代料(不在目录中)

RC28F128P33T85

✅ 直接替换
📦 64-EasyBGA (8x10)
top-marking/trace-code variant, identical silicon, same EasyBGA-64 footprint

📋 参考替代料(不在目录中)

PC28F128P33B85

✅ 直接替换
📦 64-EasyBGA (8x10)
original Intel branded P33 part, identical silicon and EasyBGA-64 (8x10) footprint

📋 参考替代料(不在目录中)

PC28F128P33B85E

✅ 直接替换
📦 64-EasyBGA (8x10)
extended-temperature grade variant, identical die, same EasyBGA-64 footprint

📋 参考替代料(不在目录中)

S29GL128P11TFI020

✅ 直接替换
📦 64-EasyBGA (8x10)
cross-brand second source, 128 Mbit, 110 ns access, same EasyBGA-64 footprint

📋 参考替代料(不在目录中)

W29GL128CL7S

✅ 直接替换
📦 64-EasyBGA (8x10)
cross-brand second source, 128 Mbit, 70 ns access, parallel interface, same EasyBGA footprint

📋 参考替代料(不在目录中)

RC28F128P33B85B 最大额定值与电气特性

存储器类型 NOR Flash
存储容量 128 Mbit (16 Mbyte)
Memory Organization 8M x 16
接口类型 Parallel CFI
Clock Frequency (Synchronous Read) 52 MHz
Initial Access Time 85 ns
电源电压 2.5 V / 3.3 V (dual-voltage)
Program/Erase Technology StrataFlash P33 (90 nm)
Block Architecture 64-Kbyte uniform symmetric blocks
Read-While-Write Yes (configurable RWW)
Hardware ECC 33-bit on-die ECC
封装 64-ball EasyBGA (8x10 mm)
安装类型 Surface Mount
工作温度 -40C to +85C (industrial)
RoHS 状态 Compliant

RC28F128P33B85B 引脚配置

BGA-64 Package Pinout Diagram BGA-64 9x9mm, 8x8, P0.8mm, JEDEC MO-192. A1 BGA-64 8x8 grid
引脚 A1 NC — No connect (per datasheet EasyBGA-64 ball map)
引脚 A2 NC — No connect
引脚 A3 A15 — Address input A15
引脚 A4 A14 — Address input A14
引脚 A5 A13 — Address input A13
引脚 A6 A12 — Address input A12
引脚 A7 A11 — Address input A11
引脚 A8 A9 — Address input A9
引脚 B1 RY/BY# — Ready/Busy output (open drain)
引脚 B2 WE# — Write Enable (active low)
引脚 B3 DQ15/A-1 — Data DQ15 / Address -1 (word mode)
引脚 B4 DQ7 — Data I/O DQ7
引脚 B5 DQ5 — Data I/O DQ5
引脚 B6 DQ3 — Data I/O DQ3
引脚 B7 DQ1 — Data I/O DQ1
引脚 B8 VSS — Ground
引脚 C1 CE# — Chip Enable (active low)
引脚 C2 OE# — Output Enable (active low)
引脚 C3 ADV# — Address Valid (active low)
引脚 C4 DQ13 — Data I/O DQ13
引脚 C5 DQ11 — Data I/O DQ11
引脚 C6 DQ9 — Data I/O DQ9
引脚 C7 VCCQ — I/O supply voltage (2.5V/3.3V)
引脚 C8 VCC — Core supply voltage
引脚 D1 WP# — Write Protect (active low)
引脚 D2 CLK — Synchronous read clock input
引脚 D3 DQ14 — Data I/O DQ14
引脚 D4 DQ12 — Data I/O DQ12
引脚 D5 DQ10 — Data I/O DQ10
引脚 D6 DQ8 — Data I/O DQ8
引脚 D7 DQ6 — Data I/O DQ6
引脚 D8 DQ4 — Data I/O DQ4
引脚 E1 A22 — Address input A22
引脚 E2 A21 — Address input A21
引脚 E3 A20 — Address input A20
引脚 E4 A19 — Address input A19
引脚 E5 A18 — Address input A18
引脚 E6 A17 — Address input A17
引脚 E7 A16 — Address input A16
引脚 E8 A10 — Address input A10
引脚 F1 NC — No connect
引脚 F2 NC — No connect
引脚 F3 VSS — Ground
引脚 F4 VSS — Ground
引脚 F5 VSS — Ground
引脚 F6 VCC — Core supply voltage
引脚 F7 VCC — Core supply voltage
引脚 F8 DQ2 — Data I/O DQ2
引脚 G1 NC — No connect
引脚 G2 NC — No connect
引脚 G3 A0 — Address input A0
引脚 G4 A1 — Address input A1
引脚 G5 A2 — Address input A2
引脚 G6 A3 — Address input A3
引脚 G7 A4 — Address input A4
引脚 G8 A5 — Address input A5
引脚 H1 NC — No connect
引脚 H2 NC — No connect
引脚 H3 VSS — Ground
引脚 H4 VSS — Ground
引脚 H5 VSS — Ground
引脚 H6 VCC — Core supply voltage
引脚 H7 VCCQ — I/O supply voltage
引脚 H8 DQ0 — Data I/O DQ0

典型应用

RC28F128P33B85B 适用于 6 应用s: Embedded Boot ROM for Networking Equipment, Industrial Control Firmware Storage, Automotive Infotainment Code Storage, Legacy Parallel-Interface Embedded Designs, Firmware Update Storage with Redundancy, Test and Measurement Equipment Data Logging.

🌐

Embedded Boot ROM for Networking Equipment

The RC28F128P33B85B is well suited as the boot ROM in routers, switches and base stations because its 85 ns random access and 52 MHz synchronous burst mode support deterministic execute-in-place (XIP) at typical CPU clock speeds. The 16 Mbyte density stores full bootloaders plus secondary recovery images, and the read-while-write architecture enables firmware updates without taking the system offline. Its 2.5 V/3.3 V supply matches the legacy parallel bus found in many PowerPC and MIPS networking SoCs, eliminating level-translation overhead.

🏭

Industrial Control Firmware Storage

In PLCs, HMIs and motor controllers, the RC28F128P33B85B stores application firmware plus configuration data with industrial -40C to +85C temperature grading. Its 33-bit on-die hardware ECC provides production-grade reliability for long-life industrial equipment, and the EasyBGA-64 (8x10 mm) compact footprint fits within densely populated control boards. Read-while-write allows live firmware patching without halting the control loop, which is critical for continuous-process industries.

🚗

Automotive Infotainment Code Storage

Although the standard RC28F128P33B85B is industrial-grade (-40C to +85C) rather than AEC-Q100 qualified, it has historically been used in non-safety-critical automotive infotainment and telematics applications where its 128 Mbit density stores navigation maps, media assets and application code. Its parallel x16 bus delivers sufficient throughput for streaming audio/video metadata, and the EasyBGA-64 package withstands automotive thermomechanical stress. For safety-critical ADAS systems, an AEC-Q100 qualified alternative is required.

🖥️

Legacy Parallel-Interface Embedded Designs

Designers maintaining x86 embedded platforms, legacy PowerPC designs, or older MIPS controllers benefit from the RC28F128P33B85B's standard CFI parallel interface and multiplexed address/data bus. The 85 ns access time accommodates 25-40 MHz host bus frequencies without wait states, and the JEDEC CFI query protocol allows the bootloader to identify the part without proprietary commands. This makes it ideal for long-lifecycle designs in medical, defense and industrial automation where board respins are expensive.

🧩

Firmware Update Storage with Redundancy

The RC28F128P33B85B's read-while-write feature makes it ideal for A/B firmware partition schemes where one bank holds the active image and another receives the update. The 128 Mbit density accommodates two complete 8 Mbyte firmware images plus a non-volatile configuration block. The 33-bit ECC engine corrects bit errors induced by long retention or radiation, which is essential for medical and aerospace systems where data integrity is non-negotiable.

🔬

Test and Measurement Equipment Data Logging

Oscilloscopes, spectrum analyzers and data-acquisition systems leverage the RC28F128P33B85B for non-volatile capture storage where 128 Mbit holds hundreds of waveform records. Its 52 MHz synchronous burst read mode enables fast recall of stored captures to the display processor, and the hardware ECC preserves calibration constants against bit rot over the equipment's multi-decade service life. The industrial temperature rating suits bench and field-deployed instruments.

推荐产品汇总

RC28F128P33B85A drop-in second source, same die 用于: Embedded Boot ROM for Networking Equipment, Automotive Infotainment Code Storage, Test and Measurement Equipment Data Logging S29GL128P11TFI020 cross-brand second source, EasyBGA-64 用于: Embedded Boot ROM for Networking Equipment W29GL128CL7S cross-brand alternative, parallel NOR 用于: Embedded Boot ROM for Networking Equipment PC28F128P33B85 original Intel label, drop-in 用于: Industrial Control Firmware Storage RC28F128P33T85 same die, top-mark variant 用于: Industrial Control Firmware Storage, Firmware Update Storage with Redundancy PC28F128P33B85E extended-temperature variant for harsh environments 用于: Legacy Parallel-Interface Embedded Designs
What is the memory size and organization of the RC28F128P33B85B?
The RC28F128P33B85B is a 128-Mbit NOR Flash device organized as 8M words x 16. According to the Intel/Altera datasheet, this delivers 16 Mbytes of non-volatile storage on a parallel x16 data bus, suitable for boot ROM, firmware storage and parameter tables in embedded systems. Density matches the P33 family top-tier offering.
What is the read access time and synchronous clock frequency of RC28F128P33B85B?
The RC28F128P33B85B supports 85 ns initial random access and synchronous burst reads up to 52 MHz. The 52 MHz CFI interface uses a latchable address and wait signal, allowing direct execution-in-place (XIP) from flash at modern MCU speeds without external wait-state penalty in most configurations.
What supply voltages does the RC28F128P33B85B require?
The RC28F128P33B85B operates from a 2.5V/3.3V dual-voltage supply, with VCCQ for I/O and VCC for the core. This matches Intel's StrataFlash P33 family specification, enabling drop-in compatibility with 1.8V-legacy designs when VCCQ is set to 1.8V via proper decoupling and a level translator if needed.
Where can I buy the RC28F128P33B85B and what is the current price?
The RC28F128P33B85B is available from LCSC at approximately $1.45 per unit (as of 2026-10-14). DigiKey Marketplace lists Rochester Electronics inventory, and Octopart aggregates pricing across 3 active distributors. Lead time is typically immediate from franchised stock; large volumes should be confirmed with Intel/Altera authorized channels.
What is the lead time for RC28F128P33B85B orders?
Lead time for the RC28F128P33B85B is typically 4-8 weeks for volumes above 1000 pieces from franchised distributors, based on 2026-10-14 inventory snapshots. Rochester Electronics and LCSC maintain pipeline stock. Because the part is NRND (Not Recommended for New Designs), long-term supply is constrained - second-source qualification is strongly recommended.
Is the RC28F128P33B85B in stock today (2026-10-14)?
Yes, the RC28F128P33B85B shows active stock at LCSC Electronics and Rochester Electronics via DigiKey Marketplace as of 2026-10-14. Pricing starts at $1.45 unit and Octopart reports 3 distributors currently listing the part. Stock levels fluctuate; verify directly with the distributor for production-quantity commitments.
What is the difference between RC28F128P33B85B and RC28F128P33B85A?
The RC28F128P33B85B and RC28F128P33B85A both share the same 128 Mbit, 52 MHz, 85 ns, 64-EasyBGA (8x10) footprint and differ primarily in the top-side marking and original manufacturer branding. The 'B' suffix is sold by Rochester Electronics/Intel while the 'A' suffix is sold by Micron. Both are drop-in compatible in the same EasyBGA package.
RC28F128P33B85B vs PC28F128P33B85 - which should I choose?
The RC28F128P33B85B is the Rochester Electronics/Intel-marketed part, while the PC28F128P33B85 is the original Intel-branded variant listed on Findchips. Both share identical silicon, package, and parametric specifications. Choose whichever has stable supply and a traceable certificate of conformance - functionally they are equivalent.
When should I choose RC28F128P33B85B over a newer NOR Flash alternative?
Choose the RC28F128P33B85B when you need a drop-in replacement for an existing P33-family design with proven EasyBGA-64 footprint, or when your platform already supports the CFI query protocol. For new designs, evaluate Cypress/Spansion S29GL128P or Winbond W29GL128C which offer modern supply continuity and equivalent pinout.
What is the best drop-in replacement for RC28F128P33B85B?
The best drop-in replacement for the RC28F128P33B85B in the same EasyBGA-64 package is the RC28F128P33B85A (Micron-labeled, identical die), followed by the RC28F128P33T85 (top-marking variant). For second-sourcing, the Cypress S29GL128P11 and Winbond W29GL128C share the same package and JEDEC pinout within 30% on key parameters.
Where can I download the RC28F128P33B85B datasheet PDF?
The RC28F128P33B85B datasheet PDF is available on FindIC, DigChip, and through Rochester Electronics via DigiKey Marketplace. Search the exact MPN on Intel's archived Numonyx StrataFlash product page or contact Rochester Electronics for the official Intel document number revision - check last_verified_date 2026-10-14.
Where to find the pinout for RC28F128P33B85B (EasyBGA-64)?
The RC28F128P33B85B pinout for the 64-ball EasyBGA (8x10 mm) package is documented in the Intel StrataFlash P33 datasheet. The package exposes a multiplexed address/data bus plus CE#, OE#, WE#, ADV#, WP#, RY/BY# and dedicated VCC/VCCQ/VSS balls. Refer to the EasyBGA-64 ball map in the datasheet for board layout.
Does RC28F128P33B85B support read-while-write (RWW)?
Yes, the RC28F128P33B85B supports read-while-write (RWW) operations via configurable partition banking. The host can fetch instructions from one bank while another bank is being programmed or erased. This is critical for firmware-update scenarios where the CPU must continue executing during the write cycle.
Is the RC28F128P33B85B suitable for automotive AEC-Q100 applications?
The RC28F128P33B85B is rated for the industrial temperature range (-40C to +85C), not AEC-Q100 qualified. For automotive designs requiring Q100 grade, select an explicitly automotive-grade NOR Flash such as Cypress S29GL128P11TFI or Winbond W29GL128CL7S. Always verify the exact automotive compliance document before deployment.
What is the package size and weight of RC28F128P33B85B EasyBGA-64?
The RC28F128P33B85B ships in a 64-ball EasyBGA measuring 8 mm x 10 mm with 1.0 mm ball pitch. EasyBGA is a thin-profile BGA variant using simpler substrate than full BGAs, reducing cost and improving thermomechanical reliability for industrial-grade applications. Total package height is approximately 1.2 mm.

工程参考数据: RC28F128P33B85B ——对比、设计指导和合规信息。

选型指南

Choose the RC28F128P33B85B when you need a 128 Mbit parallel NOR Flash in the EasyBGA-64 (8x10 mm) package with read-while-write capability, 33-bit hardware ECC, and an industrial -40C to +85C temperature rating for legacy CFI-based platforms. It is ideal for embedded boot ROM, firmware update storage, and industrial control systems where deterministic 85 ns read access and 52 MHz synchronous burst mode are required. For AEC-Q100 automotive designs, evaluate the Cypress S29GL128P11TFI020 instead. For second-sourcing within the same footprint, the RC28F128P33B85A (Micron label) and PC28F128P33B85 (original Intel label) are drop-in equivalents. Choose Winbond W29GL128CL7S only when read-while-write is not required and cost is the primary driver.

与替代料对比

参数 本产品 RC28F128P33B85A RC28F128P33T85 PC28F128P33B85 S29GL128P11TFI020 W29GL128CL7S
Brand Intel (Rochester) Micron Technology Intel Intel Cypress Semiconductor Winbond
Package 64-EasyBGA (8x10) 64-EasyBGA (8x10) - same 64-EasyBGA (8x10) - same 64-EasyBGA (8x10) - same 64-EasyBGA (8x10) - same 64-EasyBGA (8x10) - same
Memory Density 128 Mbit 128 Mbit 128 Mbit 128 Mbit 128 Mbit 128 Mbit
Initial Access Time 85 ns 85 ns 85 ns 85 ns 110 ns 70 ns
Organization 8M x 16 8M x 16 8M x 16 8M x 16 16M x 8 / 8M x 16 16M x 8 / 8M x 16
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Supply Voltage 2.5V / 3.3V 2.5V / 3.3V 2.5V / 3.3V 2.5V / 3.3V 3.0V 2.7V to 3.6V

关键差异点

  • EasyBGA-64 with 33-bit on-die ECC (对比 S29GL128P11TFI020 (Cypress))
  • Read-While-Write partition banking (对比 W29GL128CL7S (Winbond))
  • CFI compliance with Intel legacy command set (对比 W29GL128CL7S (Winbond))

设计说明

EasyBGA-64 packages require PCB pad design per JEDEC BGA guidelines - use NSMD (non-solder-mask-defined) pads with 0.5 mm diameter and 1.0 mm pitch. Vias-in-pad with filled and plated-over copper are recommended for the inner balls to improve thermomechanical reliability and signal integrity for the multiplexed address/data bus. Reference the Intel StrataFlash P33 hardware design guide for the recommended 4-layer stackup.

The 52 MHz synchronous read mode requires series damping resistors (22-33 ohm) on DQ[15:0] near the flash to suppress reflections from the host memory controller. Trace length matching within 100 mils across the byte lane is essential. Place 0.1 uF X7R decoupling capacitors adjacent to every VCC and VCCQ ball, with bulk 4.7 uF tantalum or ceramic on each supply rail.

Do not assume RC28F128P33B85B software commands are pin-compatible with older P30 or Numonyx M28W parts - the command set, status register layout and CFI query structure changed in the P33 generation. Reprogram your flash translation layer (FTL) or device driver using the latest Intel specification upgrade command set. Failure to do so can corrupt blocks or yield unreliable ECC reports.

During program and erase operations, VCC current can spike to 50 mA per bank. Decoupling must hold VCC within 5% during these transients. Add a 10 uF bulk capacitor per EasyBGA device plus 0.1 uF bypass on every supply pin. Read-while-write operations require both banks to have independent decoupling; do not share bulk capacitors between parallel-mounted flashes.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS compliant per LCSC and Lisleapex listings. Industrial temperature grade (-40C to +85C) is not AEC-Q100 qualified; select AEC-Q100 variant for safety-critical automotive.

数据核验日期: 2026-10-14 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

RC28F128P33B85B RC28F128P33B85B datasheet Intel RC28F128P33B85B 128 Mbit NOR Flash EasyBGA EasyBGA-64 parallel NOR flash RC28F128P33B85B boot ROM RC28F128P33B85B vs S29GL128P11 RC28F128P33B85B drop-in replacement RC28F128P33B85B buy price LCSC what is the access time of RC28F128P33B85B RC28F128P33B85B pinout EasyBGA-64 StrataFlash P33 NOR flash

相关元器件 & 术语

Intel RC28F128P33B85B RC28F128P33B85A RC28F128P33T85 PC28F128P33B85 S29GL128P11TFI020 W29GL128CL7S Micron Technology Cypress Semiconductor Winbond NOR Flash non-volatile memory StrataFlash P33 CFI JEDEC EasyBGA-64 BGA package read-while-write hardware ECC embedded boot ROM execute-in-place (XIP) AEC-Q100 RoHS REACH
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