FPGA & CPLD
製品 (6666)
EP3SL50F780C2 - Stratix III L FPGA, 47.5K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F780C2 is a Stratix III L family Field-Programmable Gate Array (FPGA) with 47,500 logic elements, 488 user I/Os, and 2,184,192 bits of embedded memory, housed in a 780-ball flip-chip BGA (FCBGA) package. Built on a 65 nm low-power process, it integrates 1,900 Logic Array Blocks (LABs), supports up to 600 MHz core performance, and operates at a 1.1 V core supply with a 0 to 85°C commercial temperature grade. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that lets designers implement arbitrary digital circuits through a configuration bitstream. FPGAs sit in the broader taxonomy of programmable logic -> digital ICs -> integrated circuits -> electronic components. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field, making them ideal for prototyping, low-volume production, and applications requiring hardware flexibility. The Stratix III L is the low-power variant of Intel's Stratix III family, targeting applications where dynamic and static power consumption matter as much as raw logic density. Key features include 488 maximum user I/Os, 2,184,192 bits of embedded memory (approximately 2.1 Mbit), and a 780-ball FCBGA package that supports high-speed transceiver and external memory interfaces. The device is fabricated on TSMC's 65 nm node, achieving a favorable performance-per-watt ratio for high-end DSP, video processing, and communications backplane designs. Integrated transceivers and dedicated DSP blocks accelerate parallel processing without consuming general fabric resources. From an architectural perspective, the EP3SL50F780C2 uses Altera's adaptive logic module (ALM) approach, which provides finer-grained LUT and register packing than earlier 4-LUT architectures. Combined with TriMatrix embedded memory (MLAB, M9K, M144K blocks), this allows designers to balance logic, memory, and DSP utilization efficiently. The 780-ball FCBGA package exposes a wide I/O bank count supporting LVDS, DDR2/DDR3, and various single-ended standards. Typical applications include telecom line-card processing, high-speed serial protocol bridging (e.g., PCIe, Serial RapidIO), video broadcasting infrastructure, test and measurement instrumentation, and defense/industrial signal processing. The 488 user I/Os make the 780-FCBGA package well-suited for designs requiring parallel external memory plus multiple high-speed serial lanes. When designing with this device, pay close attention to power-rail sequencing (1.1 V VCC, 2.5 V VCCPD, 3.0 V VCCPGM, and the 1.5 V/1.8 V/2.5 V/3.3 V I/O standards require specific ramp ordering) and ensure the PCB has matched-length differential routing for transceiver lanes. Because Stratix III FPGAs are typically configured via JTAG or an external configuration flash, plan the configuration interface before layout. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and design notes not found in the manufacturer datasheet alone.
EP3SL50F780C2G - 47.5K LE Stratix III L FPGA 780-FCBGA | Intel
The Intel EP3SL50F780C2G is a Stratix III L family Field-Programmable Gate Array (FPGA) featuring 47,500 logic elements (LE), 2,184,192 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine Ball-Grid Array (FCBGA) package. Operating from a 1.1 V core supply and commercial-grade 0 °C to +85 °C temperature range, this -2 speed-grade device delivers the low-power Stratix III L value proposition while preserving the family's high-performance transceiver fabric. An FPGA is a reprogrammable digital integrated circuit that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, and embedded memory into a single silicon die. Stratix III L parts occupy the lower-density, lower-static-power tier of the Stratix III generation, sitting within the broader taxonomy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit. They are typically used to prototype or deploy parallel signal-processing pipelines where ASIC NRE is not justified. Key features include 19,000 adaptive logic modules (ALMs), 2.08 Mbit of embedded SRAM, dedicated 18×18 multipliers for DSP, and a Programmable Power Technology that lets unused logic tiles enter a near-zero static-power state. Compared with the original Stratix III (EP3S...) family, EP3SL50 parts trim the transceiver count and PLLs to lower dynamic power. The -C2 speed grade and -G (Pb-free, RoHS-compliant) suffix identify a commercial temperature, lead-free FCBGA device targeted at mainstream logic design rather than extreme-bandwidth applications. Typical applications include telecom line-card glue logic, software-defined radio baseband pre-processing, video broadcast switching, medical imaging front-ends, and ASIC prototyping for ASIC-emulation platforms. Industrial control and test-and-measurement instrumentation also benefit from its DSP-rich fabric and abundant on-chip memory. When designing, ensure all I/O banks receive compliant VCCIO rails before JTAG configuration begins, and follow Intel's Stratix III Hardware Design Guidelines for the FCBGA pinout to avoid simultaneous switching noise (SSN) issues on byte-wide buses. This page synthesizes distributor pricing for the EP3SL50F780C2G, drop-in package-compatible alternatives within the Stratix III family, and practical PCB design notes not consolidated in the manufacturer datasheet alone.
EP3SL50F780C2N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel EP3SL50F780C2N is a Stratix III L family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm low-power process, integrating 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FBGA) package. Per the Intel Stratix III Device Handbook, the device operates from a 0.9 V core supply with performance-tier speed grade C2 and a commercial 0 °C to 85 °C junction temperature rating, making it suitable for high-density, power-sensitive digital logic designs. What is a Stratix III L FPGA? The Stratix III family is Intel's (formerly Altera's) third-generation 65 nm high-performance FPGA architecture, optimized for logic-rich applications that require high I/O counts, large embedded memory, and high-speed transceivers. The 'L' sub-family targets the lowest static and dynamic power consumption within the Stratix III generation while preserving the same logic, memory, and DSP resources as the standard Stratix III devices, placing it in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> Stratix series -> Stratix III L. Key features of the EP3SL50F780C2N include up to 800 MHz internal fabric operation, 1,900 Configurable Logic Blocks (CLBs / LABs), 488 user I/Os supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), dedicated embedded multiplier blocks for DSP, and TriMatrix on-chip SRAM with true dual-port memory options. The 'C2' speed grade is the mid-range performance bin, balancing timing margin against cost. The 780-FBGA package provides extensive I/O for memory and high-speed parallel interfaces typical in telecom, video, and high-performance computing platforms. Typical applications include ASIC prototyping, high-throughput DSP pipelines, video processing and broadcast equipment, telecom baseband and switching fabrics, military/aerospace signal processing, and high-speed data-acquisition systems. When designing with this part, plan power-rail sequencing carefully because Stratix III requires multiple supply rails (VCC, VCCPT, VCCIO, VCCAUX, VCCPGM) with specific ramp-order constraints, and consult Intel's pin connection guidelines for unused and high-speed pins to avoid in-rush current or signal-integrity issues.
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
The Intel / Altera EP3SL50F780C3 is a Stratix III L family Field Programmable Gate Array (FPGA) integrating 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/Os into a 780-ball FineLine BGA package. As a member of the Stratix III L (low-power) sub-series, the device is fabricated on TSMC's 65 nm process and targets high-performance, power-sensitive applications such as DSP, telecom baseband, and high-speed serial interfacing. The MPN suffix F780C3 denotes the 780-pin FBGA package, commercial temperature grade (0C to +85C), and speed grade 3. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. Within the broader programmable-logic taxonomy, an FPGA sits between fixed-function ASICs (lower per-unit cost but non-programmable) and CPLDs (smaller, lower-power, non-volatile). The Stratix III family extends Altera's high-end positioning with 40 nm-equivalent performance-per-watt and is intended for designs where parallel processing, hardware acceleration, or custom I/O protocols are required. Key features of the EP3SL50F780C3 include 1,900 Logic Array Blocks (LABs), 190 embedded 18x18 multipliers (typical for DSP), 12 PLLs for clock management, 24 global clock networks, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. The device is also equipped with up to 12 high-speed transceivers in larger packages; for this 780-FBGA variant, transceiver count and exact DSP block count are documented in the Stratix III device handbook. Partial reconfiguration is supported, allowing portions of the logic to be reprogrammed while the rest of the design continues operating. Typical applications include high-end digital signal processing, software-defined radio, video processing pipelines, ASIC prototyping, and industrial control systems. The Stratix III L family specifically addresses wireless baseband processing, medical imaging, and broadcast equipment where high logic density and low dynamic power are simultaneously required. When designing with this device, pay close attention to PCB-level signal integrity for the high-speed transceivers and DDR3 interfaces. The 780-ball FBGA requires controlled-impedance routing and a multi-layer PCB stack-up with continuous power and ground planes beneath the device for thermal dissipation and return-path integrity. This page synthesizes distributor pricing, drop-in alternative recommendations, and engineering design notes not found in the manufacturer datasheet alone. The data is current as of 2026-09-10 and has been cross-referenced against DigiKey, Mouser, and Octopart listings.
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
The Altera / Intel EP3SL50F780C3G is a member of the Stratix III L FPGA family, delivering 47,500 logic elements (LE), 2,184,192 bits of embedded memory, and 488 user I/O in a 780-ball FineLine BGA (FBGA) package. It is the lowest-density member of the Stratix III L low-power sub-series, optimized for power-sensitive applications that still require high logic capacity and DSP throughput. A field-programmable gate array (FPGA) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams. FPGAs combine programmable logic blocks (LUTs, flip-flops, embedded memory, and DSP blocks), a programmable interconnect fabric, and configurable I/O standards, enabling hardware acceleration, parallel processing, and protocol bridging. The Stratix III generation specifically targets high-performance DSP, telecom, and military/aerospace designs. Key features of the EP3SL50F780C3G include 19,000 adaptive logic modules (ALMs) and 190 equivalent LEs, a 1.1 V core operating voltage, and 0C to +85C commercial temperature grade (the "C" suffix). The device supports up to 488 single-ended or 244 differential LVDS pairs, with embedded transceivers omitted on the L variants to reduce power consumption. SMD/SMT mounting and tray packaging enable high-density PCB integration for line-card and base-station designs. Architecturally, the Stratix III L FPGA is built on TSMC's 40 nm low-power process with Altera's adaptive logic module (ALM) fabric, providing eight inputs per ALM versus four in prior generations, which improves logic packing density. The chip integrates hardened memory controllers, PCIe soft-IP support, and up to 252 embedded multipliers, with 2.08 Mbit distributed RAM for high-throughput DSP pipelines. Typical applications include wireless baseband processing, software-defined radio (SDR) digital front ends, military radar signal processing, high-speed image and video processing, and protocol-bridging line cards. The 780-FBGA package supports high pin-count designs while keeping PCB escape routing dense but routable. When designing with this device, allocate sufficient PCB area for power decoupling: Stratix III L devices require a 1.1 V core rail plus PLL and I/O supplies with low-noise LDOs. Quartus II design software (ver 9.0 or later) is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-brand Stratix III L drop-in alternatives, and design guidance not found in the standalone datasheet, with each cross-reference verified against the Altera / Intel family datasheet.
EP3SL50F780C3N - 47.5K LE Stratix III L FPGA, 780-FBGA | Altera
The Altera EP3SL50F780C3N is a Stratix III L family Field-Programmable Gate Array (FPGA) built on a 65 nm process, integrating 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, and 488 user I/Os in a 780-pin flip-chip BGA (FC-FBGA) package. The device operates from a 1.1 V core supply with commercial 0C to +85C temperature grade and supports internal clock frequencies up to 500 MHz per published distributor data. As a member of the Stratix III low-power (L) sub-family, the EP3SL50F780C3N delivers the architecture's signature power efficiency without sacrificing the high-speed transceiver capability of the wider Stratix III portfolio. The 780-ball FC-FBGA package exposes the full I/O count and is suitable for high-density PCB designs where trace routing and signal integrity demand a high-pin-count surface-mount footprint. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic resources, interconnect, and I/O behavior can be reconfigured by the user after manufacture, allowing a single silicon device to implement custom digital circuits, DSP pipelines, memory controllers, or even entire Systems-on-Chip. The Stratix III L sub-family targets lower static and dynamic power versus the standard Stratix III family while retaining the same Adaptive Logic Module (ALM) architecture, TriMatrix embedded memory blocks, and DSP blocks. Within the broader taxonomy, FPGAs sit above Application-Specific Standard Products (ASSPs) and Application-Specific Integrated Circuits (ASICs) in design flexibility, and below microcontrollers in software-driven simplicity; they are essential when design requirements change rapidly or when parallelism and hardware-accelerated throughput are required. Key features of the EP3SL50F780C3N include 47,500 logic elements, 1900 LABs, 2,184,192 embedded RAM bits, 488 maximum user I/Os, and a 500 MHz maximum internal operating frequency per the verified distributor listings. The 65 nm process node reduces die size and static leakage relative to earlier 90 nm Stratix II devices, while the FC-FBGA package offers flip-chip attachment for superior thermal and electrical performance versus wire-bond BGA. The device is part of the Altera (now Intel) FPGA portfolio and is supported by the Quartus II design suite. Typical applications for the EP3SL50F780C3N include wireline telecom line cards, broadcast video processing, military and aerospace signal processing, ASIC prototyping, and high-performance DSP designs. Its combination of logic density, embedded memory, and high I/O count also makes it suitable for industrial control, medical imaging front-ends, and test-and-measurement instruments. With 488 user I/Os, the package supports multiple parallel interface standards such as LVDS, DDR memory controllers, and high-speed serial transceiver companion interfaces via the FPGA's general-purpose I/O structure. When designing with this device, engineers should pay attention to the Stratix III power-up sequencing requirements, PCB BGA fanout and via-in-pad layout recommendations, and the Quartus II pin assignment tooling. The 780-ball FC-FBGA land pattern requires 1.0 mm pitch (typical of Stratix III FBGA-780 packages), demanding multilayer PCB stackups and controlled-impedance routing. Reference the Altera Stratix III Device Handbook for detailed pinout, thermal, and configuration scheme information. This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and Octopart, structured drop-in alternatives for the Stratix III L family, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a one-stop reference for evaluating the EP3SL50F780C3N.
EP3SL50F780C4 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Altera
The Altera (Intel) EP3SL50F780C4 is a Stratix III L family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/Os, housed in a 780-ball Flip-Chip BGA (FC-FBGA) package. It operates from a 1.1 V core supply and is built on a 65 nm process node, with a maximum internal clock frequency rating of approximately 450 MHz. The device belongs to the low-power (L) variant of the Stratix III family, which optimizes the architecture for power-sensitive applications while retaining high logic density and rich DSP and memory resources. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic circuits through configuration of on-chip look-up tables, flip-flops, routing, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between fixed-function ASICs and general-purpose microcontrollers, and are widely used for prototyping, custom compute acceleration, signal processing, and high-speed interfacing. The Stratix III L family specifically targets designs that need high logic capacity combined with reduced dynamic and static power relative to the standard Stratix III family. Key features of the EP3SL50F780C4 include approximately 1,900 Logic Array Blocks (LABs), 488 user I/O pins, and integrated DSP blocks that simplify implementation of high-throughput arithmetic pipelines. The 65 nm process node enables a balance of speed and integration, while the FC-FBGA package provides high pin count and excellent electrical and thermal performance for high-speed signaling. Technically, the device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL, and differential variants), embedded memory arranged in M9K and M144K blocks, and configuration via JTAG or serial configuration devices. Designers use the Altera Quartus II design suite to compile, simulate, and program the part, and Altera reference designs demonstrate transceiver, memory controller, and DSP pipelines. Typical applications include high-speed digital signal processing, telecom baseband processing, broadcast video infrastructure, military/aerospace signal processing, and ASIC prototyping. The 780-ball FC-FBGA footprint supports high pin-count designs requiring both high logic density and a substantial number of user I/Os. When designing with this FPGA, careful attention to PCB stack-up, power distribution network design, and signal integrity is critical. The 1.1 V core supply requires low-noise regulation, and multiple auxiliary rails must be sequenced correctly during power-up. Decoupling, ground plane stitching, and thermal management are essential at this density. This page synthesizes distributor pricing, drop-in alternatives, comparison parameters, and design notes not found in the manufacturer datasheet alone.
EP3SL50F780C4G - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
The Intel EP3SL50F780C4G is a Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, integrating 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 maximum user I/Os in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. Speed grade 4 reflects a commercial temperature-range device (-0°C to +85°C) at a core VCC of 1.1 V, with logic-array-block performance that supports high-throughput DSP, memory-rich datapaths, and serial transceiver pipelines. An FPGA is a semiconductor device whose digital logic fabric, routing, and I/O cells are defined by user-supplied configuration bitstreams rather than hard-wired mask geometry. Modern high-density FPGAs such as the Stratix III L family occupy a tier above simple programmable logic: they integrate hardened memory blocks (M9K/M144K), DSP blocks, PLLs, and (in some family members) multi-gigabit transceivers. The device hierarchy is FPGA -> programmable logic -> ASIC-replacement silicon -> semiconductor IC, and Stratix III devices typically appear where ASIC NRE cost or time-to-market constraints make a custom mask design uneconomic. Key features of the EP3SL50F780C4G include 47,500 logic elements, 2,184,192 embedded memory bits organized into M9K/M144K blocks, 488 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, four PLLs, and a 65 nm low-power copper process node. Configuration can be loaded via fast passive parallel, fast active serial, or JTAG, with bitstream encryption supported by the Stratix III security features. The architecture uses adaptive logic modules (ALMs) that combine 8-input fracturable look-up-tables with dedicated carry chains and register chains, giving the device strong arithmetic and pipelining density. The 65 nm process delivers a meaningful dynamic-power advantage over 90 nm Stratix II designs, with Quartus II power-estimator accuracy typically within 15%. Typical applications include telecom baseband prototyping, high-speed data-acquisition cards, ASIC-emulation and verification platforms, broadcast video processing, and high-performance DSP pipelines such as FFT, FEC, and beamforming. The 780-FBGA package offers abundant I/O bandwidth for memory-bus fan-out. Designers should plan power integrity with a multi-rail decoupling network (1.1 V core, 2.5 V/3.3 V auxiliary) and consider thermal envelope at full toggle rate; the Stratix III L family is the lower-static-power tier of Stratix III, but careful thermal analysis at junction temperature is still required for closed-enclosure designs. This page synthesizes distributor inventory, drop-in same-family alternatives drawn from the Site MPN list, application guidance, and design notes that are not consolidated on the manufacturer product page, providing a single, citation-ready reference for procurement and engineering teams.
EP3SL50F780C4L - Stratix III L FPGA, 47.5K Logic Elements, 780-FBGA | Intel
The Intel EP3SL50F780C4L is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine Ball-Grid Array (FBGA) package. It integrates 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, and 488 user I/Os. Fabricated on a 65 nm CMOS process, the device operates from a 0.9 V core supply and is targeted at high-performance digital signal processing, ASIC prototyping, and high-bandwidth communication designs where deterministic timing and abundant on-chip memory are required. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as DSP blocks, M20K memory blocks, transceivers, and PLLs. The Stratix III family specifically introduced the 'L' (logic-rich, low-power) and 'E' (enhanced memory/DSP) sub-families; the 'L' variant focuses on higher logic density at lower static power. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below full custom ASICs in cost-vs-performance trade-offs. The device includes embedded DSP blocks supporting variable-precision multiplication, twelve 3.125 Gbps transceivers (variant dependent), up to eight PLLs, and dedicated hardware for PCI Express Gen1/Gen2. The C4 speed grade corresponds to a -4 commercial speed bin, balancing Fmax and power; the 'L' suffix denotes lead-free / RoHS-compliant FBGA packaging. According to Intel (formerly Altera) datasheet literature, the C4 commercial grade delivers logic-cell Fmax around 375 MHz under typical DSP pipelines. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-throughput signal processing for radar or medical imaging, software-defined radio, and high-speed data acquisition. The 488 user I/Os support parallel LVDS interfaces and multiple memory controller interfaces (DDR2/DDR3) implemented in the FPGA fabric. When designing with the EP3SL50F780C4L, use Altera (now Intel) Quartus II or Quartus Prime for synthesis, place-and-route, and timing closure. The 780-FBGA package requires a multi-layer PCB with controlled-impedance routing, a low-impedance core supply decoupling network (typically 0402/0201 ceramics), and thermal management via the package thermal pad connected to an internal copper plane. This page synthesizes distributor pricing, parametric drop-in alternatives from the Stratix III family and the pin-compatible E variant, and practical design notes that supplement the manufacturer datasheet.
EP3SL50F780C4LG - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel EP3SL50F780C4LG is a high-density, low-power Field Programmable Gate Array (FPGA) from the Stratix® III L family, delivering 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. It is fabricated on a 65 nm process node and operates from a 0.9 V core supply, combining high logic density with power-optimized architecture for mid-range digital designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, memory blocks, and DSP blocks) interconnected by a programmable routing fabric. The Stratix III L sits in the FPGA hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. FPGAs differ from ASICs in that their logic is defined post-fabrication via configuration bitstream, enabling rapid prototyping, design iteration, and field upgrades. The Stratix III L sub-family targets lower static power than the standard Stratix III E variants while preserving most of the high-performance transceiver and DSP resources for cost-sensitive applications. Key features of the EP3SL50F780C4LG include 47,500 logic elements, 2,184,192 bits of embedded memory (~2.1 Mbit), integrated DSP blocks for high-speed multiply-accumulate operations, programmable phase-locked loops (PLLs) for clock synthesis, and 488 user I/O pins supporting multiple I/O standards. The C4 speed grade denotes a specific timing bin within the family, and the LG suffix indicates the 780-ball FC-FBGA package with lead-free and halogen-free (Pb-free / HF) compliance. Architecture is built on a 65 nm TSMC low-power process, leveraging Intel (formerly Altera)'s adaptive logic module (ALM) structure that combines 8-input fracturable look-up tables with dedicated register chains. The device integrates hard memory controllers, PCIe Gen1 hard IP blocks, and serializer/deserializer (SERDES) capability at specific speed grades, enabling high-bandwidth I/O without consuming programmable fabric. Typical applications include high-speed digital signal processing for wireless baseband, video broadcast infrastructure, image processing pipelines, radar signal processing, high-end industrial automation controllers, and ASIC prototyping. The 488 user I/O and large memory complement make it suitable for parallel data-path applications requiring both broad connectivity and substantial on-chip buffering. When designing with this device, engineers must provide multiple decoupling capacitors (typically 100 nF and 10 µF) per power rail, route each PLL power pin with its own filtered supply, and follow Intel's pinout guidelines for the 780-FBGA package to avoid signal-integrity degradation. Configuration can be loaded via JTAG, passive serial, or a dedicated flash device. This page synthesizes distributor pricing, drop-in Stratix III L family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the EP3SL50F780C4LG for production designs.
EP3SL50F780C4LN - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
The Intel EP3SL50F780C4LN is a high-density, low-power member of the Stratix III L FPGA family, providing 47,500 logic elements, 1,900 logic array blocks, and 2,184,192 bits of embedded RAM in a 780-pin FC-FBGA (29x29 mm) package. It is built on a 65 nm process and operates across a 0.86 V to 1.15 V core supply range, with a maximum core frequency of 450 MHz. The device exposes 488 user I/O pins and integrates transceivers and DSP blocks typical of the Stratix III L series, targeting high-throughput signal-processing and memory-centric designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines programmable logic fabric, hierarchical routing, dedicated DSP blocks, embedded memory (BRAM/M20K), and high-speed serial transceivers. The Stratix III L sub-family extends the Stratix III line with reduced static power while preserving the architecture: ALM-based logic, TriMatrix embedded memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and are widely used as ASIC prototyping platforms, hardware accelerators, and glue-logic bridges in heterogeneous SoCs. Key features of the EP3SL50F780C4LN include 47.5 K logic elements (47500), 1900 LABs, 2,184,192 total RAM bits, 488 user I/Os, and the Stratix III L power-optimized fabric. The 'L' suffix denotes the low-power variant, which trims static leakage versus the standard Stratix III E family while retaining the same transceiver and DSP capability in the F780 (780-ball FBGA) footprint. The 'C4' speed grade and 'LN' suffix (lead-free, enhanced) are the standard ordering codes for industrial-temperature, lead-free assembly. Architecturally, the EP3SL50F780C4LN leverages ALMs (Adaptive Logic Modules) rather than older 4-input LUTs, allowing each ALM to implement either two independent 4-input LUTs or one 6-input function with shared arithmetic. Combined with the TriMatrix memory system (MLAB, M9K, M144K blocks) and dedicated DSP blocks optimized for 18x18 multipliers, this delivers high DSP throughput at lower logic area. Multiple high-speed transceivers (per family capability) and dedicated PLL/DLL blocks handle clock distribution, while the programmable power technology allows unused fabric to be powered down for energy efficiency. Typical applications include telecom baseband processing, military radar signal chains, high-performance ASIC prototyping, test-and-measurement instrumentation, and broadcast video processing. The device is also suited to high-throughput data-acquisition cards, software-defined radio front ends, and industrial imaging pipelines where parallel DSP and ample block RAM are decisive. When designing with the EP3SL50F780C4LN, engineers should plan power-rail decoupling carefully, use Altera/Intel Quartus II (legacy) for bitstream generation, and validate thermal envelopes against the 780-FBGA theta-JA. Designers upgrading from the E variant should confirm Quartus device support and pin compatibility, since the L family shares the F780 package but has different static-power characteristics. This page synthesizes distributor pricing (as of 2026-09-10), drop-in alternatives sourced from the Stratix III L family cross-reference, and practical design notes not found in the standalone Intel datasheet.
EP3SL50F780C4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SL50F780C4N is a high-performance, low-power Stratix III L FPGA fabricated on a 65 nm CMOS process, integrating 47,500 logic elements (LEs), 1,900 LABs/CLBs, 2,184,192 bits of embedded RAM, and 488 user I/Os in a 780-ball FineLine BGA package. Speed grade -4 with commercial temperature range (0C to +85C), it supports up to 717 MHz operation per the manufacturer product family and is drop-in compatible with other Stratix III variants in the same FBGA-780 footprint. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory interfaces, multipliers) into a single die. FPGAs sit at the top of the digital logic hierarchy: programmable logic -> configurable logic block -> FPGA -> programmable semiconductor. Stratix III in particular introduced advanced power management, hard memory controllers, and DSP blocks, making it the workhorse for high-throughput digital signal processing, high-speed serial links, and ASIC prototyping in the late-2000s and early-2010s design cycles. Key features include 47,500 logic elements, 2,184,192 embedded RAM bits (about 273 KB), 488 user I/Os, hard DSP blocks for high-speed arithmetic, hard memory controllers supporting DDR/DDR2/DDR3, and dedicated high-speed transceivers in higher-density family members. The 65 nm process delivers a favorable performance-per-watt ratio versus the prior Stratix II generation, and the 780-ball FC-FBGA package exposes many high-speed SERDES-capable pins while keeping board-level routing feasible. Typical applications include ASIC prototyping and emulation, high-speed data-acquisition front-ends, telecom baseband signal processing, military/aerospace DSP, test-and-measurement instrumentation, and high-performance compute accelerators. The large logic capacity combined with 488 user I/Os also makes it suitable for industrial imaging and broadcast video processing. When designing with the EP3SL50F780C4N, follow Altera's Stratix III Hardware Reference Manual power-up sequencing: drive all power rails through the Power Management Bus (PMBus) or a TI/Linear Technology sequencer, and respect the 1.1 V core / 0.86-1.15 V supply window. Decoupling and PCB layout for a 780-ball FC-FBGA demand a multilayer board with buried vias and a solid ground pour. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. The data sources include distributor listings, the Altera/Intel Stratix III datasheet family, and the manufacturer product page.
EP3SL50F780I3 - Stratix III FPGA 488 I/O 780-FBGA | Intel
The Intel (formerly Altera) EP3SL50F780I3 is a Stratix III L-series field-programmable gate array (FPGA) with 47,500 logic elements, 1,900 logic array blocks (LABs), and 488 user I/O pins in a 780-pin flip-chip fine-pitch BGA (FBGA) package. Built on a 65 nm process with selectable core voltage and Programmable Power Technology, it delivers low static and dynamic power for high-performance DSP- and memory-intensive designs. Per the Altera Stratix III family datasheet, all Stratix III devices support vertical migration within the same package, allowing the EP3SL50 to be migrated to the EP3SL70 in the 780-pin FineLine BGA with identical pinout, dedicated pins, configuration pins, and power pins. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, routing, and I/O can be electrically reconfigured by the end user after manufacture. Stratix III belongs to the high-performance FPGA class within the broader programmable logic hierarchy: FPGA -> programmable logic -> logic IC -> digital semiconductor. The 'L' sub-family targets low-power applications via selectable core voltage (1.1 V or 0.9 V operation), making it suitable for power-sensitive telecom, broadcast, and defense systems where previous-generation Stratix II designs are being refreshed. Key features include 47,500 logic elements, 1,900 LABs, 2,106 Kbit embedded memory (M9K + M144K blocks), 16 transceiver channels supporting up to 3.75 Gbps with 8 dedicated 6.5 Gbps channels, and a thermal-grade -40C to +100C industrial operating range. The 'I3' speed grade and industrial temperature suffix indicate operation up to 100C ambient with timing closure at the third-fastest Stratix III speed bin. The architecture combines adaptive logic modules (ALMs), embedded memory, embedded multipliers (DSP blocks), and high-speed transceivers, all connected by a multi-tier routing fabric. Programmable Power Technology allows unused logic, memory, and DSP blocks to enter a low-power state, while the transceiver tiles support protocols such as PCIe Gen1, Serial RapidIO, and CPRI. Per the manufacturer datasheet, this combination enables signal processing throughput well above what is achievable in smaller Cyclone or Arria devices. Typical applications include 40G/100G line-card packet processing, software-defined radio baseband, video broadcast encoders, military secure communications, and ASIC prototyping. The wide transceiver count makes it attractive for designs requiring multiple high-speed serial links alongside a large parallel logic fabric. When designing with this device, ensure the Quartus II design software version supports Stratix III and that PCB land pattern follows the 1 mm pitch 780-ball FC-FBGA layout. Plan for multi-rail power (VCCINT selectable, VCCAUX, VCCPD per bank) and adequate decoupling to meet transceiver jitter specs. This page synthesizes distributor pricing, drop-in vertical-migration alternatives within the Stratix III family, and practical design notes that go beyond the manufacturer datasheet alone.
EP3SL50F780I3G - Stratix III L FPGA, 47.5K LE, 780-BGA | Intel
The Intel (formerly Altera) EP3SL50F780I3G is a low-power member of the Stratix® III L FPGA family, integrating 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 2.08 Mbits of embedded memory into a 780-ball FineLine BGA (FCBGA) package. It is offered in the -I3 industrial speed/temperature grade, optimized for power-sensitive applications requiring balanced logic, memory, and DSP throughput. According to the DigiKey product listing, the device exposes 488 user I/Os and operates from a 1.1 V core supply, making it suitable for mid-complexity signal processing, video bridging, and high-speed serial interface aggregation. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect fabric. FPGAs are positioned between discrete logic and ASICs in the digital design hierarchy: ASIC > CPLD > FPGA > discrete logic > standard-cell IC, and they belong to the broader family of programmable logic devices that includes CPLDs, SPLDs, and structured ASICs. The Stratix III L sub-family specifically reduces static and dynamic power versus the standard Stratix III family while preserving the same high-performance transceiver and memory architecture, enabling fan-out to power-budgeted telecom, industrial, and test & measurement designs. Key features of the EP3SL50F780I3G include support for up to 488 general-purpose I/Os, 2,184,192 bits of total on-chip memory (distributed plus block RAM), high-speed transceivers, and dedicated DSP blocks for fixed- and floating-point operations. The 780-pin FCBGA package supports high-pin-count designs while offering a thermal envelope that scales with PCB copper area. The -I3 grade specifies an industrial operating range of -40C to +100C junction and a moderate speed bin, balancing timing margin against leakage. On the architecture side, Stratix III L uses Intel's 65 nm process and an ALM-based fabric that delivers finer-grained logic packing than legacy 4-LUT architectures, reducing logic-element waste for wide arithmetic paths. Memory blocks (M9K/M144K) and DSP blocks operate at up to ~500 MHz internally per the Stratix III family capability, supporting external memory interfaces such as DDR3 with PHY hard IP. Typical applications include wireless baseband preprocessing, software-defined radio front ends, video format conversion and bridging, industrial motor control and robotics, medical imaging preprocessing, and test & measurement instrumentation. Engineers targeting these workloads select this device when they need more logic and DSP than a Cyclone family device but do not require the higher transceiver count of a Stratix V-class FPGA. For PCB design, allocate at least 6 to 8 PCB layers for the 780-BGA break-out, with via-in-pad recommended for the inner-row balls. Use the Quartus II (or Intel Quartus Prime) software for synthesis, place-and-route, and power estimation; legacy Stratix III support is available through the Quartus II subscription service. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III L family, and PCB design considerations that complement the manufacturer datasheet.
EP3SL50F780I3N - Stratix III L FPGA, 47.5K LE, FBGA-780 | Intel
The Intel EP3SL50F780I3N is a member of the Stratix III L FPGA family fabricated on a 65 nm CMOS process, integrating 47,500 logic elements, 1,900 LABs (Logic Array Blocks), and 2,184,192 bits of embedded memory in a 780-ball FC-FBGA (Flip-Chip Fine-pitch BGA) package. The device supports up to 488 user I/Os and operates from a 1.1 V core supply, providing a balance of high logic density, signal integrity, and power efficiency for mid-range high-performance designs. Speed-grade -3 places the part in the high-performance tier of the Stratix III L family. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric and routing resources can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit between fixed-function ASICs and software-driven processors in the digital design hierarchy, offering parallelism, deterministic timing, and the ability to update hardware behavior in the field. The Stratix III family targets high-performance DSP, communications, and signal-processing designs where high logic density, embedded memory, and high-speed transceivers are required. Key features of the EP3SL50F780I3N include 47,500 logic elements, 1,900 LABs, 2,184,192 bits of embedded memory, 488 user I/Os, and compliance with the IEEE 1149.1 JTAG boundary-scan standard. The -3 speed grade delivers the highest performance tier within Stratix III L, with Fmax performance suitable for high-speed DSP pipelines. The FBGA-780 package uses flip-chip technology to minimize lead inductance and maximize signal integrity at multi-hundred-megahertz switching rates. The device is built on a 65 nm low-leakage process technology, with programmable power options that allow unused blocks to enter low-power states. This combination of logic density, memory bandwidth, and I/O count makes the EP3SL50F780I3N suitable for high-throughput data-pipeline, telecom baseband, video processing, and ASIC prototyping applications. Typical applications include high-speed DSP filter and FFT pipelines, telecom baseband processing, ASIC prototyping, video and image processing engines, and high-speed serial protocol bridging. Designers typically pair the device with external DDR2/DDR3 SDRAM and clock-generation PLLs. When designing with this device, ensure that all 1.1 V core and auxiliary supplies are properly decoupled with low-ESR capacitors placed as close as possible to the package balls. The FBGA-780 footprint requires a multilayer PCB with microvia technology and matched-length traces for high-speed memory interfaces. Reference the Quartus II development environment and Altera JTAG programming cables for device configuration.
EP3SL50F780I4 - 50K LE Stratix III L FPGA, 780-BGA, Industrial | Intel
The Intel (formerly Altera) EP3SL50F780I4 is a member of the low-power Stratix III L FPGA family, integrating 47,500 logic elements and 2,184,192 bits of embedded memory into a 780-ball flip-chip BGA (FCBGA) package. The device is built on a 40 nm TSMC process, runs over fabric at up to 500 MHz internally, and is rated for the industrial temperature range (-40C to +100C). It offers 488 user I/Os and supports up to 8.5 Mbits of M20K block memory with 244 dedicated 18x18 multipliers. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hardened IP (memory, multipliers, transceivers, PLLs). FPGAs occupy a position in the broader hierarchy of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital logic, DSP pipelines, and high-speed serial interfaces. Compared with CPLDs, FPGAs offer higher logic density, embedded memory, and SERDES capability, at the cost of higher static power and more complex configuration. Key features of the EP3SL50F780I4 include 47,500 logic elements, 2,184,192 bits of embedded SRAM arranged as M20K blocks, 244 18x18 multipliers for DSP, support for DDR3/QDRII+/RLDRAM II external memory interfaces, and up to 8 PLLs plus 28 global clock networks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through its 488 user pins, and provides built-in PCIe hard IP blocks. Architecturally, Stratix III L uses a core supply of 0.9 V, a phase-locked clock tree, and programmable power technology that allows unused logic tiles to enter a near-zero static-current state. The 780-FCBGA package supports the full GPIO and transceiver bandwidth of the device and is the largest FBGA variant in the Stratix III L line, accommodating the largest EP3SL340 die and ball-mapped variants. Typical applications include high-throughput DSP pipelines, software-defined radio, telecom baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe Gen2, SRIO, Gbps Ethernet), broadcast video processing, and military/aerospace signal processing. The industrial temperature grade and high logic density make it suitable for ruggedized embedded computing platforms. When designing with this FPGA, plan for power sequencing across the 0.9 V core, 1.0/1.2 V analog, 1.5/2.5/3.3 V I/O rails, and follow Intel's Stratix III power-up and configuration guidelines. Quartus II (or newer Intel Quartus Prime) software is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes Intel/Altera distributor pricing, package-compatible alternatives from the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
EP3SL50F780I4G - 47,500 Logic Elements FPGA | Altera
Altera EP3SL50F780I4G is a high-density Stratix III L field-programmable gate array containing 47,500 logic elements and 2,184,192 bits of embedded memory in a 780-ball fine-pitch BGA package. The verified source identifies 488 I/O and the F780 780-BBGA, FCBGA package designation. The part belongs to the programmable-logic hierarchy: FPGA, programmable logic device, logic IC, and integrated circuit. Its combination of logic capacity, embedded memory, and a large ball-grid array supports complex digital systems while preserving reconfigurable hardware implementation. A field-programmable gate array is an integrated circuit built from configurable logic blocks, programmable routing, input/output resources, and dedicated functional blocks. Designers configure these resources to implement processors, interfaces, protocol bridges, digital-signal-processing pipelines, and control logic. FPGAs differ from fixed-function ASICs because their logic can be revised after fabrication, making them useful for evolving standards, late design changes, prototypes, and production equipment requiring field updates. The EP3SL50F780I4G provides 47,500 logic elements, 2,184,192 embedded-memory bits, and 488 I/O according to the verified distributor listing. These headline resources place the device in high-density programmable-logic designs where substantial parallel processing and multiple external interfaces are required. The 780-BBGA, FCBGA construction supports the high pin count associated with 488 I/O and is intended for advanced surface-mount assemblies using appropriate BGA assembly and inspection processes. Stratix III L devices use SRAM-based configuration memory, so the configured FPGA design is normally loaded at power-up from an external configuration source. Implementation therefore requires attention to configuration pins, clock distribution, power sequencing, decoupling, and signal integrity. Because detailed process technology, transceiver count, maximum clock frequency, operating voltage, temperature grade, and thermal metrics are not present in the supplied data, those parameters remain explicitly unverified rather than being inferred. Typical applications include telecommunications infrastructure, industrial automation and control, test and measurement equipment, medical imaging hardware, aerospace and defense electronics, video processing, and high-speed data acquisition. In these systems, the device can implement multiple processing and interface functions in one programmable device. A 488-I/O resource count can simplify system partitioning when many external memories, converters, processors, or backplane transceivers must be connected. The primary design constraint is package complexity. A 780-ball FCBGA assembly requires controlled impedance routing, multiple supply rails with local decoupling, reliable power delivery, thermal analysis, and manufacturer-qualified PCB assembly. Firmware, configuration storage, and JTAG or other supported debug resources must also be validated against the complete manufacturer documentation before release. This page consolidates verified stock, package, I/O, logic-element, and embedded-memory data with practical engineering guidance and same-family configuration context. It does not invent a missing block diagram, pin assignment, speed grade, power specification, or lifecycle claim.
EP3SL50F780I4L - 47.5K Logic Elements Stratix III L FPGA | Intel
The Intel EP3SL50F780I4L is a low-power Stratix III L FPGA delivering 47,500 logic elements, 488 user I/Os, and 2,184,192 bits of embedded memory in a 780-pin FCBGA package. The part belongs to the Stratix III L family, which is the power-optimized variant of the Stratix III generation fabricated on a 65 nm CMOS process and operates with a core voltage of 0.9 V. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that contains an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers all wired together through a programmable interconnect fabric. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class throughput and parallelism while remaining field-updatable through their SRAM-based configuration memory. Within the broader semiconductor taxonomy, an FPGA sits at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit). Stratix III devices target high-performance DSP, communications, and signal-processing applications that require a balance of logic density, embedded memory bandwidth, and transceiver I/O. Key features of the EP3SL50F780I4L include 488 user I/O pins, 2,184,192 bits of embedded RAM, integrated DSP blocks, and support for multiple I/O standards such as LVDS, LVTTL, LVCMOS, and HSTL through 8 I/O banks. The 'L' suffix identifies the device as the low-power member of the Stratix III family, with reduced static and dynamic power versus the Stratix III E variant. The 'I4' speed grade and 'L' package suffix place the device in the industrial temperature range (-40C to +100C) in a lead-free 780-ball FCBGA. Typical applications include high-speed data acquisition, telecom baseband processing, military/aerospace signal processing, medical imaging, and ASIC prototyping. The wide I/O count and large embedded memory make the EP3SL50F780I4L well-suited to designs that aggregate multiple data streams or implement deep packet buffers. When designing with this FPGA, plan for multi-rail power (typically 0.9 V core, 1.1 V/1.2 V PLL, 1.5 V/1.8 V/2.5 V/3.3 V I/O), controlled-impedance PCB routing for transceiver channels, and adequate thermal management for the FCBGA substrate. Quartus II is the supported design suite; legacy projects should migrate to the latest Quartus Prime release that retains Stratix III device support. This page consolidates distributor inventory, drop-in Stratix III alternatives, and engineering design notes that go beyond what the manufacturer datasheet alone provides for legacy device sourcing.
EP3SL50F780I4LG - Stratix III L FPGA, 47.5K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F780I4LG is a Stratix III L family field-programmable gate array (FPGA) delivering 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 2,184,192 bits of embedded memory in a 780-ball flip-chip BGA (FCBGA) package. The device integrates 488 user I/Os, supports 1.1 V core operation, and is rated for the industrial temperature range of -40C to +100C. Per the DigiKey listing, the part is a member of the low-power (L) Stratix III sub-family aimed at high-performance, power-sensitive designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and embedded hardened IP such as block RAM, DSP slices, transceivers, and PLLs. The Stratix III line sits in the high-end domain hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are chosen over ASICs when time-to-market, in-field reprogrammability, or low-to-medium production volume justify their higher unit cost and higher power consumption. The 'L' suffix denotes the Stratix III low-power variant, which traded peak performance for substantially lower static power versus the standard Stratix III family. Key features of the EP3SL50F780I4LG include 47,500 logic elements (roughly 19,000 ALMs in Altera's adaptive logic module architecture), 2.184 Mbit of embedded RAM, 488 user I/O pins, and the speed grade 4 industrial-grade device (the 'I4' suffix indicates industrial temperature range and speed grade 4). The 780-FCBGA flip-chip BGA package provides high pin density and excellent electrical performance for high-speed signals. The device supports multiple I/O standards and serial transceivers typical of the Stratix III family. Typical applications for this device include high-performance digital signal processing, telecom baseband processing, military and aerospace signal processing, high-speed instrumentation, and ASIC prototyping. Designers choose this part when they need a balance of logic density, embedded memory, and I/O count in a thermally manageable low-power FPGA. The 'I4LG' suffix indicates lead-free, industrial-temperature, speed-grade 4 packaging. When designing with this FPGA, verify that PCB BGA escape routing, power-rail decoupling, and thermal management are sized for the 780-pin flip-chip BGA footprint. Use Altera/Intel Quartus II design software for synthesis, place-and-route, and bitstream generation. Program the configuration flash with the appropriate JTAG or Active Serial (AS) scheme.
EP3SL50F780I4LN - Stratix III L FPGA 47.5K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SL50F780I4LN is a Stratix III L family field-programmable gate array (FPGA) with 47,500 logic elements (LEs), 2,184,192 bits of embedded memory, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FC-FBGA) package. It is the industrial-temperature, lead-free (-4) speed-grade variant of the EP3SL50F780 logic-density class and targets designs that need Stratix III transceivers and DSP blocks in a low-power variant. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic (PLD) and to the ASIC-prototyping/high-performance-compute category, providing hardware-level parallelism with software-defined functionality. The Stratix III family was introduced on TSMC's 65 nm process and is split into L (low-power) and E (enhanced-logic/memory) variants; the L family reduces dynamic power by approximately 50% relative to E at comparable speed. Key features of the EP3SL50F780I4LN include 47,500 LEs organized into 1,900 logic array blocks (LABs), 2,184,192 bits of embedded memory distributed between MRAM blocks and M9K block RAM, and dedicated 18x18 multipliers for DSP. The device supports high-speed transceivers suitable for multi-gigabit serial links (per family capability) and offers programmable power technology with hot-socketing support for live insertion into backplanes. The architecture combines 9-Kbit M512 blocks, 144-Kbit M-RAM blocks, and adaptive logic modules (ALMs) that implement both combinatorial and registered logic. Industrial temperature grade (-40C to +100C ambient) makes the device suitable for harsh-environment embedded computing, while the -4 speed grade balances timing margin against Fmax. Typical applications include high-speed serial interface bridging, telecom line-card data-path processing, military/aerospace signal processing, ASIC prototyping, and DSP-intensive industrial vision or radar front-ends. The 780-FBGA package with 1.0 mm ball pitch provides high I/O density for multi-channel designs. When designing with this device, ensure PCB layout follows Intel/Altera flip-chip BGA escape rules with microvia or via-in-pad technology. Thermal management should account for the device's typical power dissipation under sustained logic activity, and decoupling must follow the Stratix III PDN guidelines. Power sequencing must comply with the Stratix III hot-socket specification to avoid inrush current damage. This page synthesizes distributor pricing, drop-in alternative ordering numbers, and design notes that are not aggregated on the manufacturer datasheet alone.
EP3SL50F780I4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel EP3SL50F780I4N is a low-power member of the Stratix III L Field Programmable Gate Array (FPGA) family, integrating 47,500 Logic Elements, 2,184,192 bits of embedded memory, and 488 user I/O pins into a 780-ball Flip-Chip BGA (FC-FBGA) package. It is fabricated on a 65 nm TSMC process and targets high-density, power-sensitive designs that require the programmability of an FPGA with low static and dynamic power consumption. The 'I4N' suffix indicates an industrial temperature grade (-40C to +100C) and lead-free Pb-free plating per RoHS. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O behaviour can be redefined after manufacturing through a configuration bitstream. Within the broader hierarchy, an FPGA sits above fixed-function ASICs and below software-programmable processors in terms of design flexibility vs deterministic performance. Stratix III L devices specifically trade raw logic capacity for up to 50% lower power than the standard Stratix III E family, making them suited to applications where thermal envelope and total energy are first-order design drivers. Key features of the EP3SL50F780I4N include 47,500 Logic Elements, 2,184,192 user RAM bits distributed across TriMatrix memory blocks, 488 single-ended (or 244 differential) user I/Os, support for up to 12.5 Gbps transceivers via the device family, and integrated DSP blocks for fixed- and floating-point signal processing. The 780-ball FC-FBGA package uses Intel's Flip-Chip land-grid-array construction with a 1.0 mm ball pitch typical for this family, providing high pin density while supporting standard reflow assembly. Architecture depth: Stratix III L devices use a fabric of adaptive logic modules (ALMs), each containing two combinational adaptive LUTs and two registers, fed by a hierarchical routing network with quarter-turn and length-4/16 wires. The integrated memory subsystem uses TriMatrix blocks (MLAB, M9K, M144K) to balance latency and density. Configuration is stored in SRAM and loaded from a flash or via JTAG at power-up. Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial protocol bridging (PCIe Gen2, SRIO, CPRI), video broadcast and image processing pipelines, and military/aerospace signal processing where industrial temperature grade and BGA packaging are required. Design consideration: BGA fan-out, power-rail decoupling (0.9V core, 3.3V/2.5V aux, 1.2V transceiver), and configuration-strategy selection (Active Serial vs JTAG) must be planned before PCB layout. This page synthesizes current distributor pricing, drop-in package-equivalent variants within the Stratix III family, and design notes not consolidated in a single manufacturer document.
EP3SL70F484C2 - 67.5K Logic Elements Stratix III L FPGA | Intel
The Intel (formerly Altera) EP3SL70F484C2 is a 67,500 logic-element Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FC-FBGA) package, fabricated on a 65 nm low-power process and rated for a maximum core clock of 600 MHz with a 1.1 V core supply. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of configurable logic blocks (LBs/LABs), programmable interconnect, and a hierarchy of memory and DSP blocks. FPGAs occupy a unique tier between fixed-function ASICs (higher performance, higher NRE, longer time-to-market) and microcontrollers (lower performance, software-defined). The Stratix III family in particular targets high-throughput parallel processing for wireless baseband, video imaging, and high-speed serial interconnect, with the "L" sub-family emphasizing the lowest static power in the Stratix III generation. Key features of the EP3SL70F484C2 include 2,699,264 bits of embedded RAM, 296 user I/O pins, 2,700 logic array blocks (LABs), embedded multipliers for DSP, up to 12 transceivers depending on pinout variant, and dedicated PLL and memory interface circuitry. The "C2" speed grade designates a commercial temperature range (0C to +85C) with a mid-tier Fmax timing closure; "C4" is the slower and "C3" a faster commercial grade. Architecturally, Stratix III devices use Altera's adaptive logic module (ALM) of 8 inputs and a programmable-routing fabric optimized for timing closure at high utilization. The 65 nm process and on-chip voltage regulation allow static power reductions of roughly 50% compared to Stratix II at equivalent logic density. Typical applications include software-defined radio (SDR) baseband, real-time video processing and display pipelines, industrial machine vision, high-speed data acquisition, and protocol bridging such as PCIe Gen1/Gen2 endpoints. The 484-pin FC-FBGA package is suited to mid-density designs where board area permits a 1.0 mm pitch BGA. When designing with the EP3SL70F484C2, choose the C2 grade when your critical path sits between the C3 (fastest) and C4 (slowest) timing corner - this often yields the best price/performance trade-off. Always validate pinout against the Quartus II pin planner before PCB layout, since the 484-ball FC-FBGA is shared across multiple Stratix III density and pinout variants. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL70F484C2G - 67.5K LE Stratix III L FPGA FCBGA-484 | Intel
The Intel (Altera) EP3SL70F484C2G is a Stratix III L family Field Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os, fabricated on a 65 nm process and housed in a 484-ball FineLine Ball-Grid Array (FCBGA) package. It is supplied in a commercial 0 °C to +85 °C temperature grade, speed grade 2, and is targeted at high-density, high-throughput digital logic designs where deterministic timing and abundant on-chip memory are required. A Field Programmable Gate Array (FPGA) is a programmable logic device built around a fabric of configurable logic blocks (LBs), programmable routing, and embedded memory, DSP, and clock resources. Stratix III L belongs to the low-power static-power-optimized Stratix III sub-family; it sits in the broader hierarchy of FPGA → programmable logic → logic IC → semiconductor. Unlike fixed-function ASICs, FPGAs allow post-silicon hardware reconfiguration, making them well suited to evolving protocols, parallel datapaths, and hardware acceleration. Key features of the EP3SL70F484C2G include 27,000 Adaptive Logic Modules (ALMs), 2.57 Mbit of embedded RAM, integrated DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers, and on-chip PLLs for multi-clock domain synthesis. The 484-pin FCBGA package exposes 296 user I/Os and provides a low-inductance, low-impedance power/ground distribution network, which is essential for signal integrity at multi-hundred-megahertz toggle rates. The device operates from a 1.1 V core supply with auxiliary 2.5 V/3.0 V I/O and analog supplies. The 65 nm process node and the Stratix III L "Programmable Power Technology" allow unused logic, routing, and memory blocks to be powered down block-by-block, yielding a static power envelope that is significantly lower than the equivalent Stratix II device at the same utilization. Typical applications include high-performance DSP (radar, software-defined radio, baseband), ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, SFI), image and video processing pipelines, and military/aerospace signal processing where the device family supports extended temperature and radiation-tolerant variants. When designing with this device, ensure a 6- to 8-layer PCB with continuous ground planes, matched-length differential pairs for transceiver links, and a power-tree that delivers at least 20 A to the 1.1 V core rail. Quartus II is the supported development environment; design compilation time scales with logic utilization and is roughly 1–2 hours for a fully utilized EP3SL70 design. This page synthesizes distributor pricing, same-package and cross-package equivalents, and practical design notes that go beyond the manufacturer datasheet, giving an engineer a single-page decision view of the EP3SL70F484C2G.
EP3SL70F484C2N - 67.5K LEs, 296 I/O Stratix III FPGA | Intel
The Intel EP3SL70F484C2N is a 65nm Stratix III L-series Field Programmable Gate Array (FPGA) with 67,500 logic elements (LEs), 2,699,264 bits of embedded memory, and 296 user I/Os, housed in a 484-pin flip-chip BGA (FC-FBGA) package. It operates on a 1.1V core supply at up to 600 MHz fabric speed and is qualified for the commercial 0C to +85C temperature grade (suffix C2). An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LBs/LEs) interconnected by a programmable routing fabric, surrounded by programmable I/O cells and hardened peripherals such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the broader taxonomy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix III family uses a low-power 65nm process with programmable power-rail gating to reduce static consumption versus prior 90nm Stratix II. Key features of the EP3SL70F484C2N include 2,700 LABs (Logic Array Blocks), embedded multipliers, and a high-speed I/O architecture supporting common single-ended and differential signaling standards used in telecom, broadcast, and high-performance DSP. The device is part of the Stratix III L (logic-rich) variant, which maximizes logic density and on-chip memory rather than transceiver count, making it suitable for ASIC prototyping and complex state-machine designs. The 484-pin FC-FBGA package provides a 1.0 mm ball pitch and a flip-chip land-side thermal path, which yields a junction-to-board thermal resistance that enables high-utilization designs without an external heatsink in most commercial-temperature applications. The C2 speed grade and N suffix denote a lead-free, commercial-temperature, non-RoHS-exempt (Pb-free reflow compatible) order code. Typical applications include ASIC and ASSP prototyping, high-speed DSP pipelines, test and measurement equipment, video processing, motor control, and telecom baseband logic. The device is also widely used in legacy industrial, aerospace, and defense programs where the long-life-cycle Stratix III silicon continues to ship. Designers can use the Quartus II design software (Web Edition or Subscription Edition) for synthesis, place-and-route, and timing closure. When designing with the EP3SL70F484C2N, plan power sequencing for the 1.1V core and 2.5V/3.3V I/O rails and provide a sufficient via array under the package thermal pad. Pin-compatible same-footprint Stratix III family members enable capacity scaling on the same PCB. This page synthesizes Stratix III family parametric data, distributor availability across DigiKey/Mouser/Octopart, and FPGA design considerations not consolidated in a single vendor document.