FPGA & CPLD
製品 (6666)
EP3SL70F484C3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
The Altera (Intel) EP3SL70F484C3 is a Stratix III L family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, offering 67,500 logic elements and 296 user I/Os in a 65 nm process technology. The device integrates 2,699,264 bits of embedded memory and operates with a core voltage of 1.1 V at internal clock frequencies up to 500-800 MHz, providing high-density programmable logic for high-performance digital designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) interconnected by programmable routing fabric. FPGAs sit within the broader hierarchy of programmable logic (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), and are used to implement custom digital logic without fabricating an ASIC, enabling rapid prototyping and design iteration. Key features include 67,500 logic elements, 2,699,264 embedded memory bits, 296 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed arithmetic, and on-chip transceivers optimized for memory interfaces and high-speed serial connectivity. The 1.1 V core voltage and 65 nm process technology deliver favorable power-per-gate ratios compared to earlier Stratix generations. Architecturally, the Stratix III L family uses Altera's adaptive logic modules (ALMs) and a multi-track routing interconnect optimized for timing closure at high frequencies. The -C3 speed grade indicates a moderate speed/power balance suitable for commercial-temperature applications (0C to +85C). The 484-pin FBGA package provides high I/O density in a relatively compact 23 x 23 mm footprint suitable for high-performance PCB designs. Typical applications include high-speed data acquisition systems, telecommunications backplane interfaces, software-defined radio (SDR) baseband processing, ASIC prototyping, video processing and encoding, and high-performance computing accelerators. The large logic capacity and memory make this device well-suited for designs that previously required mid-range ASICs. Designers should pay attention to the Stratix III power planning flow (PowerPlay) and use Altera's Quartus II toolchain for synthesis, place-and-route, and timing closure. The -C3 speed grade has tighter timing margins than -C4 but offers lower power; for designs targeting maximum performance, evaluate -I3 or -I4 industrial grades. This page synthesizes distributor pricing from authorized sources, drop-in same-package alternatives within the Stratix III L family, and practical FPGA design considerations not consolidated in any single manufacturer document.
EP3SL70F484C3G - Stratix III 67.5K LE FPGA 484-FCBGA | Intel
The Intel EP3SL70F484C3G is a Stratix III L-series field-programmable gate array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os, packaged in a 484-ball FCBGA. It operates from a 1.1 V core supply and is specified over the commercial 0 C to +85 C temperature range with a -3 speed grade. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP slices, transceivers, and PLLs. FPGAs occupy the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs are reprogrammed in the field to implement custom digital signal processing, packet processing, glue logic, and compute acceleration. The Stratix III family sits in the high-performance tier of Intel (formerly Altera) FPGAs, optimized for logic density, embedded memory bandwidth, and high-speed serial transceivers. Key features of this specific device include 27,000 adaptive logic modules (ALMs), 2.57 Mbit of embedded block RAM, and the Stratix III Programmable Power Technology that reduces dynamic power by selectively gating unused logic and routing resources. The device supports industry-standard LVDS, LVTTL, LVCMOS, and SSTL I/O standards, along with hard PCI Express Gen1 endpoints and external memory interfaces to DDR3, DDR2, and QDRII+ SRAM. The architecture uses a 40 nm process node with a 9-bit ALM as the fundamental logic element. Each ALM contains two adaptive LUTs, two dedicated adders, four registers, and fracturable carry chains, allowing efficient implementation of both arithmetic-intensive DSP and bit-oriented control logic. The MultiTrack interconnect and TriMatrix memory structure deliver high utilization at clock rates above 300 MHz on typical designs. Typical applications include high-end ASIC prototyping, telecom line-card packet processing, military radar signal processing, medical imaging pre-processing, and broadcast video format conversion. The 484-ball FCBGA footprint supports PCB designs that target Stratix III logic density while preserving routing headroom. When designing with the EP3SL70F484C3G, plan power decoupling with a 1.0 uF bulk capacitor per VCC pin pair and a 0.1 uF decoupling cap on every supply ball. Maintain controlled-impedance routing on all high-speed serial links and place differential pairs within 5 mil length-matching tolerance. This page synthesizes distributor inventory, Stratix III speed-grade options, and same-package drop-in alternatives drawn from the same family and competitor FPGAs, providing decision support not found in the manufacturer datasheet alone.
EP3SL70F484C4 - Stratix III L FPGA 67500 LE | Intel
The Intel EP3SL70F484C4 is a Stratix III L Field-Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded RAM, and 296 user I/O pins, delivered in a lead-free 484-ball FC-FBGA (BGA-484) package and specified for 0°C to 85°C commercial operation. This 65 nm, 1.1 V core device is a mid-density FPGA platform intended for parallel logic, memory, and I/O intensive designs where speed-grade and packaging availability matter. An FPGA is an integrated circuit whose logic fabric can be configured after manufacturing, allowing engineers to implement custom digital logic without committing to an ASIC. FPGAs sit within the programmable logic device hierarchy below ASICs but above simple CPLDs. The EP3SL70F484C4 forms part of the Stratix III L family and is optimized for general-purpose logic from wireline access equipment to broadcast video processing. Key features of the EP3SL70F484C4 include 67,500 logic elements for mid-density systems, 2,699,264 RAM bits for buffering and data storage, and 296 user I/O pins that can interface to multiple single-ended and differential signaling standards. The 484-ball FC-FBGA package provides a compact footprint while still exposing enough I/O for wide parallel buses, DDR memories, and external commodity interfaces. Distributor listings report this device as lead-free, and FPGAkey records a 1.1 V core supply voltage on a 65 nm process. Although this part has no embedded high-speed serializer/deserializer transceivers in the logic-only L configuration, its logic density, embedded memory, and I/O count make it effective for controller, bridging, preprocessing, and protocol handling tasks. The C4 ordering bin in the Altera/Intel nomenclature denotes a commercial-temperature, speed-grade-sorted variant used for lower-cost applications where the higher speed grade is not required. Typical applications include indoor telecom/network line cards, broadcast video processing chains, industrial automation controllers, medical imaging preprocessing, test and measurement instruments, and FPGA prototyping platforms. The 0°C to 85°C commercial temperature range is suitable for indoor, climate-controlled equipment but not for unheated automotive or extended-ambient deployments. When using EP3SL70F484C4, designers must remember that an FPGA is volatile: configuration must be loaded from an external EPCS/SPI flash or through JTAG on every power-up. Power supply decoupling on the 1.1 V core rail and per-bank I/O supplies is essential for stable timing closure and reliable programming. This page synthesizes distributor pricing, stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. It is intended for engineers comparing EP3SL70F484C4 with other 484-ball Stratix III L derivatives before PCB layout and procurement.
EP3SL70F484C4G - Stratix III 67.5K LE FPGA, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL70F484C4G is a Stratix III L family Field Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package. It operates from a 1.1 V core supply and is rated for the commercial 0C to +85C temperature range. The 'C4' speed grade denotes a medium-speed timing bin within the Stratix III family, while the trailing 'G' indicates lead-free / RoHS-compliant ball finish. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that combines programmable logic blocks (logic elements / adaptive logic modules), dedicated memory blocks, DSP blocks, and high-speed serial transceivers on a single die. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD -> FPGA -> SoC FPGA) and are widely used for parallel data-path processing, high-speed protocol bridging, and ASIC prototyping before tape-out. The Stratix III family was built on TSMC's 40 nm process and represented Intel/Altera's high-density, low-power flagship line circa 2008-2010. Key features of the EP3SL70F484C4G include 27,000 adaptive logic modules (ALMs), 2.57 Mbit of embedded RAM, and up to 8 transceivers depending on the configuration. The 484-pin FCBGA package supports Stratix III's rich I/O fabric including LVDS, LVTTL, SSTL, and HSTL I/O standards, alongside dedicated PLL and clock-tree resources. Integrated configuration circuitry supports multiple modes including JTAG, passive serial, and fast passive parallel. At the architectural level, the Stratix III L device integrates programmable logic tiles (each ALM contains 8 LUTs and associated carry chains), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks for 9x9, 18x18, and 36x36 multipliers, and dedicated transceivers that can operate at multi-gigabit data rates. The '70' suffix in the part number designates the device density (LE count) within the Stratix III L family. Typical applications include high-performance digital signal processing, telecommunication infrastructure, ASIC prototyping, broadcast video processing, and high-speed serial protocol bridging. Stratix III devices are also used in defense and aerospace applications requiring high logic density with deterministic timing closure. When designing with this part, careful attention must be paid to power-rail sequencing (1.1 V core plus multiple I/O and auxiliary supplies), JTAG configuration chain integrity, and thermal management - despite the 40 nm process node, large Stratix III designs can exceed 10 W and require airflow or heatsinking at industrial temperatures. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL70F484C4L - Stratix III L FPGA, 67.5K LE, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL70F484C4L is a Stratix III L family Field Programmable Gate Array (FPGA) fabricated on a 65 nm process, delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os in a 484-ball FC-FBGA package. The device operates at a core voltage of 0.9 V and supports a maximum toggle speed of 375 MHz, with 2,700 logic array blocks (LABs) for high-density parallel logic implementation. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) → programmable logic → semiconductor IC, and offer parallel processing capability that microcontrollers and DSPs cannot match. The Stratix III L series targets ASIC prototyping, high-performance DSP, and communication infrastructure workloads where deterministic, parallel hardware acceleration is required. Key features of the EP3SL70F484C4L include 67,500 logic elements, 2,699,264 bits of embedded memory, 2,700 LABs, 296 user I/Os, 375 MHz maximum operating frequency, 0.9 V core supply, and a 484-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. The Stratix III L family is engineered for low static and dynamic power consumption relative to the original Stratix III, making it suitable for thermally constrained embedded systems. The device integrates programmable logic fabric with rich on-chip memory and DSP blocks, enabling designers to implement custom parallel datapaths, complex state machines, and high-throughput signal-processing pipelines. Configuration is stored in SRAM cells that can be re-loaded at power-up from an external flash or configuration device, supporting in-field design upgrades and multi-bitstream workflows. Typical applications include ASIC prototyping and emulation, high-performance DSP pipelines, wireline communication infrastructure, military and aerospace signal processing, and test and measurement equipment. The 484-FCBGA package offers a compact footprint for high I/O count designs while supporting the power-delivery requirements of high-utilization workloads. When designing with the EP3SL70F484C4L, ensure the PCB has sufficient decoupling capacitors placed close to each power pin, and that the 484-ball BGA footprint is laid out with manufacturer-recommended escape routing. Designers should also note that the Stratix III family is approaching end-of-life (NRND/last-time-buy status), so long-production programs should plan second-source or migration strategies. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL70F484C4LG - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3SL70F484C4LG is a low-power member of the Stratix III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory (approximately 2.57 Mbit), and 296 user I/O in a 484-pin flip-chip BGA package. Built on a 1.1 V core, 40 nm process technology, the device targets high-performance digital logic designs that demand abundant memory bandwidth, DSP throughput, and transceiver-based serial connectivity without exceeding the power envelope of the original Stratix III family. According to the Altera/Intel Stratix III Device Handbook, the 'SL' suffix denotes the low-static-power variant optimized for thermally constrained applications such as wireline backhaul, software-defined radio, and high-end test & measurement. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (LBs), programmable routing, dedicated DSP blocks, on-chip RAM, and high-speed transceiver or general-purpose I/O into a single monolithic silicon die. Within the broader taxonomy, the EP3SL70F484C4LG belongs to the hierarchy FPGA -> programmable logic -> logic IC -> digital semiconductor, and represents the high-density, low-power node of the Stratix III generation, which itself precedes Stratix IV/V in Intel's programmable-logic roadmap. Key features include 27,000 adaptive logic modules (ALMs) - the basic building block of Stratix III architecture - 2.57 Mbit of embedded memory organized into M9K/M144K blocks, dedicated variable-precision DSP blocks for high-throughput arithmetic, and up to 296 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The FBGA-484 package exposes the full I/O count of this device variant and supports industrial operating temperatures with a commercial-grade 0 C to +85 C range as shipped under the speed grade 4 ordering code. Typical applications include high-speed digital signal processing in software-defined radio, channel cards in wireless infrastructure, ASIC prototyping, high-resolution video processing, and pre-silicon verification platforms. Compared with the higher-cost Stratix III GX/GT variants, the 'L' family omits the multi-gigabit transceivers to reduce both static and dynamic power while preserving the logic, memory, and DSP fabric. When designing with this part, engineers must supply a 1.1 V core rail and a 2.5 V/3.3 V I/O auxiliary rail, ensure JTAG access is preserved, and verify PCB escape routing for the 484-ball flip-chip BGA. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix III family, and practical design considerations not collated in the manufacturer handbook.
EP3SL70F484C4LN - Stratix III L FPGA 67.5K LE | Intel | 484-FBGA
The Intel (formerly Altera) EP3SL70F484C4LN is a Stratix III L family Field Programmable Gate Array (FPGA) IC with 67,500 logic elements, 2,699,264 bits of embedded memory, 296 user I/Os, and 2,700 Logic Array Blocks (LABs), housed in a 484-ball FineLine BGA (FBGA) package. The device is built on a 65 nm TSMC low-power process node and supports core voltages of 0.9 V for the high-performance Stratix III L variant, with a maximum internal clock frequency of 375 MHz. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device belonging to the programmable logic hierarchy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. Unlike fixed-function ASICs, FPGAs implement arbitrary digital logic through configurable logic elements (LEs), embedded memory blocks (M9K/M144K), DSP blocks, and high-speed transceivers, all wired via programmable routing. The Stratix III L family specifically targets logic-dense, low-power designs where TDP budgets matter, making it a tier between the original Stratix III and the later Stratix IV/IV GX families. Key features include 67,500 logic elements (LEs), 2,699,264 embedded memory bits organized as M9K/M144K blocks, up to 12 transceiver channels in related variants, dedicated DSP blocks for high-throughput arithmetic, and 296 user I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL). The 484-ball FBGA package supports high-density board routing while keeping the die-to-PCB inductance low for 375 MHz operation. The device is offered in the C4 speed grade (commercial, -4) with the L suffix indicating a low-power static power sub-variant and the N suffix indicating a lead-free, RoHS-compliant finish. From an architectural standpoint, the Stratix III L uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables (LUTs), enabling higher logic density per LE than prior Stratix generations. The Programmable Power Technology allows unused logic to enter a near-zero static power state, which is the defining feature of the L suffix versus the standard Stratix III. Typical applications include telecom baseband processing, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition front-ends, and broadcast video routing fabrics. Its logic and memory balance also suits high-performance medical imaging pre-processing and radar front-end signal conditioning. When designing with the EP3SL70F484C4LN, use the Quartus II design suite (version 13.0 or earlier; later Quartus versions require legacy device support). Decoupling requires bulk 0.1 uF + 10 uF capacitors near every VCC/VCCIO/G pin group, and the 484-FBGA land pattern demands 4-layer minimum PCB stack-up with via-in-pad recommended for full BGA fanout. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not found in the manufacturer datasheet.
EP3SL70F484C4N - Stratix III L FPGA 67.5K LE FBGA-484 | Intel
The Intel (formerly Altera) EP3SL70F484C4N is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FCBGA) package with 296 user I/Os. The device integrates 67,500 logic elements, 2,699,264 bits of embedded memory, and 2,700 LABs/CLBs, fabricated on a 65 nm TSMC process and powered by a 1.1 V core supply. Speed grade -C4 denotes a commercial-temperature, mid-speed bin targeted at cost-sensitive, performance-balanced designs. What is a Stratix III FPGA? Stratix III is Intel's third-generation high-performance FPGA family, succeeding Stratix II and built on a 65 nm low-k dielectric process with dedicated hard IP blocks such as MLABs, M9K/M144K block RAMs, embedded DSP blocks, and multi-gigabit transceivers on higher-density members. The 'L' sub-family specifically optimizes the logic/memory/transceiver mix for logic-intensive, lower-static-power designs and is widely used in telecom line cards, broadcast video processing, and military-aerospace DSP. FPGAs occupy the top tier of programmable logic, sitting above CPLDs and standard logic ICs in the digital-semiconductor hierarchy. Key features include 67,5K logic elements arranged in 2,700 LABs, 2.7 Mbit embedded block RAM with true dual-port operation, dedicated 18x18 multipliers supporting up to 384 GMACs DSP performance, eight fractional PLLs with programmable bandwidth, and 296 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. A high-speed SERDES block (where equipped) and integrated PCI Express hard IP simplify interface design, while configuration is supported via JTAG, passive serial, fast passive parallel, and external host bus modes. Architecture depth: The 65 nm process enables a stitched transistor fabric with dedicated routing switch matrices, octagonal interconnect, and tri-matrix memory that can be configured as MLAB (640-bit) or M9K (9 Kbit) blocks. Periphery I/O elements (IOEs) support up to 1.6 Gbps LVDS performance on this generation, and the device embeds up to 12 clock networks with regional and global skew management. Power is managed via programmable on-chip voltage regulators tied to the PowerPlay early-power estimator tool. Typical applications include wireline telecom backplane multiplexing, military radar signal processing, high-end medical imaging front-ends, ASIC prototyping, and broadcast video format conversion. Design entry is via Intel Quartus II (legacy) or Quartus Prime, with IP cores for DDR2/DDR3 controllers, PCIe Gen1, and 10 Gigabit Ethernet MACs available out-of-the-box. When laying out a board, allocate a continuous GND plane under the BGA and follow Intel's via-in-pad microvia guidelines for the 1.0 mm pitch FBGA footprint. Design consideration: With 484 balls on a 1.0 mm pitch, four to six PCB layers with sequential lamination are recommended; ensure proper decoupling with 0402/0201 ceramics placed within 2 mm of each power ball. Total power consumption scales with toggle rate - estimate early using PowerPlay to size regulators and thermal solution. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix III family, and practical design notes not found on the manufacturer product page alone.
EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
The Intel EP3SL70F484I3 is a high-density, low-power member of the Stratix III L FPGA family fabricated on TSMC's 40 nm process, providing 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os in a 484-ball Flip-Chip BGA package. The "L" suffix denotes the logic-optimized variant that trades some DSP and transceiver capability for lower static power versus the Stratix III E family, while the "I3" speed/temperature grade delivers industrial temperature range (-40C to +100C) at a moderate -3 speed bin. The device integrates 2,700 Logic Array Blocks (LABs) and 384 embedded 18x18 multipliers, making it well suited for DSP-heavy signal processing in test equipment, medical imaging, and high-performance wireline backplanes. The Stratix III L is a SRAM-based FPGA (Field Programmable Gate Array) belonging to the broader category of programmable logic devices (PLD), which also includes CPLDs and one-time-programmable devices. Within the power-management hierarchy of a digital system, the FPGA sits below the DC-DC converters and LDOs that feed its core and I/O rails (typically 0.86 V VCC, 1.1 V VCCPT, 2.5 V/3.3 V I/O) and above the application logic it implements. Compared with ASICs, Stratix III devices trade mask NRE cost for design flexibility, in-system re-programmability, and accelerated time-to-market for low-volume or evolving standards. Key features of EP3SL70F484I3 include 384 DSP blocks (18x18 multipliers), 12 transceivers at up to 3.75 Gbps (per Stratix III L family specifications), Programmable Power Technology (ppt) for fine-grained static power reduction, and hard memory controllers supporting DDR, DDR2, DDR3, QDRII, and RLDRAM interfaces. The 484-FBGA package uses lead-free SAC405 balls on a 1.0 mm pitch and is rated for an extended industrial operating envelope. Architecture-wise, the device uses ALMs (Adaptive Logic Modules) of 8 inputs each, organized into LABs of 10 ALMs, with routing fabric driven by Quartus II synthesis. Configuration is via fast passive parallel, fast active serial, or JTAG, with bitstream encryption and AES support available on the family. The die integrates 8 PLLs (4 enhanced PLLs and 4 fast PLLs) and 648 Kbits of distributed memory, which complements the 2,699,264 bits of block RAM (M9K and M144K blocks). Typical applications include high-speed data acquisition, software-defined radio front-ends, digital video broadcast equipment, multi-channel telecom line cards, and ASIC-prototyping platforms where 67.5K LEs provide sufficient headroom for full-system emulation. The Stratix III L family's low static power also makes it attractive for thermally constrained embedded systems such as radar array processors and industrial machine-vision pipelines. When designing with the EP3SL70F484I3, plan for a multi-rail power tree (0.86 V core via dedicated DC-DC, plus 2.5/3.3 V I/O via an LDO) and place at least eight decoupling capacitors around the BGA perimeter per Quartus II pin connection guidelines. Use Altera's PowerPlay early power estimator before place-and-route to confirm thermal envelope, and consider de-rating I/O toggle rates when fanning out LVDS pairs above 625 Mbps. This page synthesizes Stratix III L family specifications, Octopart distributor pricing, same-brand speed/package drop-in alternatives, and practical Quartus II design notes that complement the official device handbook.
EP3SL70F484I3G - Stratix III L FPGA 67.5K LE, 484-FCBGA | Intel / Altera
The Intel / Altera EP3SL70F484I3G is a Stratix® III L high-performance, low-power FPGA delivering 67,500 logic elements, 2,699,264 memory bits, and 296 user I/O pins in a 484-ball FCBGA package. Built on a 40nm process with transceiver-rich variants and adaptive logic modules (ALMs), the device integrates up to 24 transceivers operating at data rates suitable for chip-to-chip and backplane serial links. The "I3" speed grade and industrial temperature range support demanding timing budgets in -40C to +100C environments. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric is configured via an SRAM or flash bitstream, enabling parallel hardware acceleration of algorithms that would be too slow on a CPU. The Stratix III family is positioned within Altera's high-end programmable logic portfolio, sitting above Cyclone low-cost FPGAs and below the Stratix V/Stratix 10 flagship generations. It addresses mid- to high-density designs in communications, signal processing, and embedded compute. Key differentiating specifications of the EP3SL70F484I3G include its 24 transceiver channels, dedicated DSP blocks for high-throughput fixed- and floating-point operations, on-chip triplicated register and lockstep structures for single-event upset mitigation, and support for external memory interfaces including DDR3 SDRAM up to 800 MHz. The 484-pin FCBGA package provides a high-density ball grid that supports the wide I/O count and signal-integrity demands of multi-gigabit serial links. Architecturally, the Stratix III L family uses a low-power variant of the Stratix III fabric with reduced static power consumption and 1.0V core operation, while retaining the same ALM architecture, MLAB memory blocks, and 8T/9T SRAM. Designers can compile bitstreams in Altera Quartus II and target a broad IP library for memory controllers, Ethernet MACs, PCIe Gen1/Gen2, and DSP kernels. Typical applications include wireless baseband DSP, serial backplane aggregation, ASIC prototyping, test and measurement instrumentation, and high-speed serial protocol bridging. Designers choose Stratix III L when they need a balanced mix of logic density, transceiver bandwidth, and power efficiency. When designing with this device, follow the Altera Stratix III handbook guidelines for PCB power-plane stacking, transceiver channel routing, and decoupling - the FCBGA substrate demands matched-length differential pairs and a controlled-impedance stackup. Configuration via JTAG or serial flash is supported. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
EP3SL70F484I3N - 67.5K LE Stratix III L FPGA, 484-FBGA | Intel
The Intel EP3SL70F484I3N is a high-density, low-power member of the Stratix III L FPGA family, integrating 67,500 logic elements and 2,699,264 bits of embedded RAM in a 484-ball FineLine BGA package. It is a 296-I/O device fabricated on a 40 nm process, with 2,700 LABs/CLBs, 24 DSP blocks, and a maximum user I/O count of 296. The 'I3' suffix indicates the -40C to +100C industrial temperature grade. An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that allows designers to configure digital logic blocks and interconnects after manufacture. The Stratix III L family sits in the high-performance, low-power segment of Intel's (formerly Altera's) programmable logic hierarchy: FPGA -> programmable logic -> ASIC alternative -> digital IC. The 'L' sub-family specifically trades absolute peak performance for substantially lower static and dynamic power versus the Stratix III base series, enabling higher logic density at constrained thermal envelopes. Key features include up to 296 user I/Os, support for external memory interfaces including DDR3 with dedicated hard IP, up to 24 DSP blocks for high-throughput signal processing, and embedded transceivers in higher density variants. The 484-FBGA package (23 mm x 23 mm body) exposes the full I/O bank count while keeping board area manageable for high-performance designs. Cyclone and Stratix families remain widely supported by the Quartus II design software. Architecturally, the EP3SL70F484I3N leverages an adaptive logic module (ALM) of 8-input fracturable look-up tables combined with dedicated MLAB memory blocks. The Programmable Power Technology allows unused logic and routing to be powered down automatically, which is the principal mechanism behind the 'L' family's power advantage. Hard memory controllers and DSP blocks improve both performance and energy efficiency compared with soft implementations. Typical applications include high-speed digital signal processing, telecom baseband and protocol bridging, software-defined radio front-ends, industrial vision and machine control, and high-throughput data acquisition. For engineers transitioning from ASIC designs, the Stratix III L family offers a familiar Quartus tool flow while retaining the NRE cost benefit of FPGA. Choose this part when you need Stratix III L-class resources in the 484-ball BGA package. When designing with this device, confirm the Quartus II device support status because Stratix III is now in its mature-support lifecycle and newer Intel Cyclone 10 or Stratix 10 families offer lower power at comparable logic densities. Pay attention to the I/O bank supply sequencing required by the device and reference the Intel pinout file for the 484-FBGA package before PCB layout. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix III L family, and practical design notes that are not collected together in the manufacturer datasheet, giving procurement and engineering teams a single decision-ready reference.
EP3SL70F484I4 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3SL70F484I4 is a member of the Stratix III L FPGA family, delivering 67,500 logic elements and 2,699,264 bits of embedded memory in a 484-ball fine-pitch BGA (FCBGA) package. The device is fabricated on a 40 nm TSMC process and combines high logic density, abundant block RAM, and DSP-rich architecture with industrial-grade temperature support. As a logic-array device in the Programmable Logic Device (PLD) hierarchy, it belongs to the broader category of digital ASIC-replacement silicon that sits between fixed-function ASSPs and full-custom ICs. An FPGA (Field Programmable Gate Array) is a digital integrated circuit composed of configurable logic blocks, routing channels, and dedicated hard IP blocks that the designer programs after manufacture. Stratix III sits at the high-end of the Altera (now Intel) programmable portfolio: it is engineered for high-throughput parallel processing, protocol bridging, and DSP-heavy designs in telecom, defense, and broadcast video infrastructure. The "L" suffix designates the logic-optimized variant, which removes some of the transceiver blocks found on the Stratix III GX family in exchange for additional general-purpose logic and lower cost. Key features of the EP3SL70F484I4 include 2,700 Logic Array Blocks (LABs), up to 488 embedded multipliers (18x18), 8 transceiver-style PLLs plus 16 general-purpose PLLs for clock synthesis, 1.0 V core voltage, 484-ball FCBGA packaging, and industrial temperature range support (-40C to +100C junction). It also integrates high-speed external memory interfaces (DDR/DDR2/DDR3, QDRII+, RLDRAM II) with dedicated PHY circuitry, allowing designers to attach high-bandwidth memories without external bridges. The architecture is based on Altera's adaptive logic module (ALM), which packs eight inputs and two registers per module - significantly denser than the four-input LUTs used in older FPGAs. Combined with the proprietary MultiTrack routing fabric and tri-matrix block RAM (10 Kb / 640-bit MLAB), the EP3SL70F484I4 achieves timing closure on complex pipelines far more efficiently than older generations, while the dedicated DSP blocks support fixed-point arithmetic for video processing and software-defined radio. Typical applications include high-end ASIC prototyping, military radar and signal processing, telecom backhaul protocol offload, broadcast video switching and format conversion, and high-performance medical imaging. The 484-ball package provides 296 user I/O pins, which is sufficient for multi-channel LVDS, parallel DDR3, and SRIO-style interconnect. Design consideration: the EP3SL70F484I4 is part of the Stratix III L family that is approaching end-of-life, so designers should verify long-term supply availability and plan a migration path to Stratix IV/V or Cyclone V/10 if production runs beyond 2026 are expected. This page synthesizes distributor pricing, drop-in Stratix III/IV alternatives, and practical design notes not found in the manufacturer datasheet alone - giving engineers a single decision-ready reference.
EP3SL70F484I4G - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
The Intel EP3SL70F484I4G is a high-density, low-power Stratix® III L Field Programmable Gate Array (FPGA) IC built on a 65 nm process and offered in a 484-ball FineLine BGA (FC-FBGA) package. It integrates 67,500 logic elements (LE) backed by 27,000 adaptive logic modules (ALM), 2.57 Mbit of embedded memory, and 296 user I/O pins operating from a 1.1 V core supply. The device also embeds 48 digital signal processing (DSP) blocks and 8 phase-locked loops (PLL) for high-performance DSP and high-speed serial I/O design. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, routing, and I/O can be reconfigured after manufacture. Stratix® III L sits within the FPGA taxonomy as a high-end, low-static-power variant of Altera's (now Intel) Stratix III family, optimized for applications that demand high logic density, abundant DSP, and low dynamic power. The 'SL' (Stratix III Low-power) family extends the Stratix III generation with programmable power technology that reduces static consumption while preserving performance. Key features of the EP3SL70F484I4G include 296 user I/Os that support multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), 2.57 Mbit of embedded SRAM organized as M9K/M144K blocks, 48 DSP blocks for fixed- and floating-point arithmetic, and 8 PLLs with fractional-N support. The 484-ball FC-FBGA package is a wire-bond-free flip-chip BGA that improves signal integrity and thermal dissipation, making it well suited for high-speed parallel buses and serializer/deserializer (SerDes) lanes. The 65 nm CMOS process and Stratix III architecture deliver an excellent logic-to-power ratio for compute-intensive workloads. Programmable Power Technology enables unused logic and routing to be powered down automatically, while dedicated hard IP blocks (memory, DSP, PLLs, transceivers on higher-density members) accelerate common functions. The result is a flexible platform for ASIC prototyping, high-throughput data acquisition, and real-time signal processing. Typical applications for this part include high-performance digital signal processing (radar, beamforming, software-defined radio), high-speed video and image processing pipelines, ASIC prototyping and emulation, industrial test and measurement equipment, and high-speed data-acquisition front ends. The 484-ball FC-FBGA package and industrial-grade temperature range (-40C to +100C) also suit telecom and aerospace ground systems. When designing with the EP3SL70F484I4G, ensure a multi-layer PCB with continuous power and ground planes is used to maintain signal integrity for the LVDS pairs and high-speed clocks. Decouple each core and I/O bank with a combination of bulk and high-frequency ceramic capacitors placed as close to the balls as physically possible, and follow Altera's pin-out and power-sequencing guidelines in the device handbook to avoid in-rush latch-up at power-up. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes that complement (but do not replace) the official Altera/Intel Stratix III device handbook.
EP3SL70F484I4L - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
The Altera (Intel) EP3SL70F484I4L is a low-power member of the Stratix III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/O in a 484-ball FineLine BGA (FBGA) package. Built on a 65 nm process and optimized for power efficiency, the device targets high-performance digital signal processing, high-speed serial connectivity, and memory-rich compute applications where thermal and energy budgets are critical. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected via a programmable routing fabric. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting hierarchically between standard logic ICs and ASICs. The Stratix III L family specifically trades some absolute logic capacity for substantially reduced static and dynamic power versus the Stratix III standard variant. Key features of the EP3SL70F484I4L include up to 450 MHz core performance, 1.1 V core operation, dedicated DSP blocks for fixed- and floating-point arithmetic, embedded RAM with optional ECC, programmable I/O supporting LVDS, HSTL, SSTL and other standards, and support for high-speed external memory interfaces including DDR3. The device integrates PLLs for clock management and is suitable for PCIe hard IP and multi-gigabit serial links via its transceiver blocks. The architecture combines a 65 nm process node with Altera's Programmable Power Technology, which allows unused logic and routing resources to be selectively powered down. This makes the L variant particularly attractive for power-sensitive designs such as wireline telecom line cards, software-defined radio basestations, and high-throughput image processing pipelines where the 67.5K LE capacity is sufficient but absolute maximum logic density is not required. Typical applications include high-end communication infrastructure, ASIC prototyping, high-performance DSP, and broadcast video processing. When designing with this device, verify that Quartus II design software supports the specific transceiver and I/O features required, and confirm thermal dissipation under worst-case utilization using the device's published thermal model.
EP3SL70F484I4LG - Stratix III L FPGA, 67.5K LE, 484-FCBGA | Intel
The Intel EP3SL70F484I4LG is a high-density, low-power member of the Stratix III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os into a 484-ball FineLine BGA (FCBGA) package. Built on a 40 nm process, this Stratix III L variant is positioned for power-sensitive applications that still require the performance and transceiver-rich fabric of the Stratix III family. Operating temperature spans -40 C to +100 C (industrial), and the device is supplied from a 1.1 V core rail with separate VCCIO banks for mixed-voltage I/O. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable routing, dedicated block memory, DSP slices, and high-speed transceiver blocks into a single silicon die. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-density, high-performance tier of the semiconductor logic hierarchy. Modern FPGAs are routinely used as integration platforms that replace discrete ASICs, DSPs, and microcontrollers in parallel processing, signal processing, and high-bandwidth I/O applications. Key feature highlights of the EP3SL70F484I4LG include 27,000 Adaptive Logic Modules (ALMs), 2.57 Mbit of embedded block RAM, integrated DSP blocks for high-throughput arithmetic, dedicated clock networks and PLLs, and support for external memory interfaces including DDR2/DDR3. The 484-ball FCBGA package provides ample signal margin for high-speed serial protocols and supports up to 296 user I/Os distributed across multiple I/O banks. The 'I4' speed grade and 'L' (low-power) suffix denote the low-static-power variant with the -4 speed bin, optimized for systems where thermal envelope and battery or conduction-cooled operation are critical. The architecture leverages Altera's classic Stratix III fabric with adaptive logic modules, MLAB memory, and dedicated multiplier/adder DSP blocks. A multi-tier clocking backbone with up to 12 PLLs supports complex timing requirements, while the device's high-speed serial transceivers (when populated on the silicon) enable multi-gigabit serial connectivity. Industrial temperature grade and Pb-free FCBGA assembly make the EP3SL70F484I4LG suitable for harsh-environment embedded systems. Typical applications for the EP3SL70F484I4LG span defense and avionics, industrial automation and machine vision, medical imaging pipelines, broadcast video processing, telecom baseband processing, and high-performance test and measurement instrumentation. The low-static-power fabric also makes it attractive for portable or ruggedized computing platforms where heat dissipation is constrained. When designing with the EP3SL70F484I4LG, ensure the Quartus II / Quartus Prime design toolchain is set to the correct device variant and that the board provides the multi-rail power sequencing required by Stratix III (1.1 V core plus VCCIO/VCCPD/VCCR/VCCA/VCCPT). Use the Altera (now Intel) Pin Planner and the device handbook's pinout file to assign banks and verify signal integrity on high-speed lanes. This page synthesizes distributor pricing, drop-in alternative options, and practical design notes that are not collected in the manufacturer datasheet, including parametric proximity scoring against verified same-family and cross-brand equivalents.
EP3SL70F484I4LN - Stratix III L FPGA, 67.5K Logic Elements | Intel
The Intel (formerly Altera) EP3SL70F484I4LN is a Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FC-FBGA) package, delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os. Built on a 65 nm process and operating from a 0.9 V core supply with 375 MHz maximum performance, this device targets high-density, low-power logic designs in industrial, communications, and test-and-measurement systems. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacture through configuration bitstream loading. FPGAs occupy a unique position in the digital design hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs), faster to prototype than software running on a microcontroller, and able to exploit massive parallel datapath architectures. Within Intel's portfolio, the Stratix III family sits between the low-cost Cyclone series and the high-performance Stratix V series, optimized for ASIC-prototyping, signal processing, and high-throughput datapath designs. Key features of the EP3SL70F484I4LN include 2,700 LABs (Logic Array Blocks) supporting 67,500 logic elements, 2,699,264 embedded RAM bits for on-chip buffering, integrated 18x18 multipliers for DSP operations, and 296 general-purpose user I/Os distributed across eight I/O banks. The 65 nm process node combined with Stratix III L power optimization delivers substantially lower static power than earlier Stratix II devices, while the industrial temperature grade (-40C to +100C for the I4 speed grade) supports harsh-environment deployments. The Stratix III L architecture employs an adaptive logic module (ALM) that can implement up to 6-input LUTs with shared arithmetic, alongside dedicated DSP blocks, embedded M9K memory blocks, and high-speed transceivers. The device supports configuration via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes, allowing flexible boot in production systems. Typical applications include ASIC prototyping, high-speed data acquisition, digital signal processing, software-defined radio (SDR) baseband processing, video and image processing pipelines, and industrial control systems requiring deterministic parallel computation. The 484-ball FC-FBGA package with 1.0 mm pitch is suitable for multi-layer PCBs. Designers should plan for proper decoupling of the 0.9 V core supply (typically 100 uF bulk plus 0.1 uF/0.01 uF ceramics per bank), thermal dissipation through the exposed die paddle, and consideration of the configuration scheme during PCB layout. Speed-grade I4 targets mid-tier performance balancing timing margin and power consumption. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III L family, and practical design notes not found in the manufacturer datasheet.
EP3SL70F484I4N - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
The Altera (now Intel) EP3SL70F484I4N is a high-density Stratix III L series Field Programmable Gate Array (FPGA) IC built on a 65 nm CMOS process, featuring 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os housed in a 484-ball FineLine BGA (FC-FBGA) package. It is offered in the industrial temperature grade (-40C to +100C junction) and operates from a 1.1 V core supply, making it a power-optimized member of the Stratix III family targeted at mid-range logic capacity applications. A Field Programmable Gate Array (FPGA) is a programmable semiconductor belonging to the broader category of programmable logic devices (PLD) and integrated circuits. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP blocks, and transceivers. Within the system design hierarchy, an FPGA sits between microcontrollers/MCUs and ASICs - offering higher logic density and parallelism than MCUs while remaining reprogrammable unlike ASICs. The Stratix III L series specifically addresses lower static power consumption compared to the standard Stratix III family. Key features of the EP3SL70F484I4N include 2,700 Logic Array Blocks (LABs), 450 MHz maximum internal operating frequency, programmable power technology, and 24 transceiver channels supporting up to 3.75 Gbps (per family datasheet). The device integrates hard IP for PCI Express Gen1, memory controllers (DDR2/DDR3/QDRII+), and SERDES, reducing external component count. Configuration is supported via fast passive parallel, fast active serial, or JTAG interfaces using the Altera Quartus II design suite. Typical applications include high-speed digital signal processing in wireless baseband, video broadcast infrastructure, telecom backhaul, radar and sonar signal processing, ASIC prototyping, and high-performance compute accelerators. The combination of high logic density, embedded memory, and transceiver capability makes it well suited for parallel processing tasks that exceed MCU capabilities but where ASIC NRE costs are prohibitive. When designing with this device, allocate the FBGA-484 PCB footprint carefully and provide at least 8 layers with continuous ground planes below the BGA for signal integrity and thermal dissipation. Use Altera's Quartus II toolchain (version 13.0 or later supports Stratix III) for synthesis, place-and-route, and power estimation. Note that Altera has formally discontinued the Stratix III family; long-term designs should evaluate migration to Stratix IV/V or Cyclone V GX equivalents. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found on a single manufacturer datasheet.
EP3SL70F780C2 - Stratix III L FPGA, 67.5K LE, 780-FCBGA | Intel
The Intel EP3SL70F780C2 is a high-density Stratix III L family FPGA featuring 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Built on a TSMC 65 nm process and supplied with a 1.1 V core voltage, it targets performance-oriented DSP, communications, and high-throughput data processing designs requiring up to 500 MHz operation. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs occupy the tier above general-purpose microcontrollers and below ASICs in the compute hierarchy, offering hardware-level parallelism with the flexibility of in-system reprogrammability. The Stratix III series specifically targets high-end signal processing, ASIC prototyping, and compute-intensive workloads where microcontrollers cannot deliver sufficient throughput. Key features include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier/DSP blocks, dedicated memory interfaces supporting DDR3/QDRII+, and 8.625 Mbits of MLAB memory. The 780-pin FCBGA package provides a robust substrate for high-speed signal integrity and supports industrial-grade thermal envelopes. Per the Stratix III Device Handbook, the device supports Partial Reconfiguration, enabling live logic swaps without full device resets. Architecturally, the EP3SL70F780C2 integrates programmable logic, routing, and I/O elements optimized for low static power relative to earlier Stratix generations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, enabling direct interfacing to high-speed external memories and backplane transceivers. Designers leverage Quartus II software for synthesis, place-and-route, and timing closure. Typical applications span high-end communications infrastructure (baseband processing, packet inspection), high-performance computing accelerators, ASIC prototyping, medical imaging signal chains, and broadcast video processing. Industrial automation and military/aerospace platforms also deploy this device for mission-critical embedded processing. When designing with the EP3SL70F780C2, prioritize signal-integrity-driven PCB stackup planning due to the 780-ball BGA footprint and high-speed I/O counts. Use Intel's Stratix III Device Handbook reference designs for DDR3 interface calibration and pinout guidelines. Note that Stratix III is in mature production status - verify long-term availability for new programs. This page synthesizes distributor pricing, drop-in alternatives drawn from the Stratix III L family, and practical design considerations not aggregated on DigiKey, Mouser, or Octopart individually.
EP3SL70F780C2G - Stratix III L FPGA 67.5K LE 780-FCBGA | Intel
The Intel EP3SL70F780C2G is a Stratix III L family Field-Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/O pins, housed in a 780-ball FineLine BGA (FCBGA) package. It belongs to the low-power (L) Stratix III sub-family, which targets high-performance designs where static and dynamic power must be balanced against the 40 nm process node. The device is built on Intel's (formerly Altera) TSMC 40 nm low-power CMOS process and supports up to 488 general-purpose I/Os plus high-speed transceivers and external memory interfaces. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), PLLs, and high-speed serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, an FPGA sits inside the programmable logic -> logic IC -> integrated circuit hierarchy, and is used to implement arbitrary digital hardware without the cost and lead time of an ASIC. Stratix III L parts were engineered for high-throughput signal processing and high-speed I/O while reducing power relative to the original Stratix III series. Key features of the EP3SL70F780C2G include 67,500 logic elements, 2,699,264 embedded memory bits, 488 user I/O, dedicated DSP blocks, programmable power technology with hot-socketing capability, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The device operates from a 0.9 V core supply (VCC) with auxiliary supplies for I/O banks and transceivers, and supports commercial (0 C to 85 C) junction temperature grades under the C2 speed grade designation. Architecturally, the part uses ALM-based logic elements (Adaptive Logic Modules), real-time fractional PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The C2 speed grade places it in the medium-performance bin relative to other Stratix III L devices, balancing timing margin against achievable Fmax. The 780-ball FCBGA package integrates the silicon, decoupling, and high-pin-count escape routing required for the 488 user I/Os plus transceiver and supply balls. Typical applications include high-speed data acquisition, medical imaging front-ends, wireless baseband processing, software-defined radio, broadcast video processing, and ASIC prototyping where 67.5K logic elements are sufficient. Designers select this part when they need Stratix III's transceiver and DSP capability at lower static power than the standard Stratix III series. When designing with this part, engineers should use Intel Quartus II design software (version 9.1 SP2 or later Stratix III service packs), follow the Stratix III PowerPlay early power estimator guidance, and observe PCB layout rules for FCBGA packages including via-in-pad and microvia stackups. The C2 speed grade affects timing closure; lower temperature grades (-40 C to 100 C, I-suffix) are recommended for industrial applications. This page synthesizes distributor pricing, Stratix III L family drop-in alternatives with matching FCBGA-780 footprint, and practical PCB design notes not consolidated in any single manufacturer document.
EP3SL70F780C2N - 67.5K Logic Elements, 780-FBGA Stratix III L FPGA
The Intel (Altera) EP3SL70F780C2N is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm CMOS process, offering 67,500 logic elements (LEs) organized into 2,700 Logic Array Blocks (LABs), 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FC-FBGA) package. The device is built on the Stratix III L variant that targets power-sensitive high-density designs while retaining high-speed serial transceiver support up to 600 MHz logic performance and 1.1 V core operation. The "C2" speed grade and "N" non-industrial-temperature suffix place this part in the mainstream commercial performance envelope. An FPGA is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect that an engineer can reconfigure after manufacture to implement any digital function from simple glue logic to complex multi-core System-on-Chip subsystems. Stratix III belongs to the high-performance FPGA tier (above Cyclone IV/VII, below Stratix IV/V/10), positioned by Intel/Altera for ASIC prototyping, telecom infrastructure, and signal-processing backplanes. Key features of the EP3SL70F780C2N include 488 user I/O pins, 2,700 LABs of adaptive logic modules, embedded M9K memory blocks totaling 2.7 Mb, embedded 18x18 multipliers for DSP, up to 12 full-duplex transceiver channels on the Stratix III L family, and support for external DDR/DDR2/DDR3 memory interfaces with hard PHY controllers. Hard IP blocks for PCI Express Gen1/Gen2 and multiple PLLs simplify high-speed serial and parallel interface implementation. The architecture is built on Altera's adaptive logic module (ALM) fabric - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and registers, providing approximately 1.4x the logic capacity per area versus previous-generation Stratix II ALMs. The 65 nm low-power process variant adds programmable power technology with speed and area optimized tiers, allowing unused logic and memory to enter low quiescent states. Typical applications include wireless baseband processing, high-end image-processing pipelines, military/aerospace digital signal processing, ASIC prototyping and emulation platforms, and high-throughput data-acquisition systems. The 780-FBGA package provides a high-pin-count interface suitable for memory-rich designs and wide external bus integration. When designing with this device, ensure the Quartus II / Quartus Prime design suite (the canonical toolchain for Stratix III) supports the chosen speed grade and configuration scheme. Plan for AS, PS, or JTAG configuration with appropriate EPCS or EPCQ flash, and verify thermal dissipation through PCB thermal vias under the FC-FBGA thermal pad. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes for the EP3SL70F780C2N that go beyond the manufacturer datasheet summary block.
EP3SL70F780C3 - Stratix III L FPGA, 67.5K LE, 488 I/O, 780-BGA | Intel
The Intel (formerly Altera) EP3SL70F780C3 is a high-density, low-power Stratix III L series Field Programmable Gate Array (FPGA) built on a 65 nm process, delivering 67,500 logic elements, 2,699,264 embedded memory bits, and 488 user I/O pins in a 780-ball FC-FBGA package. According to the Stratix III device family datasheet, it operates from a 1.1 V core supply, supports up to 500 MHz internal clocking, and integrates 2,700 LABs (Logic Array Blocks) plus 2,488 Kbits of embedded RAM distributed across M9K and M144K blocks. An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP (DSP blocks, M9K/M144K memory, PLLs, transceivers) that the designer configures via an HDL bitstream. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs in capacity and below ASICs in unit cost, and are widely used for parallel DSP, high-speed serial I/O, and ASIC prototyping in the broader taxonomy of programmable logic devices (PLDs) within digital semiconductors. Key features of the EP3SL70F780C3 include support for up to 12 transceivers depending on the die variant, dedicated DSP blocks for high-throughput arithmetic, on-chip termination (OCT), and the Quartus II design software ecosystem. The 780-pin FC-FBGA package offers a compact footprint for high-I/O designs while providing robust thermal dissipation through the flip-chip BGA construction. The 'C3' speed grade designates a commercial temperature range with a specific performance bin, balancing speed and power for non-extreme environments. The Stratix III L architecture leverages adaptive logic modules (ALMs) instead of traditional 4-input LUTs, yielding up to 25% higher performance and lower dynamic power versus prior Stratix generations. Hard IP such as PCI Express hard IP blocks, external memory interfaces (DDR2/DDR3), and dedicated PLLs are embedded directly in silicon, freeing programmable fabric and reducing latency for memory-intensive and serial-protocol designs. Typical applications include ASIC prototyping, high-speed digital signal processing (DSP), high-end communications infrastructure, video processing and image acceleration, and test and measurement instrumentation. The 488 user I/Os make it suitable for memory-rich and parallel data-path designs that interface with DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II memories. When designing with this part, ensure proper power-rail sequencing (1.1 V VCCINT before VCCIO), adequate PCB stackup for multi-Gbps transceivers, and the use of the Quartus II design toolchain (the last supported major release is Quartus II v13.1). The 'C3' commercial speed grade is appropriate for lab and production environments operating between 0°C and 85°C junction. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III and Stratix III L families, and design considerations not aggregated on any single distributor page.
EP3SL70F780C3G - Stratix III L FPGA, 67.5K LE, 488 I/O | Intel
The Intel EP3SL70F780C3G is a Stratix® III L series Field Programmable Gate Array (FPGA) featuring 67,500 logic elements (LE), 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FBGA) package. Operating at a -3 speed grade with commercial temperature rating, this device is fabricated on TSMC's 40nm low-power process and delivers high-performance logic, DSP, and memory-centric design capability. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon features such as block RAM, DSP slices, and high-speed transceivers. Stratix III L FPGAs extend the Stratix III architecture into lower-static-power variants, placing them in the taxonomy of programmable logic -> FPGA -> high-performance FPGA -> low-power Stratix series. The 'L' (low-power) variants reduce static power consumption by approximately 50% versus standard Stratix III devices while maintaining comparable performance. Key features include 67,500 logic elements, 2,699,264 embedded memory bits organized into M9K and M144K blocks, 384 (18x18) multipliers for DSP operations, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 4 PLL blocks and 12 global clock networks for advanced clock management. The Stratix III L architecture employs adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient mapping of combinational and registered logic. The 40nm process enables high core frequencies while the low-power variant reduces leakage, making EP3SL70F780C3G suitable for both performance-critical and power-constrained designs. Typical applications include high-performance digital signal processing, telecommunications infrastructure, broadcast video processing, high-speed serial protocol bridging, and ASIC prototyping. The 488 user I/Os support board-level integration with external memory, high-speed data converters, and backplane interfaces. When designing with the EP3SL70F780C3G, ensure proper power supply sequencing (2.5V VCCBAT, 0.9V VCC, 1.1V VCCPT) and adequate thermal management via PCB thermal vias beneath the FBGA. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation. Use JTAG or active serial configuration for in-system programming. This page synthesizes distributor pricing, FPGA family drop-in alternatives, and Stratix III L design notes not found in the manufacturer datasheet alone.
EP3SL70F780C3N - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
The Intel EP3SL70F780C3N is a Stratix III L family field-programmable gate array (FPGA) delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 hardware multipliers, all integrated in a 780-ball FC-FBGA package. Built on a 65 nm CMOS process and rated for operation up to 717 MHz, the device targets high-density logic, DSP, and memory-bandwidth applications where Stratix III's adaptive logic modules (ALMs) and TriMatrix memory blocks provide a balance of performance and integration. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that falls within the broader category of programmable logic devices (PLDs), which are themselves a subset of digital integrated circuits. Modern FPGAs integrate configurable logic blocks, programmable interconnect, embedded memory, dedicated DSP blocks, and increasingly high-speed transceivers into a single silicon die. Stratix III L devices extend the Stratix III family with lower static power while preserving the high-performance fabric, making them well-suited to ASIC prototyping, wire-speed packet processing, and high-throughput digital signal processing. Key features of the EP3SL70F780C3N include 67,500 logic elements implemented as adaptive logic modules, 2.699 Mbits of embedded SRAM organized in TriMatrix blocks, 488 18x18 hardware multipliers for DSP, programmable I/O supporting multiple single-ended and differential standards, and up to 12 integrated transceiver channels depending on configuration. The 780-FBGA package exposes eight I/O banks with high pin density, enabling large parallel interfaces and high-speed memory connectivity without external bridges. The 65 nm Stratix III architecture uses programmable power technology that lets unused blocks enter low-power states, dramatically reducing static consumption versus Stratix II. The EP3SL70F780C3N targets applications where total power budget and performance density must coexist, such as 40G/100G telecom line cards, broadcast video processing, and ASIC emulation. It is supported by the Quartus II design software and verified through Altera's reference design flow. Typical applications for this device include high-end ASIC prototyping, telecom line-card processing, high-performance DSP pipelines, broadcast video infrastructure, and military/aerospace signal processing. Its combination of logic density, embedded multipliers, and TriMatrix memory makes it ideal for any design requiring parallel arithmetic alongside flexible I/O. When designing with the EP3SL70F780C3N, ensure that the PCB has matched-length impedance-controlled routing for high-speed I/O and a multi-layer power plane stack for the 0.9 V core and 1.1 V auxiliary supplies. Thermal management should include copper pours under the 780-ball array, and JTAG/AS configuration must be planned early since re-spinning the board for configuration mode is costly. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix III family, and practical design notes not found on the manufacturer product page, giving procurement and engineering teams a single reference for sourcing the EP3SL70F780C3N.
EP3SL70F780C4 - Stratix III L FPGA 67.5K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SL70F780C4 is a high-density, low-power Stratix III L Field Programmable Gate Array built on a 65 nm process and housed in a 780-pin FCBGA (FBGA-780) package. It integrates 67,500 logic elements (LEs), 2,699,264 bits of embedded memory, 488 user I/Os, and 2,700 LABs (Logic Array Blocks), delivering 500 MHz core performance at a core voltage of 1.1 V. The device is offered in the C4 commercial speed grade with the operating junction temperature range of 0 C to 85 C. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows hardware engineers to implement arbitrary digital logic through a configuration bitstream. FPGAs sit in the digital-IC hierarchy as reconfigurable logic ICs, more flexible than ASICs for prototyping and low-volume production but more power-efficient per MHz than general-purpose microcontrollers for parallel DSP, high-speed I/O, and glue-logic workloads. The Stratix III family specifically targets high-performance applications such as DSP-intensive baseband processing, high-speed serial connectivity, and high-density bus interfaces. Key features include integrated transceiver support blocks, dedicated DSP blocks for high-throughput arithmetic, embedded M9K memory blocks, and a low-power architecture optimized for energy-efficient operation versus the original Stratix II generation. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL/SSTL memory interfaces, enabling direct connection to DDR/DDR2/DDR3 memories and high-speed parallel buses. Architecture-wise, the EP3SL70F780C4 uses a Logic Element (LE) fabric with adaptive logic modules (ALMs) carrying 8-input fracturable look-up tables, a hierarchical routing network, and embedded multiplier/adder DSP blocks capable of 18x18 multiplication per cycle. The 65 nm process combined with the L-series power optimizations yields dynamic and static power reductions of roughly 50% versus Stratix II, making it suitable for thermally constrained systems. Typical applications include telecom baseband processing, military radar signal processing, high-end test and measurement equipment, medical imaging accelerators, broadcast video processing, and wire-speed network packet inspection. The combination of 67.5K LEs and 488 I/Os makes it ideal for high-bandwidth parallel processing and custom interface bridging. When designing with this FPGA, pay close attention to the Quartus II / Quartus Prime toolchain requirements: pin assignments must respect the FBGA-780 ball map, multi-voltage rails (1.1 V core, 2.5 V/3.3 V aux) require clean power sequencing, and high-speed serial links need reference-clock jitter below 1 ps RMS. Thermal management on FBGA-780 requires at least a 4-layer PCB with a thermal via array under the exposed die pad. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical Quartus II design notes not found in the manufacturer datasheet alone.