FPGA & CPLD
製品 (6666)
10M04DCU324I7G - MAX 10 FPGA 4K LE, 324-LFBGA | Texas Instruments
The Altera (Intel) 10M04DCU324I7G is a member of the MAX 10 FPGA family, delivering 4,000 logic elements in a 324-pin LFBGA (U324) package with 246 user I/O pins. Built on a low-power non-volatile process, this device integrates 193,536 bits of embedded SRAM and 246 programmable I/O, while operating from a single 1.2V core supply with on-chip voltage regulators. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the broader category of integrated circuits used for digital logic implementation. FPGAs sit in the hierarchy of: programmable logic -> logic device -> digital IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are reconfigurable hardware that can implement custom digital circuits after manufacture, making them ideal for prototyping, low-volume production, and designs requiring late-stage logic changes. Key features of the 10M04DCU324I7G include 4,000 logic elements, 246 maximum user I/O, 193,536 bits of user flash memory for non-volatile configuration storage, and an industrial temperature grade of -40C to +100C (I7). The device also integrates a hard ADC block, dual configuration flash, and DSP blocks in selected variants. The U324 package provides high I/O density for space-constrained industrial designs. The MAX 10 architecture combines a Look-Up Table (LUT)-based fabric with embedded memory blocks (M9K), digital signal processing blocks, and the unique dual-configuration flash feature that enables instant-on operation and remote field upgrades. The 10M04DCU324I7G operates from a single 1.2V supply, eliminating the need for external configuration PROM. Typical applications include industrial control and factory automation, motor control drive interfaces, video processing bridging, automotive infotainment prototypes, IoT edge nodes, and portable instrumentation. The integrated flash and ADC make it particularly suited for industrial sensor aggregation and human-machine interface (HMI) designs. When designing with this device, ensure PCB layout follows Intel/Altera's 324-ball BGA fanout guidelines and that decoupling capacitors are placed close to the supply balls. Quartus Prime design software is required for synthesis, place-and-route, and bitstream generation. Industrial-grade variants like I7 are suited for harsh environments. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design notes not found in the manufacturer datasheet, providing engineers with a unified reference for the 10M04DCU324I7G.
10M04DCU324I7P - MAX 10 FPGA 4K LE UFBGA-324 | Intel / Altera
The Intel / Altera 10M04DCU324I7P is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 4,000 logic elements, 193,536 bits of embedded user flash memory, and a 246-pin I/O count into a 324-ball Ultra-FineLine BGA (UFBGA-324) package. Built on TSMC's 55nm embedded flash process, the device combines instant-on non-volatile configuration with on-chip analog and DSP blocks. Per the verified listing, the part is specified for an industrial junction temperature grade and a 1.2V core operating voltage. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through a configuration bitstream, occupying the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. The MAX 10 family targets glue-logic, motor control, and I/O-expansion roles where a microcontroller alone is insufficient but a high-density Cyclone or Stratix part is over-spec. The 10M04 is the lowest-density member of the MAX 10 lineup, sitting below the 10M08, 10M16, and 10M50. Key features include 4,000 Logic Elements (LEs), 193,536 bits of user flash, integrated ADC block, on-chip temperature sensor, and support for single-supply operation from a 3.0V/3.3V external rail. The device also offers embedded SRAM configured as M9K blocks, phase-locked loops (PLLs) for clock generation, and hardened multipliers for DSP. The UFBGA-324 package exposes 246 general-purpose user I/Os while the remaining balls are allocated to power, ground, and configuration signals. From an architecture standpoint, MAX 10 devices use a look-up-table (LUT) based fabric with non-volatile flash configuration cells, eliminating the need for external boot PROM. The dual-configuration flash image feature allows in-field firmware updates without external storage. The internal configuration controller reloads the bitstream from flash at power-up, achieving sub-10ms startup typical for the 10M04 density. Typical applications include industrial I/O expansion, motor drive control, sensor aggregation front-ends, protocol bridging (UART/SPI/I2C to Ethernet), and low-density glue-logic replacement. Designers also use the 10M04 for portable instrumentation and display controllers where low static power and instant-on behavior are valuable. When designing with the 10M04DCU324I7P, ensure the PCB supports the 0.8mm ball pitch required by the UFBGA-324 package, with microvia or laser-drilled via stackups. Verify that Quartus Prime supports the 10M04 device family and that the chosen speed grade (-7) meets timing closure targets. This page synthesizes distributor pricing, same-family drop-in variants, and PCB layout guidance not found in the manufacturer datasheet alone.
10M04SAE144C8G - MAX 10 FPGA 4K LE, 144-EQFP | Intel | Altera
The Intel (Altera) 10M04SAE144C8G is a MAX 10 family Field Programmable Gate Array (FPGA) with 4,000 logic elements, 101 maximum user I/Os, and 193,536 bits of embedded user flash, housed in a 144-pin plastic Enhanced QFP (EQFP-144, 22 x 22 mm, 0.50 mm pitch) package with an exposed thermal pad. It is fabricated on a 55 nm TSMC process, supports a 1.2 V core, and integrates dual-configuration flash, instant-on support, and a 12-bit 1 MSPS ADC with up to 9 analog input channels - the defining 'SA' feature of this analog-tier variant. A MAX 10 FPGA is a non-volatile, flash-based programmable logic device from Intel that combines look-up-table (LUT) logic, block RAM, phase-locked loops, user flash, and - in the SA/DA variants - an on-chip ADC. Within the broader programmable logic taxonomy, MAX 10 sits below Cyclone/Cyclone V and well below Stratix, targeting glue logic, I/O expansion, bridge, and sensor-interface applications where instant-on non-volatility matters more than absolute LUT density. Key differentiating features of the 10M04SAE144C8G include the integrated 12-bit SAR ADC capable of 1 MSPS across up to 9 analog inputs, dual-boot configuration flash for fail-safe field updates, embedded 18 x 18 multipliers, and 168 kbits of user flash. The ADC's analog inputs are routed to dedicated EQFP pins and are digitally isolated from the FPGA fabric, allowing simultaneous logic and analog acquisition without external MCU integration. Architecturally, the device pairs a flash-backed LUT array with a hard ADC IP block, an on-chip voltage regulator, and configuration memory. The exposed thermal pad on the EQFP-144 package provides a low-thermal-resistance path to PCB copper for thermal relief during sustained ADC operation at full sample rate. Typical applications include industrial sensor aggregation (analog front end plus glue logic in a single chip), motor control interface boards, portable test and measurement front ends, display controllers with touch/proximity sensing, and battery management subsystems that need both analog monitoring and timing/control logic. Design consideration: ADC accuracy is sensitive to a quiet analog supply - separate AVCC from digital VCCINT/VCCIO with a ferrite and adequate decoupling to preserve 12-bit linearity. This page synthesizes drop-in family variants, distributor pricing, and application-circuit context not found in the bare manufacturer datasheet.
10M04SAM153C8G - MAX 10 FPGA 4K LE, 112 I/O, 153-VFBGA | Intel
The Intel (Altera) 10M04SAM153C8G is a low-density MAX 10 Field Programmable Gate Array (FPGA) built on a 55 nm process, offering 4,000 logic elements, 193,536 bits of embedded memory (RAM), and 112 user I/O pins in a 153-ball Very Fine-pitch Ball Grid Array (VFBGA / MBGA) package. What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing hardware designers to implement custom digital logic that can be re-programmed in the field. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers in the design hierarchy: an ASIC is cheaper in volume but cannot be changed after tape-out, while an MCU runs sequential code, whereas an FPGA executes parallel hardware logic. MAX 10 devices belong to Intel's non-volatile CPLD/FPGA hybrid family, integrating dual-configuration flash, analog-to-digital converters, and on-chip voltage regulators that eliminate many external components. Key features include a maximum core speed grade of 8, a 1.2 V core supply (with 2.85 V to 3.15 V I/O supply), 0 to 85 °C commercial operating temperature, embedded 9-Kbit M9K memory blocks, a 1 KB CFM configuration flash, and integrated PLLs. The SAM device suffix indicates a single-supply flash variant with an analog block. Technically, MAX 10 devices use a look-up-table (LUT)-based logic fabric with routing optimized for low static power and instant-on non-volatile boot from internal flash, eliminating the external configuration PROM required by SRAM FPGAs. The 153-ball VFBGA package uses 0.5 mm ball pitch, allowing compact board integration in space-constrained designs. Typical applications include industrial control and I/O expansion, motor control, video bridging, low-volume glue-logic replacement, system management, and consumer electronics requiring fast parallel processing with non-volatile instant-on behavior. When designing with this part, allocate sufficient PCB fan-out for the 153-ball grid and follow Intel's MAX 10 hardware design guidelines for power decoupling, JTAG routing, and dual-purpose pin configuration to avoid signal-integrity issues. This page synthesizes distributor pricing, package alternatives, and practical design notes that complement the manufacturer datasheet.
10M04SAM153I7G - MAX 10 FPGA 4K LE, 153-MBGA, Industrial | Intel
The Intel (Altera) 10M04SAM153I7G is a member of the MAX 10 family of non-volatile FPGAs delivering 4,000 logic elements (LEs), 193,536 bits of embedded SRAM, and 112 user I/O pins in a 153-ball Micro FineLine BGA (MBGA) package. The device operates from a 1.2 V core supply with multi-voltage I/O support, and is rated for the industrial temperature range (-40 °C to +100 °C). This is the single-configuration variant of the smallest MAX 10 density point. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing configurable logic blocks (LBs), programmable interconnect, and on-die memory that can be reconfigured by the designer after manufacture. FPGAs sit above microcontrollers and fixed-function ASICs in the design hierarchy for parallel processing, custom I/O timing, and high-throughput glue logic. MAX 10 is Intel's non-volatile family, integrating flash configuration memory on-die so the device powers up instantly without an external boot PROM - an advantage over SRAM FPGAs that simplifies board layout and reduces BOM cost. Key features of the 10M04SAM153I7G include on-die user flash (up to ~30 Kbits available on small-density MAX 10 die), an integrated ADC block (12-bit, 1 MSps) on larger densities, and hardened PLL, I/O, and DDR3 support. The 153-MBGA package delivers high I/O density in a 9 mm × 9 mm footprint suitable for space-constrained industrial designs. The device supports LVCMOS 3.0/3.3 V I/O standards and offers a hardened Nios II soft-processor fit for state-machine and protocol-bridging tasks. The MAX 10 family uses a TSMC 55 nm embedded-flash process. Configuration is stored in on-die flash, enabling instant-on behavior (typically < 1 ms to user mode after power-up), remote upgrade via JTAG, and dual-image support for fail-safe field updates. The architecture provides per-LB 8-input adaptive logic modules, 18 × 18 multipliers, and block RAM blocks totaling the 193 Kbits quoted in the device overview. Typical applications include industrial control I/O expansion, motor-control glue logic, sensor aggregation, low-volume protocol bridging (SPI, I2C, UART, Modbus, CAN), and portable test equipment that benefits from instant-on, low static current, and high pin density in a small BGA. Design considerations: the 153-ball MBGA requires 0.5 mm (or finer) PCB pitch, microvia stack-ups, and careful fanout. Decoupling follows the Quartus Prime pin connection guidelines - at minimum 0.1 µF + 1 µF near each power pair, plus bulk caps on the 1.2 V regulator. Use the Intel MAX 10 pinout file (.pin) and Quartus Prime Fitter reports to verify timing closure before sign-off. This page synthesizes distributor pricing for 10M04SAM153I7G, drop-in same-package alternatives, and practical design notes not aggregated in the manufacturer datasheet.
10M04SAU169I7G - MAX 10 FPGA 4K LE, 169-UBGA | Intel
The Intel (formerly Altera) 10M04SAU169I7G is a member of the MAX 10 family of non-volatile FPGAs, integrating 4,000 logic elements (LE), 193,536 bits of embedded SRAM, and a 1.2 V core supply in a 169-ball Ultra FineLine BGA (UFBGA / U169) package. Built on TSMC's 55 nm embedded flash process, this single-chip FPGA delivers instant-on functionality through on-chip configuration flash, eliminating external boot memory in most designs. A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. The MAX 10 family extends the classic low-density CPLD concept into a true FPGA fabric while adding hard IP such as ADCs, PLLs, DSP blocks, and embedded SRAM - positioning it between discrete glue logic and higher-density FPGAs from the Cyclone or Arria families. Key features include 4,000 logic elements, 193,536 bits (≈189 Kb) of user flash, a 12-bit 1 Msps ADC, up to 130 user I/O pins, integrated PLLs, and DSP blocks. The 169-ball UFBGA package is 11 mm × 11 mm with 0.65 mm pitch, suitable for compact industrial designs. Operating junction temperature spans -40 °C to +100 °C for the I7 industrial grade. The 10M04SAU169I7G uses a non-volatile flash-based configuration cell, so the bitstream loads in microseconds at power-up. Hard IP for memory controllers, LVDS, and DDR3 interfaces reduces soft logic usage, leaving more LEs available for application logic. The integrated ADC simplifies sensor and analog monitoring without an external ADC IC. Typical applications include industrial motor control, IoT edge nodes, bridge and protocol conversion (I2C/SPI/UART to Ethernet or USB), low-cost video processing, and portable instrumentation. The instant-on flash configuration suits deterministic boot-time systems such as factory automation controllers. When designing with this device, verify the I/O bank voltage compatibility with your system rails. The UFBGA-169 footprint requires a 4-layer or better PCB with microvia technology; signal integrity work is essential for DDR3/LVDS lanes. Use the Intel Quartus Prime Lite or Standard edition toolchain for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-family drop-in alternatives, design notes, and application guidance that supplements the manufacturer datasheet and helps engineers evaluate the 10M04SAU169I7G against alternatives.
10M04SAU324I7G - MAX 10 FPGA, 4K LE, 246 I/O | Intel
The Intel (formerly Altera) 10M04SAU324I7G is a low-cost, non-volatile MAX 10 Field Programmable Gate Array (FPGA) from the MAX 10 family, delivering 4,000 logic elements, 246 user I/Os, and 193,536 bits of embedded SRAM in a 324-ball LFBGA (UBGA-324) package. It integrates a dual-configuration flash, instant-on support, and built-in ADC blocks, making it well-suited for I/O expansion, glue-logic, and bridge applications without external boot memory. The 'I7G' speed/temperature grade corresponds to the industrial temperature range and a specific speed bin, providing deterministic timing across -40C to +100C ambient conditions. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be reconfigured after manufacturing to implement custom digital circuits. FPGAs sit in the hierarchy: programmable logic > logic IC > integrated circuit. Unlike an ASIC, an FPGA is fully programmable in the field, allowing rapid design iteration, in-system updates, and low NRE cost for low-to-medium volume production. The MAX 10 specifically targets cost-sensitive applications by integrating hard IP (ADC, flash, PLLs) onto the FPGA fabric. Key differentiating specifications of the 10M04SAU324I7G include: 4,000 logic elements with 16 Kbits of M9K embedded memory (193,536 bits total), 246 maximum user I/Os, 4 analog inputs via the built-in 12-bit SAR ADC, integrated flash for instant-on configuration, and 1.0V/1.2V core operation. The U324 package maximizes I/O count for board-edge expansion bridges, motor-control pre-processing, or industrial sensor aggregation. Architecturally, the 10M04 uses a TSMC 55nm embedded flash process, allowing single-chip, non-volatile configuration - no external boot PROM is required. The device family integrates dual-configuration flash, analog-to-digital converters, and Phase-Locked Loops (PLLs) directly on-die. Compared with SRAM-based FPGAs that need external boot devices, the MAX 10 reduces BOM count and enables true instant-on behavior at power-up. The Quartus Prime design toolchain supports this device with the free Quartus Prime Lite edition. Typical applications include industrial control and HMI panels, factory automation bridges (I2C/SPI/UART to parallel), motor control pre-processing, portable medical device front-ends, low-cost video/display bridges, and I/O expansion for SoCs. The integrated 12-bit SAR ADC is especially valuable for sensor aggregation in industrial IoT nodes where a discrete ADC would add cost and PCB area. A key design consideration: the 10M04SAU324I7G does not include high-speed transceivers (no GTX/GTH/GTP blocks); for applications requiring multi-Gbps serial links, consider Cyclone V or later families. For designs migrating from Cyclone IV, the MAX 10 generally reduces BOM by removing the external configuration flash and adds analog/mixed-signal blocks. This page synthesizes distributor pricing, drop-in MAX 10 family alternatives from the verified Intel/MAX 10 OPN catalog, and practical design notes not aggregated on the manufacturer OPN page.
10M04SCE144A7G - MAX 10 FPGA 4K LE 144-EQFP | Intel
The Intel 10M04SCE144A7G is a MAX 10 Field Programmable Gate Array (FPGA) delivering 4,000 logic elements, 193,536 RAM bits, and 101 user I/O pins in a 144-pin EQFP (Exposed Pad LQFP) package. It targets non-volatile, instant-on logic integration with on-chip flash configuration memory, eliminating external boot devices and shortening time-to-power for industrial, automotive, and consumer designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between discrete logic ICs and custom ASICs: faster to integrate than ASICs, more flexible than fixed-function ICs, and increasingly power-efficient for parallel workloads. The MAX 10 family further integrates analog-to-digital converters (ADCs), flash configuration, and on-chip voltage regulation into a single die, allowing single-chip system control with deterministic power-up behavior. Key features of the 10M04SCE144A7G include 4,000 logic elements (LEs), 193,536 bits (Kb) of embedded user flash, single 3.0V/3.3V supply operation with on-chip voltage regulators, integrated ADC capability, automotive AEC-Q100 qualification, and an extended -40°C to +125°C industrial/automotive operating temperature range. The 144-EQFP exposed-pad footprint improves thermal dissipation while preserving the LQFP handling and reflow characteristics familiar to mid-volume SMT lines. Architecturally, the device pairs a non-volatile configuration block with dual-configuration flash image support, optional real-time ISP via JTAG, and an analog front end supporting temperature-sensor and general-purpose ADC inputs. Designers gain instant-on determinism for motor control, sensor fusion, and human-machine interface (HMI) glue logic, while software-defined peripheral replacement remains possible without NRE charges. Typical applications include industrial control boards, automotive body and chassis subsystems, low-cost video processing, I/O expansion and bridging in legacy MCUs, and portable medical instruments requiring instant-on logic. The AEC-Q100 automotive grade extends suitability to in-cabin HMI and body controllers. When designing with the 10M04SCE144A7G, allocate the exposed pad (EP) to a continuous copper pour on top and inner PCB layers to keep the silicon junction within the AEC-Q100 thermal envelope. JTAG pinout should follow the Intel MAX 10 pin connection guidelines to retain dual-boot and remote upgrade paths. This page synthesizes distributor pricing, automotive-grade qualification notes, drop-in MAX 10 family alternatives, and PCB layout guidance not collected in any single manufacturer datasheet, giving engineers a single decision-ready reference.
10M04SCE144C8G - MAX 10 FPGA, 4K LE, 101 I/O, 144-EQFP | Altera (Intel)
The Altera (Intel) 10M04SCE144C8G is a MAX 10 Field-Programmable Gate Array (FPGA) featuring 4,000 logic elements, 193,536 bits of embedded SRAM, and 101 user I/O, housed in a 144-pin EQFP (LQFP with exposed pad) package. The MAX 10 family is Intel's lowest-cost single-chip programmable logic platform with integrated flash configuration storage, eliminating the need for a separate boot PROM. The 'SC' suffix designates the standard commercial temperature grade (0C to 85C TJ), and 'E144' identifies the 144-pin EQFP package variant. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells that engineers can reconfigure in the field to implement custom digital circuits. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy: they offer hardware-level parallelism and deterministic latency while retaining the flexibility of in-system reprogramming. The MAX 10 line specifically adds on-chip analog-to-digital converters, flash memory, and voltage regulators in a non-volatile configuration architecture. Key features of the 10M04SCE144C8G include 250 LABs/CLBs, 4,000 logic elements, 193,536 total RAM bits distributed as M9K blocks, and a 2.85V to 3.465V core supply range. The device operates over the commercial 0C to 85C junction temperature range and is fabricated on a 55nm process node. The 144-EQFP package includes an exposed thermal pad to improve heat dissipation during sustained switching activity. The MAX 10 architecture integrates a flash-based configuration memory, dual-configuration flash support, instant-on operation, and optional analog blocks (ADC) depending on variant. The 10M04SCE144C8G (without 'A' analog suffix) is the digital-only version. This makes it well-suited for I/O expansion, glue logic, bridge functions, and state-machine control in cost-sensitive applications. Typical applications include industrial I/O expansion, motor control, LED display drivers, communications bridging (UART/SPI/I2C to parallel), custom peripheral controllers, and educational/hobbyist digital design. The wide 2.85V-3.465V supply tolerance aligns with 3.3V system rails commonly found in industrial and embedded designs. When designing with this FPGA, ensure Quartus Prime design software is used for synthesis and configuration. JTAG programming requires a 10-pin header per IEEE 1149.1. The exposed pad must be soldered to a sufficient copper pour for thermal relief. Designers should also confirm logic utilization stays below ~80% for timing closure. This page synthesizes distributor pricing, MAX 10 family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
10M04SCE144I7G - MAX 10 FPGA, 4K LE, 144-EQFP | Intel
The Intel (formerly Altera) 10M04SCE144I7G is a non-volatile FPGA from the MAX 10 family that integrates 4,000 logic elements, 193,536 bits of embedded user flash, and 101 maximum user I/Os into a 144-pin EQFP (Plastic Enhanced Quad Flat Pack with exposed pad) package measuring 22x22 mm. It targets low-cost, low-power, instant-on applications with on-chip flash-based configuration, eliminating the need for an external boot PROM. A field-programmable gate array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs), programmable interconnect, and configurable I/O cells, allowing hardware functionality to be defined after PCB assembly. The MAX 10 family extends the FPGA hierarchy to include on-die flash, integrated ADCs, and DSP blocks, positioning it between pure CPLDs (such as MAX II/V) and higher-density FPGAs (such as Cyclone IV/V or Arria V) for cost-sensitive industrial designs. Key features of the 10M04SCE144I7G include 4,000 logic elements, 250 Kbits of embedded SRAM organized in M9K blocks, 12 dedicated 18x18 hardware multipliers, an integrated 1 Msps 12-bit ADC, and approximately 1.4 Mb of user flash memory. It supports single 3.0 V or 3.3 V core operation, consumes approximately 65 mW of static power per core, and offers industrial-grade temperature operation from -40 °C to +100 °C. The device also provides Nios II soft-core-compatible architecture support, JTAG configuration, and bitstream encryption for IP security. Architecturally, the 10M04 uses a look-up-table (LUT) based logic fabric, 9-Kbit M9K memory blocks, variable-precision DSP blocks, and a flash-based configuration subsystem. The exposed thermal pad (EQFP) supports efficient heat dissipation for sustained operation in sealed industrial enclosures. Compared to SRAM-based FPGAs, the on-die flash eliminates boot-time latency and external configuration memory cost. Typical applications include industrial motor control, factory automation I/O expansion, portable medical instrument front-ends, low-cost video bridging, and IoT edge nodes requiring on-board flash. The integrated ADC and user flash also make it a strong fit for sensor aggregation and standalone embedded control designs. When designing with this part, ensure proper decoupling (100 nF + 10 µF) on all VCCINT/VCCA pins and adequate copper area beneath the exposed pad to maintain junction temperature within industrial limits. Configuration mode, JTAG chain ordering, and dual-purpose pin (GPIO/JTAG) selection should be planned at schematic capture to avoid pinout rework late in the cycle. This page consolidates distributor pricing, parametric data, drop-in equivalents, and engineering notes that complement the official Intel MAX 10 datasheet, giving design engineers a one-stop view for sourcing and second-source planning.
10M04SCM153C8G - MAX 10 FPGA 4K LE, 112 I/O, 153-MBGA | Intel
The Intel 10M04SCM153C8G is a member of the MAX 10 family of non-volatile FPGAs with 4,000 logic elements, 193,536 bits of embedded SRAM, and 112 user I/Os, packaged in a 153-ball FineLine BGA (MBGA) and fabricated on a 55 nm process. According to Intel distributor listings, the device operates from a nominal 3.3 V supply (2.85 V min, 3.15 V core nominal) over the commercial 0 °C to 85 °C junction range, with a maximum internal clock frequency up to 402 MHz and integrated single-supply Flash configuration that eliminates an external boot PROM. What is a non-volatile FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined by user-supplied configuration data. Within the broader programmable logic taxonomy (FPGA -> programmable logic -> digital IC -> semiconductor), MAX 10 parts are "instant-on" non-volatile FPGAs: configuration is stored on-chip in Flash, so the device behaves like an ASIC at power-up without an external boot memory. This makes MAX 10 a hybrid positioned between small CPLDs and SRAM-based FPGAs, suitable for glue logic, I/O expansion, and control-plane functions. Key features include 4,000 logic elements, 250 logic array blocks (CLBs), 193,536 bits (≈189 Kbit) of user SRAM, 112 general-purpose I/Os, integrated Flash configuration memory, on-chip user Flash (typically 30 to 60 Kbyte per density), and built-in PLLs and ADCs that are characteristic of the MAX 10 family. The 153-MBGA package gives a compact 8x8 mm to 9x9 mm ball grid that suits space-constrained industrial and consumer designs where density and instant-on behaviour both matter. Architecturally, MAX 10 uses a 55 nm TSMC process with a Flash-based configuration cell underneath each logic island. This dual-oxide Flash cell stores the bitstream at wafer level, removing the need for external configuration devices and giving deterministic behaviour at t=0. The fabric mixes 4-input LUTs, embedded multipliers (DSP blocks), and user SRAM; the 04 (4K LE) density is the lowest LE count in the family, optimised for low-cost logic integration rather than DSP throughput. Typical applications include industrial motor control, sensor interfacing and I/O aggregation, low-volume glue logic replacement, communication protocol bridging (UART/SPI/I2C-to-LVDS), and consumer display or LED control. The integrated ADC and on-chip Flash also make it popular for system management and housekeeping functions in larger CPU/SoC boards. When designing with this part, pay attention to MBGA PCB layout rules: the 0.5 mm pitch balls require microvia or via-in-pad technology, controlled-impedance routing for high-speed interfaces, and decoupling close to every GND/VCC pair. Quartus Prime (Intel FPGA design software) is required for synthesis, place-and-route, and bitstream generation; only MAX 10 device support targets remain in current Quartus releases. This page synthesises authorised distributor pricing, same-package drop-in equivalents from the MAX 10 family, and PCB-layout guidance that the manufacturer datasheet alone does not present in one place.
10M04SCM153I7G - MAX 10 FPGA 4K LE, 153-BGA, Industrial | Intel
The Intel (formerly Altera) 10M04SCM153I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) delivering 4,000 logic elements, 193,536 bits of embedded SRAM, and 112 (maximum) user I/O pins in a 153-ball FineLine BGA package. The 'SC' speed grade, 'M153' package code, 'I' industrial temperature, and '7G' lead-free / RoHS suffix identify a member of the smallest-density 10M04 family, manufactured on a 55 nm TSMC process with on-chip flash configuration memory. The device integrates dual-configuration flash, 1 Msps 12-bit ADC blocks, and DSP blocks, all powered by a 1.2 V core with 3.3 V/2.5 V LVCMOS I/O support. What is a MAX 10 FPGA? A Field-Programmable Gate Array is a reconfigurable digital logic device consisting of programmable logic elements, embedded memory blocks, DSP slices, and a programmable interconnect fabric. MAX 10 (within Intel's FPGA taxonomy: FPGA -> non-volatile FPGA -> low-power CPLD/FPGA family) uniquely integrates instant-on flash configuration with analog and DSP blocks, bridging the gap between traditional CPLDs and higher-density Cyclone / Stratix families. The 10M04 is the entry-level density tier of the MAX 10 lineup. Key features include up to 193,536 bits of embedded user flash (added to the user-accessible SRAM budget), a 12-bit 1 Msps ADC with up to 17 analog inputs, hard memory controllers (DDR3/DDR3L/LPDDR2), and up to 45 multipliers (18x18). The 153-ball MBGA package is just 8x8 mm with a 0.5 mm ball pitch, supporting densities above 30,000 logic cells when migrating within the MAX 10 family. Architecturally, MAX 10 uses logic array blocks (LABs) of 16 logic elements, each LE containing a 4-input LUT, register, and carry chain. The embedded flash reduces BOM cost by eliminating external boot PROM. The industrial -40C to +100C operating range suits factory, automotive aftermarket, and outdoor industrial deployments. Typical applications include industrial I/O expansion and glue logic, motor control, sensor aggregation in IoT edge nodes, video bridging, and human-machine interface (HMI) controllers. Designers also use 10M04 for protocol bridging (UART/SPI/I2C to Ethernet) and as a low-cost replacement for CPLD-based state machines requiring soft-core processors. When designing, account for bank-dependent I/O voltage (each bank is independently 1.2/1.5/1.8/2.5/3.0/3.3 V) and use the Quartus Prime Lite toolchain (free) for synthesis, place-and-route, and programming file generation. A JTAG or on-chip flash programmer is required for in-system configuration. This page synthesizes distributor pricing, drop-in package-compatible MAX 10 variants, and design notes not found in the standalone datasheet, enabling faster component selection for low-density FPGA designs.
10M04SCU169A7G - MAX 10 FPGA, 4K LE, 169-UBGA | Intel / Altera
The Intel / Altera 10M04SCU169A7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) from the MAX 10 family, delivering 4,000 logic elements, 193,536 bits of embedded user flash, and 130 user I/O pins in a 169-ball UFBGA package. It is fabricated on TSMC's 55 nm embedded flash process that integrates instant-on configuration and dual-configuration flash directly on-die, eliminating the external boot PROM traditionally required for SRAM FPGAs. Operating at a core voltage of 1.2 V with 3.3 V LVCMOS-tolerant I/O, the device supports automotive temperature grades (A7G suffix). A field-programmable gate array (FPGA) is a class of programmable logic device whose architecture consists of configurable logic blocks (LBs), programmable routing, dedicated memory blocks (M9K), DSP blocks, phase-locked loops (PLLs), and modern I/O such as LVDS. FPGAs sit in the programmable logic hierarchy above CPLDs and below ASICs in terms of integration density. The MAX 10 family targets low-power, low-cost, instant-on applications including I/O expansion, sensor fusion, motor control, and bridge functions between industrial buses. Key specifications include 4,000 logic elements, 193,536 bits of user flash, 246 Kbits of embedded SRAM organized as M9K blocks, 130 maximum user I/O, an integrated ADC (12-bit, up to 17 channels on this density), and a 3.3 V core supply voltage for VCCIO flexibility. The device also includes one PLL per side (typically 4 total), 16 global clock networks, and hard memory controllers that simplify DDR3/LPDDR2 interfaces. The UFBGA-169 package is 11 mm x 11 mm with a 0.5 mm ball pitch, suitable for compact PCB designs. Architecturally, MAX 10 combines a traditional SRAM-based logic fabric with TSMC's 55 nm embedded flash technology, allowing single-chip instant-on behavior, dual-boot image storage, and user flash for application data. Hardened blocks such as the ADC, PLLs, and memory controllers reduce soft-IP footprint and improve deterministic performance, while the LABS (Logic Array Blocks) and ALMs deliver efficient LUT-based combinational and sequential logic synthesis. Typical applications include industrial motor control, sensor interface aggregation, automotive body and cluster electronics, factory automation I/O expansion, video bridging, and low-cost logic replacement. The automotive temperature grade (A7G = -40C to +125C) makes it well suited for under-hood and chassis deployments requiring AEC-Q100 reliability. When designing with this part, ensure the decoupling network uses 100 nF ceramic capacitors within 1 mm of each VCC/VCCIO/GND pair, and follow Intel's Quartus Prime pin connection guidelines for unused pins. The integrated ADC requires its own analog supply rail (VCCA) decoupled separately from digital rails to maintain 12-bit linearity. This page synthesizes distributor pricing, same-brand drop-in alternatives, cross-brand drop-in equivalents, and practical PCB design notes not found in the manufacturer datasheet alone.
10M04SCU169C8G - MAX 10 FPGA 4K LE, 169-LFBGA | Intel / Altera
The Intel / Altera 10M04SCU169C8G is a MAX 10 family Field-Programmable Gate Array (FPGA) integrating 4,000 logic elements, 193,536 bits of embedded SRAM, and 130 user I/O in a 169-ball FineLine BGA (U169 / 169-LFBGA) package. It is a non-volatile FPGA that combines a LUT-based logic fabric with on-chip flash configuration memory, dual ADCs, and a 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs) connected by a programmable interconnect, surrounded by programmable I/O cells. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. The MAX 10 family targets low-power, non-volatile applications where instant-on behavior and integration of analog/digital functions reduce system BOM. Key features of the 10M04SCU169C8G include 4,000 logic elements, 193,536 bits of user flash memory, embedded 9-bit 1 Msps ADC blocks, dual-configuration flash, and support for LVCMOS 1.2 V to 3.3 V I/O standards. The device operates from a 1.2 V core rail with PLL-based clock management and supports up to 130 general-purpose I/O pins on the 169-LFBGA footprint. Architecturally, MAX 10 uses a logic-array block (LAB) fabric of 4-input LUTs, embedded 36-Kbit M9K RAM blocks, and 144-Kbit MLAB memory blocks. The non-volatile flash enables instant-on at power-up, dual-boot images, and user flash storage. The integrated ADC block eliminates an external ADC for sensor and analog monitoring tasks. Typical applications include industrial motor control, factory automation, low-cost video bridging, I/O expansion and protocol bridging, and portable / battery-powered embedded systems. Designers choose this device when they need the flexibility of an FPGA without the BOM overhead of an external configuration memory. When designing with the 10M04SCU169C8G, ensure proper decoupling of the 1.2 V core and 3.3 V auxiliary supplies, and follow Intel's PCB layout guidelines for BGA escape routing. Quartus Prime is the supported development environment. This page synthesizes distributor pricing, drop-in MAX 10 alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select the right OPN for their MAX 10 design.
10M04SCU169I7G - 4K LE MAX 10 FPGA, 130 I/O, 169-UBGA | Intel
The Intel (formerly Altera) 10M04SCU169I7G is a non-volatile MAX 10 Field Programmable Gate Array integrating 4,000 logic elements, 193,536 bits of embedded user flash memory, and 130 user I/O in a 169-ball Ultra FineLine BGA (UBGA) package. The 'SC' speed grade, U169 package code, industrial -40C to +100C operating range, and 7G lead-free finish place this device in the mainstream density tier of the MAX 10 family. A MAX 10 FPGA is a low-cost, low-power, non-volatile programmable logic device that combines a look-up table (LUT)-based fabric, on-die flash configuration memory, embedded 9-bit ADC blocks, and on-die flash-based user storage on a single 55 nm process die. This single-chip integration removes the need for external boot PROMs and allows instant-on behavior, positioning MAX 10 between discrete microcontrollers and higher-density Cyclone or Arria families for cost-sensitive industrial, automotive, and consumer glue-logic designs. Key features include 4 K logic elements (approximately 16 K logic elements in marketing equivalent terms), 270 Kbits of embedded SRAM organized in M9K blocks, 130 user I/O pins supporting LVDS, LVCMOS, SSTL, and RSDS interface standards, up to two integrated 12-bit ADC blocks with on-die temperature sensing capability, and an internal oscillator. The 169-UBGA package exposes dual-configuration flash images so designers can perform field firmware updates without external memory, reducing BOM cost and PCB footprint. Architecturally the device uses 55 nm embedded-flash CMOS, an LAB-based logic fabric with 10 logic elements per LAB, and dedicated hardware multipliers implemented as DSP blocks. Hard memory controller and PHY interfaces for DDR3 and LPDDR2 are supported via soft IP, while the on-die flash simplifies board layout by eliminating the boot PROM and reducing overall system cost. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, sensor aggregation gateways, automotive body and infotainment controllers, and portable or edge IoT nodes. The combination of ADC, on-die flash, and instant-on behavior also fits battery-backed sensor hubs and remote monitoring equipment operating in harsh industrial environments. When designing with this part, validate the device migration path within the MAX 10 family because the U169 footprint is shared with 10M08 and 10M16 density siblings, enabling upward logic capacity migration on the same PCB layout. Confirm Quartus Prime version support and pinout assignments using the manufacturer pin-out file before layout finalization. This page consolidates real distributor stock, verified cross-reference drop-in alternatives, and design guidance that is not present in the manufacturer datasheet alone.
10M04SCU324C8G - MAX 10 FPGA, 4K LE, 324-LFBGA | Intel / Altera
The Intel / Altera (formerly Altera) 10M04SCU324C8G is a member of the MAX 10 family of non-volatile Field-Programmable Gate Arrays (FPGAs), integrating 4,000 logic elements, 246 Kbits of embedded block RAM (M9K blocks delivering 193,536 RAM bits total), and a 324-pin LFBGA (UBGA) package. Built on a 55 nm CMOS process with 1.2 V core operation, this device targets low-cost, low-power, instant-on applications that benefit from integrated configuration flash and on-chip analog/digital conversion without an external boot PROM. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) within the broader semiconductor hierarchy that allows designers to configure digital logic, memory blocks, DSP multipliers, and I/O via hardware description languages. MAX 10 FPGAs occupy the small-density, low-power segment of the FPGA market, bridging the gap between traditional CPLDs (programmable logic devices) and high-density SRAM-based FPGAs such as Cyclone V or Arria. The MAX 10 architecture uniquely integrates dual-configuration flash, ADC blocks, and user flash, enabling instant-on operation. Key features include a maximum operating frequency supported by internal PLLs, up to 246 Kbits of embedded SRAM, embedded 12-bit ADC blocks (specific to MAX 10 family), DSP blocks for fixed-point math, and programmable I/O supporting LVDS, LVCMOS, and LVTTL standards. The 324-LFBGA (UBGA) package provides a compact 15 mm × 15 mm footprint with high pin density suitable for space-constrained designs. The 10M04SCU324C8G variant is specified for commercial temperature range (0 °C to 85 °C junction) with the C8 speed grade. The MAX 10 architecture combines look-up-table (LUT)-based logic with non-volatile configuration memory, eliminating the need for an external boot device and enabling fast startup typically under 10 ms — critical for industrial control, motor drive, and display interface applications requiring instant-on behavior. Typical applications include industrial control and factory automation logic consolidation, I/O expansion and bridging for legacy microcontrollers, LED display controllers, low-density video processing and image sensor interfaces, and portable or battery-powered embedded systems that benefit from low static power and non-volatile configuration. When designing with the 10M04SCU324C8G, ensure adequate decoupling on every VCCINT and VCCA power pin (0.1 µF and 10 µF ceramic) and follow Intel/Altera PCB layout guidelines for the UBGA-324 footprint, including via-in-pad arrays and matched-length differential pairs for LVDS. The Quartus Prime design software (Lite or Standard edition) supports this device for synthesis, place-and-route, and programming file generation. This page consolidates current distributor pricing, drop-in alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone — useful for engineers evaluating the 10M04SCU324C8G against higher-density MAX 10 or Cyclone V devices.
10M08DAF256A7G - MAX 10 FPGA 8K LE, 256-BGA | Intel / Altera
The Intel / Altera 10M08DAF256A7G is a member of the MAX 10 family of non-volatile FPGAs, integrating 8,000 logic elements, 387,072 bits (approximately 378 Kbit) of embedded SRAM, and 178 user I/Os in a 256-ball FineLine BGA package. The 'A7G' suffix denotes the automotive-grade temperature range (-40C to +125C junction) with the lead-free / RoHS-compliant / halogen-free package option, while the '10M08' prefix denotes the 8K-LE density and 'DA' denotes the dual-configuration flash plus logic-array architecture. The device operates from a 1.2 V core supply and supports the same Quartus Prime design flow used across the entire MAX 10 family. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacture by a user-supplied configuration bitstream stored in on-chip non-volatile memory. MAX 10 devices are unique among mainstream FPGAs because they integrate a dual-configuration flash array directly on the die, enabling instant-on functionality, multi-boot image storage, and field-upgradeable user flash without an external boot PROM. The MAX 10 family sits in Intel's hierarchy as: FPGA -> programmable logic device -> non-volatile FPGA -> low-power FPGA -> MAX 10. Key features of the 10M08DAF256A7G include 8K logic elements (LEs), 378 Kbit embedded memory, one internal PLL, embedded SRAM blocks, user flash memory, 178 GPIO, and integrated ADC blocks available on selected variants. The 256-ball BGA package supports high-speed LVDS and external memory interfaces while fitting into compact board layouts. The automotive-grade temperature rating makes this part well suited for in-cabin and under-hood automotive electronics, as well as industrial control systems that must survive harsh thermal environments. Typical applications include industrial motor control and PLCs, automotive body and chassis electronics, factory automation and robotics I/O expansion, low-power video bridging and display controllers, sensor aggregation hubs, and replacement of discrete logic or ASICs in medium-volume custom hardware. The on-chip flash and ADC reduce BOM cost in cost-sensitive designs. When designing with this device, route configuration-related JTAG, MSEL, and POR pins per the MAX 10 pin connection guidelines; respect the LVDS I/O bank supply domains (VCCIO) and provide decoupling for each bank. Quartus Prime (standard or Lite, depending on device support) is the supported development environment.
10M08DAF256C7G - MAX 10 FPGA, 8K LE, 256-LBGA | Altera / Intel
The Altera (Intel) 10M08DAF256C7G is a MAX 10 family Field-Programmable Gate Array (FPGA) offering 8,000 logic elements (LE), 387,072 bits of embedded user flash memory, and a 1.2 V core supply, housed in a 256-pin LBGA (F256) package. The device combines a non-volatile flash-based FPGA fabric with on-chip analog and memory blocks, enabling single-chip system-level integration without an external configuration PROM. The 10M08DAF256C7G suffix breakdown follows Intel's MAX 10 OPN convention: 10M08 = MAX 10 family, 8K LE density; D = dual-configuration flash; A = enhanced analog; F256 = 256-pin FineLine BGA; C = commercial temperature grade (0°C to +85°C); 7G = lead-free RoHS packaging revision. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, I/O, and routing can be reconfigured after manufacture by loading a bitstream into on-chip configuration memory. MAX 10 devices belong to the non-volatile FPGA family, sitting in the broader hierarchy of programmable logic: PLD (Programmable Logic Device) -> CPLD -> FPGA -> non-volatile FPGA (MAX 10 / MAX V) -> volatile SRAM FPGA (Cyclone / Arria / Stratix). Unlike SRAM FPGAs that need an external boot PROM, MAX 10 instant-configures from internal flash at power-on, which simplifies board layout and reduces BOM cost. Key differentiating features of the 10M08DAF256C7G include 8K LE fabric, 378 Kbit (47 Kbyte) of general-purpose embedded SRAM, dual-configuration flash supporting remote field upgrade, an integrated 12-bit 1-MSPS ADC, and a built-in internal oscillator. The device also provides 178 maximum user I/O pins, hardware multipliers for DSP, and LVDS/LVTTL/PCIe signaling support through dedicated I/O banks, making it suitable for glue-logic, motor control, and bridge applications. Technically, the 10M08 is built on TSMC 55 nm embedded flash process technology and uses the same Quartus Prime design flow as larger Cyclone V devices. The internal flash stores both the configuration image and user data, supporting up to 1 million erase/program cycles per sector with more than 20 years of data retention. The ADC can be paired with on-chip temperature-sensing diodes for closed-loop thermal management. Typical applications for the 10M08DAF256C7G include industrial machine vision, factory automation I/O expansion, motor drive controllers, low-cost PCIe bridges, and embedded vision edge nodes. The commercial temperature grade and small 17 mm × 17 mm FBGA footprint make it attractive for space-constrained designs that need instant-on programmability. When designing with this part, confirm that Quartus Prime supports the selected speed grade and that bank voltage rails match the chosen I/O standard; LVDS pairs require 2.5 V VCCIO on the receiving bank.
10M08DAF256C8G - MAX 10 FPGA, 8K LE, 178 I/O, 256-LBGA | Altera
The Altera 10M08DAF256C8G is a member of the MAX 10 family of non-volatile FPGAs, integrating 8,000 logic elements (LE), 387,072 bits of embedded SRAM, and 178 user I/O in a 256-ball FineLine BGA (F256) package. Built on TSMC's 55 nm embedded NOR flash + CMOS process, the MAX 10 family uniquely combines FPGA fabric with on-chip dual-configuration flash, removing the need for an external boot PROM and enabling instant-on behavior at power-up. A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic functionality is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM, optionally backed by non-volatile memory. FPGAs sit between fixed-function ASICs (high NRE, low unit cost at volume) and microcontrollers (software-driven, lower throughput), offering hardware-level parallelism for glue logic, state machines, custom interfaces, and signal conditioning. MAX 10 specifically targets cost-sensitive, low-power applications where the instant-on and integrated analog features deliver ASIC-like integration at FPGA-like flexibility. Key features of the 10M08DAF256C8G include integrated 12-bit ADC blocks (up to 2 channels on select variants), on-chip temperature sensing, hard DDR3/LPDDR2 memory controllers, and support for LVDS, LVTTL, and SSTL I/O standards. The 256-LBGA package offers a compact 17 mm x 17 mm footprint and supports densities from 8K up to 50K logic elements within the same pin-compatible logic-array layout, simplifying scalability across the family. The architecture leverages the same LE structure used across Altera/Intel FPGA product lines, with adaptive logic modules (ALMs), embedded M9K memory blocks, and dedicated 18x18 multipliers for DSP workloads. Combined with the dual-boot flash configuration scheme, the device can fail-safe update firmware in the field and revert to a known-good image if a configuration error occurs - critical for remote, unattended, or safety-sensitive deployments. Typical applications include industrial motor control, factory automation I/O expansion, automotive body electronics and infotainment bridging, portable medical device glue logic, IoT sensor aggregation nodes, and low-cost video/display bridging. The integrated ADC and temperature sensor also make MAX 10 useful for board-management controllers in larger systems. When designing with this part, plan I/O bank assignments carefully because the 256-LBGA pinout is shared across the 10M08/10M16/10M25/10M40/10M50 density grades, allowing migration within the family without board rework. Use the Quartus Prime Lite or Standard edition for synthesis; the device is supported by both. This page synthesizes distributor pricing, pin-compatible same-family variants, and practical design notes that go beyond the manufacturer datasheet to help engineers select and source the correct MAX 10 density for their target application.
10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel
The Intel 10M08DAF484C8G is a non-volatile MAX 10 field-programmable gate array (FPGA) integrating 8,000 logic elements, 387,072 bits of embedded SRAM, 1,540 Kbits of user flash, and an 8-channel 12-bit analog-to-digital converter (ADC) in a single 484-ball FineLine BGA package. Built on a 55 nm CMOS process, it provides 250 user I/O pins, single-chip instant-on operation from on-die flash, and operates from a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V standards. The -C8 speed grade and industrial temperature rating (-40 C to +100 C junction) target commercial and industrial embedded platforms. What is a non-volatile FPGA? A non-volatile FPGA is a programmable logic device that retains its configuration bitstream in on-die flash memory, eliminating the need for an external boot PROM and enabling instant-on operation at power-up. Within the broader taxonomy it belongs to programmable logic -> FPGAs -> non-volatile FPGAs -> CPLDs/PLD hybrids. MAX 10 devices sit at the intersection of FPGAs and microcontrollers, integrating hard IP such as ADC, PLLs, and flash that historically required separate companion chips, thereby reducing BOM cost and PCB area. Key features include 8,000 logic elements, 387 Kbits embedded SRAM, 1,540 Kbits user flash, 250 maximum user I/Os, two PLLs, 8-channel 12-bit ADC with up to 1 MSPS sample rate, and DSP blocks. The integrated dual-configuration flash supports remote field upgrades and RSU (remote system update) for in-system reconfiguration. I/O banks support LVDS, LVTTL, LVCMOS, SSTL, and other industry-standard single-ended and differential interfaces, simplifying memory and sensor bridging. The MAX 10 architecture pairs a logic fabric of 8K adaptive logic modules (ALMs) with embedded memory blocks (M9K), DSP blocks, and hard IP blocks. The 55 nm process yields an excellent cost-per-logic-element ratio suitable for mid-volume glue-logic, motor control, and industrial I/O expansion. The internal flash subsystem also supports Nios II soft-core configuration and user data storage, allowing on-chip firmware persistence without an external EEPROM. Typical applications include industrial motor control, factory automation I/O expansion, video processing bridges, telecom line cards, low-cost ASIC replacement, and portable test instruments. The combination of on-chip ADC and flash makes MAX 10 a frequent choice for sensor aggregation nodes, predictive-maintenance modules, and battery-powered edge devices where board area, BOM, and power are constrained. When designing with this device, reserve sufficient PCB area for the 484-ball FineLine BGA and follow Intel's PCB layout guide for BGA breakout routing, including via-in-pad and microvia stackup recommendations. Use Quartus Prime software for synthesis, place-and-route, and programming; the device is supported by both the Quartus Prime Lite (free) and Pro editions. Decouple each VCC/VCCIO/GXB power pin with 0.1 uF and 10 uF capacitors placed as close as possible. This page synthesizes current distributor pricing, drop-in MAX 10 same-package alternatives, and practical design notes not aggregated on the Intel datasheet or on a single distributor page.
10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel
The Intel (Altera) MAX® 10 10M08DAF484I7G is a non-volatile, flash-based Field Programmable Gate Array (FPGA) with 8,000 logic elements and 387,072 bits (378 Kb) of embedded SRAM, housed in a 484-ball FineLine BGA package. It is fabricated on a 55 nm low-power process and supports a core nominal supply of 1.2 V with up to 250 user I/Os, targeting industrial temperature (-40 °C to +100 °C) applications. FPGAs are reprogrammable logic devices that sit between fixed-function ASICs and software-driven microcontrollers. The MAX 10 family in particular is a low-cost, instant-on, non-volatile FPGA family that integrates features traditionally external to the FPGA: user flash memory, ADCs, and voltage references. Within Intel's portfolio, MAX 10 occupies the small-to-medium density non-volatile segment, distinct from the higher-density Cyclone family and the transceiver-equipped Cyclone V family. Key features of the 10M08DAF484I7G include 8K logic elements (~8K equivalent LE), 378 Kb embedded SRAM, 250 maximum user I/Os, integrated configuration flash (no external boot PROM needed), up to 4 PLLs for clock management, embedded 12-bit ADCs in larger MAX 10 die, and JTAG-based IEEE 1149.1 configuration. The 'I7' suffix indicates the industrial temperature grade (-40 °C to +100 °C) and speed grade 7, while 'G' denotes lead-free / RoHS-compliant terminal finish. Typical applications for the 10M08DAF484I7G include industrial I/O expansion and protocol bridging (I2C/SPI/UART glue logic), motor control and factory automation, video bridging and display aggregation, low-cost PCIe endpoint bridges, and system management / housekeeping logic. The combination of flash-based instant-on (under 10 ms) and integrated analog makes it popular as a companion device to larger processors/SoCs. When designing with the MAX 10 484-FBGA, plan for at least four PCB layers with solid ground and power planes, keep all decoupling capacitors within 100 mils of each supply pin, and verify the chosen speed grade ('I7') against your timing closure targets. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-package drop-in alternatives within the MAX 10 family, and practical design notes drawn from the manufacturer datasheet.
10M08DAF484I7P - MAX 10 FPGA 8K LE 484-BGA | Intel / Altera
The Intel (formerly Altera) 10M08DAF484I7P is a MAX 10 family Field-Programmable Gate Array (FPGA) offering 8,000 logic elements (LEs), 378 Kbits of embedded memory, and 250 user I/O pins in a 484-ball FineLine BGA package. It integrates a 12-bit 1 Msps ADC, on-chip flash configuration memory, and DSP blocks, enabling single-chip implementation of glue logic, control state machines, and sensor interface front ends without an external configuration PROM. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as PLLs, RAM, and DSP slices. FPGAs sit hierarchically between programmable microcontrollers and application-specific integrated circuits (ASICs): they deliver higher logic density and parallelism than microcontrollers while avoiding the NRE cost of ASICs. The MAX 10 family occupies the non-volatile, low-power niche that combines instant-on dual-configuration flash with cost-sensitive industrial and consumer use cases. Key features of the 10M08DAF484I7P include 1.0 V core operation, commercial/industrial temperature grade, 8 Kbit user flash, 1.6 Gbps LVDS support on select I/O banks, and integrated phase-locked loops (PLLs). The 484-FBGA package provides ample routing density for the 250 I/O pins while maintaining a footprint compatible with mainstream PCB assembly lines. The device is supported by the Quartus Prime Lite design software, which provides synthesis, place-and-route, timing analysis, and on-chip debugging via JTAG. Typical applications include industrial motor and motion control, factory automation I/O expansion, sensor fusion pre-processing, low-cost video bridging, and portable medical instrumentation. The embedded 12-bit ADC and dual-boot flash make it attractive for designs that previously required a microcontroller plus a separate FPGA plus external configuration memory. When designing with the 10M08DAF484I7P, ensure that PCB layer count and via-in-pad capability are sufficient for the 1.0 mm pitch BGA escape pattern, and verify that the Quartus Prime Lite version supports the specific device speed grade (-I7P = industrial speed grade 7). Provide decoupling capacitance of at least 10 uF bulk + 100 nF per VCC pin pair to meet inrush transients during configuration. This page synthesizes distributor pricing from DigiKey and Mouser, package-specific drop-in alternatives (10M08DAF484I7G, 10M08DAU324I7G, 10M08DCU324I7G) and practical design notes not found in the datasheet alone.
10M08DAU324C8G - MAX 10 FPGA, 8K LE, 324-LFBGA | Intel / Altera
The Intel / Altera 10M08DAU324C8G is a low-power, non-volatile MAX 10 Field Programmable Gate Array (FPGA) with 8000 logic elements (LE), 378 Kbits of embedded block RAM (M9K), and 246 user I/O pins, housed in a 324-ball LFBGA (U324) package. Built on TSMC 55nm NOR-flash-based process technology, the device integrates a dual-configuration flash, user flash memory, and analog-to-digital converters (ADC) directly on-chip, eliminating external boot PROM requirements for many designs. A field programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the designer after manufacture. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit between standard logic ICs (fixed-function) and application-specific integrated circuits (ASIC, fully custom). FPGAs trade power and absolute performance for design flexibility, fast prototyping, and in-field reconfiguration - making them ideal for low-volume, fast-time-to-market, or rapidly evolving products. The MAX 10 family specifically targets low-cost, low-power, instant-on applications with on-chip flash and analog features that approximate an SoC. Key features of the 10M08DAU324C8G include 8K LE (8,000 logic elements), 378 Kbit embedded SRAM, 246 maximum user I/O, integrated 12-bit ADC up to 1 MSPS, 1.2 V core operating voltage, and an internal configuration flash of approximately 2.4 Mbit. The device supports commercial junction temperature grade 0C to +85C in the C8 speed grade and is delivered in a 19 mm x 19 mm, 1.0 mm pitch, 324-LFBGA package that suits industrial control, motor drive, and consumer video bridge designs. The MAX 10 architecture employs LUT-based logic elements, M9K embedded memory blocks, DSP blocks, and hard PCIe Gen2 IP. Its on-chip flash enables instant-on single-chip functionality and supports dual-configuration images, remote system upgrade, and field updates without external storage. Compared with SRAM-based FPGAs, the MAX 10 simplifies board design by removing the boot PROM and configuration controller, while still allowing I/O and logic to be reprogrammed unlimited times. Typical applications include industrial machine vision, factory automation controllers, automotive driver-assistance prototyping, video bridging and display controllers, low-power IoT edge nodes, and portable medical devices. Designers select the 10M08DAU324C8G when they need MAX 10 instant-on capability, on-chip ADC for sensor aggregation, and a high-I/O count package in a single chip. When designing with this device, plan for 1.0 mm BGA PCB assembly with controlled-impedance routing, allocate sufficient decoupling, and choose the speed grade (C8 commercial vs I7 industrial) carefully to ensure timing closure. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation; only -I6 and -A6 speed grades are restricted by default in Quartus Prime and require local Intel support. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
10M08DAU324I7G - MAX 10 FPGA, 8K LE, 246 I/O, 324-BGA | Intel
The Intel 10M08DAU324I7G is a MAX 10 family Field Programmable Gate Array (FPGA) delivering 8,000 logic elements, 387,072 bits of embedded user flash memory, and 246 user I/O pins in a 324-ball LFBGA (UBGA) package with industrial -40C to +100C temperature rating. As the lowest-density member of the non-volatile MAX 10 family, it integrates a flash configuration block, on-chip ADC, and DSP blocks alongside traditional FPGA fabric, eliminating the need for an external boot PROM. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that uses look-up tables (LUTs), programmable interconnect, and I/O cells to implement arbitrary digital logic. Within the broader semiconductor hierarchy, FPGAs sit between application-specific integrated circuits (ASICs) and microcontrollers: more flexible than ASICs but more deterministic and parallel than MCUs. The MAX 10 series is Intel's low-cost, instant-on, non-volatile FPGA line optimized for I/O expansion, bridge/replacement, and motor control in industrial, automotive, and consumer markets. Key features include 8K logic elements, 378 Kbits of embedded SRAM (M9K blocks), 1.4 Mb of user flash, integrated dual 12-bit ADCs (1 MSPS), and DSP blocks with up to 18x18 multipliers. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, with hot-socketing capability and 3.0/3.3 V LVDS on the 324-pin BGA. Configuration is instant-on from internal flash, eliminating external boot components. The 10M08 is fabricated on TSMC 55 nm embedded flash process technology, providing single-chip, low-power operation with typical core current under 100 mA and on-chip voltage regulation. It supports JTAG (IEEE 1149.1) and passive serial configuration, and includes a 10/100/1000 Ethernet hard IP block (MAC + PCS) plus embedded multipliers optimized for cost-sensitive DSP workloads. Typical applications include industrial I/O expansion and bridge/replacement, low-cost motor control, video processing and display interfaces, portable medical devices, and consumer electronics requiring instant-on custom logic. The on-chip ADC and flash storage make the 10M08 a true single-chip SoC FPGA solution. When designing with the 10M08, pay careful attention to the 324-ball BGA fan-out and PCB escape routing; the 1.0 mm ball pitch requires microvia or via-in-pad technology. The internal flash can store both configuration and user data, simplifying BOM and enabling in-field updates via JTAG or a soft CPU such as the Nios II embedded processor. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet alone.