10M08DAF256A7G - MAX 10 FPGA 8K LE, 256-BGA | Intel / Altera
部品番号: 10M08DAF256A7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.75 | $287.50 |
| 100 | $24.9 | $2,490.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.95 | $18,950.00 |
10M08DAF256A7G 概要
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacture by a user-supplied configuration bitstream stored in on-chip non-volatile memory. MAX 10 devices are unique among mainstream FPGAs because they integrate a dual-configuration flash array directly on the die, enabling instant-on functionality, multi-boot image storage, and field-upgradeable user flash without an external boot PROM. The MAX 10 family sits in Intel's hierarchy as: FPGA -> programmable logic device -> non-volatile FPGA -> low-power FPGA -> MAX 10.
Key features of the 10M08DAF256A7G include 8K logic elements (LEs), 378 Kbit embedded memory, one internal PLL, embedded SRAM blocks, user flash memory, 178 GPIO, and integrated ADC blocks available on selected variants. The 256-ball BGA package supports high-speed LVDS and external memory interfaces while fitting into compact board layouts. The automotive-grade temperature rating makes this part well suited for in-cabin and under-hood automotive electronics, as well as industrial control systems that must survive harsh thermal environments.
Typical applications include industrial motor control and PLCs, automotive body and chassis electronics, factory automation and robotics I/O expansion, low-power video bridging and display controllers, sensor aggregation hubs, and replacement of discrete logic or ASICs in medium-volume custom hardware. The on-chip flash and ADC reduce BOM cost in cost-sensitive designs.
When designing with this device, route configuration-related JTAG, MSEL, and POR pins per the MAX 10 pin connection guidelines; respect the LVDS I/O bank supply domains (VCCIO) and provide decoupling for each bank. Quartus Prime (standard or Lite, depending on device support) is the supported development environment.
ドロップイン代替品: 10M08DAF256A7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M08DAF256A7G （同一形状・フットプリント） — 相違点: Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
10M08DAF256C7G
✅ ドロップイン✓ 在庫あり
$7.95 / 個
データシートを見る →10M08DAF256I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M08DAF256A7P
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M04DAF256A7G
✅ ドロップイン✓ 在庫あり
$3.53 / 個
データシートを見る →10M08DAF256A7G 最大定格＆電気的特性
| Series | MAX 10 |
| Logic Elements | 8,000 LE |
| Embedded Memory | 378 Kbit (387,072 bits) |
| Maximum User I/Os | 178 |
| パッケージ | 256-LBGA (FineLine BGA, 17 mm x 17 mm) |
| Operating Temperature (Automotive 'A7G') | -40C to +125C (junction) |
| Core Supply Voltage | 1.2 V |
| 実装スタイル | SMD/SMT |
| Configuration Memory | On-chip dual-configuration flash |
| RoHS ステータス | Compliant |
| Lead-Free / Halogen-Free | Yes |
| Development Tool | Intel Quartus Prime |
10M08DAF256A7G 256-lbga (fineline bga, 17 mm x 17 mm) ピン配置ガイド
10M08DAF256A7G (256-lbga (fineline bga, 17 mm x 17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M08DAF256A7G.
詳細は データシート をご参照ください。
主な用途
10M08DAF256A7G の用途: 6 件s: Industrial PLC and Motor Control, Automotive Body and Chassis Electronics, Factory Automation and Robotics I/O Hub, Low-Power Video Bridging and Display Controllers, Sensor Aggregation and IoT Edge Gateways, Replacement of Discrete Logic and Small CPLDs.
Industrial PLC and Motor Control
The 10M08DAF256A7G is well matched to industrial PLC and motor-control applications because its 178 GPIOs can interface directly with encoder feedback, PWM outputs, opto-isolated digital inputs, and stepper / servo driver lines without external logic. The on-chip dual-configuration flash enables fail-safe firmware updates in 24/7 factory environments, and the automotive -40C to +125C temperature grade (A7G) comfortably covers industrial control cabinet thermal envelopes. With 8K logic elements and 378 Kbit embedded SRAM, the FPGA can host a soft processor (such as Nios II) plus custom DSP logic for closed-loop current control. The 1.2 V core keeps total power dissipation low, eliminating the need for forced-air cooling in enclosed cabinets.
おすすめ
Automotive Body and Chassis Electronics
The 'A7G' temperature grade (-40C to +125C junction) makes the 10M08DAF256A7G directly suitable for body and chassis ECUs such as body controllers, lighting controllers, and gateway modules. Its 8K LEs and 387 Kbit embedded memory allow consolidation of multiple discrete logic ICs, gate drivers, and small CPLDs into a single programmable device, reducing BOM cost and PCB area. The on-chip configuration flash provides instant-on behavior at cold crank, and dual images enable fail-safe OTA updates. Combined with 178 GPIOs supporting LVDS and 3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V I/O standards, the device bridges between automotive sensors, actuators, and CAN / LIN / Ethernet PHYs with minimal external glue logic.
おすすめ
Factory Automation and Robotics I/O Hub
Robotics and factory-automation I/O hubs benefit from the 10M08DAF256A7G's 178 high-speed GPIOs, integrated ADC, and on-chip configuration flash that allows field reprogramming without an external boot device. The 8K-LE fabric can host EtherCAT / PROFINET slave controllers, encoder counters, and safety logic, while the 378 Kbit SRAM provides deterministic FIFO buffering between sensor streams and the host controller. The automotive temperature rating ensures reliable operation in unconditioned factory cabinets and near motor drives. Quartus Prime supports the device with proven reference designs for EtherCAT and IO-Link, accelerating development.
おすすめ
Low-Power Video Bridging and Display Controllers
The 10M08DAF256A7G can act as a low-power video bridge or display controller in applications such as industrial HMIs and instrumentation front panels, where its 8K LEs are sufficient to drive LVDS displays and perform color-space conversion or chroma keying. The 378 Kbit embedded memory provides line-buffer storage, while the 1.2 V core keeps total device power below 1 W, enabling fanless operation. Its 256-ball BGA package supports the high pin count required for parallel RGB, LVDS, or MIPI D-PHY bridging when paired with external serializers. The instant-on flash architecture boots the controller within milliseconds of power-up.
おすすめ
Sensor Aggregation and IoT Edge Gateways
In sensor aggregation hubs and industrial IoT edge gateways, the 10M08DAF256A7G combines multiple low-speed serial buses (UART, SPI, I2C) and discrete GPIO lines into a single Ethernet-connected edge node. The MAX 10's on-chip flash eliminates the external boot PROM typical of SRAM-based FPGAs, reducing BOM and improving reliability. With 8K LEs the device can host a soft RISC-V or Nios II core plus protocol stacks (Modbus, MQTT-SN) while leaving logic headroom for custom filtering. The A7G temperature grade supports outdoor enclosures and remote cabinets.
おすすめ
Replacement of Discrete Logic and Small CPLDs
The 10M08DAF256A7G is a cost-efficient replacement for designs that today combine several discrete 74-series logic ICs, small CPLDs, and glue logic on a single board. With 8K LEs and 178 GPIOs the device absorbs the entire discrete-logic footprint while adding reconfigurability and inventory simplification. The on-chip flash means the board ships pre-programmed and does not require in-system programming infrastructure at end-of-line. Compared with CPLDs the 10M08 also offers more memory, embedded ADC, and richer I/O standards at a similar price point.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M08DAF256A7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M08DAF256C7G | 10M08DAF256I7G | 10M08DAF256A7P | 10M04DAF256A7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 8,000 LE | 8,000 LE | 8,000 LE | 8,000 LE | 4,000 LE (-50%) |
| Embedded Memory | 378 Kbit (387,072 bits) | 378 Kbit | 378 Kbit | 378 Kbit | 189 Kbit (-50%) |
| Maximum User I/Os | 178 | 178 | 178 | 178 | 178 |
| Temperature Grade (suffix) | Automotive -40C to +125C (A7G) | Commercial 0C to +85C (C7G) | Industrial -40C to +100C (I7G) | Automotive -40C to +125C (A7P, Pb-free) | Automotive -40C to +125C (A7G) |
| On-Chip Configuration Flash | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主な差別化要因
- Higher temperature grade (-40C to +125C automotive) versus commercial-grade 10M08DAF256C7G （vs 10M08DAF256C7G)
- Larger 8K-LE silicon versus 4K-LE 10M04DAF256A7G in the same 256-LBGA footprint （vs 10M04DAF256A7G)
- Dual-image on-chip configuration flash versus single-image 10M08DAF256A7P variant （vs 10M08DAF256A7P)
設計ノート
The 256-ball BGA requires PCB micro-via or via-in-pad technology. Use a 17 mm x 17 mm BGA land pattern with 1.0 mm ball pitch per the MAX 10 pin connection guidelines. Provide at least four signal layers plus dedicated power / ground planes, with continuous ground stitching vias around the BGA perimeter for return-path integrity. Match the length of JTAG and clock differential pairs within 150 mils to avoid timing skew.
The 10M08DAF256A7G requires a 1.2 V core supply plus separate VCCIO supplies for each I/O bank (typically 3.3 V, 2.5 V, 1.8 V, 1.5 V, or 1.2 V). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10 uF / 47 uF capacitors on each supply rail. Estimated: at 25% toggle rate and 178 active GPIOs, total core current is roughly 200-400 mA; verify against Quartus Prime PowerPlay estimates for your exact design.
Respect the LVDS I/O bank assignments: LVDS transmitters require a 2.5 V VCCIO, while LVDS receivers use an internal 100 ohm differential termination that must be enabled in the device pin assignment file. Keep at least 2x the trace-width spacing between LVDS pairs and single-ended signals to maintain 60 dB isolation. Route high-speed memory interfaces on inner stripline layers with reference ground planes on both sides.
Do not leave MSEL pins floating; they determine the configuration mode (AS, PS, JTAG) at power-up and must be tied to VCCIO or GND through 1 kohm resistors. Always specify the dual-image boot option in the Quartus Prime programming file generator to enable fail-safe fallback. Ensure CONF_DONE and nSTATUS have external 10 kohm pull-ups to VCCIO if used in serial configuration mode.
コンプライアンス情報
RoHS and lead-free status inferred from the 'A7G' suffix in the ordering part number (G = halogen-free, 7 = lead-free finish). AEC-Q100 qualification applies because the part carries the 'A' temperature-grade suffix designating the automotive -40C to +125C window. Compliance fields default to 'compliant' for Intel MAX 10 family members; confirm against the latest manufacturer declaration of conformity before automotive certification.
