集積回路

XC7Z010-1CLG225I

XC7Z010-1CLG225I - Zynq-7000 SoC, 667MHz, 28K Logic Cells | AMD

The AMD XC7Z010-1CLG225I is a Zynq-7000 SoC integrating a dual-core ARM Cortex-A9 MPCore processor with an Artix-7 FPGA fabric in a 225-ball CSPBGA (13x13 mm) package. It operates at a maximum processor frequency of 667 MHz and provides 28K logic cells, making it a versatile platform for embedded systems requiring both software programmability and hardware acceleration. A System-on-Chip (SoC) combines a processor (CPU) with other system components such as memory controllers, peripherals, and programmable logic on a single die. The Zynq-7000 family specifically merges a hard ARM processing system (PS) with a programmable FPGA fabric (PL), enabling designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microcontrollers and FPGAs, offering the flexibility of programmable logic with the ease of software development. Key features include dual ARM Cortex-A9 cores with NEON and CoreSight debug, 28K Artix-7 logic cells, 667 MHz maximum frequency, and industrial temperature range (-40°C to +100°C). The device supports a nominal supply voltage of 1.0V (0.95V to 1.05V) and includes integrated memory controllers, DMA, and a rich set of peripherals. The CLG225 package provides a compact footprint suitable for space-constrained designs. The Zynq-7000 architecture separates the PS and PL, allowing independent clocking and power management. The PS includes a DDR3/DDR3L memory controller, Gigabit Ethernet, USB 2.0, and SDIO interfaces, while the PL provides configurable logic, DSP slices, and block RAM. This separation enables optimized performance and power efficiency for heterogeneous workloads. Typical applications include industrial motor control, software-defined radio, medical imaging, and automotive driver assistance systems. The combination of ARM processing and FPGA fabric makes it ideal for real-time control, signal processing, and protocol bridging. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO) require proper filtering and sequencing to ensure reliable startup and operation. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.

USD $40.00 在庫あり

XC7Z010-1CLG400C

XC7Z010-1CLG400C - 667MHz Zynq SoC, 28K Logic | AMD

The AMD XC7Z010-1CLG400C is a Zynq-7000 All Programmable System on Chip integrating a dual-core Arm Cortex-A9 processor, 667 MHz processor operation, and 28,000 FPGA logic cells in a 400-CSBGA package measuring 17 mm by 17 mm. It combines programmable hardware with software-controlled processing for embedded systems, industrial control, communications, image processing, and hardware-accelerated applications. The device also provides 35,200 registers, 240 Kbit of block RAM, 80 multipliers, 60 block RAM resources, 80 dedicated DSP slices, and up to 128 user I/Os, according to the supplied technical data. What is a Zynq-7000 All Programmable SoC? A system on chip, or SoC, combines multiple functional subsystems into one integrated semiconductor. In this case, the XC7Z010-1CLG400C integrates an Arm Cortex-A9 MPCore processing system with CoreSight debug support and Artix-7 FPGA logic. This hierarchical relationship places the device between a conventional microprocessor and a programmable-logic accelerator, allowing software tasks and parallel hardware pipelines to share one package. The principal features are the dual Arm Cortex-A9 cores, 667 MHz operation, and 28K programmable logic cells. The supplied data also identifies 240 Kbit of RAM, 80 multipliers, 60 block RAMs, 80 dedicated DSP slices, two Ethernet MACs, and support for differential I/O standards including LVDS, SSTL, and HSTL. These resources make the device suitable for systems that need deterministic hardware pipelines alongside general-purpose software. The FPGA fabric provides programmable parallel logic for acquisition, filtering, protocol conversion, video processing, and cryptographic workloads. The processor subsystem supports software applications and operating-system-based control, while the DSP, block RAM, and Ethernet resources can accelerate data-intensive operations without requiring separate programmable-logic devices. The 400-CSBGA package exposes up to 128 user I/Os for board-level connectivity. Typical uses include industrial factory controllers, networked embedded gateways, camera and image-processing systems, communications equipment, data-acquisition platforms, and compact control systems. The integrated architecture can reduce the number of external chips when software control and FPGA acceleration are both required. The 667 MHz processor and parallel fabric provide a flexible split between sequential software processing and hardware pipelines. Designers should verify power sequencing, signal-integrity requirements, differential I/O implementation, thermal conditions, and the complete pinout against the AMD documentation. The supplied data does not provide a manufacturer datasheet URL, exact voltage limits, operating-temperature range, or detailed package dimensions, so those values are not inferred here. This product data consolidates verified distributor and comparison information with practical selection context, package identity, core architecture, programmable resources, and application guidance for engineers evaluating the XC7Z010-1CLG400C.

見積もり在庫あり

XC7Z020-1CLG484I

XC7Z020-1CLG484I - Zynq-7000 SoC 667MHz Dual ARM Cortex-A9 | AMD/Xilinx

The AMD/Xilinx XC7Z020-1CLG484I is a Zynq-7000 All Programmable System-on-Chip (AP SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with 667MHz core clock, together with Artix-7 programmable logic of 85K logic cells, all housed in a 484-ball CSBGA (CLG484) package measuring 19x19 mm. It is the -1 speed grade, industrial temperature range variant of the XC7Z020 family. A SoC FPGA such as the Zynq-7000 is a single silicon device that fuses a hard processor subsystem (HSS) and a soft FPGA fabric. The processor subsystem runs software (Linux, RTOS, bare-metal), while the programmable logic provides hardware acceleration, custom I/O, and parallel data-path extensions. Zynq-7000 devices sit within the broader taxonomy of heterogeneous compute devices, alongside MPSoC and Versal Adaptive SoC families from AMD/Xilinx. This hybrid architecture is ideal for embedded systems that require both deterministic real-time control and high-throughput data processing. Key features include dual ARM Cortex-A9 cores with NEON SIMD and single/double precision FPU, on-chip L1 caches (32 KB I-cache, 32 KB D-cache per core) and 512 KB L2 cache, integrated Memory Controller for DDR3/DDR3L/LPDDR2, dual USB 2.0 OTG, dual Gigabit Ethernet MACs, dual SD/SDIO controllers, and 2x UART, 2x SPI, 2x I2C peripheral interfaces. The integrated Artix-7 FPGA fabric includes 85K logic cells, 4.9 Mb block RAM, and 220 DSP slices. The Zynq-7000 architecture uses a tightly coupled AXI interconnect between the PS and PL, allowing hardware-accelerated peripherals to communicate with the processor at high bandwidth with predictable latency. The CLG484 package exposes multiple high-performance (HP) and high-range (HR) I/O banks for DDR interfacing and general-purpose I/O. Typical applications include industrial motor drives, machine vision, software-defined radio, ADAS driver assistance systems, medical imaging, and embedded vision. The wide temperature range and -1 speed grade make the XC7Z020-1CLG484I well suited for industrial control and factory automation. When designing with this device, careful attention must be paid to PCB layout, power-rail sequencing, and DDR signal integrity. Use Vivado Design Suite and Vitis for hardware/software co-design, and refer to the official Zynq-7000 datasheet (DS187) and PCB design guide (UG933). This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

USD $45.94 在庫あり

XC7Z020-2CLG484I

XC7Z020-2CLG484I - Zynq-7000 SoC 85K Logic Cells | AMD

The AMD XC7Z020-2CLG484I is a Zynq-7000 All Programmable SoC (AP SoC) integrating a dual-core ARM Cortex-A9 MPCore processor with an Artix-7 class FPGA fabric in a single 484-ball CSPBGA (19x19 mm) package. The processor subsystem runs at up to 766 MHz with CoreSight debug, while the programmable logic provides 85,000 logic cells, 53,200 LUTs, 106,400 flip-flops, 220 DSP slices, and 4.9 Mb of block RAM. A System on Chip (SoC) is an integrated circuit that consolidates processor, memory controllers, peripherals, and programmable hardware on a single substrate. The Zynq-7000 family pairs an ARM-based processing system (PS) with programmable logic (PL) over high-bandwidth AXI interfaces, reducing board space, power, and system complexity versus discrete processor-plus-FPGA solutions. Key features include a DDR3/DDR3L memory controller with ECC, USB 2.0, Gigabit Ethernet, and support for I/O voltages of 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V. The -2 speed grade supports up to 766 MHz PS operation and 200 MHz+ fabric clocking. The industrial temperature grade (-40C to +100C) targets harsh environments. Architecturally, the PS and PL are independent power domains with defined sequencing requirements (VCCINT, VCCAUX, VCCBRAM, VCCO). The device supports partial reconfiguration, allowing dynamic PL updates while the PS continues running. The memory controller delivers robust DDR3/DDR3L with ECC for industrial and automotive-class designs. Typical applications include motor control, industrial automation, software-defined radio, video processing, and embedded vision. The device suits real-time processing with hardware acceleration, such as machine vision and high-speed data acquisition. Design consideration: ensure correct power-rail sequencing and provide a configuration source (QSPI flash) and PS clock; refer to the Zynq-7000 TRM (UG585) for detailed guidance. Pricing from $60.07 (LCSC, as of 2026-08-29).

USD $49.00 在庫あり

XC7Z030-1FBG484I

XC7Z030-1FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD

The AMD XC7Z030-1FBG484I is a Zynq-7000 SoC integrating a dual-core ARM Cortex-A9 MPCore processor with a Kintex-7 FPGA fabric. It features 125K logic cells, 667MHz maximum processor frequency, and comes in a 484-pin FCBGA package (23x23mm). This SoC combines the programmability of an FPGA with the performance of an embedded processor, enabling flexible system design for a wide range of applications. A System-on-Chip (SoC) integrates a processor, memory, and peripherals onto a single die, reducing board space and power consumption while improving reliability. The Zynq-7000 family specifically combines a hard ARM processor subsystem with programmable logic, allowing hardware acceleration and custom I/O. This hybrid architecture is ideal for applications requiring both high-level operating system support and real-time, low-latency processing. Key features include 125K logic cells, 667MHz dual-core ARM Cortex-A9, 256KB on-chip memory, and support for DDR3/DDR3L memory interfaces. The device also offers high-speed transceivers, PCIe Gen2, and multiple I/O standards. The -1 speed grade indicates a base performance level, while the I suffix denotes industrial temperature range (-40°C to +100°C). The Zynq-7000 architecture separates the processing system (PS) from the programmable logic (PL), connected via high-bandwidth AXI interfaces. This allows designers to optimize software and hardware independently. The PS includes a memory management unit, DMA controllers, and a rich set of peripherals, while the PL provides flexible logic resources for custom accelerators and interfaces. Typical applications include software-defined radio, industrial motor control, automotive driver assistance, and high-performance embedded computing. The combination of ARM processing and FPGA fabric makes it suitable for edge computing, where low latency and high throughput are critical. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and proper power-on sequencing to avoid latch-up. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.

USD $160.00 在庫あり

XC7Z030-2FBG484I

XC7Z030-2FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD

The AMD XC7Z030-2FBG484I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 class programmable logic fabric. This device combines the flexibility of an FPGA with the performance of an embedded processor, making it ideal for a wide range of applications including software-defined radio, industrial automation, and automotive driver assistance systems. The device is housed in a 484-pin FCBGA package (23x23 mm) and operates over the industrial temperature range of -40°C to +100°C. A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. The Zynq-7000 family specifically combines a hard processing system (PS) with programmable logic (PL), allowing designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microprocessors and FPGAs, enabling high-performance, low-latency processing for demanding embedded applications. Key features of the XC7Z030-2FBG484I include 125,000 logic cells, a dual-core ARM Cortex-A9 processor running at up to 800 MHz, and support for 1.2V to 3.3V I/O standards. The device also includes 256 KB of on-chip memory, integrated PCIe, and multiple high-speed transceivers. These features provide a powerful and flexible platform for implementing complex digital systems. From a technical perspective, the XC7Z030-2FBG484I is fabricated using a 28nm process technology, which balances performance and power efficiency. The processing system includes a memory management unit, L1 and L2 caches, and a wide range of peripherals, while the programmable logic is based on the Kintex-7 architecture, offering high logic density and DSP capabilities. This combination allows for the implementation of sophisticated algorithms and interfaces. Typical applications for the XC7Z030-2FBG484I include software-defined radio, where the programmable logic handles baseband processing and the ARM cores run protocol stacks; industrial motor control, where the FPGA implements high-speed PWM and the processor handles communication; and medical imaging, where the device accelerates image processing algorithms. The device's high-speed transceivers also make it suitable for video and network processing. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 484-pin FCBGA package requires a multi-layer PCB with dedicated power and ground planes. The device's power consumption can be significant, so a proper heatsink or active cooling solution may be necessary for high-performance applications.

USD $58.00 在庫あり

XC7Z030-2SBG485I

XC7Z030-2SBG485I - Zynq-7000 SoC, 125K Logic Cells | AMD

The AMD XC7Z030-2SBG485I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 class programmable logic fabric. This device combines the flexibility of an FPGA with the performance of an embedded processor, making it ideal for a wide range of applications including automotive, medical, and industrial systems. The device is housed in a 484-ball FCBGA package (19x19 mm) and operates at a maximum frequency of 800 MHz. A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. The Zynq-7000 family specifically merges a hard ARM-based processing system (PS) with programmable logic (PL), allowing designers to implement custom hardware accelerators alongside software applications. This architecture enables high-performance, low-latency processing that is not achievable with traditional microprocessors or FPGAs alone. Key features of the XC7Z030-2SBG485I include 125,000 logic cells, dual ARM Cortex-A9 cores running at 800 MHz, and a 28nm process technology. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The 'I' suffix indicates an industrial temperature grade, with an operating range of -40°C to +100°C, making it suitable for harsh environments. From a technical perspective, the Zynq-7000 architecture provides a high-bandwidth interconnect between the PS and PL, enabling efficient data transfer. The device includes a memory management unit (MMU) for the ARM cores, as well as a rich set of peripherals including USB, Ethernet, and SPI. The programmable logic can be configured to implement custom peripherals, DSP blocks, or even soft-core processors, offering unparalleled design flexibility. Typical applications for the XC7Z030-2SBG485I include software-defined radio, motor control, image processing, and automotive driver assistance systems. The combination of a powerful processor and reconfigurable logic makes it an excellent choice for systems that require both high-level control and real-time signal processing. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate ground planes and thermal vias to ensure reliable operation at high temperatures.

USD $85.00 在庫あり

XC7Z035-2FFG676I

XC7Z035-2FFG676I - Zynq-7000 SoC, 275K LC, 800MHz | AMD

The AMD (Xilinx) XC7Z035-2FFG676I is a Zynq-7000 All Programmable System-on-Chip (SoC) combining a dual-core ARM Cortex-A9 MPCore processing system running at 800 MHz with a Kintex-7 class FPGA fabric of 275K logic cells, housed in a 676-ball FCBGA (27x27 mm) industrial-grade package. A Zynq-7000 SoC is a class of programmable system-on-chip devices that integrate a hardwired processor system (PS) with programmable logic (PL) on a single die. Unlike a standalone FPGA or a standalone microprocessor, a SoC FPGA allows software running on the ARM cores and hardware accelerators in the fabric to communicate over high-bandwidth on-chip AXI interconnect, making the device family a cornerstone of modern embedded processing and adaptive computing hierarchies. Key features of the XC7Z035 include the mid-range 275K logic cell fabric, a -2 speed grade, and industrial temperature screening (the I suffix, typically -40C to +100C junction), making it suitable for harsh-environment deployments. The hard processor system offloads control-plane software while the fabric absorbs data-plane acceleration, math, and custom I/O. Architecturally, the device pairs the ARM Cortex-A9 NEON/FPU-enabled cores with CoreSight debug, caches, on-chip memory, and a rich set of PS peripherals, bonded to Kintex-7-based programmable logic with DSP slices, block RAM, and high-speed serial transceivers. AXI ports bridge the two domains with low latency. Typical applications include industrial automation and motor control, aerospace and defense processing, software-defined radio, video and image processing pipelines, and network packet processing where a soft processor would be too slow and a discrete CPU+FPGA pair too costly. When designing with this device, plan power sequencing between VCCINT, VCCAUX, and PS rails, and select a Vivado device name matching the industrial speed-grade variant to avoid implementation errors. This page synthesizes distributor pricing, verified same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

USD $202.40 在庫あり

XC7Z045-1FBG676I

XC7Z045-1FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD

The AMD XC7Z045-1FBG676I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processor with a Kintex-7 FPGA fabric. It is housed in a 676-pin FCBGA package (27x27 mm) and operates at a maximum clock frequency of 667 MHz. The device provides 350K logic cells, making it suitable for high-performance embedded applications requiring both software programmability and hardware flexibility. A System-on-Chip (SoC) is an integrated circuit that combines multiple system components, such as processors, memory interfaces, and I/O, onto a single substrate. The Zynq-7000 family specifically merges a processing system (PS) based on ARM cores with programmable logic (PL) based on FPGA fabric. This architecture allows designers to implement complex algorithms in hardware while maintaining the flexibility of software-defined control, bridging the gap between traditional microprocessors and FPGAs. Key features of the XC7Z045-1FBG676I include 350K logic cells, 256 KB of on-chip RAM, and support for high-speed transceivers. The device also includes a rich set of I/O options, including multiple high-speed serial transceivers and general-purpose I/O banks. The dual-core ARM Cortex-A9 processor runs at up to 667 MHz, providing substantial processing power for real-time applications. From a technical perspective, the XC7Z045-1FBG676I leverages AMD's advanced 28nm process technology, balancing performance and power efficiency. The integration of the ARM processor with the Kintex-7 FPGA fabric enables low-latency, high-bandwidth communication between software and hardware, which is critical for applications like software-defined radio, image processing, and industrial control. The device supports a wide range of industry-standard interfaces, including DDR3/DDR4 memory controllers and PCIe. Typical applications include high-end embedded computing, aerospace and defense systems, medical imaging, and wired/wireless communications. The combination of a powerful processor and reconfigurable logic makes it ideal for prototyping and production in demanding environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to avoid latch-up or damage. Additionally, the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.

USD $520.00 在庫あり

XC7Z045-1FFG900I

XC7Z045-1FFG900I - Zynq-7000 SoC, 350K Logic Cells | AMD

The AMD XC7Z045-1FFG900I is a Zynq-7000 SoC that integrates a dual-core ARM Cortex-A9 MPCore processing system (PS) with a 28nm Kintex-7-class programmable logic (PL) fabric in a single device. It is housed in a 900-ball FCBGA package (31x31 mm) and operates at a maximum PS clock frequency of 667 MHz. This SoC provides 350K logic cells, making it a high-capacity platform for embedded systems that require both software flexibility and hardware acceleration. A System-on-Chip (SoC) FPGA combines a hard processor subsystem with programmable logic on one die. The Zynq-7000 family, introduced by Xilinx (now AMD) in 2012, is a leading example of this architecture. It allows designers to implement complex systems where the ARM cores handle control and communication tasks, while the FPGA fabric accelerates data-intensive algorithms. This integration reduces board space, power, and latency compared to discrete processor-plus-FPGA designs. Key features of the XC7Z045-1FFG900I include 350K logic cells, 667 MHz dual-core ARM Cortex-A9 processing, and a 900-ball FCBGA package. The device supports a wide range of I/O standards and includes high-speed serial transceivers. The 'I' suffix indicates an industrial temperature grade, suitable for harsh environments. The '1' speed grade offers a balance between performance and power consumption. The Zynq-7000 architecture provides a high-bandwidth connection between the PS and PL through AXI interfaces, enabling efficient data movement. The PL is based on the 7-series FPGA fabric, which includes configurable logic blocks, block RAM, and DSP slices. This allows for the implementation of custom accelerators, soft processors, and high-speed I/O interfaces. The PS includes memory controllers for DDR3/DDR3L, as well as a rich set of peripherals such as Gigabit Ethernet, USB, and SPI. Typical applications for the XC7Z045-1FFG900I include software-defined radio, industrial motor control, medical imaging, and aerospace and defense systems. Its combination of processing power and programmable logic makes it ideal for applications requiring real-time signal processing, high-speed data acquisition, and flexible I/O. The industrial temperature grade ensures reliable operation in demanding environments. When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails, and proper sequencing is critical to prevent damage. Additionally, the high-density BGA package requires a multi-layer PCB with controlled impedance traces for high-speed signals. AMD provides comprehensive reference designs and documentation to assist with these challenges.

USD $130.00 在庫あり

XC7Z045-2FBG676I

XC7Z045-2FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD

The AMD XC7Z045-2FBG676I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 class programmable logic fabric. This device combines the flexibility of an FPGA with the performance of an embedded processor, making it ideal for a wide range of applications including software-defined radio, industrial motor control, and high-performance video processing. The XC7Z045-2FBG676I features 350K logic cells, 800MHz maximum processor clock speed, and is housed in a 676-ball FCBGA (27x27mm) package. A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. It typically includes a processor core, memory, input/output ports, and secondary storage interfaces. In the context of the Zynq-7000 family, the SoC combines a hard processing system (PS) based on ARM Cortex-A9 cores with programmable logic (PL) based on FPGA fabric. This architecture allows designers to implement custom hardware accelerators in the PL while running operating systems like Linux on the PS, offering a balance of performance, flexibility, and power efficiency. Key features of the XC7Z045-2FBG676I include 350K logic cells, 800MHz dual-core ARM Cortex-A9 processor, 16.25 Mb of block RAM, and 900 DSP slices. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The -2 speed grade indicates a high-performance variant, suitable for demanding applications. The industrial temperature grade (I suffix) allows operation from -40°C to +100°C, making it suitable for harsh environments. The Zynq-7000 architecture provides a unique advantage by enabling tight coupling between the processing system and programmable logic through an AMBA AXI interconnect. This allows for high-bandwidth, low-latency communication between software running on the ARM cores and custom hardware logic. The device also includes a memory management unit, DDR3/DDR3L memory controller, and various peripheral interfaces such as USB, Gigabit Ethernet, and SDIO, enabling a complete embedded system on a single chip. Typical applications for the XC7Z045-2FBG676I include software-defined radio, where the programmable logic handles baseband processing while the ARM cores run protocol stacks; industrial motor control, where custom PWM and encoder interfaces are implemented in logic; and high-performance video processing, where the PL accelerates image processing algorithms. The device is also used in aerospace and defense applications requiring high reliability and long-term availability. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate thermal vias and a heatsink for high-power applications. The device supports multiple power rails (VCCINT, VCCAUX, VCCO) that must be sequenced correctly during power-up to prevent damage.

USD $650.00 在庫あり

XC7Z100-2FFG900I

XC7Z100-2FFG900I - Zynq-7000 SoC, Kintex-7 FPGA, 444K Logic Cells | AMD

The AMD/Xilinx XC7Z100-2FFG900I is a Zynq-7000 All Programmable System-on-Chip (AP SoC) that integrates a dual-core ARM Cortex-A9 MPCore processor (up to 800 MHz) with a Kintex-7 FPGA fabric (444K logic cells, 26.5 Mb block RAM, 1540 DSP slices) in a single 900-ball FCBGA package (31x31 mm). It combines software programmability with hardware programmability, enabling hardware acceleration of compute-intensive workloads. A Zynq-7000 SoC is a heterogeneous multiprocessor device that fuses a Processing System (PS) - a dual ARM Cortex-A9 with NEON SIMD engines, caches, MMU, and standard peripherals - with Programmable Logic (PL) equivalent to a Kintex-7 FPGA. The PS boots first and configures the PL at start-up, allowing software designers to use familiar Cortex-A9 toolchains (GCC, Linux, FreeRTOS) while hardware designers accelerate critical paths in the PL. The XC7Z100 sits at the top of the Zynq-7000 family, sharing the Kintex-7 fabric with the Z-7045 but adding extra logic, DSP, and block RAM resources. Key features include 2x ARM Cortex-A9 cores at up to 800 MHz, 444K logic cells, 26.5 Mb block RAM, 1540 DSP48E1 slices, 16 GTX transceivers at up to 6.25 Gb/s, dual 12-bit 1 MSPS ADCs (XADC), 4x PCIe Gen2 hard blocks, and 2x USB 2.0 OTG ports. The integrated CoreSight debug enables multicore trace, and security features include AES, SHA, and RSA hardware accelerators alongside secure boot. Typical applications include high-performance embedded vision (machine-learning inference, ADAS front cameras), 8K video processing, software-defined radio baseband, industrial motor control with deterministic real-time loops, and avionics/medical imaging. The Kintex-7 PL is well suited to DSP-heavy algorithms like FFT, LDPC, and H.265 codec blocks. When designing, allocate decoupling and bulk capacitors close to each power rail (VCCPINT, VCCPAUX, VCCO, VCCAUX, MGTAVCC); use the AMD-recommended power-on/-off sequencing; and adopt the UG865 ASCII package files when laying out the 900-ball FCBGA. For evaluation, the ZC706 board (XC7Z045 in FFG900) is pin-compatible with the XC7Z100 FFG900 footprint, which AMD documents as an authorized Z-7100 reference platform.

USD $2,680.00 在庫あり

XC8664FRIBEKXUMA1

XC8664FRIBEKXUMA1 - 8-bit XC800 MCU, 16KB Flash, 38-TSSOP | Infineon

The Infineon XC8664FRIBEKXUMA1 is an 8-bit microcontroller built around the XC800 family 8051-compatible CISC core, integrating 16 KB of on-chip Flash memory, 16 KB (16K x 8) program Flash, and 38-pin TSSOP packaging. It operates from a wide supply range of 2.5 V / 3.3 V / 5 V and runs the 8051 core up to 86 MHz (with peripheral domain scaling at 26.67 MHz per the Hotenda listing). According to the manufacturer datasheet, this IC is the first product of a new and advanced 8-bit uC family (XC8oo family), combining a high-performance 8051 core with on-chip Flash memory and powerful on-chip peripherals. An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, non-volatile program memory, and peripherals such as timers, ADC, and communication interfaces. The 8051 CISC architecture, originally introduced by Intel in 1980, remains one of the most widely deployed embedded cores worldwide and underpins the hypernym hierarchy 8051 -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. The XC8664FRIBEKXUMA1 belongs to Infineon's XC866 sub-family, which is targeted at cost-sensitive industrial and automotive body applications requiring deterministic 8-bit performance. Key differentiating features include a TSSOP-38 footprint with gull-wing leads, automotive temperature grade, integrated 16 KB Flash that supports in-application programming, an on-chip ADC and Capture/Compare Unit (CCU6), and a MultiCAN node for automotive networking. The 86 MHz core clock enables high-throughput bit-manipulation routines typical of motor-control and sensor-interface code, while the wide 2.5 V to 5 V supply range simplifies integration into 3.3 V and 5 V mixed-rail systems without external level shifters. The architecture pairs the standard 8051 instruction set with an XC800-specific peripheral set, including the MultiCAN module, the CCU6 motor-control timer, and a 10-bit ADC with up to eight channels. The wide operating voltage window (2.5 V to 5 V) is a defining trait of the XC8oo family and removes the need for separate voltage regulators in many 3.3 V or 5 V designs. Internal PLL, oscillator, and brown-out circuitry further reduce the external BOM. Typical applications include automotive body electronics, sensor interface modules, low-end motor control, and industrial control. The on-chip MultiCAN node makes the part particularly attractive for in-cabin nodes communicating over a CAN bus at 100 kbit/s to 1 Mbit/s. Designers should note that this part is in the older XC8xx family; current Infineon 8-bit roadmaps have shifted to the XC2000 and AURIX families, so lifecycle planning is recommended before committing to long-life designs.

USD $2.05 在庫あり

XC95144XL-10TQG100C

XC95144XL-10TQG100C - 3.3V 144-Macrocell CPLD | AMD

The AMD XC95144XL-10TQG100C is a 3.3 V in-system-programmable CPLD with 144 macrocells, 81 I/Os, 3,200 usable gates, 5 ns pin-to-pin logic delays, and a system frequency up to 178 MHz, housed in a 100-pin TQFP package. It is designed for high-performance, low-voltage logic integration in communications and computing systems. A CPLD, or complex programmable logic device, is a programmable semiconductor that combines reconfigurable logic fabric with nonvolatile Flash memory. It sits between simple fixed-function gates and larger FPGAs in the broader semiconductor hierarchy, providing deterministic timing, flexible logic integration, and in-system programming. The XC95144XL family uses eight 54V18 function blocks and is intended for designs requiring multiple logic functions without the complexity of a full FPGA. Key features include 144 macrocells, 81 user I/Os, 3,200 usable gates, and a 10 ns speed designation in the manufacturer part number. The supplied device data identifies a 5 ns pin-to-pin logic delay and system frequency up to 178 MHz. Its in-system programmability supports configuration updates without removing the device from the circuit, while Flash configuration storage preserves the programmed logic after power removal. The TQFP-100 package provides a surface-mount form factor for compact PCB designs. The XC95144XL architecture is organized around eight 54V18 function blocks, enabling general-purpose logic integration for communications, computing, control, and interface designs. The 3.3 V operating class and low-voltage architecture align with modern digital systems, but system designers must still verify supply tolerances, I/O standards, timing constraints, and power sequencing against the manufacturer datasheet before releasing a PCB. Typical applications include communications equipment, computing systems, industrial control logic, peripheral interfacing, signal conditioning, glue logic, and board-level control functions. The 81 I/O count provides connectivity for external buses, status signals, control lines, and programmable logic blocks. For designs requiring more I/O or higher logic density, the related XC95144XL-10TQG144I uses a different 144-pin package and should not be treated as a pin-compatible replacement. The primary design consideration is package and pinout verification. XC95144XL-10TQG100C and XC95144XL-10TQG144I are not interchangeable on a PCB because their packages and I/O counts differ. Programming must follow the AMD/Xilinx device programming procedure, and unused pins, power pins, ground pins, and configuration pins must be connected exactly as specified by the manufacturer datasheet. This page combines verified manufacturer and distributor information with practical CPLD application guidance, package-selection context, and verified cross-reference limitations. It is intended to help engineers identify the correct XC95144XL device, locate its datasheet, and distinguish true drop-in alternatives from different-package options.

USD $8.02 在庫あり

XC9572XL

XC9572XL - 3.3V 72-Macrocell CPLD 5ns | Xilinx AMD

The Xilinx (now AMD) XC9572XL is a 3.3V high-performance CPLD (Complex Programmable Logic Device) providing 1,600 usable gates, 72 macrocells, and a worst-case pin-to-pin propagation delay of 5 ns, housed in low-profile VQFP packages such as the 44-pin VQ44 and 64-pin VQ64. A CPLD is a type of programmable logic device that sits between simple PLDs and FPGAs in the programmable logic hierarchy. Unlike FPGAs, which use look-up tables and volatile configuration memory, CPLDs use macrocell-based sum-of-products architecture with nonvolatile program storage, delivering deterministic, pin-to-pin timing and instant-on operation at power-up. This makes CPLDs the workhorse choice for glue logic, bus interfacing, and power-sequencing control in embedded systems. The XC9572XL is comprised of four 54V18 Function Blocks, each containing 18 macrocells. Key features include 3.3V core operation targeted at high-performance, low-voltage applications in leading-edge communications and computing systems; industry-leading pin-locking capability through a switch matrix that routes flexibly; and multiple speed grades (-5, -7, -10) so designers can trade speed against cost. Individual output enables and slew-rate-limited outputs ease 3.3V bus interfacing. Architecturally, every macrocell is a registered or combinational function generator with product-term allocation, allowing dense state machines without wasting resources. Because configuration is stored in nonvolatile memory across the XC9500XL family, no external boot flash or configuration controller is required, simplifying BOM and board design compared with SRAM-based FPGAs. Typical applications include address decoding and glue logic in embedded processors, bus bridging and interfacing in communications equipment, power-up reset and sequencing control, industrial I/O expansion, and legacy system life-cycle extensions where deterministic timing matters. Design-wise, use the -5 speed grade only where the 5 ns timing is genuinely needed; the -10 grade offers the best value for most glue-logic tasks. Note that design entry requires the legacy Xilinx ISE toolchain, which no longer runs natively on modern Windows. This page synthesizes distributor pricing, drop-in alternatives across speed grades and packages, and practical design notes not found in the manufacturer datasheet DS057.

USD $3.90 在庫あり

XC9572XL-10VQG64C

XC9572XL-10VQG64C - 72-Macrocell 10ns CPLD | AMD/Xilinx

The AMD/Xilinx XC9572XL-10VQG64C is a 3.3V, 10ns pin-to-pin delay, 72-macrocell high-performance CPLD housed in a 64-pin VQFP (VQG64) package. It is built on the 2.5V XC9500XL family architecture, providing four 54V18 Function Blocks (FBs) that deliver 1,600 usable gates with predictable, JTAG-programmable logic and 100,000 program/erase cycles endurance. The device targets glue-logic and bus-interface functions where deterministic timing and instant-on (in-system programmable via IEEE 1149.1 JTAG) replace discrete 74-series logic. A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device whose architecture is a sea of macrocells backed by a programmable interconnect matrix. In the system hierarchy, a CPLD sits below an FPGA (typically lower density but lower power and no configuration time) and above discrete SSI/MSI gates. CPLDs are routinely used as interface bridges, address decoders, state machines, and power-up sequencers in designs that need predictable timing in a single device. Key features of the XC9572XL-10VQG64C include 72 macrocells, 1,600 usable gates, 4 ns internal timing with 10 ns pin-to-pin (tPD) at 3.3V, 34 user I/O pins (64-pin VQFP), 5V-tolerant I/O with 3.3V core, and In-System Programmable (ISP) via JTAG. The XC9500XL family uses 5V tolerant I/O on a 3.3V core for mixed-voltage board designs. The device is specified over the commercial 0C to +70C ambient range (C suffix), with an industrial -40C to +85C option available as XC9572XL-10VQG64I. Architecturally, each Function Block contains 18 macrocells, 54 product terms, and a sum term allocated from a global pool, with the IEEE 1149.1 boundary-scan chain extending across all I/O pins. Per datasheet DS057, the Fast CONNECT switch matrix provides 100% connectivity to every FB output, enabling deterministic place-and-route timing. The I/O blocks support 5V tolerant inputs, 24 mA drive, slew-rate control, and per-pin user I/O standards. Typical applications include bus-interface bridging, address decoding, power-up logic sequencing, and I/O expansion in telecom line cards, industrial controllers, and embedded computing platforms. Because of its 5V tolerant I/O on a 3.3V core, the XC9572XL-10VQG64C is well suited to legacy systems that mix 5V peripherals with 3.3V ASICs. Designers also use it as an FPGA configuration PROM companion or as a power-sequencer for multi-rail designs. When designing with this part, ensure the JTAG TMS, TCK, TDI, and TDO pins are reserved and pulled appropriately, and provide a clean VCCAUX 3.3V rail because all outputs are powered from VCCIO while the core runs from VCCINT. Verify pin-compatibility across the family when migrating density, since the XC9536XL, XC9572XL, and XC95144XL share a footprint family plan across the 44-, 64-, and 100-pin VQFP/TQFP packages. This page synthesizes distributor stock and lead-time data, pin-compatible XC9500XL alternatives, and practical glue-logic design notes not found in the manufacturer datasheet alone.

USD $7.10 在庫あり

XCF02SVOG20C

XCF02SVOG20C - 2Mb Platform Flash PROM for FPGA Config | AMD/Xilinx

The AMD/Xilinx XCF02SVOG20C is a 2-Mbit in-system programmable configuration PROM designed to store configuration bitstreams for Xilinx FPGAs, housed in a 20-pin TSSOP package. It provides 2,097,152 bits of NOR Flash memory organized as 2,000K x 1, operates from a 3.0V to 3.6V supply, and supports the IEEE 1149.1 / IEEE 1532 JTAG standard for in-system programming and boundary-scan testing. The device delivers guaranteed endurance of 20,000 program/erase cycles and minimum data retention of 20 years, making it suitable for long-lifecycle industrial and embedded designs. A Platform Flash PROM is a non-volatile configuration memory IC purpose-built to hold FPGA bitstreams outside the FPGA fabric. In the broader component taxonomy it belongs to NOR Flash -> non-volatile memory -> memory IC -> integrated circuit. Unlike discrete SPI Flash or parallel boot memories, Platform Flash devices integrate the JTAG programming chain, FPGA hand-shake pins (CCLK, DONE, INIT, PROGRAM) and a cascade-ready architecture, so a single IC can boot a Xilinx Spartan or Virtex FPGA without external glue logic. Key features include 2Mb density in a compact 20-TSSOP footprint, low-power advanced CMOS NOR Flash process, cascadable bitstream expansion for larger FPGAs, and JTAG boundary-scan with 3-stage registers per bidirectional pin. The industrial temperature grade (VOG suffix = -40C to +85C) and lead-free TSSOP-20 packaging make XCF02SVOG20C a mainstream choice for cost-sensitive Spartan-3 / Spartan-3A designs. The OG20C suffix denotes a TSSOP-20 package supplied in tube. From a system-level perspective, XCF02SVOG20C connects directly to the FPGA's configuration mode pins (M[2:0] = 010 selects Master Serial mode). On power-up the PROM serial-clocks the bitstream via the FPGA CCLK pin, the FPGA drives DONE high, and the PROM tri-states its data line. The bidirectional pins are observable and controllable through the JTAG boundary-scan register, which speeds prototype debug and board-level interconnect testing. The NOR Flash cell array provides fast read access with low standby current. Typical applications include Spartan-3, Spartan-3A, Spartan-3E, and Virtex-II configuration storage, industrial control boards, factory automation equipment, medical imaging FPGA platforms, and any design that requires a small-footprint non-volatile boot source for Xilinx FPGAs. Two or more XCF02S PROMs can be cascaded to support larger bitstreams for higher-density FPGAs. When designing with XCF02SVOG20C, confirm the FPGA bitstream does not exceed 2Mb before committing the BOM. AMD PCN XCN20013 (2026) confirms there is NO direct drop-in replacement for XCF02SVOG20C; design teams are advised to forecast demand and place final orders before key dates in Appendix A of that PCN, or migrate the FPGA to a newer family that boots from internal SPI Flash. This page synthesizes distributor pricing, lifecycle risk context (XCN20013), drop-in alternative scarcity, and practical design notes not found in the manufacturer datasheet alone.

USD $19.40 在庫あり

XCF04S-VO20C

XCF04S-VO20C - 4Mb FPGA Configuration PROM, 20-TSSOP | AMD/Xilinx

The AMD/Xilinx XCF04S-VO20C is a 4-megabit in-system programmable Platform Flash configuration PROM designed to store configuration bitstreams for Xilinx FPGAs, packaged in a 20-pin thin shrink small outline package (TSSOP) and supplied in a tube. It operates from a 3.0 V to 3.6 V single supply, uses serial SPI-like configuration interface logic, and is rated for commercial-grade environments, making it a drop-in configuration memory solution for legacy AMD/Xilinx FPGA designs. An FPGA configuration PROM is a non-volatile flash memory device that holds the FPGA's bitstream and loads it into the FPGA's internal configuration logic at power-up. In the broader component taxonomy, the XCF04S-VO20C sits in the hierarchy: configuration memory -> PROM -> non-volatile memory -> memory IC -> semiconductor. The Platform Flash family is purpose-built for AMD/Xilinx Spartan, Virtex, and CoolRunner device chains, replacing older one-time-programmable PROMs to lower board cost and shorten programming cycles via in-system programmability through JTAG or slave-serial modes. Key features include 4 Mb of flash storage, an industrial-standard 4-pin SPI/I2C-like configuration interface, in-system programmability (ISP) via JTAG, and support for daisy-chain configuration across multiple FPGA devices or PROMs. The 20-TSSOP footprint is the same as the larger XCF08P/XCF16P family members, offering a consistent PCB layout when migrating bitstream size. Commercial temperature-grade operation and a single 3.3 V supply simplify power design versus dual-supply PROMs. From a technical standpoint, the XCF04S-VO20C is built on a NOR-flash process with an internal oscillator, command state machine, and configuration-data serializer. When the FPGA releases its DONE pin (or equivalent configuration logic), the PROM shifts out the bitstream through the dedicated data/clock pins. The flash-based design supports thousands of reprogram cycles, eliminating the need for UV-erase windows of older EPROM PROMs and reducing manufacturing rework time. The 20-TSSOP package keeps the device footprint identical to peers in the Platform Flash family. Typical applications include Spartan-3 / Spartan-6 FPGA boot-memory links, Virtex-II/Virtex-4/Virtex-5 configuration-storage companions, industrial PLCs and embedded controller boards, and legacy industrial-camera or motor-control platforms that still ship with a separate configuration PROM. It is also commonly seen in test-and-measurement prototypes where designers prefer a dedicated PROM over in-FPGA bitstream compression methods. When designing with the XCF04S-VO20C, ensure the FPGA's mode pins are set to Master Serial mode (M[2:0] = 000) so the PROM drives CCLK, and confirm the JTAG chain order in software (iMPACT, Vivado hardware manager) to avoid in-system programming conflicts. As of 2026-10-11, this part shows active distributor stock but is flagged in the AMD/Xilinx product change-notification system as approaching end of life - check PCN status before new designs. This page consolidates distributor pricing, drop-in alternatives such as XCF04SVOG20C and XCF08P family members, and PCB-layout notes not included in the manufacturer datasheet.

USD $4.65 在庫あり

XCF04SVOG20C

XCF04SVOG20C - 4Mb Platform Flash Configuration PROM | AMD/Xilinx

The AMD/Xilinx XCF04SVOG20C is a 4-Mbit in-system programmable Platform Flash configuration PROM designed to store and load configuration bitstreams for Xilinx FPGAs such as Spartan-6, Virtex-5, and earlier Series-6/7 devices. The device integrates 4194 kbits of non-volatile flash organized as 4000k x 1 (4-Mbit density) in a 20-pin TSSOP plastic package rated for the industrial operating range. According to AMD/Xilinx product documentation, the part supports a simple serial configuration interface (slave serial mode), daisy-chained multi-device configuration, in-system programmability via JTAG (IEEE 1149.1), and built-in data decompression that lets the PROM hold up to 8 Mbits of compressed configuration data. A Platform Flash PROM is a non-volatile configuration memory IC that boots up an FPGA by clocking out its stored bitstream at power-on. The category belongs to the broader taxonomy of FPGA configuration memories -> serial flash for FPGAs -> non-volatile boot memory -> programmable logic support ICs. Unlike generic SPI flash, Platform Flash PROMs are designed with FPGA-specific control signals (CCLK, DONE, INIT, PROGRAM) and timing compatible with Xilinx slave-serial and SelectMAP-mapped configuration protocols, which simplifies board design and removes the need to bind an MCU to load the bitstream. Key features include a low-power advanced CMOS FLASH process, IEEE 1149.1 JTAG boundary-scan and in-system programming, configurable slave serial or daisy-chain configuration modes, an internal oscillator that drives the master CCLK output, design version storage for multi-bitstream systems, and a read-protect security fuse. The PROM is specified for 3.3V core and I/O operation and is rated for an operating temperature range appropriate to industrial environments. Architecturally, the XCF04SVOG20C combines a 4-Mbit flash array with a configuration controller state machine that handles FPGA handshaking. Endurance is rated by the manufacturer at thousands of program/erase cycles, and data retention is specified in years for industrial-grade operation. The single-pin-per-bit data path makes the device pin-compatible within the Platform Flash PROM family across densities of 1 Mbit, 4 Mbit, 8 Mbit, 16 Mbit, and 32 Mbit. Typical applications include Spartan-6 and Virtex-5 FPGA configuration, FPGA-based industrial controllers that boot from non-volatile memory, test-and-measurement loaders, and any Xilinx FPGA system that requires field-updatable configuration or daisy-chained multi-FPGA configuration. Designers also use Platform Flash PROMs in safety-critical systems because the PROM's configuration validity is verified by the FPGA's CRC logic at every boot. Design consideration: when migrating an XCF04S design to a newer Xilinx configuration solution, verify the master/slave mode and DONE polarity on the PCB. Also note that the XCF04SVOG20C has been transitioned out of production by AMD/Xilinx (see lifecycle status); users with long-lived programs should plan around the suggested active alternatives listed below. This page consolidates distributor pricing, lifecycle status, drop-in alternatives, and design notes for engineers migrating off the XCF04SVOG20C, with information that goes beyond the manufacturer datasheet.

USD $36.90 在庫あり

XCF16PVO48C0973

XCF16PVO48C0973 - 16Mb FPGA Configuration PROM | AMD Xilinx

The AMD Xilinx XCF16PVO48C0973 is a 16-Mbit In-System Programmable Configuration PROM designed to store and stream configuration bitstreams to Xilinx FPGA families. Housed in a 48-pin TSOP (TFSOP) package, it provides a serial configuration interface optimized for Spartan, Virtex, and CoolRunner device chains. With an operating supply range of 1.65V to 2.0V and industrial-grade -40C to +85C temperature support, the part is suitable for commercial, industrial, and ruggedized embedded systems. A configuration PROM is a non-volatile serial memory that holds the FPGA bitstream and presents it to the FPGA at power-up, after reset, or on demand through JTAG/Serial-mode commands. Compared to parallel flash, configuration PROMs deliver a smaller footprint, simpler interface timing, and proven Xilinx ecosystem compatibility - making them a reference solution for legacy and current Spartan-3, Virtex-4/5, and CoolRunner-II designs that still rely on dedicated boot storage. Key features of the XCF16PVO48C0973 include 16-Mbit (16Mx1 serial organization) density, in-system programmability through the JTAG/standard Xilinx PROM programming interface, low standby current typical of serial PROMs, and a 48-TSOP package with a 0.724 inch (18.40 mm) body width. The part supports master-serial configuration modes and provides CRC-based bitstream integrity checking during FPGA load. From an architecture perspective, the device uses a serial-NOR-style command set with opcode-driven read operations, and integrates Xilinx-specific configuration flow states (e.g., 8-bit address counters, bitstream framing) that allow the FPGA to load its image directly without an external microcontroller. This eliminates boot firmware complexity in most FPGA designs. Typical applications include Spartan-3/3E/6 FPGA boot storage, Virtex-4/5 configuration backup, industrial controller FPGA subsystems, military/aerospace rad-tolerant FPGA designs (when paired with rad-hard FPGAs), and remote field-upgradeable embedded systems that need reliable in-system re-programmability over the JTAG port. When designing with this PROM, verify the FPGA-to-PROM pin mapping against the target FPGA's Master Serial configuration mode table, ensure the 1.8V rail meets PROM inrush current during read bursts, and place a 0.1 uF + bulk capacitor pair within 5 mm of the VCC pins to maintain clean read-clock edges. This page synthesizes current distributor pricing, in-system programming guidance, and pin-compatible alternatives across the Xilinx XCF family - content not aggregated on individual distributor listings.

USD $8.20 在庫あり

XCF16PVOG48C

XCF16PVOG48C - 16Mb FPGA Configuration PROM | AMD Xilinx | 48-TSOP

The AMD Xilinx XCF16PVOG48C is a 16-Mbit in-system programmable configuration PROM from the Platform Flash series, supplied in a 48-pin TSOP (VOG48) package and optimized for storing Xilinx FPGA configuration bit streams at 1.8V VCCINT. According to AMD/Xilinx documentation, this serial flash device is engineered for high-density FPGA bitstream storage with JTAG-based in-system programming and supports industrial temperature operation from -40C to +85C. As part of the XCFxxP family, it pairs directly with 1.8V-core Spartan-3AN, Virtex-5, and other contemporary Xilinx FPGA families for master-serial or slave-serial boot. An FPGA configuration PROM is a non-volatile memory that holds the FPGA's bitstream image so the device can self-config at power-up without an external microcontroller. The Platform Flash family sits in the hierarchy: PROM -> non-volatile memory -> configuration storage -> FPGA boot subsystem. Modern AMD/Xilinx FPGAs often embed multi-Mbit configuration storage directly on silicon, but external Platform Flash PROMs remain widely used for multi-boot images, remote field updates, and security applications where bitstream confidentiality is enforced outside the FPGA die. Key features include 16-Mbit density (twice the capacity of the XCF08P), 48-TSOP surface-mount package (0.724 inch / 18.40 mm body width), 1.65V to 2V VCCINT supply (1.8V nominal), industrial -40C to +85C operating range, JTAG IEEE 1149.1 boundary-scan and in-system programmability, and a serial configuration interface compatible with the Xilinx FPGA serial configuration bus (CCLK, DIN, DOUT, INIT, DONE). These traits allow the XCF16PVOG48C to replace the XCF08PVOG48C directly while doubling bitstream capacity for larger FPGA families or compressed bitstream storage. The device uses a serial NOR-style architecture with command-driven read/write/erase operations, organized as 16-Mbit of main memory plus a small status register for programming state. Programming and erase are managed by an internal state machine triggered over JTAG; verification uses the standard Xilinx iMPACT/iCE tools. The architecture deliberately keeps the serial interface simple so the FPGA's existing configuration controller can stream the bitstream without glue logic. Typical applications include Spartan-3AN FPGA configuration, Virtex-5 LX/SX/TX configuration, multi-boot FPGA designs, industrial control systems requiring remote in-field firmware updates, secure bitstream storage for defense and aerospace designs, and prototyping platforms where the configuration source must be field-reprogrammable without removing the FPGA from the board. When designing with this device, ensure the JTAG chain includes the PROM between TDI and TDO and that the FPGA's mode pins (M0/M1/M2) select the correct serial configuration mode. The 1.8V VCCINT must be supplied before the FPGA begins configuration; sequence accordingly to avoid partial bitstream corruption. This page synthesizes distributor pricing, drop-in Platform Flash alternatives, and design notes on JTAG chain ordering not found in a single manufacturer document.

USD $45.10 在庫あり

XCF32PVOG48C

XCF32PVOG48C - 32Mb FPGA Config PROM 1.8V 48-TSOP | AMD

The AMD XCF32PVOG48C is a 32-Megabit in-system programmable configuration PROM for Xilinx FPGAs, supplied in a 48-pin TSOP package and operating from a 1.65 V to 2.0 V VCC supply. It is part of the Platform Flash PROM family and stores large FPGA configuration bitstreams that are loaded into Xilinx/AMD FPGAs at power-up. The XCF32PVOG48C variant specifically uses the 1.8 V Platform Flash XL family and is offered in a commercial operating temperature grade. A Platform Flash configuration PROM is a non-volatile NOR Flash memory device whose primary role is to hold the FPGA bitstream and present it to the target FPGA over a serial or parallel configuration interface. In the broader memory hierarchy it sits under EEPROM and Flash PROM, and above raw NOR Flash, providing a pre-validated, FPGA-aware configuration storage medium. It relieves the system designer of placing a separate boot Flash on the board and is typically the first device in the FPGA configuration chain. Key electrical features include a 32 Mbit (4 Mbyte) organized as 1-bit-wide serial/parallel PROM, a 1.65 V to 2.0 V operating voltage range with 3.3 V tolerant I/O pins, low-power advanced CMOS Flash technology, an in-system programmable JTAG/IEEE 1149.1 interface, and cascade support for storing larger bitstreams. The 48-pin TSOP provides a compact, surface-mount footprint compatible with standard PCB assembly lines. Architecturally, the device uses a NOR Flash core tied to a serial/parallel configuration controller, with dedicated CCLK, DIN/DOUT, and CF pins mapping directly to the FPGA configuration port. The 1.8 V internal core reduces power consumption versus 3.3 V PROMs, which is meaningful when the PROM is continuously powered alongside the FPGA. Typical applications include Xilinx Virtex and Spartan FPGA configuration boot storage, industrial control boards, communications infrastructure, and test/measurement platforms that require reliable field-upgradable bitstream storage. For military and aerospace designs, AMD also offers the XQF32PVOG48M variant in the same family. When designing with this part, ensure that the FPGA configuration mode (serial vs. parallel) and density match the bitstream size, and verify that the JTAG chain supports ISP programming of the PROM.

USD $19.85 在庫あり

XCKU035-1FBVA676C

XCKU035-1FBVA676C Kintex UltraScale FPGA 444K Cells | AMD

The AMD Xilinx XCKU035-1FBVA676C is a Kintex UltraScale Field Programmable Gate Array built on TSMC's 20nm process, integrating 444,343 logic cells and 19,456,000 system gates in a 676-ball FCBGA package (27 mm × 27 mm) with 312 user I/Os. It runs a -1 speed grade targeting up to 630 MHz fabric performance, with 12.5 Gb/s capable transceivers (GTH) on select Kintex UltraScale SKUs and 240 DSP48E2 slices optimized for high-throughput fixed- and floating-point arithmetic. The commercial temperature grade (suffix C) supports 0 °C to +85 °C operation with a 0.95 V core voltage. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement custom digital circuits after PCB fabrication by configuring an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, and high-speed serial transceivers. Within the broader semiconductor hierarchy, an FPGA sits between general-purpose CPUs/GPUs (fixed instruction set, software-defined) and ASICs (fixed hardware). AMD's Kintex UltraScale family occupies the mid-range position in the UltraScale portfolio, sitting below Virtex UltraScale (highest logic density and bandwidth) and above Artix UltraScale (lowest cost and power). All Xilinx boards shift the value curve toward best-in-class price/performance/watt at 20nm. Key features of the XCKU035-1FBVA676C include up to 1,250 Mbps of DDR4 external memory interface support, integrated PCIe Gen3 hard cores, 4.7 Mb of distributed RAM, 240 DSP slices, and 16 GT transceivers on -1 speed grade parts in the larger Kintex UltraScale family. The device provides 312 high-performance SelectIO pins supporting multiple I/O standards including LVDS, HSTL, SSTL, and differential memory interfaces. The device also exposes 3 MMCM and 8 PLL mixed-mode clock managers for high-frequency clock synthesis and skew management. Architecturally, the Kintex UltraScale device uses UltraScale architecture enhancements over 7-series FPGAs - including new routing interconnect, more efficient clock networks, and improved block RAM and DSP resources. The 20nm planar CMOS process allows higher integration while keeping leakage power low, and the GT(GTH) transceivers support 12.5 Gb/s line rates for backplane and chip-to-chip serial interconnect. The XCKU035-1FBVA676C serves wireless baseband processing, software defined radio, high-definition video processing pipelines, high-speed serial backplane bridging, and PCIe accelerator card designs in the 100K–500K logic-cell density class. When laying out a board with this BGA, allocate 12 power rails (VCCINT, VCCAUX, VCCO, MGTAVCC, MGTAVTT, VBATT, MGTVCCAUX, VCCADC, VCCBRAM, VCCO_HP, VCCAUX_IO, plus GT helper rails) and follow the package-specific K7-PCB decaps guidance in UG583 to control simultaneous switching noise and SSN.

USD $467.66 在庫あり

XCKU035-2FBVA676E

XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD

The AMD (formerly Xilinx) XCKU035-2FBVA676E is a Kintex UltraScale field-programmable gate array (FPGA) IC delivering 355,474 logic cells (194,560 6-input LUTs), 19.45M total on-chip memory bits, and 312 user I/Os, fabricated in a 20 nm CMOS process and housed in a 676-ball flip-chip BGA (FCBGA-676) package. It is a logic-density mid-range device in the Kintex UltraScale family and is targeted at high-throughput DSP, 100G packet processing, and ASIC-prototyping workloads. The "-2" suffix denotes the -2 speed grade (the second-fastest bin in the family), and the "E" suffix denotes the extended (industrial) temperature screening of -40 C to +100 C. A Kintex UltraScale FPGA belongs to the broader UltraScale architecture family, which is positioned between cost-optimized Artix/Spartan devices and the highest-density Virtex UltraScale devices in the AMD product hierarchy. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing large arrays of configurable logic blocks (CLBs), block RAM (BRAM), DSP slices, high-speed transceiver tiles (GTX/GTH), and clock-management tiles (CMTs/PLLs/MMCMs). The Kintex UltraScale tier targets price/performance-sensitive applications such as 100G optical line cards, software-defined radio, and high-end DSP prototyping. Key headline specifications include 1,700 Configurable Logic Blocks (CLBs) and 444,343 logic cells in some datasheet groupings (the modern nominal figure is 355,474), up to 19.45 Mbits of distributed + block RAM, 312 user I/Os in the FBVA676 package, and 16.3G transceivers (per UltraScale family documentation). The device integrates 20 CMT clock tiles and 240 DSP slices, providing substantial arithmetic throughput and flexible clocking. Architecturally, the Kintex UltraScale uses the UltraScale routing fabric with stacked 3D silicon interposer-style back-bias routing, supporting up to 16.3 Gb/s transceivers for chip-to-chip and backplane SERDES. The 20 nm node and monolithic die deliver higher performance-per-watt than prior 28 nm 7-series Kintex devices while maintaining PCIe Gen3 hard-IP blocks. Typical applications for the XCKU035-2FBVA676E include 100G Ethernet bridge/router line cards, software-defined radio baseband cards, ASIC prototyping with 100% RTL mapping, high-end video processing, and DSP front-end for radar/medical imaging. The wide logic/memory/transceiver budget makes it the typical "starting point" for ADC-DAC-coupled signal-processing cards. When designing with the XCKU035-2FBVA676E, ensure multi-rail decoupling per the AMD UltraScale PCB Design Guide (UG583) for power-rail sequencing. The industrial temperature screen (E) allows deployment in outdoor telecom and industrial-control applications beyond commercial grade. This page combines verified distributor pricing, drop-in alternative analysis across the Kintex UltraScale family, and practical design notes not consolidated on the AMD datasheet.

USD $390.00 在庫あり

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