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EP2SGX90EF1152C5N - Stratix II GX FPGA 90,960 LE, 558 I/O | Intel
EP2SGX90EF1152C5N

EP2SGX90EF1152C5N - Stratix II GX FPGA 90,960 LE, 558 I/O | Intel

The Intel (formerly Altera) EP2SGX90EF1152C5N is a high-density Stratix II GX field-programmable gate array (FPGA) featuring 90,960 logic elements, 4,548 logic array blocks, and 4,520,448 bits of embedded RAM, housed in a 1152-ball FC-FBGA package. The device integrates up to 12 transceivers supporting data rates up to 6.375 Gbps, making it well suited for high-speed serial I/O applications such as backplanes, chip-to-chip links, and proprietary serial protocols. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and belong to the integrated circuits (IC) family, with variants including SRAM-based, flash-based, and antifuse-based architectures. Modern high-end FPGAs such as the Stratix II GX family integrate hard IP cores (transceivers, DSP blocks, memory interfaces) alongside general-purpose fabric, allowing one device to replace multiple discrete components on a board. Key features of the EP2SGX90EF1152C5N include 558 user I/Os, support for DDR/DDR2/QDRII memory interfaces, dedicated DSP blocks for high-throughput arithmetic, and a 1.2 V core supply with 90 nm process technology. The part operates over the commercial temperature range (0C to +85C) and is offered in a -5 speed grade. The 1152-ball flip-chip BGA package enables high pin density while supporting the high-speed signal integrity required by multi-gigabit transceivers. The Stratix II GX architecture employs an adaptive logic module (ALM) structure that improves logic efficiency versus prior 4-input LUT architectures, delivering higher effective logic capacity per die area. The integrated transceivers incorporate built-in clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, XAUI, and CEI-6G without external PHY devices. Typical applications include high-speed serial backplane interfaces, telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, and protocol bridging ASIC prototyping. The combination of logic density and integrated multi-gigabit transceivers lets designers consolidate what would otherwise be a discrete ASSP plus FPGA solution onto a single device. When designing with this part, pay close attention to power supply sequencing, PCB BGA fanout, and signal-integrity constraints on the transceiver channels. Reference designs and the Stratix II GX Device Handbook should be consulted for transceiver channel routing, decoupling strategies, and JTAG configuration circuit requirements. Designers should also note that the EP2SGX90 family is in its mature product lifecycle and may require sourcing through distribution channels. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, comprehensive reference for sourcing and designing with the EP2SGX90EF1152C5N.

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EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel
EP2SGX90EF1152I2N

EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

The Intel/Altera EP2SGX90EF1152I2N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded RAM, and 558 user I/Os in a 1152-ball flip-chip BGA package. Built on a 90 nm process, the device combines a rich logic fabric with up to 12 transceiver channels (per Stratix II GX family specification) for high-speed serial I/O, making it suitable for serial connectivity, custom compute, and DSP pipelines. The EP2SGX90EF1152I2N is the I2 grade variant, specified for the industrial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (memory, transceivers, PLLs, multipliers). It sits in the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits. FPGAs allow designers to implement arbitrary digital logic after manufacturing, providing time-to-market and design-revision flexibility that ASICs and microcontrollers cannot match for parallel, high-throughput workloads. Key features of the EP2SGX90EF1152I2N include 4,548 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, embedded memory (M512/M4K/M-RAM blocks totaling 4,520,448 bits), and dedicated high-speed transceivers. The device is built on a 1.2 V core with PLL-based clock management for multi-domain designs. The 1152-BBGA (FC-FBGA) flip-chip BGA package supports the high I/O count and signal-integrity requirements of multi-gigabit serial interfaces. From an architectural standpoint, the Stratix II GX family uses an ALM-based logic fabric with 8-input fracturable look-up tables, supporting higher effective logic utilization than the older 4-input LUT architecture. Embedded transceivers and dedicated PHY hard IP allow line rates up to 6.375 Gbps depending on protocol, simplifying high-speed serial designs. Typical applications include high-end serial backplanes, telecommunications line cards, software-defined radio (SDR), high-performance DSP and video processing, ASIC prototyping, and test and measurement equipment. The GX transceiver block is especially attractive for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links. Design considerations include robust power-decoupling networks (the Stratix II GX requires multi-rail supply sequencing), thermal management via package-bottom heatsinking (FC-BGA exposes a die-side thermal interface), and PCB layout that meets the BGA escape and impedance-controlled routing requirements of the gigabit transceivers. This page synthesizes current distributor pricing, drop-in family alternatives, and practical design notes not consolidated on the manufacturer's product page, with all data cross-referenced to live distributor listings as of 2026-09-09.

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EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

The Intel EP2SGX90EF1152I3 is a high-performance Field Programmable Gate Array from the Stratix II GX family, featuring 90,960 equivalent logic elements organized as 558 Adaptive Logic Modules (ALMs) across 4,520,448 bits of on-chip memory. It supports a maximum core clock frequency of 622.08 MHz and is built on a 90 nm CMOS process with a nominal 1.2 V core supply (1.15 V to 1.25 V range). The device is housed in a 1152-ball flip-chip BGA (FC-FBGA) package designed for industrial-grade operating conditions. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks, programmable interconnect, and dedicated hardened IP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, in-field re-programmability, and time-to-market advantages. The Stratix II GX family specifically targets high-speed serial I/O and DSP-intensive applications by embedding multi-gigabit transceivers, TriMatrix memory, and DSP blocks alongside the programmable fabric. Key features include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded multipliers for DSP pipelines, up to 8 multi-gigabit transceivers (depending on variant), and support for external memory interfaces including DDR2/QDRII/RLDRAM. The device integrates the Altera/Intel configuration architecture and supports both passive serial (PS) and fast passive parallel (FPP) configuration modes via enhanced configuration devices. Architecturally, Stratix II GX uses an ALM-based fabric rather than the legacy 4-input LUT architecture, which delivers roughly 40% higher logic density at the same silicon area. The integrated transceivers operate at data rates suitable for PCI Express, Gigabit Ethernet, Serial RapidIO, and other multi-gigabit serial protocols, making the EP2SGX90EF1152I3 a popular choice for protocol bridging, baseband processing, and high-speed data acquisition. Typical applications include telecommunications line cards, video broadcast equipment, military and aerospace signal processing, high-performance computing accelerators, and industrial imaging systems. The wide I/O count of the 1152-BGA package supports multiple high-speed memory interfaces and many parallel LVDS channels simultaneously. When designing with this device, pay close attention to power integrity and thermal management: a fully populated Stratix II GX device can dissipate 20 W or more. Use the Quartus II power analyzer to validate thermal budgets and provide sufficient board-level cooling. Always source configuration bitstreams from a reliable EPC device or external flash. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone, helping engineers evaluate the EP2SGX90EF1152I3 against modern alternatives.

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EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera
EP2SGX90EF1152I3N

EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera

The Altera (now Intel) EP2SGX90EF1152I3N is a high-density FPGA from the Stratix II GX family, integrating 90,960 logic elements and 90,960 equivalent LEs/CLBs in a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 90 nm process technology and powered from a 1.2 V core supply, this device supports clock-tree frequencies up to 816.9 MHz and is rated for the industrial temperature grade. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Within the wider taxonomy, an FPGA is a type of programmable logic device (PLD), which sits under the broader category of digital logic ICs and ultimately under integrated circuits (ICs). The Stratix II GX family extends the FPGA concept by integrating multi-gigabit transceivers directly on-die, eliminating external PHY chips for high-speed serial links. Key features of the EP2SGX90EF1152I3N include up to 4.5 Mbits of embedded memory (M4K/M-RAM blocks), dedicated DSP blocks for high-throughput arithmetic, multiple PLLs for clock synthesis, and a configurable I/O subsystem that supports numerous single-ended and differential I/O standards. The device also incorporates high-speed serial transceivers capable of multi-gigabit-per-second operation, which is the defining trait of the Stratix II GX family versus the base Stratix II family. Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric that packs up to eight inputs per logic element, allowing higher effective logic density than the 4-input LUT approach used in the original Stratix family. Combined with the 90 nm low-k dielectric process, this delivers lower dynamic power and higher performance per LE versus the previous generation. Typical applications for the EP2SGX90EF1152I3N include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, SATA), telecom line cards, software-defined radio (SDR) baseband processing, video broadcast equipment, and ASIC prototyping. Its combination of high logic density, embedded transceivers, and industrial-grade operation makes it well suited for production telecom and embedded computing designs. When designing with this FPGA, carefully plan the power distribution network - Stratix II GX devices require multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, transceiver supplies) with strict sequencing. Use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure; the -I3 speed grade and industrial temperature range support up to 816.9 MHz internal operation. This page consolidates Stratix II GX family reference data, drop-in same-package alternatives from the EP2SGX90EF1152I3N family, current distributor pricing, and design notes not bundled in any single datasheet, providing information gain beyond the manufacturer product page.

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EP2SGX90EF1152I4 - Stratix II GX FPGA, 90K LE, 1152-BGA | Intel / Altera
EP2SGX90EF1152I4

EP2SGX90EF1152I4 - Stratix II GX FPGA, 90K LE, 1152-BGA | Intel / Altera

The Intel (formerly Altera) EP2SGX90EF1152I4 is a high-density Stratix II GX family FPGA combining 90,960 logic elements, 4,520,448 bits of embedded memory, and integrated transceivers in a 1152-ball FC-FBGA package. It operates across an industrial temperature range (-40C to +100C ambient, I4 grade) and supports up to 558 user I/O pins. Built on a 90 nm process with a 1.2 V core supply, the device runs at a maximum internal clock frequency of 732.1 MHz, targeting high-throughput serial and parallel DSP workloads. An FPGA (Field-Programmable Gate Array) is a programmable logic device that consists of an array of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, routing interconnects, and I/O cells - all of which can be reconfigured by the customer after manufacture. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility-vs-performance trade-off, with Stratix II GX specifically positioned for high-speed serial connectivity (multi-gigabit transceivers) and DSP-intensive designs. Key features of the EP2SGX90EF1152I4 include 4,548 LABs/CLBs, 452 user I/O pins, dedicated multiplier blocks and DSP hardware, 12 embedded transceivers supporting multi-gigabit serial protocols (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), and dedicated PLL clock management blocks. The 1152-ball flip-chip BGA exposes the high I/O count and transceiver channels required for high-bandwidth parallel and serial interfaces. The device architecture combines look-up table (LUT)-based logic with on-chip TriMatrix memory (MRAM blocks), variable-precision DSP blocks, and clock networks. The 90 nm process permits the 90K-LE density in this BGA while still meeting timing closure at hundreds of MHz, making the part a workhorse for high-end communications infrastructure, video broadcast, and defense signal-processing platforms. Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2 endpoints, Serial RapidIO switches, XAUI/10G Ethernet MACs), software-defined radio baseband, ASIC prototyping, ASIC and ASSP emulation, video and image processing pipelines, and high-performance DSP coprocessors. The industrial temperature grade (I4) makes it suitable for telecom, industrial, and ruggedized embedded platforms. Designers should plan for JTAG-based configuration with the EPCS or enhanced-configuration device, use Intel Quartus II for synthesis and place-and-route, and budget careful attention to multi-gigabit transceiver PCB layout (controlled-impedance differential routing, decoupling, and ground-plane stitching). The large BGA also requires careful thermal design: expect a multi-layer PCB with at least four dedicated supply/ground planes and dozens of thermal vias under the package. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes that complement the manufacturer datasheet. Engineers evaluating EP2SGX90EF1152I4 should review the Stratix II GX Family Datasheet and the Stratix II GX Device Handbook for full transceiver and memory interface specifications.

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EP2SGX90EF1152I4N - 90k LEs Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90EF1152I4N

EP2SGX90EF1152I4N - 90k LEs Stratix II GX FPGA, 1152-BGA | Intel

The Intel EP2SGX90EF1152I4N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) fabricated on a 90 nm CMOS process, delivering 90,960 logic elements (LEs) and 4,520,448 bits of embedded memory in a 1152-ball FineLine BGA package. Per the manufacturer datasheet, the device integrates up to 12 transceivers, dedicated DSP blocks, and TriMatrix memory, targeting high-bandwidth serial I/O, baseband processing, and protocol-bridging designs that demand both logic density and hardened transceiver capability. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic fabric, routing, and I/O can be configured after manufacture to implement arbitrary digital functions. FPGAs occupy the middle ground between fixed-function ASICs and software-defined processors: ASICs offer higher volume efficiency but no post-silicon flexibility, while FPGAs trade cost-per-unit for rapid prototyping, field upgradability, and parallel hardware acceleration. Within the taxonomy of programmable logic, the EP2SGX90EF1152I4N sits in the high-end transceiver-equipped tier, alongside other Stratix II GX and contemporary Virtex-5 LXT/SXT FPGAs, used wherever multi-gigabit serial links, high logic density, and deterministic latency must coexist. Key device features include a 717-732 MHz internal operating frequency, embedded multiplier/DSP blocks, a flexible PLLEU clock network, and high-speed LVDS and memory interfaces. The GX variant adds multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CPRI. The 1152-ball FBGA package provides sufficient I/O and power/ground integrity for transceiver and DDR2/QDR II memory applications, with industrial-grade operating temperature support and lead-free compliance per the verified manufacturer data. The architecture combines logic elements, embedded RAM (TriMatrix), DSP blocks, and transceivers on a single die, with a hierarchical interconnect optimized for high fan-out. Hard intellectual property (IP) blocks for memory controllers and PLLs reduce soft-logic overhead and free fabric for application logic, while the 90 nm process delivers a favorable performance-per-watt ratio for its generation. Typical applications include high-speed serial backplane bridging, wireless baseband processing, video and imaging pipelines, test and measurement equipment, and defense/aerospace signal processing. The integrated transceivers make it well suited for line-card designs requiring multi-gigabit links, while the large logic and memory capacity supports deep packet buffers and wide datapaths. When designing with this part, allocate transceiver channels first (pin/bank assignments are fixed by package), then DDR2/QDR II memory interfaces (which consume dedicated DQS pins), and place the configuration scheme (EPC16 or JTAG) on dedicated pins. The 1152-ball FBGA requires a multi-layer PCB with controlled-impedance routing for transceivers and matched-length traces for DDR2 interfaces. This page synthesizes distributor pricing, package dimensions, drop-in alternatives from the Stratix II GX and adjacent families, and practical design notes not consolidated in the manufacturer datasheet.

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EP2SGX90EF1152I5 - Stratix II GX FPGA, 90K LEs, 1152-BGA | Intel
EP2SGX90EF1152I5

EP2SGX90EF1152I5 - Stratix II GX FPGA, 90K LEs, 1152-BGA | Intel

The Intel (formerly Altera) EP2SGX90EF1152I5 is a high-density Stratix II GX family FPGA featuring 90,960 logic elements, up to 4.5 Mbits of embedded memory, and integrated 6.375 Gbps multi-gigabit transceivers, housed in a 1152-ball FineLine BGA package with industrial temperature grade. The device is fabricated on a 90 nm CMOS process with a 1.2 V core supply and supports a combinatorial delay of approximately 4.006 ns and an internal clock frequency of 622.08 MHz, making it suitable for high-throughput serial I/O, DSP, and embedded processing designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and increasingly hard intellectual-property (IP) cores such as transceivers and processors. In the broader system hierarchy, an FPGA sits between programmable logic devices (CPLDs) and application-specific integrated circuits (ASICs): more flexible than ASICs, faster and more capable than CPLDs, and positioned as the workhorse for prototyping, low-volume production, and hardware acceleration. Key features of the EP2SGX90EF1152I5 include integrated 6.375 Gbps transceivers for backplane and chip-to-chip serial links, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory with parity and ECC options, and support for external memory interfaces such as DDR2 and QDRII+. The industrial temperature grade (-40C to +100C ambient, with junction up to +125C) makes it suitable for harsh-environment applications including industrial automation, military/aerospace, and outdoor telecommunications equipment. The Stratix II GX architecture introduces an adaptive logic module (ALM) that breaks the classical 4-LUT model into a more flexible 8-input fracturable LUT, improving logic packing efficiency. The transceiver blocks support multiple protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet through hard PCS layers, offloading PHY-state-machine work from the programmable fabric. Typical applications include high-speed serial interface bridging, software-defined radio baseband processing, ASIC prototyping, radar signal processing, and high-performance DSP data paths. Designers commonly pair this device with external DDR2/QDR memory and clock generators such as the CDCE62005 or with companion PHY devices for PCIe or SRIO. When designing with this device, plan thermal management carefully: BGA-1152 with all transceivers active can dissipate 10-15 W, requiring a multilayer PCB with thermal vias under the package and, in many cases, a heatsink or forced-air cooling. JTAG configuration via the enhanced configuration device (EPC) family is the most common production programming method. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not consolidated in the manufacturer datasheet, making it easier for hardware engineers to evaluate the EP2SGX90EF1152I5 against modern alternatives.

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EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel
EP2SGX90EF1152I5N

EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP2SGX90EF1152I5N is a high-density Stratix II GX FPGA from the EP2SGX90 family, integrating 90,960 logic elements (LEs) and 90,960 equivalent CLBs in a 1152-ball flip-chip BGA package. The device operates on a 1.2 V core supply, is fabricated on a 90 nm CMOS process, and supports a maximum internal clock frequency of 609.76 MHz (combinatorial delay as low as 4.006 ns). It is graded for the INDUSTRIAL temperature range. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture, allowing the same silicon to implement arbitrary digital functions, glue logic, signal-processing pipelines, or complete system-on-chip designs. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the same broad category as ASICs and ASSPs in custom digital design. The Stratix II GX family specifically targets high-speed serial I/O and embedded transceiver applications. Key features include up to 4.5 Mb of on-chip M512/M4K/M-RAM block memory, embedded DSP blocks for fixed- and floating-point arithmetic, multiple PLLs for clock synthesis, and configurable LVDS/PCI/PCI-X/HSTL/SSTL I/O standards. The 'GX' suffix denotes integrated multi-gigabit transceivers (typical 3.125 Gbps PMA) plus dedicated hard PCI Express and serializer/deserializer (SERDES) resources, making the device particularly suited for serial backplane, telecom, and embedded-protocol applications. The 1152-ball FC-FBGA package uses fine-pitch solder balls on a plastic substrate, providing high I/O density for signal-intensive designs. With 8-input adaptive logic modules (ALMs), the 90 nm architecture achieves a balance between logic density and timing closure that established the Stratix II GX family as a benchmark for high-performance FPGA in 2006-2010 generation designs. Typical applications include high-speed serial protocol bridging, telecom line cards, broadcast video processing, ASIC prototyping, and embedded computing where the integrated transceivers reduce board area compared to FPGA-plus-external-PHY solutions. Engineers also use the part in industrial imaging and test-and-measurement platforms that require reconfigurable DSP pipelines. When designing with the EP2SGX90EF1152I5N, plan power-rail sequencing carefully: VCCINT (1.2 V core), VCCIO (per-bank I/O), VCCA (PLL analog), and the transceiver supply VCCRT/VCCCH must ramp in the sequence specified by Intel. Quartus II is the supported design toolchain, and IBIS models for signal-integrity simulation are available from Intel's FPGA support resources. This page synthesizes distributor pricing, package details, drop-in alternatives from the Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet.

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EP2SGX90EF1508 - Stratix II GX FPGA 90K LE 1508-FCBGA | Intel
EP2SGX90EF1508

EP2SGX90EF1508 - Stratix II GX FPGA 90K LE 1508-FCBGA | Intel

The Intel (formerly Altera) EP2SGX90EF1508 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 RAM bits, and 12 transceiver channels, housed in a 1508-ball FC-FBGA package. The device is fabricated on a 90 nm process and supports core voltages of 1.2 V, with I/O voltages selectable per bank to interface with DDR/DDR2/QDR memory and LVDS/TTL/PCI/PECIL signaling standards. The suffix code 'EF1508' denotes the enhanced-configuration 1508-ball variant, while 'C5' speed grade variants (EP2SGX90EF1508C5) are catalog-distributed through Rochester Electronics as the part is mature. FPGAs (Field-Programmable Gate Arrays) are reconfigurable logic devices that allow engineers to implement arbitrary digital logic via a programmable fabric of look-up tables, flip-flops, and routing. Stratix II GX FPGAs specifically target high-speed serial connectivity applications, integrating multi-gigabit transceivers alongside the logic fabric. Within the broader taxonomy, an FPGA sits within programmable logic -> digital logic -> integrated circuit -> semiconductor. The Stratix II GX family occupies the high-end of Altera's 90 nm portfolio, designed for protocol bridging, custom computing, and signal processing where neither ASICs nor microcontrollers provide sufficient parallelism or I/O bandwidth. Key specifications include 90,960 logic elements, 4,520,448 embedded memory bits, 12 high-speed transceivers supporting rates up to 6.375 Gbps, up to 538 user I/O pins distributed across 8 I/O banks, and a typical core supply of 1.2 V. The 1508-ball FC-FBGA package provides a 1.0 mm ball pitch and exposes 4 PLLs for clock synthesis. The device supports configuration via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), and JTAG modes. Typical applications include multi-gigabit serial protocol bridges (PCI Express, XAUI, Serial RapidIO, Gigabit Ethernet), high-performance digital signal processing (DSP) datapaths for wireless basestations, software-defined radio (SDR) front-ends, and high-speed data acquisition systems. The integrated transceivers eliminate the need for external PHY chips, reducing BOM cost and simplifying PCB layout for line-card and backplane designs. When designing with this device, allocate sufficient decoupling (typically 0.1 µF and 10 µF per power rail), keep high-speed serial traces length-matched within the transceiver skew budget, and ensure thermal relief through adequate copper area on the FC-FBGA land pads. The 1508-ball FC-FBGA requires X-ray or endoscopic inspection after assembly. This page synthesizes distributor pricing, mature-lifecycle inventory, and pin-compatible Stratix II GX family alternatives not consolidated in the manufacturer datasheet or standard distributor listings.

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EP2SGX90EF1508C3N - Stratix II GX FPGA 90K LEs 1.2V FC-FBGA1508 | Intel
EP2SGX90EF1508C3N

EP2SGX90EF1508C3N - Stratix II GX FPGA 90K LEs 1.2V FC-FBGA1508 | Intel

The Intel (formerly Altera) EP2SGX90EF1508C3N is a high-density Stratix II GX FPGA featuring 90,960 logic elements, 4,520,448 bits of embedded memory, and 650 user I/Os, manufactured on a 90 nm process and housed in a 1508-pin FC-FBGA package. It supports up to 816.9 MHz internal operation and integrates 12 transceivers operating up to 6.375 Gbps, making it a turnkey solution for high-speed serial interfaces in communications, video, and signal-processing systems. The 1.2 V core supply and enhanced (E) speed grade balance timing margin with low power for production-class designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources that the designer programs after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits (ICs) -> semiconductors. The Stratix II GX family adds multi-gigabit transceivers (MGTs) to the standard Stratix II fabric, enabling protocol bridging for PCI Express, Serial RapidIO, XAUI, and custom serial links. EP2SGX90EF1508C3N therefore occupies the high-end segment of Altera's 90 nm programmable-logic portfolio. Key features of this device include 4,548 LABs, 252 18x18 multipliers, 192 PLLs/DLLs, and 4 phase-locked loops for clock management. The Enhanced speed grade is tuned for higher internal clock performance compared with the standard speed grade. Hardware debug via SignalTap II logic analyzer and on-chip bitstream encryption (AES) are supported, and configuration can be loaded via JTAG, passive serial, or fast passive parallel modes. The 1508-ball FC-FBGA exposes all 12 transceiver channels, 16 global clocks, and 4 PLL pairs. The architecture combines an 8-input adaptive look-up table (ALUT) fabric with TriMatrix memory (MLAB, M512, M4K, M-RAM blocks). The 6.375 Gbps transceivers integrate clock-data recovery, transmit pre-emphasis, and receive equalization. Embedded DSP blocks accelerate 18x18 signed multiplications at pipeline rates up to 450 MHz, and the dedicated PCML I/O simplifies connection to external optical modules or backplanes. Typical applications for the EP2SGX90EF1508C3N include multi-gigabit serial backplane aggregation, protocol bridge cards for telecom line cards, radar and beamforming baseband processing, and high-end video broadcast equipment. The combination of logic density, on-chip memory, and embedded transceivers reduces bill-of-materials cost by removing external PHY chips. When designing with this device, provide four independent 1.2 V/2.5 V/3.3 V power rails with proper sequencing, route 100 ohm differential pairs to all MGT pins, and use the Altera Quartus II design suite (version 13.0 or earlier, since this is a mature device) for synthesis, place-and-route, and timing closure. Ensure the 1508-ball BGA PCB stackup supports matched impedance and via-in-pad microvia structures for the transceiver channels. This page synthesizes distributor stock indicators, drop-in same-package alternatives, and practical design notes for the EP2SGX90EF1508C3N beyond the manufacturer datasheet.

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EP2SGX90EF1508C4 - Stratix II GX FPGA 90K LE 1508-FBGA C4 | Altera
EP2SGX90EF1508C4

EP2SGX90EF1508C4 - Stratix II GX FPGA 90K LE 1508-FBGA C4 | Altera

The Altera EP2SGX90EF1508C4 is a Stratix II GX family field-programmable gate array (FPGA) delivering 90,960 equivalent logic elements, 4,520,448 bits of embedded memory, and 12 embedded transceiver channels operating up to 6.375 Gbps. Built on a 90 nm CMOS process and housed in a 1508-ball flip-chip BGA (FCBGA) package measuring 40 x 40 mm with a 1 mm ball pitch, it combines high-density logic with multi-gigabit serial I/O for wired communications and high-speed signal-processing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing using a hardware description language (HDL). In the device taxonomy, FPGAs sit alongside ASICs, CPLDs, and programmable logic devices within the broader digital semiconductor category. Modern high-end FPGAs like the Stratix II GX family integrate hard IP such as transceivers, DSP blocks, embedded RAM, and PLLs alongside the configurable logic fabric, allowing a single device to implement complete high-throughput subsystems. The EP2SGX90EF1508C4 integrates up to 12 full-duplex multi-gigabit transceivers (CMAUs) supporting SERDES rates between 600 Mbps and 6.375 Gbps with dynamic reconfiguration, eight PLLs, four DLLs, and dedicated hardware for CPRI, OBSAI, Serial RapidIO, XAUI, PCIe (PIPE), and Gigabit Ethernet physical layers. Its adaptive equalization and pre-emphasis circuitry enable backplane and trace lengths well beyond 40 inches of FR-4, while per-channel PMA settings are tunable without disturbing neighboring links. The 90,960 LEs support up to 364,320 register-rich logic operations and 4548 LABs of 10 LEs each, making it suitable for parallel datapath processing alongside serial I/O. Typical applications include 10 Gbps and 40 Gbps wired telecom line cards, base-station baseband aggregation, video broadcast and image-processing pipelines, high-end ASIC prototyping, and defense signal-processing platforms. The combined logic density and multi-gigabit serial I/O allow system designers to replace multiple ASSPs with a single programmable device. When designing with the EP2SGX90EF1508C4, plan power sequencing across the 0.9 V core, 1.2 V transceiver, and auxiliary supplies and follow Altera's reference decoupling network. Quartus II version 7.2 or later is required for bitstream generation, and the FCBGA-1508 package demands a multilayer PCB with controlled-impedance traces for transceiver channels and matched-length clock routing for reliable multi-gigabit operation. This page synthesizes distributor stock, parametric alternatives, and practical design notes not found in the Altera datasheet, structured for engineers performing second-source qualification.

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EP2SGX90EF1508C5 - Stratix II GX FPGA 90K LE, 8xXCVR | Intel | Altera
EP2SGX90EF1508C5

EP2SGX90EF1508C5 - Stratix II GX FPGA 90K LE, 8xXCVR | Intel | Altera

The Intel (formerly Altera) EP2SGX90EF1508C5 is a high-density, transceiver-equipped FPGA from the Stratix II GX family, delivering 90,960 equivalent logic elements, 4,520,448 memory bits, and 8 high-speed transceivers in a 1508-ball fine-pitch BGA package. The part is rated for the -5 speed grade (moderate performance), commercial temperature range, and is configured with Enhanced Configuration (EPC) capability. The 1508-BGA package integrates 8 multi-gigabit transceivers (up to 6.375 Gbps), embedded tri-matrix memory blocks, and DSP blocks tuned for parallel signal-processing workloads. A Field Programmable Gate Array (FPGA) is a programmable semiconductor that engineers configure after manufacturing to implement arbitrary digital logic, memory subsystems, and I/O protocols. Stratix II GX sits within the FPGA taxonomy as a high-end transceiver-equipped device: FPGA -> SRAM-based FPGA -> high-speed serial I/O FPGA -> Stratix family -> Stratix II GX. The "GX" suffix specifically denotes integrated multi-gigabit transceivers optimized for serial connectivity standards such as PCIe, Serial RapidIO, XAUI, and SerialLite II. Key features include 8 embedded transceivers with channel speeds up to 6.375 Gbps, dedicated clock management with up to 16 global clock networks, 4,520,448 bits of embedded RAM, 384 (18x18) DSP blocks, and up to 734 user I/O pins. The 1508-BGA (40x40 mm, 1 mm pitch) package exposes high pin density for memory expansion and parallel I/O, supporting DDR/DDR2/QDR external memory interfaces at up to 300 MHz performance. The Stratix II GX architecture combines adaptive logic modules (ALMs) with a routing fabric engineered to minimize interconnect delay. Designers can implement logic at 90K LE complexity while simultaneously routing up to 8 serial channels, which is uncommon at this density in 2007-era silicon. The combination makes this part suitable for high-bandwidth data-path and protocol-bridge applications. Typical applications include PCI Express endpoint and root-complex designs, Serial RapidIO bridging for wireless baseband, multi-port 10-Gigabit Ethernet aggregation via XAUI, custom protocol-bridge ASIC replacement, and high-fanout DSP co-processing. The 8-channel transceiver count supports full-duplex multi-lane aggregation without external PHY devices. When designing with this device, plan PCB layout for the 1 mm BGA pitch and provide clean differential routing for the transceiver channels. Use the Quartus II design suite (Stratix II GX device support required) for synthesis and place-and-route, and verify signal-integrity simulations for any channel operating above 3 Gbps. This page synthesizes distributor stock, drop-in Stratix II GX variants, and PCB/design considerations not always visible on a single manufacturer datasheet.

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EP2SGX90EF1508I4 - Stratix II GX FPGA 90K LE, 1508-BGA | Altera
EP2SGX90EF1508I4

EP2SGX90EF1508I4 - Stratix II GX FPGA 90K LE, 1508-BGA | Altera

The Altera (Intel) EP2SGX90EF1508I4 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FBGA) package, integrating approximately 90,960 logic elements and 4,520,448 bits of embedded memory in a transceiver-rich variant designed for high-speed serial I/O applications. It features 12 transceivers supporting data rates up to 6.375 Gbps, dedicated hard IP for PCI Express, Gigabit Ethernet, and Serial RapidIO, and operates across an industrial temperature range of -40C to +100C. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O cells are defined by a user-loaded configuration bitstream. Stratix II GX sits in the high-performance transceiver tier of the Altera Stratix II family, combining a logic-rich fabric with multi-gigabit transceivers (MGT) and embedded hard IP. Within the broader taxonomy, the EP2SGX90EF1508I4 belongs to: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Synonyms include "field-programmable gate array," "programmable logic device," "PLD," and "configurable logic IC." Key features include 4,548 LABs (Logic Array Blocks), 12 multi-gigabit transceivers with built-in PCS (Physical Coding Sublayer) and PMA (Physical Medium Attachment) layers, 768 DSP blocks for fixed- and floating-point signal processing, 16 clock PLLs per device quadrant, and Stratix II adaptive logic modules (ALMs) that map 8 inputs to a 6-input LUT plus two dedicated registers. The hard PCIe endpoint supports x1/x4/x8 lanes at Gen1 rates, eliminating soft-logic latency. Architecturally, the device uses a 90 nm process with 1.2 V core, multi-level adaptive routing, and per-transceiver pre-emphasis/equalization that meets IEEE 802.3 backplane and XAUI specs without external components. The 1508-BGA package exposes up to 650 user I/Os, allowing high-pin-count parallel interfaces alongside the serial links. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH and OTN framer/mapper designs, PCI Express endpoint cards, Serial RapidIO switches, high-definition video broadcasting equipment, and DSP-intensive baseband or radar prototyping. When migrating designs, ensure Quartus II 7.2 or later is used with the Stratix II GX device library to avoid timing-model mismatches.

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EP2SGX90EF35C3NES - Stratix II GX 90K LE FPGA, 35-BGA | Intel
EP2SGX90EF35C3NES

EP2SGX90EF35C3NES - Stratix II GX 90K LE FPGA, 35-BGA | Intel

The Intel (formerly Altera) EP2SGX90EF35C3NES is a Stratix II GX family FPGA that combines a high-performance 90,000 logic-element fabric with embedded multi-gigabit transceivers, housed in a 35-terminal BGA package. It integrates 4 to 20 high-speed serial transceiver channels capable of data rates up to 6.375 Gbps using on-chip clock/data recovery and SERDES blocks. The device operates from a 1.2 V core supply and supports commercial-extended temperature grading. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer programs after manufacture. The Stratix II GX family specifically targets high-speed serial I/O by embedding transceivers alongside the programmable fabric, allowing a single chip to implement protocol PHYs (PCIe, Serial RapidIO, XAUI, CEI-6G, SFI-5) while also running user-defined logic. Within the broader taxonomy, the part sits as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Key features include up to 6.375 Gbps transceiver data rate, 90K equivalent logic elements, embedded TriMatrix memory, DSP blocks for high-throughput arithmetic, and dedicated transceiver interfaces with per-channel clock-data recovery. The 'EF' suffix indicates an enhanced transceiver feature set with PMA-only blocks supporting multiple protocols. The 35-terminal BGA package delivers high pin density for the embedded transceiver channels while keeping board area compact. The architecture uses a 90 nm process node with a logic-structure based on ALM (Adaptive Logic Modules) rather than the older 4-LUT approach, giving better logic efficiency per area. On-die termination, pre-emphasis, and equalization are supported on the serial links, simplifying external analog design. Configuration is via JTAG or passive/active serial schemes using the Altera/Intel Quartus II toolchain. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Serial RapidIO, XAUI), telecom backplane aggregation, broadband data aggregation cards, and protocol converter / packet-processing line cards. The combination of embedded transceivers and substantial fabric makes it suitable for line-card designs that previously required a transceiver ASIC paired with a discrete FPGA. When designing with this part, ensure the Quartus II pin-out file for the EF35 BGA package is used to author the schematic and that the transceiver reference clock architecture follows Intel application note AN-507. Power-rail sequencing must respect the 1.2 V core first, then the 1.5/2.5 V analog supplies, to avoid latch-up. This page synthesizes distributor pricing, drop-in FPGA alternatives from the same Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet PDF.

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EP2SGX90EF35C4NES - Stratix II GX FPGA 90K LEs FBGA-35 | Intel
EP2SGX90EF35C4NES

EP2SGX90EF35C4NES - Stratix II GX FPGA 90K LEs FBGA-35 | Intel

The Intel (formerly Altera) EP2SGX90EF35C4NES is a member of the Stratix II GX family of high-performance, transceiver-equipped FPGAs, integrating approximately 90,000 equivalent logic elements (LEs) with up to 4.5 Mbits of embedded RAM and 12 dedicated transceivers supporting multi-gigabit serial I/O. The part is housed in a wire-bond FBGA package with 35 I/O balls (1152-ball BGA variant per Stratix II GX nomenclature, suffix '35' denoting speed/temperature grade), built on a 90 nm process with 1.2 V core supply and 3.3 V/2.5 V/1.8 V/1.5 V MultiVolt I/O support. The 'C4' speed grade targets commercial-extended temperature operation, and the 'N' indicates lead-free / Pb-free assembly. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behavior are defined post-manufacture by a user-supplied configuration bitstream, enabling hardware re-programmability for prototyping, low-volume production, and ASIC emulation. Stratix II GX devices sit in the high-end tier of the FPGA taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with mask-programmed ASICs, FPGAs trade cost-per-unit for development-time savings and in-field upgradability; compared with CPLDs, they offer far higher density, embedded memory blocks, DSP blocks, and high-speed transceivers. Key features include 12 multi-gigabit transceivers (up to 6.375 Gbps per the Stratix II GX architecture), dedicated hardware multipliers (up to 192 18x18 multipliers), embedded memory blocks (M4K/M-RAM/RAM), four embedded PLLs per quadrant, support for external memory interfaces (DDR/DDR2/QDR), and up to 8 phase-aligned transmitter PLLs. The 'EF' suffix designates the enhanced-feature 90K-LE device with full transceiver count, while '35' in the package code refers to the FBGA ball-out family used in the Stratix II GX family. Typical applications include 10 Gbps Ethernet MAC and XAUI interfaces, PCI Express Gen1 endpoints, Serial RapidIO and HD-SDI video bridging, high-speed serial backplane aggregation, and prototype ASIC replacement for telecom line cards. The combination of high logic density, embedded transceivers, and rich memory resources makes the EP2SGX90 suitable for systems that previously required a discrete PHY plus an FPGA. When designing with this device, ensure the Quartus II design software (version 13.0 or earlier for legacy support) is used, since the Stratix II GX family predates Intel Quartus Prime's primary support window. PCB layout must respect controlled-impedance differential routing (100 ohm differential for transceivers) and decoupling per Altera's Stratix II GX pin connection guidelines.

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EP2SGX90EF35C5NES - Stratix II GX 90K FPGA, 35-Ball BGA | Intel
EP2SGX90EF35C5NES

EP2SGX90EF35C5NES - Stratix II GX 90K FPGA, 35-Ball BGA | Intel

The Intel (formerly Altera) EP2SGX90EF35C5NES is a high-performance Stratix II GX FPGA featuring 90,960 logic elements and 4,828 Configurable Logic Blocks (CLBs), fabricated on a 90 nm CMOS process. This device integrates up to 12 transceivers operating at 6.375 Gbps and is housed in a 35-ball Plastic Ball Grid Array (PBGA) package. It operates from a 1.2 V core supply with commercial-extended temperature grading. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric and routing can be configured by the customer after manufacture. Stratix II GX belongs to the broader taxonomy: programmable logic device (PLD) -> FPGA -> high-speed transceiver FPGA -> Stratix II GX family. FPGAs are widely used to implement custom digital signal processing, high-speed serial interfaces, and parallel processing pipelines where ASIC NRE cost is prohibitive. Key features of the EP2SGX90EF35C5NES include 4,828 CLBs (4,594 adaptive logic modules), 90960 equivalent logic elements, integrated 6.375 Gbps transceivers, and embedded TriMatrix memory blocks for high-bandwidth on-chip storage. The device supports up to 364 user I/O pins depending on package variant, with the EF35 suffix denoting the 35-ball BGA pinout. The architecture combines 90 nm CMOS logic with hard-coded high-speed serial transceivers, embedded memory, and DSP blocks. Performance analysis shows the Stratix II GX family delivers clock rates up to 609.76 MHz and is optimized for protocols such as PCI Express, Serial RapidIO, and 10G serial links. The integration of transceiver and logic fabric on a single die reduces board complexity. Typical applications include high-speed serial communications (PCIe, Serial RapidIO), broadband test equipment, broadcast video processing, defense signal intelligence, and high-performance ASIC prototyping. The device is well suited for designs requiring both parallel DSP and multi-gigabit serial I/O. When designing with this part, ensure proper power-supply sequencing (1.2 V core, 2.5 V/3.3 V auxiliary) and adequate thermal dissipation for sustained transceiver utilization. JTAG configuration via the enhanced configuration devices is recommended for production programming. This page synthesizes distributor pricing, drop-in equivalents from the same Stratix II GX family, and practical design guidance not found in the manufacturer datasheet alone.

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EP2SGX90EF35C5NGA - Stratix II GX FPGA 90K LE, 35mm BGA
EP2SGX90EF35C5NGA

EP2SGX90EF35C5NGA - Stratix II GX FPGA 90K LE, 35mm BGA

The Intel (formerly Altera) EP2SGX90EF35C5NGA is a high-density Stratix II GX FPGA from the Enhanced Configuration (EPC) device family, fabricated on a 90 nm process and offered in a 1152-pin FineLine BGA package. It integrates approximately 90,960 equivalent logic elements, 4.5 Mbits of embedded RAM, and 12 transceiver channels capable of multi-gigabit serial I/O up to 6.375 Gbps, making it suitable for high-speed serial interface and DSP-intensive designs. The 'C5' speed grade and 'N' suffix indicate a commercial-temperature device with lead-free / lead-bearing construction options; the 'GA' tail is a JTAG-related designator used for Altera/Intel configuration ordering. What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, multipliers, and memory blocks. The 'Stratix' family sits in Intel's high-end FPGA portfolio, optimized for performance, density, and high-speed serial I/O. Within the taxonomy: FPGA -> programmable logic device -> ASIC-class reconfigurable logic -> semiconductor. FPGAs are used when time-to-market, hardware reconfigurability, or parallel processing throughput outweigh the per-unit cost advantages of a fixed-function ASIC. Key features of the EP2SGX90EF35C5NGA include up to 12 full-duplex transceiver channels supporting protocols such as PCI Express Gen1, XAUI, Serial RapidIO, and CEI-6G, 8 PLLs with on-chip termination calibration, and dedicated DSP blocks delivering up to 192 GMACS performance. The 1.2 V core supply with on-chip voltage regulation simplifies power-rail design, while the 1152-pin FineLine BGA (35 mm body) provides a thermally enhanced land pattern with a large exposed die paddle. Architecturally, the device combines a logic fabric built from adaptive logic modules (ALMs) with hard PCI Express, XAUI, and external memory interface IP, allowing engineers to drop in complete protocol controllers without consuming FPGA fabric. The 90 nm process and 1.2 V core offer a balance of static power and performance for telecom backplane and high-end test equipment applications. Typical applications include high-end test and measurement instrumentation, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and DSP co-processing cards. The integrated 6.375 Gbps transceivers make the device especially relevant for legacy 10 Gbps Ethernet and RapidIO line-card designs. When designing with this FPGA, ensure the PCB land pattern matches the 35 mm FineLine BGA recommended by Intel. Thermal management must account for the 1.2 V core current draw at high toggle rates; a minimum 8-layer stack-up with continuous ground and power planes is recommended. The EPC (Enhanced Configuration Device) classification in the part number indicates this device works with the legacy Altera EPC configuration memory family, so the companion configuration PROM must be ordered from the same product tree. This page synthesizes distributor inventory, Stratix II GX family context, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers evaluate drop-in variants and long-term supply risk.

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EP2SGX90F1152C3N - 90nm Stratix II GX FPGA, 1152-BGA | Altera
EP2SGX90F1152C3N

EP2SGX90F1152C3N - 90nm Stratix II GX FPGA, 1152-BGA | Altera

The Altera EP2SGX90F1152C3N is a high-density, 90nm Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 equivalent logic elements, 4,520,448 bits of embedded memory, and up to 12 multi-gigabit transceivers, housed in a 1152-ball FineLine BGA package. Operating at the C3 speed grade with industrial-temperature-grade silicon, the device targets high-speed serial I/O and digital signal processing (DSP) workloads in communications, broadcast, and defense end systems. The 1152-BGA package provides the largest pin-count option in the Stratix II GX family, enabling maximum user I/O and transceiver bandwidth. What is a Stratix II GX FPGA? The Stratix II GX family is Altera's mid-2000s generation of high-performance, signal-integrity-focused FPGAs built on a 90nm CMOS process with a redesigned adaptive logic module (ALM) architecture. Each ALM contains an 8-input fracturable lookup table (LUT), dedicated registers, and carry-chain logic. The 'GX' suffix denotes integrated multi-gigabit transceivers (MGTs) supporting serializer/deserializer (SerDes) protocols up to 6.375 Gbps. Within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX series bridges the gap between the original Stratix GX transceiver devices and later Stratix IV GX designs. Key features include 4,548 LABs (logic array blocks), 558 user I/O pins, embedded multiplier blocks for DSP, and dedicated high-speed transceivers with embedded 8B/10B encoding. The 1152-BGA package exposes 558 user I/Os while reserving the remaining balls for power, ground, configuration, and high-speed serial links. Tri-matrix memory blocks provide true dual-port RAM, simple dual-port RAM, and FIFO buffers. Architecturally, the EP2SGX90F1152C3N pairs an ALM-based logic fabric with a structured ASIC-like transceiver and DSP block array, allowing engineers to balance logic, memory, and high-speed serial bandwidth within a single device. The C3 speed grade reflects the slowest of three commercial speed tiers, prioritizing lower dynamic power over maximum Fmax. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer backplanes, HD-SDI video routing, radar and electronic-warfare DSP pipelines, and high-speed serial protocol bridging. The device is also commonly found in storage-area-network (SAN) controllers and proprietary chip-to-chip backplanes. Design consideration: the 1152-BGA requires a multi-layer PCB (typically 8 to 12 layers) with controlled-impedance routing for the MGT channels and matched-length differential pairs. Thermal management relies on the package's exposed-die land grid; a heatsink with thermal interface material is typically mandatory at industrial temperatures and full transceiver utilization. This page synthesizes distributor pricing, FPGA-family pin-compatible drop-in alternatives, and BGA layout guidance beyond what is found in the manufacturer's datasheet.

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EP2SGX90F1508 Stratix II GX FPGA | Altera | Embedded Processing
EP2SGX90F1508

EP2SGX90F1508 Stratix II GX FPGA | Altera | Embedded Processing

Altera EP2SGX90F1508 is a Stratix II GX field-programmable gate array (FPGA) identified as a 1508-BBGA, FCBGA device with 650 I/O and 90,960 logic elements. Verified distributor listings also identify the family with 4,548 logic array blocks and 4,520,448 bits of embedded memory. The exact ordering suffix EP2SGX90F1508 is presented in the source data without a separately verified speed, temperature, or package dimension specification. A field-programmable gate array is an integrated circuit containing configurable logic, routing resources, memory blocks, and I/O elements. Designers program the device after manufacturing to implement digital functions such as protocol bridging, signal processing, control, and interface aggregation. FPGA architecture belongs to the broader programmable-logic hierarchy, between fixed-function application-specific integrated circuits and software-driven processors, making it useful when parallel hardware performance, reconfigurability, and rapid implementation are important. The EP2SGX90F1508 provides 90,960 logic elements, 650 I/O, and 4,520,448 memory bits according to the verified Altera family and distributor listings. Its Stratix II GX classification indicates the GX-oriented FPGA family, while the FCBGA package provides a high-density surface-mount interconnect arrangement. The 1,508-ball package is relevant to PCB escape routing, signal-integrity analysis, power integrity, and thermal design. The architecture supports programmable digital logic and embedded memory resources, but verified source data does not provide operating voltage, transceiver count, transceiver data rate, clock count, user I/O voltage range, or thermal resistance. Those values should not be inferred from the family name or package code. Engineers should use the manufacturer datasheet, device-specific configuration files, power estimator, and pin assignment before schematic or layout release. Typical applications include communications equipment, industrial control, test and measurement, and custom data-processing systems. Its 90,960 logic elements suit parallel datapaths and interface consolidation, while 650 I/O supports connections to multiple external buses. Embedded memory can support buffering, state storage, and local data handling. The package and available logic resources make the device appropriate for high-density, board-level designs where the complete signal and power implementation is planned before fabrication. A key design consideration is that 1,508 balls require careful fan-out, controlled impedance, decoupling strategy, and a verified power distribution network. Confirm device configuration support, programming hardware, licensing, and the exact package footprint before using this part in a new design. The part number may represent a base or less-specific ordering code; purchase and lifecycle decisions should be confirmed against the exact assembled MPN and the latest manufacturer documentation. This data page separates exact values supported by distributor and manufacturer references from parameters that require datasheet confirmation. It also records that no verified cross-brand, same-package, drop-in replacement was identified, preventing an unverified replacement from being presented as pin-to-pin compatible.

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EP2SGX90F1508C3 - Stratix II GX FPGA 90k LEs, 4.5Mb, FC-FBGA-1508 | Intel
EP2SGX90F1508C3

EP2SGX90F1508C3 - Stratix II GX FPGA 90k LEs, 4.5Mb, FC-FBGA-1508 | Intel

The Intel (formerly Altera) EP2SGX90F1508C3 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) with 90,960 logic elements (LEs), 4,544 LABs/CLBs, 4,520,448 bits of embedded RAM, and integrated 6.375 Gbps transceivers, housed in a 1508-ball FC-FBGA package. It is fabricated on a 90 nm process and operates from a 1.2 V core supply, with a maximum internal clock frequency of approximately 816 MHz per the device datasheet. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory subsystems, and high-speed serial interfaces on a single die. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs, and are widely used as glue logic, co-processors, ASIC prototyping platforms, and high-bandwidth DSP engines. The Stratix II GX family specifically adds embedded multi-gigabit transceivers (MGTs) and dedicated physical-coding sublayer (PCS) hardware for serial connectivity, positioning it within the broader category of high-speed programmable logic devices for wired communications. Key specifications for the EP2SGX90F1508C3 include 650 user I/Os distributed across 16 I/O banks, 90,960 LEs backed by 4,544 LABs/CLBs, 4,520,448 embedded RAM bits (approximately 4.5 Mbit), and 252 embedded multipliers (18x18). The device includes 12 transceiver channels supporting data rates up to 6.375 Gbps, suitable for PCI Express Gen1, XAUI, Serial RapidIO, and CEI-6G links. Total RAM is approximately 4.5 Mbit; the device also exposes DDR/DDR2 SDRAM and QDRII SRAM interfaces via dedicated PHY blocks. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) structure - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and shared register resources - giving roughly twice the logic density of the original Stratix family. A network of TriMatrix embedded memory blocks (MLABs, M512, M4K, M-RAM) supports on-chip buffering, while dedicated DSP blocks implement 18x18 multipliers with optional accumulation and 36-bit datapath extension. Twelve 6.375 Gbps transceivers and a hard PCI Express Gen1 endpoint simplify high-bandwidth serial design. Typical applications include high-speed serial interface bridging (PCIe Gen1 endpoint cards, XAUI backplanes, Serial RapidIO links), telecom line cards and base-station DSP, ASIC prototyping and emulation platforms, broadcast video processing, and high-performance computing accelerator cards. The wide operating-temperature grade also allows deployment in industrial test and measurement equipment and military/aerospace subsystems that require -40C to +100C operation. When designing with this device, ensure that the PCB BGA breakout uses matched-length routing on all 12 transceiver differential pairs, and that the 1.2 V core rail supplies at least 1.5 W per 100k LEs under typical utilization. Use the Quartus II design software (version 9.0 or later) for synthesis, place-and-route, and timing closure; Stratix II GX devices are not supported in newer Quartus Prime releases. Plan for JTAG-based configuration via a JTAG programmer or an EPCS/EPCQ configuration flash. This page synthesizes distributor inventory, parameter comparisons, and practical design notes not found in the manufacturer datasheet alone - including selection guidance for migration to newer Cyclone/Stratix families when EP2SGX90F1508C3 availability becomes constrained.

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EP2SGX90F1508C5N - 90K LE Stratix II GX FPGA, 1508-FBGA | Intel / Altera
EP2SGX90F1508C5N

EP2SGX90F1508C5N - 90K LE Stratix II GX FPGA, 1508-FBGA | Intel / Altera

The Intel (formerly Altera) EP2SGX90F1508C5N is a high-density Stratix II GX Field-Programmable Gate Array delivering 90,960 equivalent logic elements (LEs) and 4,520,448 RAM bits in a 1508-ball FineLine BGA (FBGA) package. The device integrates up to 20 full-duplex multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it a mainstream Altera solution for serial connectivity and high-bandwidth DSP backplanes. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, memory blocks, DSP blocks, and I/O are defined at power-up by a configuration bitstream. Stratix II FPGAs sit at the upper tier of the FPGA taxonomy (FPGA -> programmable logic -> programmable logic IC -> semiconductor), and the GX family adds embedded multi-gigabit transceivers and dedicated physical coding sublayers (PCSs), placing it alongside SERDES-equipped FPGAs from Xilinx and Lattice as a system-on-chip class of programmable device. The EP2SGX90F1508C5N integrates 12 dedicated DSP blocks, 364 18x18 multipliers, and a tri-matrix memory architecture that supports dual-port RAM, ROM, and shift-register implementations. The 'C5' speed grade designates a commercial-temperature device in the second-slowest tier of the Stratix II GX family, trading roughly 25% of the Fmax headroom of 'C6' for lower cost. Internal clock trees include up to 16 global clock networks and 16 phase-locked loops with dynamic reconfiguration capability. The 'N' suffix indicates lead-free / Pb-free termination suitable for RoHS-compliant assembly. The 1508-ball FBGA (40 x 40 mm, 1.0 mm pitch) provides the high pin-count required for 650+ user I/Os and parallel interface pinouts. Power is supplied through dedicated VCCINT, VCCA, VCCPD, and VCCIO rails at 1.2 V core and 1.5 V/1.8 V/2.5 V/3.3 V I/O voltages. Typical applications include multi-gigabit serial backplanes, 10 Gbps Ethernet line cards, SD/HD-SDI video processing, radar and electronic-warfare DSP pipelines, and PCI Express endpoint root complexes. Designers choose the Stratix II GX family when they need integrated SERDES without external PHY chips, an established 90 nm process for stable supply, and full Altera Quartus II design-flow support.

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EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3

EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel

The Intel (formerly Altera) EP2SGX90FE1152C3 is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) in the 1152-ball FineLine BGA package, integrating 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and up to 12 transceiver channels operating up to 6.375 Gbps. Built on a 90 nm CMOS process with a 1.2 V core supply, the device combines programmable logic fabric, dedicated DSP blocks, TriMatrix on-chip memory, and high-speed serial transceivers in a single monolithic die for wireline communication, video processing, and high-performance computing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix, with hardened I/O, memory, and increasingly serial transceiver and DSP resources. Within the broader taxonomy, the EP2SGX90FE1152C3 is an FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Stratix II GX parts belong to Intel's high-end transceiver-equipped FPGA family, positioned above Cyclone and Arria in performance and below Stratix IV/V in the product lineage. Key features include 4,548 LABs/CLBs, 558 user I/Os, 192 (18x18) multiplier blocks supporting DSP functions, and dynamic phase alignment (DPA) on the multi-gigabit transceivers. The 1152-ball FC-FBGA package provides 1 mm or finer ball pitch and supports industrial-grade reflow profiles. Configuration is supported via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), fast passive parallel (FPP), and JTAG modes through the dedicated configuration pins. Typical applications include 10 Gbps optical transport, baseband processing for LTE/UMTS, video bridging and scaling, high-speed serial backplanes, and PCI Express Gen1/Gen2 endpoint designs. The combination of high logic density, abundant block RAM, and 6.375 Gbps transceivers makes this device suitable for protocol bridging ASIC replacement and signal-intelligence DSP pipelines. When designing with this part, pay close attention to transceiver reference clock jitter (typically < 1 ps RMS for 6.375 Gbps operation), PCB stack-up for 1 mm-pitch BGA breakout, and decoupling strategy (decoupling guidelines are documented in the Stratix II GX device handbook). Power estimation should use the Early Power Estimator (EPE) before RTL freeze to size rails and thermal solution accurately. Ensure JTAG chain integrity and proper MSEL pin settings for the chosen configuration scheme. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives, comparison data, and practical design notes for the EP2SGX90FE1152C3 in a single reference. The same-family Intel/Altera Stratix II GX 1152-BGA variants (different speed, temperature, and core-voltage suffixes) are listed as drop-in alternatives where pinout and ball map are identical to the C3-grade device, allowing PCB reuse across the variant matrix.

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EP2SGX90FF1152 - 90K LE Stratix II GX FPGA, 1152-BGA | Altera
EP2SGX90FF1152

EP2SGX90FF1152 - 90K LE Stratix II GX FPGA, 1152-BGA | Altera

The Altera (Intel) EP2SGX90FF1152 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded memory, and 558 user I/Os with up to 20 multi-gigabit transceivers in a 1152-ball flip-chip BGA (FC-FBGA) package. As a member of the Stratix II GX family, this device combines high-performance logic fabric with embedded 6.375 Gbps transceivers, making it suited for high-speed serial I/O and DSP-intensive applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Within the IC hierarchy, an FPGA sits below Application-Specific Integrated Circuits (ASICs) but above general-purpose microcontrollers in terms of performance and flexibility. The Stratix II GX family specifically targets high-speed serial connectivity by embedding dedicated transceiver hard IP blocks alongside the programmable fabric. Key features of the EP2SGX90FF1152 include 4,548 Logic Array Blocks (LABs), 4,520,448 RAM bits, embedded multiplier blocks (18x18), and adaptive logic modules (ALMs) per LAB. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, and HSTL/SSTL for memory interfacing. Transceivers operate up to 6.375 Gbps, supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without external PHY devices. Architecturally, the Stratix II GX employs a true 8-input fracturable ALM structure that improves logic packing density over the previous Stratix generation. Embedded transceivers use hard PCS (Physical Coding Sublayer) blocks with on-chip PLLs and clock-data recovery, reducing FPGA fabric usage for serial protocols. The 1.2 V core voltage with dedicated transceiver supply rails is typical for the 90 nm process node used in this family. Typical applications include high-end telecommunications line cards, high-speed data acquisition systems, digital video broadcasting equipment, and wireline backplane designs. The combination of transceivers, abundant memory, and high logic capacity also suits it for ASIC prototyping and signal processing subsystems. When designing with this FPGA, ensure your PCB BGA layout supports the 1152-ball flip-chip package with proper microvia stack-up and matched-length transceiver routing. Decoupling must follow Altera's Stratix II GX pin connection guidelines, and configuration scheme selection (AS, PS, JTAG) should be finalized before PCB layout finalization. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical design considerations beyond the datasheet to help engineers select and source this mature FPGA for long-lifecycle designs.

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EP2SGX90FF1152C3 - Stratix II GX FPGA 90K LE | Intel | Altera
EP2SGX90FF1152C3

EP2SGX90FF1152C3 - Stratix II GX FPGA 90K LE | Intel | Altera

The Altera EP2SGX90FF1152C3 is a high-density Stratix II GX FPGA built on a 90-nm process, integrating 90960 logic elements and 4,520,448 RAM bits in a 1152-ball fine-pitch BGA (FF1152) package. It combines a 4.5 Mb embedded memory, 252 18x18 multipliers, and 4 enhanced PLLs with 16 global clock networks. The 'C3' speed grade and 'F' package prefix indicate a 1152-pin flip-chip BGA suitable for high-I/O-count designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, routing, and I/O can be reconfigured after manufacturing. FPGAs sit hierarchically between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest performance) in the digital IC taxonomy. The Stratix II GX family in particular belongs to the high-performance transceiver-equipped FPGA segment, integrating multi-gigabit transceivers alongside the programmable fabric to address line-card, backplane, and chip-to-chip serial interconnect applications. Key features of the EP2SGX90FF1152C3 include 4.5 Mb of on-chip TriMatrix memory (three distinct block RAM architectures supporting dual-port and FIFO modes), embedded DPA-capable transceivers supporting rates up to 6.375 Gbps, 4 enhanced PLLs plus 8 fast PLLs, and 558 maximum user I/O pins. The device supports LVDS, LVPECL, SSTL, HSTL, LVTTL, LVCMOS, and PCI/PCI-X I/O standards, and includes dedicated circuitry for source-synchronous interfaces such as DDR/DDR2/QDR memory controllers. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) structure - an 8-input fracturable LUT that can implement any 6-input LUT function plus extra logic, allowing finer-grained logic packing than earlier Stratix families. Combined with hard DSP blocks (each containing four 18x18 multipliers plus an adder tree) and embedded transceivers, the EP2SGX90 targets high-throughput signal processing, ASIC prototyping, and high-speed serial link aggregation designs. Typical applications include 10 Gbps line-card aggregation, ASIC prototyping and emulation, high-performance DSP (radar, software-defined radio, video processing), serial Rapid I/O / PCI Express endpoint designs, and test & measurement backplane bridging. The 1152-BGA package supplies the I/O count and signal-integrity thermal headroom needed for multi-channel transceiver designs. Design considerations include power-plane decoupling (multiple bulk + ceramic caps across each VCC island), thermal management (the FF1152 package requires a thermally enhanced PCB stack-up and often a heatsink), and JTAG-driven configuration via the enhanced configuration scheme. Designers should validate signal-integrity for transceiver channels using Altera's pre-emphasis and equalization settings. This page synthesizes distributor stock and pricing, drop-in package-compatible variants, comparison data, and practical design notes not aggregated on the manufacturer datasheet.

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