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MCIMX515CJM6C - i.MX51 600MHz ARM Cortex-A8 MPU | NXP
MCIMX515CJM6C

MCIMX515CJM6C - i.MX51 600MHz ARM Cortex-A8 MPU | NXP

The NXP MCIMX515CJM6C is a Freescale-legacy i.MX51 multimedia applications processor featuring a 600 MHz ARM Cortex-A8 core integrated into a 529-ball MAPBGA package. The device delivers high-performance processing optimized for the lowest power consumption, targeting smartbooks, netbooks, portable media players, gaming consoles, secure handheld devices, and other consumer/industrial human-machine interface (HMI) products. What is a multimedia applications processor? A multimedia applications processor is a system-on-chip (SoC) class integrated circuit that combines a high-performance CPU core, a graphics processing unit (GPU), video and audio accelerators, memory controllers, and a wide range of peripheral interfaces on a single die. Within the embedded taxonomy, this places the i.MX515 at the top of the stack: MPU -> applications processor -> SoC -> semiconductor. The i.MX51 family specifically targets power-constrained portable products that previously required separate host processors plus companion multimedia chipsets. Key features of the MCIMX515CJM6C include the ARM Cortex-A8 core running at 600 MHz, an integrated NEON SIMD engine, hardware-accelerated video encoding/decoding up to 720p, an Image Processing Unit (IPU), an Enhanced LCD controller supporting up to XGA resolution, integrated DDR2/LPDDR memory controller, and an extensive peripheral set including USB 2.0, SD/MMC, SATA, Ethernet, and multiple UART/SPI/I2C ports. The 529-ball MAPBGA package is 19 mm × 19 mm with 0.8 mm ball pitch, suitable for compact portable designs. The architecture pairs the Cortex-A8 superscalar core with a vector floating-point unit and dedicated multimedia accelerators, enabling efficient video playback, image processing, and graphics rendering without taxing the CPU. The integrated display controller supports RGB, LVDS, and DSI output paths, while the IPU handles real-time camera input and post-processing for video pipelines. Typical applications include portable media players (PMP), smartbooks/netbooks, industrial HMI panels, point-of-sale terminals, gaming consoles, secure handheld devices such as payment terminals, and low-power embedded computing platforms requiring Cortex-A8 performance with aggressive battery-life targets. When designing with the MCIMX515CJM6C, ensure the power management IC (PMIC) selected is compatible with the i.MX51 power-up sequencing requirements, and follow NXP hardware reference manual guidelines for DDR2/LPDDR trace routing, decoupling, and thermal management. This page synthesizes distributor pricing, parametrically compatible drop-in alternatives, and practical PCB design notes not aggregated on a single distributor page, providing a one-stop engineering summary for the i.MX51 platform.

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MCIMX516AJM6 - i.MX51 ARM Cortex-A8 600MHz MPU | NXP
MCIMX516AJM6

MCIMX516AJM6 - i.MX51 ARM Cortex-A8 600MHz MPU | NXP

The NXP MCIMX516AJM6 is an ARM Cortex-A8 based i.MX51 applications processor designed for automotive infotainment and embedded multimedia systems, delivering a 600MHz single-core 32-bit MPU in a 529-ball BGA (19x19 mm) package. Key headline parameters include the Cortex-A8 core at 600MHz, 32-bit datapath, and BGA-529 packaging optimized for high-density PCB layouts in space-constrained automotive head units and telematics platforms. An applications processor (AP) is a system-on-chip (SoC) class microprocessor that integrates one or more CPU cores with peripheral controllers, memory interfaces, and graphics/multimedia blocks on a single die. The i.MX family sits within the broader hierarchy of microprocessors (MPU) and SoCs, targeting applications that need richer OS support (Linux, Android, WinCE) and richer I/O than typical microcontrollers (MCU) provide. The i.MX51 specifically targets the multimedia-rich infotainment segment with hardware video accelerators, an integrated image processing unit (IPU), and an LCD controller. Key features of the MCIMX516AJM6 include the 600MHz Cortex-A8 core with NEON SIMD and VFPv3 floating-point extensions, integrated DDR2/LPDDR memory controller supporting up to 200MHz, on-chip Image Processing Unit (IPU), Enhanced Multimedia Accelerator (eMMA) for pre-/post-processing, and dedicated automotive peripherals such as CAN, MLB, and FlexCAN. The SoC also integrates an LCD controller supporting up to XGA resolution, a hardware video processing block (VPU), and multiple connectivity options including USB, Ethernet, and SD/MMC interfaces. Architecturally, the i.MX51 leverages ARM's Cortex-A8 superscalar pipeline with out-of-order execution, paired with dedicated hardware accelerators that offload video decode/encode and image processing from the CPU. This heterogeneous compute approach enables full-rate 720p video playback while keeping the CPU available for application logic, OS scheduling, and graphics rendering. The 529-ball BGA package provides the I/O density needed for automotive dual-display cluster/instrument panel designs. Typical applications include automotive infotainment head units, in-vehicle navigation systems, rear-seat entertainment, industrial human-machine interfaces (HMI), and portable medical imaging devices. The automotive-grade process technology and extended temperature range make it well suited for under-hood and dashboard environments where consumer-grade parts would fail. When designing with the MCIMX516AJM6, ensure the PCB has a minimum 4-layer stackup with continuous ground planes under the BGA, and follow NXP's reference design for DDR2 routing (matched-length, 50-ohm single-ended impedance). Thermal management via copper pours and a heatsink or thermal interface material is recommended when sustained CPU utilization exceeds 50%. This page synthesizes NXP datasheet parameters, distributor stock status, drop-in same-package alternatives, and practical design notes not consolidated on the manufacturer product page, with all data last verified on 2026-10-17.

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MCIMX51LEVK - i.MX51 ARM Cortex-A8 MPU | NXP Semiconductors
MCIMX51LEVK

MCIMX51LEVK - i.MX51 ARM Cortex-A8 MPU | NXP Semiconductors

The NXP Semiconductors (formerly Freescale Semiconductor) MCIMX51LEVK is a 32-bit applications processor from the i.MX51 family built around an ARM Cortex-A8 core, designed for cost-effective multimedia and general-purpose industrial platforms. Per verified distributor data the part is catalogued as an I.MX51 32-bit MPU ARM Cortex-A8 microprocessor, offered as a component for embedded designs requiring integrated multimedia, connectivity, and human-interface peripherals. An applications processor (AP) is a system-on-chip class of microcontroller that integrates a high-performance CPU, memory controllers, hardware accelerators, and rich peripheral I/O into a single device. Within the hierarchy, an applications processor sits above ordinary microcontrollers (MCU) and below high-end CPUs/APUs; it targets workloads such as graphical user interfaces, video playback, and connected edge devices that need both processing throughput and a rich software ecosystem (typically Linux or Android). Key feature highlights for the MCIMX51LEVK include the ARM Cortex-A8 CPU core, the legacy Freescale i.MX51 multimedia subsystem, on-chip L2 cache, and a comprehensive peripheral set covering display, camera, USB, Ethernet, and SD/MMC interfaces. The part targets industrial temperature grades and is suited to long-lifecycle designs where NXP's roadmap stability matters as much as raw performance. Technically the i.MX51 family was one of the early ARM Cortex-A8 implementations at NXP, manufactured on a CMOS process and pairing the CPU with a vectoring floating-point unit, hardware video accelerators, and an enhanced memory controller. Rochester Electronics' continued stocking of this part confirms it is treated as a mature, long-life component suitable for production continuance programs. Typical applications include industrial human-machine interface (HMI) panels, portable medical devices, point-of-sale terminals, smart-home gateways, and telematics/fleet management hardware. The integrated peripherals reduce BOM count for graphics- and connectivity-rich designs. When designing with this part, engineers should verify software support longevity and confirm whether NXP's BSP for the specific i.MX51 sub-variant covers their Linux/Android kernel version. Long-life programs may need to engage distributors such as Rochester Electronics for sustained supply. This page synthesizes distributor pricing, availability signals, and practical sourcing context that complement the manufacturer datasheet and help engineers evaluate the MCIMX51LEVK for new and legacy designs.

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MCIMX535DVV1CR2 - i.MX53 ARM Cortex-A8 1GHz MPU | NXP
MCIMX535DVV1CR2

MCIMX535DVV1CR2 - i.MX53 ARM Cortex-A8 1GHz MPU | NXP

The NXP MCIMX535DVV1CR2 is an i.MX53 family 32-bit microprocessor unit (MPU) built on the ARM Cortex-A8 core, clocked at 1.0 GHz, and housed in a 529-ball Fine-Pitch Ball Grid Array (FBGA / TEBGA-2) package measuring 19 mm x 19 mm with 0.8 mm pitch. It integrates 128 KB of on-chip SRAM and exposes 224 general-purpose I/O lines, with core voltages in the 0.9/1.25/1.3 V range depending on operating point. An MPU (microprocessor unit) is a System-on-Chip (SoC) device that integrates a CPU core, memory controllers, and a wide range of peripherals into a single package, eliminating the need for an external chipset. MPU devices sit at the top of the embedded processing hierarchy (MPU > MCU > discrete microcontroller) and are designed for operating systems such as Linux, Android, and Windows Embedded Compact. The i.MX53 specifically targets multimedia-rich applications where high CPU performance combined with hardware-accelerated video, graphics, and connectivity peripherals is required. Key features of the MCIMX535DVV1CR2 include the ARM Cortex-A8 single-core architecture with NEON SIMD and VFPv3 floating-point support, dual-display controller hardware (parallel + LVDS), hardware-accelerated video codec for H.264 BP/HP, MPEG-4, H.263, and VC-1, an integrated image processing unit (IPU), and a 10/100 Ethernet MAC with hardware security acceleration (SAHARAS). The 529-FBGA package is designed for high-density surface-mount assembly and supports the full industrial temperature range typical of embedded multimedia designs. The i.MX53 architecture uses a multi-level memory hierarchy combining L1 cache with the ARM Cortex-A8's NEON engine, plus a unified L2 cache that feeds the Cortex-A8 core. A dedicated Smart Direct Memory Access (SDMA) controller handles high-throughput I/O, while the clock control module provides independent frequency scaling for ARM, L2, AHB, and IPG buses to balance performance against power dissipation in always-on systems. Typical applications include industrial human-machine interfaces (HMI), point-of-sale (POS) terminals, automotive infotainment heads, medical patient-monitoring displays, barcode scanners, and portable multimedia players. The combination of high CPU frequency with hardware video acceleration makes it suitable where user interfaces need to remain smooth alongside background video processing tasks. When designing with this device, allocate at least four PCB layers dedicated to the 529-ball BGA escape routing and provide a continuous ground reference plane under the package. The DDR2/LPDDR2 memory interface requires matched-length routing with controlled impedance of 50 ohms single-ended and 100 ohms differential for DQS signals to maintain signal integrity at 200 MHz+ memory bus speeds. This page synthesizes distributor stock counts, exact-package drop-in alternatives within the i.MX53 family, and practical PCB layout considerations not found on the manufacturer product page.

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MCIMX536AVV8C - i.MX53 ARM Cortex-A8 800MHz MPU, 529-BGA | NXP
MCIMX536AVV8C

MCIMX536AVV8C - i.MX53 ARM Cortex-A8 800MHz MPU, 529-BGA | NXP

The NXP MCIMX536AVV8C is an i.MX53 family 32-bit applications microprocessor based on the ARM Cortex-A8 core, running at up to 800 MHz, and housed in a 529-ball TEPBGA-2 package measuring 19 x 19 mm with 0.8 mm pitch. The part integrates 128 KB of on-chip SRAM and targets advanced automotive instrument cluster, navigation, and infotainment head-unit designs that require high-performance 2D/3D graphics acceleration, dual-display support, and robust connectivity. It is part of NXP's i.MX53xA automotive-grade processor family, qualified for AEC-Q100 applications. An applications processor (AP) is a system-on-chip (SoC) class of integrated circuit that integrates a CPU core, memory controllers, graphics accelerators, display controllers, and a wide set of peripheral interfaces on a single die. It belongs to the broader hierarchy of microprocessors (MPU) and microcontrollers (MCU), sitting above simple MCUs because it runs a full operating system (typically Linux, Android, or QNX) rather than bare-metal firmware. The i.MX53 family specifically targets multimedia-rich embedded applications where the ARM Cortex-A8 superscalar core provides a balance of performance (2.0 DMIPS/MHz) and power efficiency for portable and vehicle-mounted devices. Key features of the MCIMX536AVV8C include an ARM Cortex-A8 CPU with NEON SIMD engine, a hardware graphics accelerator supporting OpenGL ES 2.0 and OpenVG 1.1, dual-display controllers capable of driving two independent WVGA or one WXGA+ panel, integrated HDMI 1.3 transmitter, and a rich peripheral set including CAN, USB, PCIe, SATA, and multiple SD/SDIO/MMC ports. The device also includes hardware encryption acceleration (AES, SHA) and a 10/100 Ethernet MAC for automotive networking. Memory interface supports LPDDR2, DDR2, and DDR3 with a 16-bit or 32-bit data bus. The MCIMX536AVV8C uses a 0.8 V to 1.15 V internal core voltage and integrates a sophisticated power management block with multiple voltage domains and DVFS support. It is manufactured in a low-power CMOS process, and the TEPBGA-2 package offers a thermal resistance in the range typical for 529-pin BGA devices, requiring careful PCB thermal via design under the exposed die pad. Typical applications include automotive infotainment head units, in-vehicle navigation systems, digital instrument clusters, factory-floor HMI panels, industrial patient monitors, and high-end POS terminals. The part's automotive qualification makes it particularly well-suited for tier-1 automotive OEM designs with extended temperature range requirements (-40C to +85C or -40C to +125C junction). When designing with the MCIMX536AVV8C, ensure the PCB provides adequate thermal vias under the package center pad and that the DDR memory routing is impedance-controlled and length-matched within the tolerances specified in the NXP hardware reference manual. Software bring-up should use NXP's BSP (Board Support Package) for Linux or QNX, which provides validated drivers for all on-chip peripherals. This page synthesizes distributor pricing, same-package alternatives from the i.MX53xA family, and practical design notes not found in the manufacturer datasheet, helping engineers select the right variant and avoid common pitfalls.

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MCIMX537CVV8C - i.MX53 ARM Cortex-A8 MPU 800MHz | NXP
MCIMX537CVV8C

MCIMX537CVV8C - i.MX53 ARM Cortex-A8 MPU 800MHz | NXP

The NXP MCIMX537CVV8C is a 32-bit ARM Cortex-A8 applications microprocessor from the i.MX53 family, operating at 800 MHz with a single core, housed in a 529-ball TFBGA (19x19 mm, 0.8 mm pitch) surface-mount package. It integrates 128 KB of on-chip SRAM, 224 general-purpose I/O, and a rich multimedia peripheral set targeting industrial, automotive infotainment, and human-machine interface (HMI) systems. The device pairs an advanced power-management subsystem with dual Ethernet, dual USB, PCIe, and SATA controllers to deliver balanced connectivity for embedded designs. An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU core, graphics, memory controllers, and industrial peripherals on a single die. The i.MX53 family represents NXP's next-generation advanced multimedia and power-efficient implementation of the ARM Cortex-A8 core, sitting within the broader i.MX applications-processor hierarchy (i.MX5 -> i.MX applications processors -> NXP edge-computing SoCs -> embedded microprocessors). Key features include a 32-bit ARMv7 Cortex-A8 core running up to 800 MHz, 128 KB on-chip SRAM, an L1 cache with separate I/D paths, hardware-accelerated graphics and video engines, and a 224-GPIO multiplexed interface. External memory support covers LPDDR2, DDR2, and DDR3, while peripherals include dual 10/100 Ethernet MACs, dual USB 2.0 with PHY, PCIe, SATA-II, CAN, UART, I2C, SPI, I2S, and an integrated touchscreen controller. The 529-FBGA (19x19 mm) package supports industrial temperature grades. The i.MX53 uses a hierarchical bus architecture with ARM Cortex-A8 NEON media processing, a multi-level cache, smart DMA, and dedicated engines for 2D/3D graphics, video codec (H.264, MPEG-4, VC-1), image processing, and LCD output up to WXGA resolution. Process technology is a low-power CMOS node with dynamic voltage and frequency scaling (DVFS) to balance performance and consumption across active and idle states. Typical applications include industrial HMI panels, automotive infotainment head-units, medical patient-monitoring displays, smart-home gateways, and ruggedized portable data terminals. According to the NXP product page, the i.MX537 specifically delivers dual Ethernet connectivity and optimized power for industrial and automotive systems. When designing with this part, plan PCB escape routing carefully for the 0.8 mm pitch 529-ball BGA and provide a four-layer minimum stack-up with continuous ground planes for signal integrity on the DDR3 interface. Decouple each power rail with at least 10uF bulk plus 0.1uF high-frequency ceramic capacitors placed as close to the balls as the fanout allows. This page synthesizes NXP product documentation, distributor pricing, drop-in alternatives from the i.MX53 family, and practical design notes not found in the manufacturer datasheet alone.

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MCIMX6D4AVT10AC - i.MX 6Dual 1GHz ARM Cortex-A9 MPU | NXP
MCIMX6D4AVT10AC

MCIMX6D4AVT10AC - i.MX 6Dual 1GHz ARM Cortex-A9 MPU | NXP

The NXP MCIMX6D4AVT10AC is a 32-bit dual-core ARM Cortex-A9 microprocessor IC from the i.MX 6Dual (i.MX6D) applications processor family, operating at up to 1.0 GHz, housed in a 624-ball FCBGA package measuring 21x21 mm and qualified to the automotive temperature range (-40C to +125C). It belongs to the i.MX 6 series platform, which combines scalable architecture with broad levels of integration and power-efficient processing capabilities specifically suited to multimedia applications such as automotive infotainment, industrial HMI, and connected devices. An applications processor is a system-on-chip (SoC) microprocessor IC that integrates CPU cores, graphics accelerators, memory controllers, and a wide range of peripherals onto a single die. Within the broader semiconductor taxonomy, MCIMX6D4AVT10AC sits at: applications processor -> microprocessor IC (MPU) -> integrated circuit (IC) -> semiconductor. Its ARM Cortex-A9 cores execute the ARMv7-A instruction set and are paired with NEON SIMD media engines, hardware VFPv3 floating-point, and a multilevel memory hierarchy (L1 + L2 cache plus external DDR3/LPDDR2 interface). Key features distinguishing this variant include dual-core 1.0 GHz Cortex-A9, integrated 2D and 3D graphics accelerators (Vivante GC2000 + GC355 + GC320), an LVDS display controller, dual Gigabit Ethernet MACs with hardware acceleration, USB 2.0 with PHY, PCIe Gen 2.0, SATA II, and an automotive-grade operating range. The i.MX6D sub-family targets high-tier portable multimedia and infotainment workloads where MIPS throughput and rich graphics matter more than absolute lowest power. Smart speed technology allows per-core frequency scaling for thermal efficiency. The architecture uses a 40 nm low-power CMOS process with an asynchronous multi-core fabric that isolates CPU, GPU, and IO voltage/frequency domains. This allows independent power gating of idle blocks, dropping total SoC power well below the sum of its sub-block maximums during typical workloads. External interfaces include 32-bit DDR3/LPDDR2, NAND/NOR flash controllers, multiple SD/MMC, I2C, SPI, UART, I2S, ESAI, and a camera sensor interface (CSI). Typical applications include automotive infotainment head units, industrial HMI panels, smart energy gateways, point-of-sale terminals, and medical patient-monitoring consoles. The dual-core architecture is well-matched to OS-level multitasking (Linux, Android, QNX) where one core handles UI rendering while the other runs connectivity or control stacks. When designing with this part, allocate adequate PCB real estate for the 21x21 mm FCBGA and follow NXP's reference design thermal recommendations, including a 4- or 6-layer stack-up with continuous ground planes under the package. Decoupling follows the manufacturer's reference manual; do not omit the DDR3 termination supply (VDD_DRAM) decoupling network. This page synthesizes NXP datasheet specifications, current distributor stock, drop-in same-family alternatives, and practical design notes - engineering context not found in the datasheet alone.

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MCIMX6D5EYM1 - i.MX6 Dual Cortex-A9 MPU 1GHz 624-FCPBGA | NXP
MCIMX6D5EYM1

MCIMX6D5EYM1 - i.MX6 Dual Cortex-A9 MPU 1GHz 624-FCPBGA | NXP

The NXP MCIMX6D5EYM1 is a dual-core ARM Cortex-A9 microprocessor from the i.MX 6 family, integrating up to 1 GHz of application processing performance in a 624-ball FCPBGA package (21 x 21 mm). It is positioned for industrial and consumer multimedia applications requiring rich graphics, dual-core parallelism, and DDR3L memory support. An application processor (AP/MPU) is a system-on-chip that integrates one or more CPU cores, a graphics processing unit, memory controllers, and a wide peripheral set into a single device. The i.MX 6 family targets multimedia HMI, automotive infotainment, industrial control, and embedded vision. Within the NXP portfolio, the i.MX 6 sits between the lower-end i.MX 28/53 series and the higher-end i.MX 8, offering a balance of cost, performance, and proven software support. The MCIMX6D5EYM1 specifically belongs to the i.MX6D dual-core sub-family with the 5EYM1 ordering code indicating commercial temperature grade and standard feature set. Key features include a dual-core ARM Cortex-A9 up to 1.0 GHz with 32 KB L1 instruction cache and 32 KB L1 data cache per core, plus a unified 512 KB L2 cache. Integrated graphics include a 3D GPU (Vivante GC2000) supporting OpenGL ES 2.0/3.0 and a 2D GPU (GC320). The device integrates a 32-bit DDR3L-1066 memory controller, dual Gigabit Ethernet MACs, two USB 2.0 OTG controllers, PCIe Gen 2.0, HDMI, MIPI-DSI, MIPI-CSI, and multiple display/camera interfaces. The architecture combines two superscalar Cortex-A9 cores with NEON SIMD media engine, hardware accelerated graphics, and a rich multimedia IP block set. The device is manufactured in a low-power CMOS process and supports multiple boot sources including NAND flash, eMMC, SD card, and serial SPI flash. Typical applications include industrial HMI panels, multimedia gateways, point-of-sale terminals, medical imaging interfaces, and ruggedized tablets. The 624-FCPBGA package supports industrial-grade PCB designs with a recommended 6-layer or higher stack-up for proper DDR3L signal integrity. When designing with this device, ensure proper DDR3L trace length matching within 25 mil tolerance per byte lane and provide a minimum 6-layer PCB stack-up. Thermal management is critical as the package dissipates up to 3 W under full CPU+GPU load, requiring thermal vias and copper pours. This page synthesizes distributor pricing, application context, and drop-in i.MX6 alternatives not found in the manufacturer datasheet alone, complementing the NXP reference manual with practical sourcing information.

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MCIMX6D5EYM10AC - i.MX6Dual 1GHz ARM Cortex-A9 MPU | NXP
MCIMX6D5EYM10AC

MCIMX6D5EYM10AC - i.MX6Dual 1GHz ARM Cortex-A9 MPU | NXP

The NXP Semiconductors MCIMX6D5EYM10AC is a dual-core ARM Cortex-A9 microprocessor from the i.MX 6 series, operating at up to 1.0 GHz and housed in a 624-ball FCPBGA (21x21 mm) package. The i.MX6Dual integrates two Cortex-A9 cores with 32KB I-cache and 32KB D-cache per core, plus a shared 1MB L2 cache, NEON SIMD media engine, and hardware VFPv3 floating-point unit. An applications processor (AP) is a highly-integrated system-on-chip (SoC) designed for multimedia and human-machine-interface (HMI) workloads. It sits above microcontrollers in the embedded processing hierarchy and below desktop CPUs in raw performance, combining CPU cores, GPU, memory controller, display controllers, and a rich peripheral set on a single die. The i.MX6 family further refines this concept with smart speed technology that scales voltage and frequency per domain to optimize power consumption. Key features of the MCIMX6D5EYM10AC include 1080p60 video decode/encode via the integrated multi-format video codec, a 3D-capable GPU (Vivante GC2000 plus GC355 plus GC320), dual-display support up to WUXGA+WXGA, dual-lane MIPI-DSI and MIPI-CSI interfaces, SATA-II (3 Gbps), PCI Express Gen 2.0, USB OTG with PHY, and a wide peripheral mix including Gigabit Ethernet, MLB150, and multiple UART/I2C/SPI ports. The -EYM10AC suffix denotes the industrial-grade 1.0 GHz dual-core variant in FCPBGA-624. Architecturally the part uses a 40 nm process with a 64-bit DDR3/LPDDR2 memory controller supporting up to 2 GB of addressable memory. A multi-level memory system (L1 + L2 + NEON) and dedicated smart-speed domains let the cores, GPU, and IP blocks run at independent DVFS curves, which is critical for fanless industrial designs. Typical applications include industrial HMI panels, automotive infotainment, medical imaging terminals, factory-automation controllers, digital signage, and ruggedized single-board computers. The wide operating temperature range and ECC support on the DDR interface make it suitable for harsh environments. Designers should plan a 4-layer or 6-layer PCB with the controlled-impedance DDR routing required by the i.MX6 and provide a dedicated PMIC such as the NXP PF3000/PF3001 to supply the multi-rail core/SoC/GPU sequencing. The 624-ball package also demands strict via-in-pad and microvia stackup adherence. This page synthesizes distributor pricing, lifecycle status, drop-in alternatives from the same i.MX6 family, and PCB/design notes not found in the manufacturer datasheet - giving the engineer a single, decision-ready view of the part.

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MCIMX6D5EZK08AD - i.MX6Dual 800MHz ARM Cortex-A9 MPU | NXP
MCIMX6D5EZK08AD

MCIMX6D5EZK08AD - i.MX6Dual 800MHz ARM Cortex-A9 MPU | NXP

The NXP MCIMX6D5EZK08AD is a 32-bit applications processor from the i.MX 6 series, featuring two ARM Cortex-A9 cores running at 800 MHz, packaged in a 569-ball MAPBGA (12 mm x 12 mm) with Package-on-Package (POP) memory support. It belongs to the i.MX 6Dual family, a dual-core variant of the i.MX6 platform that targets multimedia and industrial HMI applications, with on-chip L1 cache and a unified L2 cache, plus a pixel-processing pipeline, GPU and multiple connectivity peripherals. An applications processor (AP) is a high-integration system-on-chip that combines one or more CPU cores, graphics, memory controllers, display/touch interfaces and I/O into a single IC for embedded multimedia products. In the broader taxonomy, the i.MX6D sits within microprocessors / MPUs, then ARM Cortex-A class processors, then multimedia APs; it is the typical application processor used between an OS kernel (Linux, Android, Windows Embedded) and peripherals such as LCD panels, camera sensors, audio codecs, and Ethernet PHYs. Compared with a microcontroller (MCU), an MPU like the MCIMX6D5EZK08AD runs at GHz-class clocks with an MMU, enabling full OS support and complex user interfaces. Key features include the dual-core ARM Cortex-A9 core complex with NEON SIMD and VFPv3, hardware-accelerated multi-format video engine (VPU), 2D/3D graphics GPU (GC880 + GC320), dual-display support up to two independent LVDS or HDMI outputs, integrated SATA-II, PCIe 2.0, multiple USB 2.0 ports (one with HSIC), and a rich mix of audio, MIPI-CSI camera and MIPI-DSI display interfaces. The 569-ball MAPBGA POP variant allows a companion memory package (typically DDR3 / LPDDR2) to be stacked directly on top, simplifying PCB layout and reducing board area. Typical applications include automotive infotainment head units, industrial HMI / factory-control panels, smart-home gateways, point-of-sale terminals, and medical patient-monitoring displays. The wide operating-temperature range, hardware video codec and dual-display capability are the main reasons the i.MX6D is selected for these designs rather than a smaller MCU. When designing with the MCIMX6D5EZK08AD, follow the NXP Hardware Development Guide for the i.MX6 family: respect the strict DDR3/LPDDR2 routing topology (matched lengths, controlled impedance), provide a clean multi-rail power tree, and use only NXP-qualified POP memory stacks to keep signal-integrity within datasheet margins. The part is RoHS compliant and shipped in trays; long-term availability must be confirmed with NXP because the i.MX 6Dual line is on the manufacturer's product-change / discontinuance track. This page synthesizes distributor pricing from Mouser, DigiKey and Octopart, drop-in / package-compatible alternatives from NXP's i.MX6 family, and practical board-design notes not found in the standalone datasheet PDF.

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MCIMX6D6AVT08AC - i.MX 6Dual 852MHz ARM Cortex-A9 MPU | NXP
MCIMX6D6AVT08AC

MCIMX6D6AVT08AC - i.MX 6Dual 852MHz ARM Cortex-A9 MPU | NXP

The NXP MCIMX6D6AVT08AC is a dual-core ARM Cortex-A9 applications processor from the i.MX 6 family operating at up to 852 MHz, housed in a 624-pin FCBGA (21 mm x 21 mm) package. The part combines two Cortex-A9 cores with NEON SIMD media engine, a 2D/3D GPU subsystem, and a multilevel memory system for industrial-grade multimedia and HMI applications in the -40C to +105C automotive temperature range. What is a MPU? A microprocessor unit (MPU) is a System-on-Chip (SoC) computing platform that integrates one or more application CPU cores together with on-chip peripherals, graphics, and memory controllers on a single die. The i.MX 6Dual sits within the MPU > applications processor > multimedia SoC hierarchy and is targeted at operating systems (Linux, Android, Windows Embedded) running complex graphical user interfaces, video playback, and connected peripherals. Key features of this variant include 852 MHz maximum ARM Cortex-A9 core frequency, 32 KB L1 instruction cache and 32 KB L1 data cache per core, 1 MB unified L2 cache shared across both cores, integrated 2D and 3D graphics engines (Vivante GC2000 plus GC355 GC320), dual HDMI/LVDS display interfaces with 1080p60 encode/decode, dual USB 2.0 with PHY, Gigabit Ethernet MAC, MLB and PCIe support, and hardware cryptographic accelerators for AES, SHA, and RNG. The integrated Smart Speed technology enables per-core DVFS to extend idle runtime in battery-powered panels. The device architecture is built on a 40 nm low-power CMOS process, enabling the entire SoC to operate in extended-temperature industrial environments. The 624-pin FCBGA with 0.8 mm ball pitch supports a high-pin-count integration of multiple display, memory, and connectivity interfaces while keeping the PCB footprint compact at 21 mm x 21 mm. The variant designation -VT08A indicates 852 MHz industrial-grade (extended) temperature range and DDR3/LPDDR2 memory interface compatibility. Typical applications for this MPU include industrial HMI panels, automotive infotainment head units, point-of-sale terminals, patient monitors, and digital signage controllers. The combination of dual ARM cores and on-chip GPU enables smooth Qt/Web/HTML5 rendering without an external graphics chip. NXP recommends pairing the SoC with the PF3000 PMIC, SGTL5000 audio codec, and an eMMC 5.0+ NAND flash for typical reference designs. When designing with this part, allocate PCB area for the 21 mm x 21 mm FCBGA land pattern with controlled-impedance routing for DDR3 traces and follow NXP's i.MX 6 layout guidelines (AN4156). Ensure a stable 1.8 V/2.8 V/3.3 V supply rail sequencing and adequate decoupling near each power domain to meet DDR jitter requirements. This page synthesizes NXP specifications, distributor stock and pricing, real drop-in alternatives, and practical design notes not consolidated elsewhere.

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MCIMX6D6AVT10AC - i.MX 6Dual 1GHz ARM Cortex-A9 MPU | NXP
MCIMX6D6AVT10AC

MCIMX6D6AVT10AC - i.MX 6Dual 1GHz ARM Cortex-A9 MPU | NXP

The NXP MCIMX6D6AVT10AC is a 32-bit applications microprocessor from the i.MX 6Dual family, integrating two ARM Cortex-A9 cores running up to 1.0 GHz in a 624-pin FCBGA (21x21 mm) package. It is targeted at automotive infotainment and consumer multimedia systems requiring high computational density, hardware-accelerated graphics, and rich peripheral integration. An applications processor is a system-on-chip that integrates one or more CPU cores with memory controllers, graphics engines, multimedia accelerators, and a wide peripheral set onto a single die. The i.MX 6 family sits in the high-tier of the ARM Cortex-A class, positioned below server-class SoCs but well above microcontroller units (MCUs) in raw compute and multimedia capability. The hierarchy is: applications processor -> microprocessor -> integrated circuit -> semiconductor device. Key features of the MCIMX6D6AVT10AC include dual ARM Cortex-A9 cores with NEON SIMD and FPU, hardware 2D/3D graphics (GPU3D, GPU2D, OpenVG via separate IP blocks), a multi-format hardware video codec engine (VPU) supporting 1080p30 decode, dual-display controllers (LCDIF + HDMI/eLCDIF), dual Gigabit Ethernet with AVB, two USB 2.0 OTG ports, three SDIO/MMC ports, PCIe 2.0, SATA-II, and a 64-bit DDR3/LVDDR3 memory controller. The SoC uses smart speed technology to dynamically voltage-scale the cores. The architecture partitions power into separate domains for the CPUs, GPU, and peripherals, enabling fine-grained power gating. The on-chip image processing unit (IPU) and a hardware camera sensor interface (CSI) make it well suited to multimedia-rich automotive head units and industrial HMI panels. Typical applications include automotive infotainment head units, rear-seat entertainment, industrial human-machine interfaces (HMIs), medical patient-monitoring displays, smart-home control panels, and digital signage media players. The part is AEC-Q100 oriented, so it is commonly chosen for cabin-mounted electronics with strict thermal derating requirements. When designing with the FCBGA-624 package, allocate at least 4 layers with continuous GND stitching under the package, and follow NXP hardware design guide for DDR3 routing to avoid signal-integrity issues. Match the system's boot-mode strapping to the chosen boot source (NAND/NOR/SD/eMMC/QSPI) before bringing up the board. This page synthesizes the NXP i.MX 6 reference manual, distributor pricing data, and pin-compatible drop-in alternatives within the i.MX family - information not consolidated in any single datasheet chapter.

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MCIMX6DP6AVT1AA - i.MX6DualPlus 1GHz Dual A9 MPU | NXP
MCIMX6DP6AVT1AA

MCIMX6DP6AVT1AA - i.MX6DualPlus 1GHz Dual A9 MPU | NXP

The NXP MCIMX6DP6AVT1AA is a 32-bit dual-core ARM Cortex-A9 microprocessor from the i.MX 6DualPlus family, running up to 1.0 GHz, housed in a 624-pin FCBGA (21x21 mm, 0.8 mm pitch) package. It is the dual-core variant of the i.MX6 series that is pin-compatible with a broad range of i.MX 6 processors (Dual, DualPlus, Quad, QuadPlus) on the same FCBGA-624 footprint, allowing scalable single-PCB designs across product tiers. An applications processor is a system-on-chip (SoC) class integrated circuit designed to run an operating system (typically Linux or Android) and execute complex user applications, as opposed to a microcontroller that typically runs bare-metal or a small RTOS. Within the broader taxonomy, the i.MX6DualPlus sits in the chain: applications processor -> multimedia processor -> ARM Cortex-A based SoC -> NXP i.MX family -> NXP Layerscape/i.MX product portfolio. It integrates the CPU cores, GPU, display controllers, and memory interfaces that historically required several discrete ICs. Key features include dual ARM Cortex-A9 cores with NEON SIMD and VFPv3, an enhanced GC2000-series GPU for OpenGL ES 3.0 and OpenCL, dual-stream 1080p video decode/encode, LVDS and MIPI-DSI display outputs, and three memory controller options (LPDDR2, DDR3L, DDR3). According to NXP product information, this variant carries the automotive temperature grade and is qualified for AEC-Q100-style harsh-environment use, making it suitable for in-vehicle infotainment, cluster, and telematics platforms. The architecture uses a heterogeneous multi-core approach with the Cortex-A9 cores connected via an ARM NIC-301 interconnect to L2 cache, multimedia accelerators, and a wide peripheral set including USB, PCIe, SATA, Gigabit Ethernet, and multiple SD/eMMC controllers. The 'Plus' suffix denotes the upgraded GPU/memory subsystem versus the earlier i.MX6Dual, while remaining software-compatible at the BSP level. Typical applications include automotive infotainment head units, industrial human-machine interfaces (HMIs), digital signage, point-of-sale terminals, and patient-side medical terminals. The 1 GHz speed grade and the dual-core configuration deliver enough headroom to drive two independent displays concurrently. When designing with this device, ensure the PCB uses the 21x21 mm, 0.8 mm pitch FCBGA land pattern, route matched-length DDR3 traces, and provide a clean 1.35 V/1.5 V core supply. The part is marked NRND on the NXP product page; verify lifetime and recommended replacements before new designs.

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MCIMX6G0DVM05AA - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP
MCIMX6G0DVM05AA

MCIMX6G0DVM05AA - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP

The NXP MCIMX6G0DVM05AA is a member of the i.MX 6UltraLite family of applications processors, integrating a single ARM Cortex-A7 core running at up to 528 MHz in a 289-ball MAPBGA package measuring 14x14 mm. The part is supplied by a 3.3 V primary rail and is targeted at cost-sensitive, power-efficient embedded applications requiring a Linux-capable 32-bit MPU. An applications processor (AP) is a system-on-chip (SoC) class device that combines a CPU core, memory controllers, and a rich set of peripheral interfaces into a single IC, enabling compact and low-power designs for human-machine interfaces, connected devices, and industrial control systems. The i.MX 6UltraLite sits within NXP's i.MX 6 hierarchy as the entry-level variant optimized for low-power applications, below the dual-core i.MX 6DualLite and the higher-performance i.MX 6Quad families. Key features include a 32-bit ARM Cortex-A7 core with NEON and FPU support, 32 KB instruction and 32 KB data L1 caches, 128 KB L2 cache, and integrated power management. The peripheral set includes two USB 2.0 controllers with PHY, two CAN-FD interfaces, multiple UART/SPI/I2C instances, and an LCD controller supporting up to WXGA resolutions. Hardware accelerators for cryptography (CAAM) and image processing (PXP) reduce CPU load for security and graphics tasks. Architecturally, the device uses a Cortex-A7 single-core complex with a coherent system bus and an integrated L2 cache controller. The Cortex-A7 implements out-of-order issue with in-order pipeline for balanced performance and power. The SoC integrates wide I/O voltage tolerance and a flexible pin mux (IOMUXC) that allows nearly any peripheral function to be routed to most balls, simplifying board routing. Typical applications include industrial human-machine interfaces (HMI), connected IoT gateways, building automation controllers, point-of-sale terminals, e-readers, smart appliances, and low-cost Linux-based IoT edge nodes. The combination of low power consumption, broad peripheral set, and mature Linux/FreeRTOS support makes it a common choice for brownfield industrial upgrades. When designing with this MPU, allocate a generous PCB copper pour beneath the MAPBGA and follow NXP's AN4589 layout guidelines for high-speed signal integrity, DDR3L routing, and decoupling. Validate thermal performance under sustained CPU load since Cortex-A7 cores can draw significantly more current than the typical application note figures suggest. This page consolidates distributor pricing, drop-in alternatives from the i.MX 6UltraLite family, and practical design notes that go beyond the manufacturer datasheet to help engineers select, source, and integrate this MPU into cost-sensitive Linux designs.

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MCIMX6G1AVM05AA - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP
MCIMX6G1AVM05AA

MCIMX6G1AVM05AA - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP

The NXP Semiconductors (formerly Freescale) MCIMX6G1AVM05AA is an i.MX 6UltraLite applications processor built around a single ARM Cortex-A7 core operating up to 528 MHz, housed in a 289-pin MAP-BGA (14x14 mm) package. It integrates an advanced power management subsystem, dual HS USB 2.0 OTG controllers with integrated PHY, eMMC 4.5/5.0 interface, MMC 4.4/4.5/5.0, and a rich set of connectivity peripherals tailored for cost-sensitive embedded designs. An applications processor (AP) is a system-on-chip (SoC) designed to run an operating system and execute application code for connected, human-machine, or industrial products. Within NXP's i.MX portfolio, the i.MX6UL sits in the power-efficient tier between the Cortex-M class microcontrollers and the high-performance Cortex-A9/A53 i.MX6/7 families, making it the typical choice for HMI panels, IoT gateways, and connected appliances where MIPS-per-watt dominates the BOM. Key features include the ARM Cortex-A7 single-core up to 528 MHz with 32 KB I-cache and 32 KB D-cache, NEON SIMD media engine, hardware floating-point unit, 128 KB on-chip SRAM, 2D GPU (PxP) for blit/rotate/composition, dual USB 2.0 OTG with integrated PHY, 2x Ethernet (10/100 with IEEE 1588), 2x CAN, 2x SD card/eMMC controllers, 4x SPI, 4x I2C, 2x I2S/SAI audio interfaces, 12-bit ADC, and a temperature range of -40C to +105C for automotive and industrial deployments. The chip is manufactured on a 40 nm low-power CMOS process, enabling the typical 0.25 W active power envelope that places it below Cortex-A9-class competitors while retaining a full Linux/Android-capable application core. The integrated PMU with DVFS and per-domain power gating further reduces deep-sleep current to single-digit milliamps, which is critical for battery-backed IoT nodes. Typical applications include industrial HMI panels, IoT edge gateways, home automation gateways, e-metering / smart energy, connected medical peripherals, automotive infotainment entry, and ruggedized handheld terminals. The 289-MAPBGA package provides robust thermal headroom for fanless enclosures. Design consideration: the 289-BGA requires careful 6/6 mil via-in-pad and microvia stackup planning on 4+ layer PCBs to avoid solder joint fatigue. Pair the processor with DDR3L (not DDR4) memory for validated timing closure. This page synthesizes distributor pricing, AEC-Q100/automotive qualification status, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet summary alone.

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MCIMX6G1AVM07AA - i.MX 6UltraLite ARM Cortex-A7 MPU 696MHz 289-BGA | NXP
MCIMX6G1AVM07AA

MCIMX6G1AVM07AA - i.MX 6UltraLite ARM Cortex-A7 MPU 696MHz 289-BGA | NXP

The NXP MCIMX6G1AVM07AA is a member of the i.MX 6UltraLite (i.MX 6UL) microprocessor family that integrates a single ARM Cortex-A7 core running up to 696 MHz in a 289-ball LFBGA package. It targets power-efficient embedded applications with 32-bit processing, NEON media acceleration, and a rich set of industrial peripherals, while maintaining low active power and a wide industrial temperature range. A microprocessor (MPU) is a System-on-Chip (SoC) that integrates a CPU core, memory interfaces, and peripheral controllers into a single device, sitting one level above microcontrollers (MCUs) in the embedded hierarchy. An ARM Cortex-A7 core belongs to the ARMv7-A application-processor family, supporting a 32-bit instruction set, MMU, and an optional NEON SIMD engine; compared to Cortex-M cores it delivers substantially higher throughput at the cost of higher power and complexity, making it suitable for Linux-based products rather than bare-metal designs. Key features of the MCIMX6G1AVM07AA include the single Cortex-A7 core with NEON and FPU, hardware cryptography acceleration (CAAM), two USB 2.0 controllers (one with integrated HS PHY), dual 10/100-Mbit Ethernet MACs with IEEE 1588 support, an LCD controller, 8-bit parallel CIF camera interface, and a flexible pin-multiplexed I/O set. The device integrates 128 KB of on-chip OCRAM and supports DDR3 / DDR3L / LPDDR2 external memory up to 2 GB. Architecture-wise, the i.MX 6UltraLite is built on a 40 nm low-power CMOS process and uses NXP's Smart Power Management architecture, achieving the performance-per-watt profile required for fanless industrial designs. Multiple clock domains and integrated voltage regulators allow dynamic frequency scaling and granular peripheral gating, which is why the family is widely deployed in battery-tolerant or thermally constrained products. Typical applications include industrial human-machine interfaces (HMIs), low-end point-of-sale terminals, smart energy / metering endpoints, building automation gateways, and cost-sensitive connected IoT nodes. The wide operating temperature range, Linux BSP support (Yocto, Buildroot), and the 14x14 mm 289-LFBGA footprint also make it suitable for compact, ruggedised embedded boards. Designers should note that the V suffix in the part number denotes a 289-BGA (LFBGA) package without on-package DRAM, requiring PCB layout to standard DDR3 / LPDDR2 routing rules. Decoupling, BGA escape routing, and 4-layer stack-up with controlled-impedance layers are recommended for first-pass success.

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MCIMX6G1CVM05AA - i.MX 6UltraLite ARM Cortex-A7 MPU, 528MHz | NXP
MCIMX6G1CVM05AA

MCIMX6G1CVM05AA - i.MX 6UltraLite ARM Cortex-A7 MPU, 528MHz | NXP

The NXP Semiconductors MCIMX6G1CVM05AA is a 32-bit applications processor from the i.MX 6UltraLite family, integrating a single ARM Cortex-A7 core running up to 528 MHz and housed in a 289-ball MAPBGA package measuring 14x14 mm. An applications processor (AP) is a system-on-chip (SoC) class of microprocessor designed to run a high-level operating system such as Linux, Android, or Windows Embedded while handling rich user interfaces, multimedia pipelines, and connectivity stacks. Within the wider taxonomy, the MCIMX6G1CVM05AA sits in the i.MX 6UltraLite family -> i.MX 6 series -> ARM Cortex-A applications processors -> microprocessors (MPU) -> integrated circuits. The Cortex-A7 core implements the ARMv7-A architecture with NEON SIMD, single-precision FPU, and TrustZone security extensions, delivering high performance per Watt for cost-sensitive industrial designs. Key features include a 528 MHz maximum CPU clock, an integrated 2D graphics processing unit (GPU) via the Pixel Processing Pipeline (PxP) for simple overlays and image scaling, and a wide set of on-chip peripherals: dual Ethernet MACs, dual USB 2.0 with PHY, dual CAN-FD, multiple UART/SPI/I2C, and an integrated analog block. The part also exposes LPDDR2/DDR3/DDR3L memory controller and parallel display interfaces (RGB and LVDS bridges). From an architectural standpoint, the i.MX 6UltraLite leverages NXP's heterogeneous multicore approach but in a single-core Cortex-A7 implementation, allowing deterministic real-time behavior on one core while leaving room for a Cortex-M4 companion in higher-tier variants. The device is built on a low-power 40 nm process and supports dynamic voltage and frequency scaling (DVFS) with multiple low-power states to fit battery-powered and thermally constrained products. Typical applications include industrial human-machine interfaces (HMI), IoT gateways, smart energy and metering systems, point-of-sale (POS) terminals, building automation controllers, and low-end connected printers. The part's mix of Ethernet, CAN-FD, and display interfaces makes it a common choice when engineers need Linux-level compute with industrial-grade connectivity. When designing with this device, allocate adequate PCB area for the MAPBGA 14x14 mm footprint, ensure LPDDR2/DDR3 trace lengths are matched for signal integrity, and follow NXP's Hardware Development Guide for the i.MX 6UltraLite family to avoid boot-mode pitfalls. This page synthesizes distributor pricing, same-family drop-in variants, and practical design considerations not found in the manufacturer datasheet alone, helping engineers compare the MCIMX6G1CVM05AA against other i.MX 6UltraLite and competing Cortex-A7 MPUs.

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MCIMX6G2CVK05AA-FR - i.MX6UL ARM Cortex-A7 MPU 528MHz | NXP
MCIMX6G2CVK05AA-FR

MCIMX6G2CVK05AA-FR - i.MX6UL ARM Cortex-A7 MPU 528MHz | NXP

The NXP MCIMX6G2CVK05AA-FR is an i.MX 6UltraLite (i.MX6UL) applications processor built on the ARM Cortex-A7 core running up to 528 MHz, packaged in a 272-ball MAPBGA (9x9 mm, 0.5 mm pitch). It integrates a single Cortex-A7 core with 32-bit datapath, NEON media engine, and a rich peripheral set for cost-sensitive embedded and IoT designs. An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU core, memory controller, graphics/video pipeline, and industrial peripherals on a single die. The i.MX6UL sits at the entry tier of the i.MX 6 family - below the i.MX 6SoloLite and i.MX 6Solo - targeting HMI, low-cost gateways, and battery-powered IoT nodes. Its role in the broader system hierarchy is: i.MX6UL -> Cortex-A7 class AP -> 32-bit applications microprocessor -> embedded SoC -> semiconductor IC. Key specifications include 528 MHz maximum CPU frequency, 16 KB L1 instruction cache + 16 KB L1 data cache, 128 KB L2 cache, support for LPDDR2/DDR3/DDR3L memory, dual USB 2.0 OTG controllers with integrated PHYs, two 12-bit ADCs (up to 10 channels), dual CAN-FD, and 1.2V/1.35V/1.5V/1.8V/2.5V/2.8V/3.3V I/O voltage support. The integrated security features include secure boot, high-assurance boot, and tamper detection suitable for industrial- and consumer-grade protection. The MCIMX6G2CVK05AA-FR is fabricated in a low-power 40 nm CMOS process enabling typical active power in the sub-500 mW range and deep-sleep currents suitable for always-on battery applications. The 272-MAPBGA package provides a thermal resistance suitable for industrial fanless enclosures. Typical applications include HMI panels, industrial IoT gateways, low-cost POS terminals, e-readers, smart appliances, building automation controllers, and portable medical devices. The Cortex-A7 core's ARMv7-A architecture with NEON makes it well suited for Linux/RTOS-based GUI stacks. When designing with this part, ensure proper PCB layer stack-up for the 0.5 mm BGA escape routing and provide adequate decoupling on the multi-rail power domains. The wide I/O voltage support allows direct connection to 1.8V or 3.3V peripherals without level shifters. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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MCIMX6G2CVM05AA-FR - i.MX 6UltraLite 528MHz Cortex-A7 MPU | NXP
MCIMX6G2CVM05AA-FR

MCIMX6G2CVM05AA-FR - i.MX 6UltraLite 528MHz Cortex-A7 MPU | NXP

The NXP MCIMX6G2CVM05AA-FR is an i.MX 6UltraLite applications processor featuring a single-core ARM Cortex-A7 CPU running at up to 528 MHz, housed in a 289-ball MAPBGA package (14x14 mm) optimized for industrial-grade operating conditions. As a member of the NXP i.MX 6 family, this device integrates an advanced power management subsystem, multiple connectivity interfaces, and a rich set of peripherals, while consuming a fraction of the power of higher-tier i.MX parts. An applications processor (AP) is a system-on-chip (SoC) class of integrated circuit that combines one or more CPU cores, a memory controller, graphics/display pipelines where present, and a wide selection of on-chip peripherals into a single BGA-packaged die. The i.MX 6UltraLite sits in the entry-level portion of the i.MX 6 product hierarchy - positioned below the i.MX 6SoloLite, i.MX 6Solo, i.MX 6DualLite, and i.MX 6Quad families but above simple Cortex-M microcontrollers, offering a Linux-capable MPU at minimal BOM cost for connected edge devices. Key differentiating features of the MCIMX6G2CVM05AA-FR include 528 MHz Cortex-A7 compute, integrated 10/100 Ethernet MAC with deterministic performance for industrial protocols, USB 2.0 with integrated PHY, multiple UART/SPI/I2C/CAN controllers, a 12-bit ADC, and an external memory interface supporting DDR3/LPDDR2 memories. The industrial-grade variant (denoted by the C field) supports an extended -40C to +105C junction temperature range enabling deployment in factory automation, building controls, and other harsh environments. Architecturally, the device leverages ARM's Cortex-A7 core in single-core configuration with NEON and FPU optional extensions, paired with NXP's Smart DMA (SDMA) engine for peripheral offload and a hardware cryptography block (DCP) for secure boot and on-the-fly data encryption. This combination enables deterministic real-time response together with rich OS support (Linux, Windows Embedded, Android), making the part suitable for hybrid real-time + application workloads. Typical applications for the MCIMX6G2CVM05AA-FR include industrial HMI panels, IoT edge gateways, smart energy metering, building automation controllers, medical point-of-care devices, and connected white goods. The low-power design supports battery-backed or energy-harvesting scenarios where sleep-mode current directly impacts total cost of ownership. When designing with this MPU, allocate PCB layer stack and via-in-pad geometry for the 0.8 mm pitch 289-BGA, place the DDR3/LPDDR2 memories within the package's strict trace-length budget, and budget thermal dissipation assuming the industrial -40C to +105C junction envelope. A four-layer board with a continuous ground plane beneath the BGA is the typical minimum starting point. This page synthesizes distributor availability, Rochester Electronics franchise stock, drop-in same-package alternatives within the i.MX 6UL family, application circuits, and practical PCB/thermal design notes not consolidated in the manufacturer datasheet.

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MCIMX6G2CVM05AB - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP
MCIMX6G2CVM05AB

MCIMX6G2CVM05AB - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP

The NXP Semiconductors MCIMX6G2CVM05AB is a 32-bit ARM Cortex-A7 applications processor from the i.MX 6UltraLite family, integrating a single core running at up to 528 MHz in a 289-pin MAPBGA (14x14 mm) package. The device features an integrated power management module that simplifies sequencing, supports 16-bit LPDDR2/DDR3/DDR3L memory interfaces, and exposes a wide peripheral set including NAND/NOR flash, eMMC, Quad SPI NOR, SD, USB, Ethernet, and multiple UART/SPI/I2C channels. Industrial temperature grade (-40C to +105C) is part of the silicon bill of materials. An applications processor (AP) is a system-on-chip (SoC) class device that integrates one or more CPU cores with on-chip memory controllers, graphics accelerators, and a broad peripheral mix so that a single IC can serve as the host of an embedded product. The i.MX6UL sits in the low-power, low-cost tier of the NXP i.MX family, optimized for fanless, battery-friendly designs that still need Cortex-A7 performance. Within the broader taxonomy, i.MX6UL is an applications processor -> microprocessor unit (MPU) -> SoC -> semiconductor IC. Key differentiators of the MCIMX6G2CVM05AB include the Cortex-A7 core with Neon SIMD and single-precision FPU, hardware crypto acceleration (optional per SKU suffix), the integrated PMU that reduces external regulator count, and the 14x14 mm MAPBGA footprint that allows dense 4-layer PCB routing. The 528 MHz speed grade ('05' in the part number) targets cost-sensitive HMI, gateway, and IoT edge nodes where higher-speed 6ULL parts would be over-specified. Architecturally, the i.MX6UL couples the Cortex-A7 cluster with a 32 KB I-cache / 32 KB D-cache L1 subsystem and a unified 128 KB L2 cache, plus on-chip OCRAM, and an LCDIF pixel pipeline. The 'G2' SKU in the i.MX6UL family denotes specific peripheral fuse-blow options (no security, no GPU); 'AB' denotes the 289-MAPBGA industrial package. Typical applications include industrial HMI panels, IoT gateways, home automation controllers, point-of-sale terminals, and low-cost automotive telematics modules where AEC-Q100 qualification is not required. Designers also use this part as a cost-down replacement for i.MX6ULL when 528 MHz is sufficient. Design considerations include careful MAPBGA fan-out (8-layer PCB recommended for DDR3 routing), thermal management at the 528 MHz operating point, and choosing the matching PF3000 or PF0100 PMIC. The integrated power management module does not remove the need for a companion PMIC. This page synthesizes distributor pricing, drop-in i.MX6UL family alternatives, and PCB/layout design notes not consolidated on the NXP product folder.

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MCIMX6G2DVK05AA - i.MX6UL 528MHz Cortex-A7 MPU 272-MAPBGA | NXP
MCIMX6G2DVK05AA

MCIMX6G2DVK05AA - i.MX6UL 528MHz Cortex-A7 MPU 272-MAPBGA | NXP

The NXP MCIMX6G2DVK05AA is a 32-bit ARM Cortex-A7 microprocessor from the i.MX 6UltraLite (i.MX6UL) family, operating at up to 528 MHz and housed in a 272-pin MAPBGA (9x9 mm) package. Per NXP's product page and DigiKey listing, this MPU integrates a single Cortex-A7 core with 32 KB I-cache and 32 KB D-cache, 128 KB L2 cache, and on-chip RAM (OCRAM) of up to 160 KB, targeting low-power embedded applications at 1.8 V / 2.8 V / 3.3 V rails. An application processor (AP) is a system-on-chip (SoC) class IC that integrates a CPU core, memory controller, graphics/video pipeline, and a rich peripheral set into a single die. APs sit at the top of the embedded hierarchy: microcontroller -> microprocessor (MPU) -> application processor -> SoC, and are used when workloads exceed the capability of typical MCUs - including multimedia HMI, industrial control, and connected IoT gateways. The i.MX 6UltraLite family specifically targets cost- and power-sensitive designs that previously used MCUs but require Cortex-A class Linux capability. Key features include hardware encryption (AES, SHA, DES/3DES), two 12-bit ADCs (up to 10 input channels each), two 12-bit DACs, two USB 2.0 controllers (one with HS PHY), two CAN-FD ports, two Gigabit-capable Ethernet MACs (one with 1588 timestamp), and an LCD controller supporting up to WXGA resolution. The integrated power management unit supports dynamic voltage and frequency scaling (DVFS) and multiple low-power modes (Run, Wait, Stop, Deep Sleep, Power Down). Architecture highlights: the Cortex-A7 core delivers ARMv7-A compatibility with NEON SIMD and FPU, manufactured on a 40 nm low-power process. The unified L2 cache and dual 32-bit DDR3/LPDDR2 memory controller deliver up to 6.4 GB/s peak bandwidth. Hardware virtualization and TrustZone security extensions are supported, enabling secure boot and isolated execution environments. Typical applications include industrial HMI panels, IoT gateways, smart energy meters, building automation controllers, point-of-sale terminals, portable medical monitoring, and low-end multimedia consoles. The wide peripheral mix makes the part well-suited for systems requiring Ethernet, CAN, USB, and LCD in a single chip. When designing with this MPU, ensure proper PCB stack-up for the 272-pin MAPBGA - NXP recommends a 4+ layer board with microvia-in-pad for the exposed die-pad (EP) for thermal dissipation. DDR3/LPDDR2 routing requires length-matched fly-by topology and proper termination per JEDEC JESD79-3F; signal integrity simulations should be run before tape-out. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers evaluate second-source options, lifecycle risk, and PCB layout considerations in one place.

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MCIMX6G2DVK05AA557 - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP
MCIMX6G2DVK05AA557

MCIMX6G2DVK05AA557 - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP

The NXP MCIMX6G2DVK05AA557 is an ARM Cortex-A7 based i.MX 6UltraLite microprocessor IC operating at up to 528 MHz, packaged in a 272-ball MAPBGA (9x9 mm). It integrates a single 32-bit core with the i.MX6UL application processor architecture, optimized for low-power embedded designs including HMI, IoT gateways, and industrial control. An applications processor (AP) is a system-on-chip (SoC) class device that integrates a CPU core, memory controller, and a broad set of peripheral interfaces into a single package. Within the broader hierarchy, this part is a microprocessor unit (MPU) — a CPU-centric IC without on-chip flash — which sits inside the embedded processing category alongside microcontrollers (MCUs) and digital signal processors (DSPs). The i.MX6UL family specifically targets cost-sensitive, power-constrained applications where Linux or other rich operating systems are required but high-end graphics are not. Key features include a 528 MHz Cortex-A7 core with NEON media engine, 32-bit data path, integrated L1 cache, and support for DDR3/DDR3L/LPDDR2 external memory. Peripherals include USB OTG, multiple UART/SPI/I2C, dual CAN, dual Ethernet (10/100 Mbps), LCD controller, and a hardware security module for secure boot. Power management features enable sub-mW standby currents for battery-powered operation. The i.MX6UL architecture pairs the Cortex-A7 with an LCDIF display controller, eMMC 4.5/SD 3.0 interfaces, and NXP's hardware cryptographic accelerator, giving designers a single-chip solution for connected, secure, and graphically rich edge devices. Industrial temperature grade and long-term NXP supply commitment make it suitable for products with 10+ year lifecycles. Typical applications include industrial HMI panels, smart energy metering, building automation controllers, portable medical devices, and IoT edge nodes. The integrated LCD controller and Ethernet MACs enable direct connection to TFT displays and industrial networks without external bridge chips. When designing with this MPU, allocate sufficient PCB area for the 272-ball MAPBGA (9x9 mm) and follow NXP reference design guidelines for DDR3 routing, power decoupling, and thermal management. Boot configuration strapping pins must be set correctly for the desired boot source (SD, eMMC, or serial download). This page synthesizes distributor pricing, parametric alternatives, and practical design considerations drawn from the NXP i.MX 6UltraLite datasheet and reference manuals — content not assembled on the manufacturer product page or single distributor listing.

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MCIMX6G2DVM05AA - i.MX 6UL ARM Cortex-A7 528MHz MPU | NXP
MCIMX6G2DVM05AA

MCIMX6G2DVM05AA - i.MX 6UL ARM Cortex-A7 528MHz MPU | NXP

The NXP MCIMX6G2DVM05AA is a 32-bit applications microprocessor from the i.MX 6UltraLite family, integrating a single ARM Cortex-A7 core running up to 528 MHz in a 289-pin MAPBGA package (14x14 mm). It is designed for cost-sensitive, power-efficient embedded applications where an industrial-grade operating range is required. An applications processor (AP) is a system-on-chip (SoC) class microprocessor optimized for running a full operating system (typically Linux) with rich peripherals. Within the broader taxonomy, this device sits at: applications processor -> microprocessor unit (MPU) -> integrated circuit -> semiconductor. The i.MX 6UltraLite family targets industrial HMI, IoT gateways, and low-cost connected devices that need Cortex-A application-class compute without the multimedia acceleration of higher-tier i.MX parts. Key features include a single ARM Cortex-A7 core at 528 MHz with 32 KB L1 instruction cache and 32 KB L1 data cache, NEON media acceleration, and integrated LCD controller supporting up to WXGA resolution. The SoC provides dual Ethernet (10/100 Mbps with IEEE 1588), dual USB 2.0 with PHY, dual CAN-FD, multiple UART/SPI/I2C interfaces, and a 12-bit ADC. Power management integrates an internal LDO and DC-DC controller for low-power standby. The architecture combines an ARM Cortex-A7 application core with NEON SIMD for multimedia codecs, a separate Cortex-M4-style sensor processing subsystem is absent on this 6UL part. Memory interface supports 16-bit LPDDR2/DDR3/DDR3L at up to 400 MHz. Hardware security includes secure boot, high assurance boot (HAB), and on-chip SRAM for cryptographic keys. Typical applications include industrial IoT gateways, building automation controllers, HMI panels, point-of-sale terminals, smart energy meters, and portable medical devices. The 528 MHz Cortex-A7 offers sufficient throughput for Linux-based GUI stacks while consuming under 500 mW typical. When designing with this part, ensure proper DDR routing with matched impedance and reference the NXP hardware design guide for the MAPBGA escape. Decoupling requires 100 nF capacitors near each VDDCORE pin and bulk capacitance on the DC-DC output. This page synthesizes distributor pricing from Rochester Electronics, NXP EOL notice status, drop-in same-package alternatives within the i.MX 6UL family, and practical design notes not collated in the manufacturer datasheet.

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MCIMX6G3DVK05AA - i.MX6UL 528MHz A7 MPU, 272-MAPBGA | NXP
MCIMX6G3DVK05AA

MCIMX6G3DVK05AA - i.MX6UL 528MHz A7 MPU, 272-MAPBGA | NXP

The NXP MCIMX6G3DVK05AA is a single-core ARM Cortex-A7 microprocessor IC from the i.MX 6UltraLite (i.MX6UL) family, running at up to 528 MHz with a 32-bit datapath, integrated into a 272-ball MAPBGA (9 mm x 9 mm) package. It targets cost- and power-sensitive industrial HMI, IoT gateways, and connected consumer devices that need deterministic real-time response with Linux support. What is an application processor? An application processor is a system-on-chip (SoC) microprocessor that integrates one or more CPU cores, a memory controller, peripheral interfaces (Ethernet, USB, CAN, UART, SPI, I2C, I2S, display/LCD, and ADC), and security blocks in a single device. Within the embedded taxonomy, an application processor sits above a microcontroller (MCU) in capability - delivering higher compute, MMU-based Linux support, and richer peripherals - while remaining below a multicore communications SoC. The i.MX6UL belongs to NXP's i.MX family of ARM-based application processors, positioned between the lower-power Cortex-M based crossover MCUs and the higher-end i.MX 6/7/8 Cortex-A series. Key features of the MCIMX6G3DVK05AA include a Cortex-A7 core with Neon media engine and FPU, integrated L1 cache, support for DDR3/LPDDR2 memory, an LCD controller, dual 10/100 Ethernet MACs with IEEE 1588 support, two USB 2.0 controllers with PHY, up to two CAN-FD interfaces, secure boot with HABv4, and advanced power management with multiple low-power modes. The 272-MAPBGA package integrates the entire processor plus its supply rails, allowing compact four-layer PCB designs. Architecturally, the i.MX6UL combines a Cortex-A7 cluster running Linux with an Arm Cortex-M4 coprocessor-style domain (select SKUs), a 2D graphics engine (PXP), and dedicated hardware acceleration blocks for encryption and secure boot. The 528 MHz operation yields deterministic interrupt latency under 100 ns in real-time extensions, while typical active power stays under 500 mW at full load with all peripherals enabled. Typical applications include industrial HMI terminals, smart energy and metering gateways, building automation controllers, IoT edge nodes, point-of-sale terminals, and connected medical devices. The wide peripheral set (dual Ethernet, CAN-FD, USB, LCD) plus Linux/RTOS support makes it a strong fit for protocols like MQTT, OPC-UA, and BACnet. When designing with this part, pay close attention to PCB stack-up, decoupling, and DDR3/LPDDR2 routing; matched-impedance memory traces and a 4-layer board with continuous ground are recommended for signal integrity at 528 MHz. For designs requiring hardware cryptography, configure the HAB and SNVS blocks early in your Bring-Up sequence per the i.MX6UL reference manual. This page synthesizes NXP datasheet values, distributor pricing, drop-in same-brand alternatives, and PCB-level design guidance not duplicated on a standard product page.

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