5CSXFC6C6U23C8N vs 5CSXFC6C6U23C8NES 比較
詳細な並列比較: 5CSXFC6C6U23C8N メーカー: Intel および 5CSXFC6C6U23C8NES メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | 5CSXFC6C6U23C8N | 5CSXFC6C6U23C8NES |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $445.00 | $195.00 |
| Family | Cyclone V SX (SoC FPGA) | Cyclone V SX |
| Series | Cyclone V SX | — |
| Architecture | MCU + FPGA (Hard Processor System + FPGA fabric) | — |
| Logic Elements | 110,000 | 110,000 |
| Process Technology | 28 nm low-power (TSMC) | — |
| Core Voltage | 1.1 V | — |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| Processor Maximum Frequency | 600 MHz | — |
| HPS L1 Cache | 32 KB instruction + 32 KB data per core | — |
| HPS L2 Cache | 512 KB shared | — |
| DSP Blocks | Variable-precision DSP (number not specified in retrieved data) | — |
| Embedded Memory | M10K blocks (total Kbits [DATA_NEEDED: total embedded memory Kbits]) | — |
| Transceivers | Up to 3.125 Gbps integrated transceivers | — |
| Maximum User I/O | 145 user I/O (per DigChip summary; full count per package [DATA_NEEDED: package pinout max user I/O]) | — |
| Memory Controller | Hard controller supporting DDR2, DDR3, LPDDR2 | — |
| パッケージ | 672-pin UFBGA (UBGA), 23x23 mm | 672-pin UBGА (23x23 mm) |
| 実装タイプ | Surface Mount (BGA) | Surface Mount (BGA) |
| 動作温度 | -40C to +100C (industrial grade, code C) | — |
| MSLレベル | 3 (per JEDEC J-STD-020, typical for large BGA) | — |
| RoHS ステータス | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes (lead-free BGA; halogen status [DATA_NEEDED: halogen-free yes/no]) | — |
| Speed Grade | C8 (commercial speed grade 8) | 8 (commercial) |
| Lifecycle | Active (Cyclone V family in production) | — |
| Device Type | — | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Hard Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency (max) | — | 600 MHz |
| Process Node | — | 28 nm TSMC low-power |
| Embedded Memory (M10K + MLAB) | — | 5,140 Kbits (approx) |
| DSP Blocks (18x19 multipliers) | — | 112 |
| User I/O Pins | — | 224 |
| 動作接合温度 | — | 0C to +85C (commercial) |
| External Memory Interfaces | — | DDR2, DDR3, LPDDR2 |
| Hard PCIe Gen2 Controllers | — | 2 |