EP3SE260H780C2N vs EP3SE260H780C3N 比較
詳細な並列比較: EP3SE260H780C2N メーカー: Intel および EP3SE260H780C3N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP3SE260H780C2N | EP3SE260H780C3N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | ラストバイ | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $3,600.00 | $1,325.00 |
| Series | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | — |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | — |
| パッケージ | 780-BGA FCBGA | 780-BBGA, FCBGA (H780) |
| 実装タイプ | Surface Mount | Surface Mount |
| 動作温度範囲 | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| MSLレベル | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| RoHS ステータス | [DATA_NEEDED: rohs status] | Compliant (lead-free 'N' suffix) |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| User I/Os | — | 488 |
| Number of Pins / Balls | — | 780 |
| 動作温度 | — | 0 °C to +85 °C (C grade, commercial) |
| Process Technology | — | 40 nm CMOS |
| Maximum Core Frequency | — | [DATA_NEEDED: maximum core frequency MHz] |
| Supply Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal V] |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks and precision] |
| 湿気感度レベル（MSL） | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Configuration Method | — | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel |
| Design Toolchain | — | Altera Quartus II (legacy); Intel Quartus Prime |