XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
部品番号: XC6SLX75-3FGG676C ✓ 生産中XC6SLX75-3FGG676C 概要
An FPGA is a programmable logic device in which the digital interconnect and processing elements are configured at power-up from a bitstream held in external flash or configuration EEPROM. The Spartan-6 LX family sits in the Xilinx/AMD product hierarchy below Artix-7 and Kintex-7, and is positioned as a low-cost, high-volume platform for bridging, interface, and control logic rather than ultra-high-speed serial fabrics.
Key features of this device include a 27 mm x 27 mm FBGA-676 package on a 1 mm ball pitch, 408 user I/O for high connectivity, integrated Digital Clock Managers (DCM) and PLLs for clock generation and jitter cleanup, and hard DSP48A1 multipliers for signal-processing datapaths. The LX variant is logic-optimized, prioritizing logic density and I/O count over the high-speed serial transceivers found in the LXT line.
Technically, the XC6SLX75-3FGG676C is a 45 nm FPGA whose logic fabric is built from 4-input LUT-based CLBs. Third-party listings for this device cite internal frequency figures of 400 MHz, 667 MHz, and 862 MHz depending on the metric quoted (logic maximum, DSP, or memory performance); the authoritative per-clock-domain Fmax tables should be taken from the manufacturer data sheet for the exact speed grade.
Typical applications include automotive infotainment and cluster bridging, industrial automation and factory control, consumer set-top and video scaling, industrial networking gateways, and general-purpose embedded control platforms that need abundant parallel I/O.
The key design consideration is ball-pitch and thermal compliance: FBGA-676 with 1 mm pitch requires a fine-pitch PCB layout with filled thermal vias under the package, and derating of junction temperature must be checked against the -3 speed grade power envelope in the datasheet.
This page consolidates distributor availability, package and pin-assignment references, verified parametric alternatives, and practical PCB and clocking design notes that are typically spread across the manufacturer data sheet, selector guides, and separate package documents.
ドロップイン代替品: XC6SLX75-3FGG676C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX75-3FGG676C （同一形状・フットプリント） — 相違点: Logic Cells, Speed Grade, Ball Pitch, Device Type, Mounting Type.
XC6SLX75-3FGG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX75-N3FGG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX75-2FGG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX75T-3FGG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX75-3FGG676E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC6SLX75-3FGG676C 最大定格＆電気的特性
| Device Type | FPGA (Field Programmable Gate Array) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 74,637 |
| Configurable Logic Blocks (CLBs) | 5,831 |
| User I/O | 408 |
| DSP48A1 Slices | 132 |
| Block RAM | 3,096 Kbit |
| Internal Frequency | 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) |
| 電源電圧 | 1.14 V to 1.26 V |
| Process Technology | 45 nm CMOS |
| Speed Grade | -3 (highest performance grade) |
| 動作温度 | 0 C to 85 C (commercial) |
| Package Type | FBGA-676 (PBGA676) |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm ball pitch |
| 実装タイプ | Surface Mount |
| Clock Management | DCM and PLL present |
| Lead-Free | Yes |
| Automotive Grade (AEC-Q100) | Not qualified - commercial temperature grade |
| Maximum Package Pin Count | 676 balls |
XC6SLX75-3FGG676C 676 balls ピン配置ガイド
XC6SLX75-3FGG676C (676 balls パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX75-3FGG676C.
詳細は データシート をご参照ください。
主な用途
XC6SLX75-3FGG676C の用途: 6 件s: Automotive Infotainment System Bridging, Industrial Automation and Factory Control, Industrial Networking Gateway and Protocol Bridge, Consumer Video Scaling and Display Processing, Data Acquisition and Signal Conditioning Front End, General-Purpose Embedded Control Platform.
Automotive Infotainment System Bridging
The XC6SLX75-3FGG676C suits automotive infotainment head-unit bridging because it offers 408 user I/O in a single device, enough to aggregate legacy parallel display, touch, and audio control buses alongside a processor interface without adding a second logic device. The 132 DSP48A1 slices handle audio mixing and video scaling filtering, while the 45 nm Spartan-6 LX fabric closes timing on control logic at the -3 speed grade. Note that the commercial 0 C to 85 C part is not AEC-Q100 qualified, so the XC6SLX75-3FGG676I or the E-grade variant should be evaluated for vehicle cabin positions, while the FBGA-676 1 mm pitch footprint demands a via-in-pad PCB layout.
おすすめ
Industrial Automation and Factory Control
In PLC and factory-floor control designs, the XC6SLX75-3FGG676C combines a deterministic parallel I/O budget of 408 with 5,831 CLBs of programmable logic, which allows motion-control timing and interlock logic to be consolidated into one device alongside safety-rated monitoring. The 3,096 Kbit of block RAM supports event logging and data buffering, and the DSP48A1 slices can implement PID loops or vibration analysis without external DSP silicon. The 27 mm x 27 mm FBGA-676 package keeps the board area manageable, but designers must reserve a via array under the die for heat spreading and keep the -3 grade junction temperature within the published power envelope, especially in sealed enclosures.
おすすめ
Industrial Networking Gateway and Protocol Bridge
The XC6SLX75-3FGG676C fits networking gateways that must terminate several interface standards simultaneously, because its 408 I/O can host parallel Ethernet PHY management, serial protocols, and legacy field-bus transceivers in a single fabric. Block RAM of 3,096 Kbit supports packet buffering and protocol translation tables, and the integrated DCM and PLL resources provide the jitter-controlled clocks required for deterministic serial links. Because the LX device omits high-speed serial transceivers, the design must pair it with external SerDes or Ethernet PHY hardware, so a LX-to-LXT decision (XC6SLX75T-3FGG676C) is worth revisiting if the gateway needs integrated GTX lanes.
おすすめ
Consumer Video Scaling and Display Processing
For video scaling, picture-format conversion and multi-screen display boards, the XC6SLX75-3FGG676C delivers 74,637 logic cells and 132 DSP48A1 slices that can absorb pixel-rate datapaths, de-interlacing and colour-space conversion without offloading to an ASIC. Its 408 I/O is generous enough to drive multiple parallel LVDS or digital DVI/HDMI bridge interfaces alongside a control MCU link. The 1.14 V to 1.26 V core supply keeps board power lower than older 90 nm FPGA generations, though the FBGA-676 1 mm pitch layout requires microvia escape routing and careful LVDS pair matching, and the -3 speed grade should be used only where the video pipeline needs the extra timing margin.
おすすめ
Data Acquisition and Signal Conditioning Front End
The XC6SLX75-3FGG676C is a strong fit for multi-channel data acquisition front ends because the 132 DSP48A1 slices can implement digital filters, windowing and FFT stages for sensor conditioning, while 3,096 Kbit of block RAM holds sample buffers and the 408 I/O accepts parallel ADC data and digital sensor buses. DCM and PLL resources generate the low-jitter sampling clock required for accurate conversion. Because the DSP slices are hard multiplier blocks, the design must budget multiplier usage carefully against the 132 available, and the FBGA-676 package thermal path demands a solid ground-pour and via array to hold junction temperature within limits during sustained high-rate sampling.
おすすめ
General-Purpose Embedded Control Platform
The XC6SLX75-3FGG676C supports embedded control platforms where a microcontroller plus discrete logic is being consolidated into a single programmable device: 5,831 CLBs absorb glue logic, timers and state machines, while 408 I/O can drive displays, keypads and industrial outputs directly. The 45 nm Spartan-6 LX silicon draws significantly less power than equivalent 90 nm FPGAs, which suits battery or fanless systems, and the -3 speed grade provides margin for soft-processor cores running from block RAM. For a complete embedded control node, a USB or serial bridge can be added from the companion list, and the FBGA-676 footprint should be reviewed against the enclosure and assembly capability of the contract manufacturer.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX75-3FGG676C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX75-3FGG676I | XC6SLX75-N3FGG676C | XC6SLX75-2FGG676C | XC6SLX75T-3FGG676C | XC6SLX75-3FGG676E |
|---|---|---|---|---|---|---|
| Package | FBGA-676 (FGG676), 1.0 mm pitch | FBGA-676 (FGG676) - same | FBGA-676 (FGG676) - same | FBGA-676 (FGG676) - same | FBGA-676 (FGG676) - same | FBGA-676 (FGG676) - same |
| Brand | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) |
| Logic Cells | 74,637 | 74,637 | 74,637 | 74,637 | 74,637 | 74,637 |
| User I/O | 408 | 408 | 408 | 408 | 348 | 408 |
| Speed Grade | -3 (highest performance) | -3 | -3 / -3N class | -2 (slower) | -3 | -3 |
| Operating Temperature | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) | Commercial class -3N | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (extended) |
| Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Block RAM | 3,096 Kbit | 3,096 Kbit | 3,096 Kbit | 3,096 Kbit | 3,096 Kbit | 3,096 Kbit |
| DSP48A1 Slices | 132 | 132 | 132 | 132 | 132 | 132 |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
主な差別化要因
- Highest-performance Spartan-6 LX speed grade with the densest logic budget in the family （vs XC6SLX75-2FGG676C)
- 408 user I/O versus 348 on the LXT alternative, plus 5,831 CLBs for pure logic density （vs XC6SLX75T-3FGG676C)
- Full 132-slice DSP48A1 datapath and 3,096 Kbit of block RAM on a single die （vs XC6SLX75-2FGG676C)
- Same-footprint industrial upgrade path without a PCB respin （vs XC6SLX75-3FGG676I)
設計ノート
The FBGA-676 (FGG676) package uses a 1.0 mm ball pitch across a 27 mm x 27 mm footprint, so every general-purpose signal must escape through a via-in-pad or microvia structure before it can reach a component with a usable lead pitch. Plan the stack-up with a dedicated buried or blind microvia layer directly under the device, keep differential and clock nets on contiguous reference planes, and avoid splitting planes under the ball array, since a return-path discontinuity under a high-speed clock net causes far worse jitter than the raw Fmax number suggests.
The -3 speed grade is the highest-performance Spartan-6 LX grade and correspondingly draws the most power. Route a dense array of thermal vias from the package ground balls into an internal ground plane and keep the top-layer copper free of keep-out voids in the die shadow. Estimated: at roughly 500 mW of device dissipation and a 1 mm-pitch FBGA with poor via density, junction temperature rise can exceed 30 C above ambient, so verify against the published theta-JA and theta-JC values in the manufacturer data sheet before committing to a sealed enclosure.
Do not substitute the XC6SLX75T-3FGG676C (LXT) for the XC6SLX75-3FGG676C (LX) without a pin-level review. The LXT variant lists 348 user I/O against 408 on the LX part and adds high-speed serial transceiver balls, so several general-purpose I/O balls are re-purposed. Similarly, the XC6SLX75-3FG676C variant uses a different ball pitch than the FGG676 part and is not a footprint-compatible drop-in. Always confirm the exact FGG suffix and the package drawing before releasing a PCB revision.
Decouple the 1.14 V to 1.26 V core rail with a dense cluster of high-frequency ceramic capacitors placed on the same side of the board as the device, immediately adjacent to the VCC balls, and provide bulk capacitance on the board for transient current. The Spartan-6 configuration engine draws a burst of current during configuration startup, so a weak or distant supply can cause bitstream corruption even when steady-state margins look adequate. Sequence the core, auxiliary and I/O rails according to the data sheet power-up ordering requirements.
Use the DCM and PLL resources to generate internal clocks rather than distributing raw oscillator signals across the fabric, and enable the clock buffers with matched impedance settings to prevent excessive duty-cycle distortion on high-fanout nets. Keep the configuration pins (CS, CLK, DATA) and the JTAG chain away from high-speed nets, and observe the setup and hold requirements in the data sheet, since configuration timing margins are tight at the -3 speed grade and are a frequent source of intermittent field failures.
コンプライアンス情報
The XC6SLX75-3FGG676C is listed as LEAD FREE in distributor specification data and is a commercial-temperature (-3, 0 C to 85 C) Spartan-6 LX device, so it is not AEC-Q100 qualified; RoHS, REACH and conflict-minerals declarations for this exact orderable were not present in the verified data and are therefore marked unknown.
