10AS032H2F35I2SG - Arria 10 SX 320K LE SoC FPGA 1.5GHz | Altera
部品番号: 10AS032H2F35I2SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2480 | $248,000.00 |
| 500 | $2275 | $1,137,500.00 |
| 1,000 | $2050 | $2,050,000.00 |
10AS032H2F35I2SG 概要
An SoC FPGA is an integrated circuit that combines a processor subsystem (typically ARM Cortex-A or Cortex-M) with programmable logic on the same silicon. The processor subsystem handles control-plane tasks, operating systems, and network stacks, while the FPGA fabric accelerates data-plane workloads such as DSP, packet processing, and custom I/O protocols. This heterogeneous architecture reduces board area, lowers power versus discrete processor-plus-FPGA designs, and tightens hardware/software coupling by eliminating inter-chip buses.
Key features of the 10AS032H2F35I2SG include the integrated dual-core ARM Cortex-A9 MPCore with CoreSight, support for high-speed serial transceivers, on-chip memory, and DSP blocks optimized for floating-point and fixed-point arithmetic. The Arria 10 family uses TSMC's 20nm process, achieving a favorable performance-per-watt ratio versus prior 28nm Stratix and Arria V devices. The H2 speed grade is typically the highest bin within the family, allowing the highest core clock frequencies and tightest timing margins at the cost of higher unit price.
Typical applications include wireless baseband processing, software-defined radio, radar signal processing, industrial machine vision, high-performance embedded computing, and protocol bridging. The 1.5GHz core clock combined with the FPGA fabric enables line-rate processing of multi-gigabit data streams while the HPS runs a Linux or RTOS control stack. Designers can partition algorithms in hardware for throughput-critical paths and software for flexibility.
When designing with this device, ensure the PCB has a 35x35 mm land pattern with microvia-in-pad capability for the FCBGA. Reference Altera's Arria 10 SoC development kit schematics for DDR3/DDR4 memory interface routing. Quartus Prime software is required for synthesis, place-and-route, and HPS configuration. Note that the HPS and FPGA fabric must be configured together; review the Arria 10 HPS boot flow before committing to pinout.
This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 SX family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: 10AS032H2F35I2SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS032H2F35I2SG （同一形状・フットプリント） — 相違点: Package, Mounting Type, RoHS Status, Operating Temperature Grade, Package Code.
クイック比較ツール — 並列比較する代替部品を選択:
10AS032H2F35I2LG
✅ ドロップイン✓ 在庫あり
$1295 / 個
データシートを見る →10AS032H2F35I1HG
✅ ドロップイン✓ 在庫あり
$2890 / 個
データシートを見る →10AS032H2F35E2SG
✅ ドロップイン✓ 在庫あり
$1325 / 個
データシートを見る →10AS032H2F34I2SG
✅ ドロップイン✓ 在庫あり
$3760 / 個
データシートを見る →10AS032H1F35I1HG
✅ ドロップイン✓ 在庫あり
$2265 / 個
データシートを見る →10AS032H2F35I2SG 最大定格＆電気的特性
| Product Type | SoC FPGA (System-on-Chip FPGA) |
| Series | Arria 10 SX |
| Logic Elements | 320K |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Clock Frequency | 1.5 GHz |
| Speed Grade | H2 |
| パッケージ | 1152-ball FCBGA (F35) 35x35 mm |
| 動作温度 | -40C to +100C (Industrial) |
| 実装タイプ | Surface Mount |
| Process Technology | TSMC 20nm |
| MSLレベル | 3 (168 Hours) |
| Packaging | Tray |
| RoHS ステータス | Compliant |
| ライフサイクル状態 | Active (per Altera product page) |
| Configuration Method | SRAM-based, Quartus Prime required |
10AS032H2F35I2SG 1152-ball fcbga (f35) 35x35 mm ピン配置ガイド
10AS032H2F35I2SG (1152-ball fcbga (f35) 35x35 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS032H2F35I2SG.
詳細は データシート をご参照ください。
主な用途
10AS032H2F35I2SG の用途: 6 件s: Wireless Baseband Processing, Software Defined Radio, Radar Signal Processing, Industrial Machine Vision, Protocol Bridging and Aggregation, High-Performance Embedded Computing.
Wireless Baseband Processing
The 10AS032H2F35I2SG integrates dual ARM Cortex-A9 cores with 320K logic elements, making it ideal for wireless baseband processing in LTE and 5G small cells. The FPGA fabric accelerates FFT, channel coding, and modulation/demodulation while the HPS runs the PHY/mac stack and network interfaces. At 1.5GHz HPS clock, the SoC handles LTE baseband at 20MHz bandwidth with margin. Compared with discrete processor-plus-FPGA designs, the integrated HPS eliminates PCIe or serial RapidIO links between chips, reducing latency for time-critical HARQ and scheduling decisions. The 1152-ball F35 package provides sufficient I/O for multiple RF ADC/DAC interfaces and CPRI/eCPRI links.
おすすめ
Software Defined Radio
The 10AS032H2F35I2SG suits software-defined radio applications requiring flexible waveform processing across multiple bands. The 320K logic elements support wideband DDC/DUC, polyphase filter banks, and real-time spectrum analysis, while the Cortex-A9 HPS handles network protocol stacks and waveform selection. The H2 speed grade closes timing at the highest DSP block clock frequencies, sustaining multi-Msample/sec data rates. Industrial temperature grade (-40C to +100C) enables outdoor deployment in tactical and commercial SDR systems. Designers can reconfigure waveforms via partial reconfiguration without rebooting the HPS.
おすすめ
Radar Signal Processing
The 10AS032H2F35I2SG is well-suited for phased-array radar signal processing where FPGA throughput and embedded processing are both required. The 320K logic elements plus on-chip DSP blocks implement pulse compression, MTI filtering, and CFAR detection at line rate. The Cortex-A9 HPS runs the tracker, plot extractor, and network interface, eliminating the need for a separate processor board. At 1.5GHz HPS clock, the SoC processes thousands of plots per second. The industrial temperature rating supports ground-based and shipboard radar installations. Multiple high-speed transceiver channels handle digitized antenna array data.
おすすめ
Industrial Machine Vision
The 10AS032H2F35I2SG drives high-throughput industrial machine vision systems where FPGA image preprocessing reduces CPU load. The 320K logic elements implement Bayer demosaicing, color correction, and feature extraction at multi-megapixel rates, while the Cortex-A9 HPS runs classification algorithms and factory communication protocols (PROFINET, EtherNet/IP). Industrial temperature grade supports factory floor deployment. The 1152-ball F35 package provides LVDS and MIPI CSI-2 interfaces for direct camera connection. Compared with GPU-based vision, the Arria 10 SoC delivers deterministic latency for real-time inspection.
おすすめ
Protocol Bridging and Aggregation
The 10AS032H2F35I2SG excels at protocol bridging between industrial fieldbuses, automotive networks, and Ethernet. The FPGA fabric implements custom protocol engines with nanosecond timing accuracy, while the Cortex-A9 HPS runs network stacks and protocol conversion software. Common applications include EtherCAT master bridges, CAN-to-Ethernet gateways, and time-sensitive networking (TSN) aggregators. The 320K logic elements support multiple parallel protocol instances. The industrial temperature grade ensures reliable operation in factory automation cabinets and outdoor enclosures.
おすすめ
High-Performance Embedded Computing
The 10AS032H2F35I2SG serves high-performance embedded computing applications requiring both deterministic hardware acceleration and software flexibility. Typical uses include avionics data concentrators, medical imaging preprocessors, and test instrumentation. The Cortex-A9 HPS runs Linux or VxWorks for system management and user interfaces, while the FPGA fabric handles sensor I/O, signal conditioning, and custom DSP. The H2 speed grade sustains the highest HPS-to-FPGA bridge throughput, enabling tight hardware/software coupling. The 1.5GHz HPS clock provides sufficient performance for control-plane tasks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS032H2F35I2SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS032H2F35I2LG | 10AS032H2F35I1HG | 10AS032H2F35E2SG | 10AS032H2F34I2SG | 10AS032H1F35I1HG |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F35) 35x35 mm | 1152-ball FCBGA (F35) 35x35 mm - same | 1152-ball FCBGA (F35) 35x35 mm - same | 1152-ball FCBGA (F35) 35x35 mm - same | F34 BGA - different footprint | 1152-ball FCBGA (F35) 35x35 mm - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | H2 | H2 | H1 | H2 | H2 | H1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended (-40C to +125C) | Industrial | Industrial |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| HPS Processor | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 |
| Process Technology | TSMC 20nm | TSMC 20nm | TSMC 20nm | TSMC 20nm | TSMC 20nm | TSMC 20nm |
| Lifecycle Status | Active | Active (LG suffix) | Active | Active | Active | Active |
| MSL Level | MSL 3 (168 hours) | MSL 3 | MSL 3 | MSL 3 | MSL 3 | MSL 3 |
主な差別化要因
- Same die, different speed grade - drop-in for cost optimization （vs 10AS032H2F35I1HG)
- Extended temperature variant available in same package （vs 10AS032H2F35E2SG)
- Integrated HPS eliminates external processor （vs 10AX032H2F35I2SG (Arria 10 GX non-SoC))
設計ノート
Estimated: The 10AS032H2F35I2SG at full HPS and FPGA utilization can dissipate 8-12W, depending on clock frequency and toggle rate. The F35 FCBGA package requires a thermal management strategy including thermal vias to inner copper planes and potentially a heatsink for industrial temperature operation. Ensure junction temperature stays below 100C at maximum ambient. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet before committing to PCB layout.
The 1152-ball F35 FCBGA at 1.0mm pitch requires microvia-in-pad PCB fabrication. Use a minimum 4-2-4 stackup with stacked microvias for breakout. Reference the Altera Arria 10 SoC development kit PCB stackup as a starting point. Signal integrity for DDR3/DDR4 interfaces requires impedance-controlled traces with length matching within 25 mils. Allocate sufficient vias under the BGA for power and ground - at least 20% of balls should be dedicated to GND.
Do not confuse the Arria 10 SX SoC FPGA (10AS prefix) with the non-SoC Arria 10 GX (10AX prefix) or Arria 10 GT (10AT prefix). The SX variant includes the HPS; the others require an external processor. Also verify that the HPS boot configuration pins (BSEL, CSEL) are correctly pulled for your boot source - misconfigured BSEL pins are a common cause of first-power-on failures. The HPS and FPGA fabric must be configured together or sequentially per the boot flow documentation.
High-speed serial transceivers on the Arria 10 require careful PCB routing with controlled impedance (100 ohm differential for most protocols). Reference the Altera Arria 10 Transceiver PHY User Guide for channel loss budgets. Use the Quartus Prime Transceiver Toolkit for eye diagram analysis during bring-up. Power supply noise on the XCVR_VCC rails must stay below 10 mV RMS - use LDO regulators near the BGA, not switching converters.
コンプライアンス情報
RoHS and lead-free per Altera/Intel product page (SG suffix). Halogen-free status not specified in verified data. Industrial temperature grade; not AEC-Q100 qualified (use automotive-qualified parts for automotive applications).
