10AS032H2F35I2SG - Arria 10 SX 320K LE SoC FPGA 1.5GHz | Altera
MPN: 10AS032H2F35I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2480 | $248,000.00 |
| 500 | $2275 | $1,137,500.00 |
| 1,000 | $2050 | $2,050,000.00 |
Drop-in alternatives for 10AS032H2F35I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H2F35I2LG
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →10AS032H2F35I1HG
✅ Drop-In✓ In Stock
$2890 / Unit
View Datasheet →10AS032H2F35E2SG
✅ Drop-In✓ In Stock
$1325 / Unit
View Datasheet →10AS032H2F34I2SG
✅ Drop-In✓ In Stock
$3760 / Unit
View Datasheet →10AS032H1F35I1HG
✅ Drop-In✓ In Stock
$2265 / Unit
View Datasheet →10AS032H2F35I2SG Maximum Ratings & Electrical Characteristics
| Product Type | SoC FPGA (System-on-Chip FPGA) |
| Series | Arria 10 SX |
| Logic Elements | 320K |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Clock Frequency | 1.5 GHz |
| Speed Grade | H2 |
| Package | 1152-ball FCBGA (F35) 35x35 mm |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Process Technology | TSMC 20nm |
| MSL Level | 3 (168 Hours) |
| Packaging | Tray |
| RoHS Status | Compliant |
| Lifecycle Status | Active (per Altera product page) |
| Configuration Method | SRAM-based, Quartus Prime required |
10AS032H2F35I2SG 1152-ball fcbga (f35) 35x35 mm Pin Configuration Guide
Complete pinout information for 10AS032H2F35I2SG (1152-ball fcbga (f35) 35x35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H2F35I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H2F35I2SG is suitable for 6 applications: Wireless Baseband Processing, Software Defined Radio, Radar Signal Processing, Industrial Machine Vision, Protocol Bridging and Aggregation, High-Performance Embedded Computing.
Wireless Baseband Processing
The 10AS032H2F35I2SG integrates dual ARM Cortex-A9 cores with 320K logic elements, making it ideal for wireless baseband processing in LTE and 5G small cells. The FPGA fabric accelerates FFT, channel coding, and modulation/demodulation while the HPS runs the PHY/mac stack and network interfaces. At 1.5GHz HPS clock, the SoC handles LTE baseband at 20MHz bandwidth with margin. Compared with discrete processor-plus-FPGA designs, the integrated HPS eliminates PCIe or serial RapidIO links between chips, reducing latency for time-critical HARQ and scheduling decisions. The 1152-ball F35 package provides sufficient I/O for multiple RF ADC/DAC interfaces and CPRI/eCPRI links.
Recommended
Software Defined Radio
The 10AS032H2F35I2SG suits software-defined radio applications requiring flexible waveform processing across multiple bands. The 320K logic elements support wideband DDC/DUC, polyphase filter banks, and real-time spectrum analysis, while the Cortex-A9 HPS handles network protocol stacks and waveform selection. The H2 speed grade closes timing at the highest DSP block clock frequencies, sustaining multi-Msample/sec data rates. Industrial temperature grade (-40C to +100C) enables outdoor deployment in tactical and commercial SDR systems. Designers can reconfigure waveforms via partial reconfiguration without rebooting the HPS.
Recommended
Radar Signal Processing
The 10AS032H2F35I2SG is well-suited for phased-array radar signal processing where FPGA throughput and embedded processing are both required. The 320K logic elements plus on-chip DSP blocks implement pulse compression, MTI filtering, and CFAR detection at line rate. The Cortex-A9 HPS runs the tracker, plot extractor, and network interface, eliminating the need for a separate processor board. At 1.5GHz HPS clock, the SoC processes thousands of plots per second. The industrial temperature rating supports ground-based and shipboard radar installations. Multiple high-speed transceiver channels handle digitized antenna array data.
Recommended
Industrial Machine Vision
The 10AS032H2F35I2SG drives high-throughput industrial machine vision systems where FPGA image preprocessing reduces CPU load. The 320K logic elements implement Bayer demosaicing, color correction, and feature extraction at multi-megapixel rates, while the Cortex-A9 HPS runs classification algorithms and factory communication protocols (PROFINET, EtherNet/IP). Industrial temperature grade supports factory floor deployment. The 1152-ball F35 package provides LVDS and MIPI CSI-2 interfaces for direct camera connection. Compared with GPU-based vision, the Arria 10 SoC delivers deterministic latency for real-time inspection.
Recommended
Protocol Bridging and Aggregation
The 10AS032H2F35I2SG excels at protocol bridging between industrial fieldbuses, automotive networks, and Ethernet. The FPGA fabric implements custom protocol engines with nanosecond timing accuracy, while the Cortex-A9 HPS runs network stacks and protocol conversion software. Common applications include EtherCAT master bridges, CAN-to-Ethernet gateways, and time-sensitive networking (TSN) aggregators. The 320K logic elements support multiple parallel protocol instances. The industrial temperature grade ensures reliable operation in factory automation cabinets and outdoor enclosures.
Recommended
High-Performance Embedded Computing
The 10AS032H2F35I2SG serves high-performance embedded computing applications requiring both deterministic hardware acceleration and software flexibility. Typical uses include avionics data concentrators, medical imaging preprocessors, and test instrumentation. The Cortex-A9 HPS runs Linux or VxWorks for system management and user interfaces, while the FPGA fabric handles sensor I/O, signal conditioning, and custom DSP. The H2 speed grade sustains the highest HPS-to-FPGA bridge throughput, enabling tight hardware/software coupling. The 1.5GHz HPS clock provides sufficient performance for control-plane tasks.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H2F35I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H2F35I2LG | 10AS032H2F35I1HG | 10AS032H2F35E2SG | 10AS032H2F34I2SG | 10AS032H1F35I1HG |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F35) 35x35 mm | 1152-ball FCBGA (F35) 35x35 mm - same | 1152-ball FCBGA (F35) 35x35 mm - same | 1152-ball FCBGA (F35) 35x35 mm - same | F34 BGA - different footprint | 1152-ball FCBGA (F35) 35x35 mm - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | H2 | H2 | H1 | H2 | H2 | H1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended (-40C to +125C) | Industrial | Industrial |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| HPS Processor | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 @ 1.5GHz | Dual Cortex-A9 |
| Process Technology | TSMC 20nm | TSMC 20nm | TSMC 20nm | TSMC 20nm | TSMC 20nm | TSMC 20nm |
| Lifecycle Status | Active | Active (LG suffix) | Active | Active | Active | Active |
| MSL Level | MSL 3 (168 hours) | MSL 3 | MSL 3 | MSL 3 | MSL 3 | MSL 3 |
Key Differentiators
- Same die, different speed grade - drop-in for cost optimization (vs 10AS032H2F35I1HG)
- Extended temperature variant available in same package (vs 10AS032H2F35E2SG)
- Integrated HPS eliminates external processor (vs 10AX032H2F35I2SG (Arria 10 GX non-SoC))
Design Notes
Estimated: The 10AS032H2F35I2SG at full HPS and FPGA utilization can dissipate 8-12W, depending on clock frequency and toggle rate. The F35 FCBGA package requires a thermal management strategy including thermal vias to inner copper planes and potentially a heatsink for industrial temperature operation. Ensure junction temperature stays below 100C at maximum ambient. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet before committing to PCB layout.
The 1152-ball F35 FCBGA at 1.0mm pitch requires microvia-in-pad PCB fabrication. Use a minimum 4-2-4 stackup with stacked microvias for breakout. Reference the Altera Arria 10 SoC development kit PCB stackup as a starting point. Signal integrity for DDR3/DDR4 interfaces requires impedance-controlled traces with length matching within 25 mils. Allocate sufficient vias under the BGA for power and ground - at least 20% of balls should be dedicated to GND.
Do not confuse the Arria 10 SX SoC FPGA (10AS prefix) with the non-SoC Arria 10 GX (10AX prefix) or Arria 10 GT (10AT prefix). The SX variant includes the HPS; the others require an external processor. Also verify that the HPS boot configuration pins (BSEL, CSEL) are correctly pulled for your boot source - misconfigured BSEL pins are a common cause of first-power-on failures. The HPS and FPGA fabric must be configured together or sequentially per the boot flow documentation.
High-speed serial transceivers on the Arria 10 require careful PCB routing with controlled impedance (100 ohm differential for most protocols). Reference the Altera Arria 10 Transceiver PHY User Guide for channel loss budgets. Use the Quartus Prime Transceiver Toolkit for eye diagram analysis during bring-up. Power supply noise on the XCVR_VCC rails must stay below 10 mV RMS - use LDO regulators near the BGA, not switching converters.
Compliance Information
RoHS and lead-free per Altera/Intel product page (SG suffix). Halogen-free status not specified in verified data. Industrial temperature grade; not AEC-Q100 qualified (use automotive-qualified parts for automotive applications).
