10AS032H4F34E3SG - Arria 10 SX SoC FPGA 320K LE | Intel (Altera)
部品番号: 10AS032H4F34E3SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4095 | $40,950.00 |
| 100 | $3820 | $382,000.00 |
| 250 | $3650 | $912,500.00 |
| 500 | $3490 | $1,745,000.00 |
10AS032H4F34E3SG 概要
What is an SoC FPGA? An SoC (System-on-Chip) FPGA combines a hardened ARM processor subsystem with a programmable FPGA fabric on a single die, giving designers deterministic processor performance for OS, control-plane, and protocol-stack tasks while preserving FPGA flexibility for high-throughput data-path acceleration. The Arria 10 SX sits in the mid-to-high-performance tier of Intel's FPGA portfolio, between the lower-power Cyclone V SoC and the high-end Stratix 10 SoC families, and is targeted at applications needing 10-25 Gbps transceivers, hardware DSP, and embedded CPU in one device.
Key features include 320,000 logic elements, integrated dual-core ARM Cortex-A9 MPCore with CoreSight, 1.5 GHz core frequency, embedded hard memory controllers, high-speed serial transceivers, and a 20nm low-power process. The 1152-ball FC-FBGA package supports high-speed signal integrity and dense I/O, with multiple high-performance HPS peripherals and FPGA-to-HPS bridges.
Architecturally, the Arria 10 SX uses a coherent 64-bit ARM Cortex-A9 MPCore subsystem connected to the FPGA fabric through hardened bridges supporting AXI/ACP. The 20nm process delivers a balance of performance and power efficiency, with hard floating-point DSP blocks, M20K memory blocks, and variable-precision DSP blocks for signal-processing acceleration.
Typical applications include wireless baseband processing, radar and electronic warfare, broadcast video infrastructure, industrial motor control, medical imaging, and high-performance test and measurement. The 320K-LE tier suits mid-range DSP pipelines and protocol-bridging designs.
When designing, plan the HPS pin multiplexing early - HPS peripherals (EMAC, USB, SDIO, NAND) share fixed SoC balls. Reserve sufficient decoupling and use Intel's Quartus Prime power-estimator to size rails.
This page synthesizes distributor pricing, parametric comparison, and drop-in alternatives across the Arria 10 SX family not found in the manufacturer datasheet alone.
ドロップイン代替品: 10AS032H4F34E3SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS032H4F34E3SG （同一形状・フットプリント） — 相違点: Package, Logic Elements, Speed Grade, DSP Blocks, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
10AS032H4F34E3LG
✅ ドロップイン✓ 在庫あり
$2240 / 個
データシートを見る →10AS032H3F35I2SG
✅ ドロップイン✓ 在庫あり
$2120 / 個
データシートを見る →10AS032H3F35E2SG
✅ ドロップイン✓ 在庫あり
$2450 / 個
データシートを見る →10AS032H3F34I2SG
✅ ドロップイン✓ 在庫あり
$3450 / 個
データシートを見る →10AS032H3F34E2SG
✅ ドロップイン✓ 在庫あり
$2120 / 個
データシートを見る →10AS032H2F35I2SG
✅ ドロップイン✓ 在庫あり
$2050 / 個
データシートを見る →10AS032H2F35E2SG
✅ ドロップイン✓ 在庫あり
$1325 / 個
データシートを見る →10AS032H4F34E3SG 最大定格＆電気的特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| パッケージ | 1152-ball FC-FBGA, 35x35 mm |
| Package Code | F34 |
| 実装タイプ | Surface Mount (BGA) |
| Terminal Form | Ball |
| Terminal Count | 1152 |
| Operating Temperature Grade | E2 (Extended) |
| RoHS ステータス | Compliant (per Altera product page) |
| Lead-Free | Yes |
| Recommended FPGA Toolchain | Intel Quartus Prime |
10AS032H4F34E3SG f34 ピン配置ガイド
10AS032H4F34E3SG (f34 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS032H4F34E3SG.
詳細は データシート をご参照ください。
主な用途
10AS032H4F34E3SG の用途: 6 件s: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Broadcast Video Infrastructure, Industrial Motor Control and Robotics, Medical Imaging and Diagnostics, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS032H4F34E3SG fits wireless baseband designs needing moderate logic density plus an embedded CPU for MAC-layer scheduling. Its 320K logic elements, hardened dual-core ARM Cortex-A9 MPCore, and 1.5 GHz HPS clock let engineers implement LTE PHY, custom FFT pipelines, and L1 protocol stacks on a single die. Hard floating-point DSP blocks accelerate channel estimation while the HPS handles Layer 2/3 and OS tasks. E3 transceiver grade supports backhaul links to 25 Gbps.
おすすめ
Radar and Electronic Warfare Signal Processing
Arria 10 SX 320K LE is well suited to mid-range phased-array radar and electronic-warfare front-end processing where hardened ARM cores handle track management while the FPGA fabric runs pulse-Doppler FFTs. The 20 nm process delivers high DSP throughput per watt, and E3 transceiver grade lets designers aggregate multiple ADC lanes. Embedded CoreSight simplifies real-time debug of multi-channel DSP pipelines.
おすすめ
Broadcast Video Infrastructure
Broadcast video routers, format converters, and 4K/UHD processing engines map well to the 10AS032H4F34E3SG. The 320K logic budget supports multi-stream SDI/HDMI bridging, HDR metadata insertion, and on-the-fly color-space conversion. The hard ARM subsystem runs control software and IP-based video stacks. E3 transceiver grade enables SMPTE ST 2022/2110 IP video at 25 Gbps.
おすすめ
Industrial Motor Control and Robotics
The 10AS032H4F34E3SG delivers deterministic real-time motor control by combining FPGA fabric for high-rate current-loop PWM with the ARM Cortex-A9 MPCore for motion planning, EtherCAT/Ethernet/IP stacks, and safety logic. Its 320K logic budget supports multi-axis servo drives, while the HPS runs Linux or RTOS. Industrial temp grades are available via speed-grade variants.
おすすめ
Medical Imaging and Diagnostics
Mid-tier medical imaging systems (ultrasound beamformers, endoscopy video processors, CT reconstruction pipelines) fit the 10AS032H4F34E3SG's 320K-LE budget. Hard DSP blocks accelerate beamforming and tomographic reconstruction while the ARM subsystem handles UI, DICOM networking, and safety-class control. Quartus Prime supports IEC 62304/62366 design workflows common in medical development.
おすすめ
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and ATE platforms leverage the 10AS032H4F34E3SG's mix of FPGA fabric for real-time DSP and ARM cores for instrument UI, storage, and remote control. E3-grade transceivers aggregate multi-GHz ADC lanes to host CPUs over PCIe or 10/25 GbE. Quartus Prime DSP Builder accelerates filter and FFT design for these instruments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS032H4F34E3SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS032H4F34E3LG | 10AS032H3F35I2SG | 10AS032H3F35E2SG | 10AS032H3F34I2SG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand |
| Package | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F35, 35x35 mm) - different ball map | 1152-ball FC-FBGA (F35, 35x35 mm) - different ball map | 1152-ball FC-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 320,000 | 320,000 - same | 320,000 - same | 320,000 - same | 320,000 - same |
| Speed Grade | H4 | H4 - same | H3 (-10-15% Fmax) | H3 (-10-15% Fmax) | H3 (-10-15% Fmax) |
| Transceiver Grade | E3 | E3 - same | I2 (lower-grade transceiver) | E2 | I2 |
| Operating Temperature | Extended (E2) | Extended (E2) - same | Industrial (I2) | Extended (E2) | Industrial (I2) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Same | Same | Same | Same |
| Maximum Core Frequency | 1.5 GHz | 1.5 GHz - same | 1.5 GHz (HPS independent of FPGA speed grade) | 1.5 GHz | 1.5 GHz |
主な差別化要因
- Highest available speed grade in 320K Arria 10 SX F34 family （vs 10AS032H3F34E2SG)
- Higher transceiver grade (E3) than E2 or I2 variants （vs 10AS032H3F34I2SG)
- Tray packaging suitable for low-volume and lab use （vs 10AS032H4F34E3LG)
設計ノート
Estimated: at 0.9 V core with the 20 nm Arria 10 SX process, a typical 320K-LE utilization design draws 8-15 W static power plus dynamic power proportional to toggle rate. The 35x35 mm F34 FC-FBGA requires a multi-layer PCB with a thermal via array under the central ground balls and at least 4 inner solid ground planes. Designers should run Quartus Prime Power Estimator before layout finalization to size the heatsink and airflow. Junction temperature must stay below 100 C for the E2 grade.
The 1152-ball F34 FC-FBGA needs 1.0 mm pitch BGA escape with microvia-in-pad stackups and 0.8 mm drill via-on-pad microvias for breakout. Maintain matched length on HPS DDR3/4 lanes to within +/-25 ps; group byte lanes together. Keep high-speed transceiver differential pairs length-matched to within 0.05 mm and reference continuous ground planes for the full length. Decoupling: place 0.1 uF and 0.01 uF ceramics within 2 mm of each power ball cluster.
A common pitfall is treating F34 and F35 packages as interchangeable - they share the 35x35 mm body but have different ball assignments. The 10AS032H4F34E3SG (F34) cannot be swapped with an F35 device without a PCB redesign. Another pitfall is ignoring the HPS pin-muxing constraints: EMAC, USB, SDIO, and NAND balls are fixed and conflict if multiple peripherals are enabled. Use Quartus Prime HPS Pin Multiplexer tool early in pin planning.
Recommended: route HPS traces on inner layers adjacent to a solid reference plane; place the boot configuration flash (QSPI or SD card) within 100 mm of the HPS boot pins to meet signal-integrity requirements. Reserve the top layer above the FPGA for high-speed serializer/deserializer (SerDes) channels; do not route slow control signals across SerDes lanes. Place the JTAG header within 75 mm of the FPGA TCK pin for reliable boundary-scan.
コンプライアンス情報
RoHS and REACH compliance confirmed on the Altera/Intel product page trade-compliance section. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Conflict-minerals declaration available on the Intel supply-chain portal.
