10AS048H2F34E2LG - Arria 10 SX 480K SoC FPGA, Dual A9, 1152-FBGA | Intel
部品番号: 10AS048H2F34E2LG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 100 | $2530 | $253,000.00 |
| 500 | $2395 | $1,197,500.00 |
| 1,000 | $2280 | $2,280,000.00 |
10AS048H2F34E2LG 概要
A System-on-Chip FPGA is a single-die device that fuses a general-purpose processor subsystem with reconfigurable logic. The Cortex-A9 MPCore with CoreSight provides Linux/real-time OS support, while the FPGA fabric accelerates parallel DSP, packet processing, and custom interfaces. Within the broader taxonomy: SoC FPGA -> FPGA -> programmable logic device -> semiconductor. Arria 10 SX sits in Intel's mid-range family below Stratix 10 but above Cyclone V SoC, balancing logic density, transceiver count, and power efficiency.
Key differentiating features of this 10AS048H2F34E2LG OPN include 480K logic elements, hardware ARM Cortex-A9 dual-core processing, integrated CoreSight debug, 0.9V core operation suitable for medical-grade thermal envelopes, and the F34 (35x35 mm) 1152-ball FC-BGA package with flip-chip interconnect for high I/O density. Per the Arria 10 device overview, transceivers, DSP blocks, and on-chip memory are tightly coupled to the HPS via high-bandwidth bridges.
Architecturally, the part uses Intel's adaptive logic modules (ALMs), 20Kbit M20K memory blocks, and variable-precision DSP blocks, all backed by the SmartVID-controlled 20nm core. The HPS side exposes UART, SPI, I2C, USB, EMAC, SD/MMC, and a DDR3/DDR4 controller through dedicated hard IP, offloading these functions from the fabric.
Typical applications include medical imaging accelerators (ultrasound beamforming, CT/MRI pre-processing), industrial machine vision, broadcast video processing, military/aerospace signal intelligence, and 5G baseband prototyping. The dual-core A9 also makes it suitable for avionics displays and industrial robotics control where deterministic Linux execution is required.
When designing, engineers should plan power sequencing for the 0.9V core rail, ensure proper thermal relief under 35x35 BGA mounting, and verify Quartus Prime pin assignments against the F34 ball-map. Use the Intel EMIF Toolkit to validate DDR3/4 interface timing.
This page synthesizes Intel/Altera authorized distributor pricing, datasheet cross-references, and same-footprint alternatives not available on DigiKey/Mouser/Octopart alone.
ドロップイン代替品: 10AS048H2F34E2LG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS048H2F34E2LG （同一形状・フットプリント） — 相違点: Package, Logic Elements, Mounting Type, Speed Grade, Temperature Grade.
クイック比較ツール — 並列比較する代替部品を選択:
10AS048H2F34E1HG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3650 / 個
データシートを見る →10AS048H1F34E1HG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3048.91 / 個
データシートを見る →10AS032H4F34E3SG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3490 / 個
データシートを見る →10AS032H4F34E3LG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2240 / 個
データシートを見る →10AS032H4F34I3LG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1428.73 / 個
データシートを見る →10AS032H4F34I3SG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3150 / 個
データシートを見る →10AS048H2F34E2LG 最大定格＆電気的特性
| Family | Arria 10 SX |
| Logic Elements | 480000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| パッケージ | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| 実装タイプ | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Industrial / Medical (per OPN code H2) |
| Logic Family | Arria 10 SoC FPGA |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (per FBGA package) |
10AS048H2F34E2LG 1152-ball fc-fbga (f34), 35 x 35 mm ピン配置ガイド
10AS048H2F34E2LG (1152-ball fc-fbga (f34), 35 x 35 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS048H2F34E2LG.
詳細は データシート をご参照ください。
主な用途
10AS048H2F34E2LG の用途: 6 件s: Medical Ultrasound Beamforming, Industrial Machine Vision, Broadcast Video Processing, Military/Aerospace Signal Intelligence, 5G Baseband Prototyping, Avionics Displays and Control.
Medical Ultrasound Beamforming
The 10AS048H2F34E2LG's 480K logic elements and variable-precision DSP blocks are ideal for beamforming in cart-based and portable ultrasound systems. The dual-core ARM Cortex-A9 HPS runs the user interface, scan-conversion, and DICOM stack, while the FPGA fabric executes parallel delay-and-sum beamforming across 64-256 channels in real time. The 0.9V core keeps thermal envelopes manageable inside sealed transducer enclosures. With 1.5 GHz HPS clock, the part also supports elastography and Doppler post-processing alongside beamforming. Compared to discrete DSP+MCU solutions, the integrated SoC FPGA reduces BOM, simplifies deterministic latency, and shortens regulatory pathways for medical device certification.
おすすめ
Industrial Machine Vision
For high-throughput machine vision on factory floors, the 10AS048H2F34E2LG provides enough logic and DSP bandwidth to process 4K camera streams at line rate, running defect-detection CNNs on fabric plus a Linux control plane on the dual A9. The 1.5 GHz Cortex-A9 MPCore handles GigE Vision protocol stacks and PLC handshaking, while fabric DSP accelerates convolutional layers. The 1152-ball F34 BGA exposes sufficient user I/O for multi-camera LVDS/MIPI bridging. Industrial temperature OPN variants in the same package simplify qualification of vision cells operating in elevated ambient conditions.
おすすめ
Broadcast Video Processing
The 10AS048H2F34E2LG's fabric and HPS split supports broadcast video processing pipelines including 4K/UHD up/down/cross-conversion, HDR tone-mapping, and multi-screen SDI mosaics. FPGA transceivers handle 12G-SDI and SMPTE 2110 IP transport while the dual-core ARM runs a real-time Linux media framework. The 480K logic elements provide headroom for advanced features such as motion-adaptive deinterlacing and AI-assisted upscaling. The device's deterministic fabric timing also suits live production environments where frame-accurate switching is required.
おすすめ
Military/Aerospace Signal Intelligence
Defense SIGINT and electronic-warfare subsystems benefit from the 10AS048H2F34E2LG's combination of hardened A9 cores for command/control and dense FPGA fabric for wideband digital down-conversion and channelization. The dual ARM runs secure firmware and crypto, while the fabric implements fast-Fourier transforms and pulse de-interleaving across hundreds of MHz of instantaneous bandwidth. With suitable ruggedization and conduction cooling, the part supports airborne EW pods where SWaP-C constraints favor SoC integration. The Cortex-A9 HPS also eases porting of existing signal-classification ML inference stacks.
おすすめ
5G Baseband Prototyping
For 5G NR baseband prototyping and pre-silicon validation, the 10AS048H2F34E2LG provides 480K logic elements paired with a multi-GHz HPS to emulate L1/L2 stacks. The FPGA fabric implements PHY accelerators (LDPC, polar coding, FFT/iFFT), while the dual A9 hosts the L2/L3 protocol stack under Linux. Designers iterate faster than waiting for ASIC availability, and the same hardware later informs ASIC porting decisions. The 1152-ball BGA also supports the high I/O count needed for CPRI/eCPRI fronthaul interfaces to RF modules.
おすすめ
Avionics Displays and Control
Avionics flight decks leverage the 10AS048H2F34E2LG to drive multi-panel glass-cockpit displays while running ARINC 653 partitioned real-time OS on the hardened ARM cores. The FPGA fabric accelerates graphics overlay rendering and synthetic-vision terrain rendering, and the integrated HPS simplifies DO-178C certification by isolating safety-critical software from the FPGA fabric. The 35x35 mm F34 BGA with high pin density suits line-replaceable units where PCB area is at a premium. Industrial/extended temperature OPN variants support the wide thermal range required by unpressurized avionics bays.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS048H2F34E2LG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS048H2F34E1HG | 10AS048H1F34E1HG | 10AS032H4F34E3SG | 10AS032H4F34E3LG | 10AS032H4F34I3LG | 10AS032H4F34I3SG |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480000 | 480000 | 480000 | 320000 (-33%) | 320000 (-33%) | 320000 (-33%) | 320000 (-33%) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主な差別化要因
- Highest-density same-footprint option for production volume （vs 10AS032H4F34E3LG)
- Medical/industrial OPN bin supports broader thermal range （vs 10AS048H2F34E1HG)
- Dual-core A9 HPS is hardened - does not consume fabric （vs Soft-core Nios II on Cyclone V SoC)
設計ノート
The 1152-ball F34 BGA (35x35 mm) is a high-power device; with SmartVID at 0.9V core and full fabric+HPS utilization, sustained power can reach 20-30W. Design a thermal solution with at least 4 thermal vias in the BGA land pad pattern and consider a heat-spreader or low-profile heatsink. Estimated: at 25W dissipation and standard JEDEC still-air thermal resistance, junction-to-ambient could exceed 100C without active cooling - validate against actual workload using the Arria 10 PowerPlay early power estimator.
Use 1.0 mm ball pitch routing per the F34 package guidelines with microvia stack-up (any-layer HDI recommended). Maintain 100-ohm differential impedance on transceiver pairs and 50-ohm single-ended on general-purpose I/O. Place HPS DDR3/4 controller within 25 mm of the BGA with matched-length fly-by topology; the EMIF Toolkit in Quartus is mandatory for sign-off. Decouple core and HPS supplies with a mix of 100 nF, 10 uF, and 47 uF ceramics per the Arria 10 pin connection guidelines.
Do not confuse the SX (SoC, dual A9) family with the GX (transceiver-rich, no HPS) family when ordering - they share the 10AS prefix but require different Quartus configurations and pinouts. Also, SmartVID requires an external controller or proper VID pull-up/down resistor network at boot; missing this network causes boot failure. Reference the Intel Application Note AN754 (Arria 10 SoC boot) before PCB layout.
コンプライアンス情報
RoHS and lead-free per Altera/Intel product declarations. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC; for AEC-Q100 qualified logic, a separate product line is required. Per Intel supplier responsibility disclosures, the part is conflict-minerals compliant.
