10AS032H4F34E3LG - Arria 10 SX 320K SoC FPGA | Altera
MPN: 10AS032H4F34E3LG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2725 | $27,250.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2410 | $1,205,000.00 |
| 1,000 | $2240 | $2,240,000.00 |
Drop-in alternatives for 10AS032H4F34E3LG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AS032H4F34E3SG
β Drop-Inβ In Stock
$3490 / Unit
View Datasheet β10AS032H4F34I3LG
β Drop-Inβ In Stock
$1428.73 / Unit
View Datasheet β10AS032H4F34E3SGES
β Drop-Inπ Reference alternative (not in catalog)
10AS032H3F34E2LG
β Drop-Inβ In Stock
$1650 / Unit
View Datasheet β10AS032E4F34E3LG
β Drop-Inπ Reference alternative (not in catalog)
10AS032H4F34E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device | 10AS032 |
| Logic Elements | 320000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | 1.5 GHz |
| Package | 1152-FBGA, FC (35x35 mm) |
| Process Technology | 20 nm |
| Transceivers | Up to 24 channels |
| PCIe Hard IP | PCIe Gen3 x4 capable |
| Memory Controller Hard IP | DDR4 with ECC |
| DSP Blocks | Hardened floating-point capable |
| Temperature Grade | E3 (Extended) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10AS032H4F34E3LG Pin Configuration
| Pin 1 | VCC β Core supply voltage (multiple pins across BGA) |
| Pin 2 | GND β Common ground (multiple pins across BGA) |
| Pin 3 | IO_BANK_A β I/O bank A user pins |
| Pin 4 | DIFF_TX β Differential transceiver TX lane |
| Pin 5 | DIFF_RX β Differential transceiver RX lane |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H4F34E3LG is suitable for 6 applications: Wireless Baseband Processing, Broadcast Video Encoding and Decoding, Industrial Machine Vision, High-Speed Protocol Bridging, Radar and LiDAR Signal Processing, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS032H4F34E3LG's 320K logic elements and dual 1.5 GHz ARM Cortex-A9 cores make it well suited for wireless baseband digital signal processing. The FPGA fabric accelerates FIR filtering, channelization, FFT/iFFT, and modulation/demodulation tasks in parallel, while the HPS runs the protocol stack (LTE MAC, 5G NR PHY control) under embedded Linux. The integrated transceiver array supports CPRI or JESD204B links to RF front ends, eliminating an external PHY chip. Power consumption stays manageable versus higher-density Stratix 10 parts, suiting 4G small-cell and 5G RRH designs.
Recommended
Broadcast Video Encoding and Decoding
For HEVC/H.264 broadcast encoders, the 10AS032H4F34E3LG provides the DSP throughput needed for multi-stream 4K video pipelines. The hardened floating-point DSP blocks accelerate motion estimation and transform coding, while the 1.5 GHz Cortex-A9 handles transport stream multiplexing, encryption, and IPTV protocol packaging. The FCBGA package supports parallel external DDR4 memory bandwidth critical for real-time 4:2:2 10-bit video. Engineers typically pair this part with HDMI 2.0 or 12G-SDI PHY companions.
Recommended
Industrial Machine Vision
The 10AS032H4F34E3LG is well matched to multi-camera industrial inspection lines where latency and determinism matter. The FPGA fabric runs parallel image pre-processing (color conversion, filtering, defect detection) at line rate, while the ARM Cortex-A9 HPS executes machine-learning inference and communicates with factory PLCs over EtherCAT or PROFINET. The hardened PCIe Gen3 port enables co-processing with a host CPU, and the 24 transceivers support multi-lane CoaXPress or Camera Link camera links. Extended temperature grade E3 supports factory floor environments.
Recommended
High-Speed Protocol Bridging
The integrated transceivers and PCIe Gen3 hard IP make the 10AS032H4F34E3LG a strong bridge between heterogeneous protocols such as 10G Ethernet, PCIe, SATA, and Aurora. The FPGA fabric implements MAC-layer adaptation, DMA engines, and protocol offload while the HPS runs a network protocol stack (DPDK, custom TCP/IP) under Linux. This combination eliminates discrete bridge ASICs and gives engineers a single firmware-update path. Power consumption versus a discrete bridge + CPU solution is typically 30-40% lower.
Recommended
Radar and LiDAR Signal Processing
For automotive radar pre-processing or LiDAR point-cloud pipelines, the 10AS032H4F34E3LG delivers the parallel arithmetic density needed for FFT, beamforming, and clustering. The hardened DSP array handles vector math in fewer clock cycles than soft multipliers, and the HPS runs perception and object-tracking algorithms. The integrated transceivers support multi-lane MIPI CSI-2 or FPD-Link III camera/LiDAR inputs, reducing PCB complexity. Note: this part is not AEC-Q100 qualified; production automotive designs require the -Q part variant.
Recommended
Test and Measurement Instrumentation
Modular instrumentation (PXIe, AXIe, LXI) benefits from the 10AS032H4F34E3LG's combination of FPGA fabric for real-time DSP and an ARM HPS for instrument control and SCPI command processing. The PCIe Gen3 endpoint supports 8 GT/s backplane links, while the transceivers drive high-speed DACs and ADCs used in arbitrary waveform generators and digitizers. Designers can replace legacy FPGA + microcontroller + DSP three-chip designs with a single SoC FPGA, reducing BOM and board area.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H4F34E3LG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H4F34E3SG | 10AS032H4F34I3LG | 10AS032H4F34E3SGES | 10AS032H3F34E2LG | 10AS032E4F34E3LG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 320000 | 320000 | 320000 | 320000 | 320000 | 320000 |
| HPS Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Speed Grade | H4 (mid) | H4 | H4 | H4 | H3 (slower) | E4 (faster) |
| Temperature Grade | E3 (Extended) | E3 | I3 (Industrial) | E3 | E2 | E3 |
| Shipping Media | Tray (LG suffix) | Tape-and-reel | Tray | Tape-and-reel (engineering sample) | Tray | Tray |
| Approximate Unit Price (USD) | 2850 | 2850 | 2920 | 1900 (sample pricing) | 2650 | 3050 |
Key Differentiators
- Dual ARM Cortex-A9 HPS integrated on-die (vs 10AS032H4F34E3SG)
- Mid-range 320K logic density balances cost and capability (vs 10AS032E4F34E3LG)
- 1152-ball FCBGA with maximum I/O count in the family (vs 10AS032E3F29E3LG)
Design Notes
The 1152-ball FCBGA at 35x35 mm requires a 1.0 mm or 1.27 mm ball pitch PCB land pattern per Altera's Arria 10 pin connection guidelines. Use a 4-6 layer stack-up with continuous GND planes beneath the BGA to provide a low-impedance return path for the high-speed transceivers. Microvia-in-pad construction is recommended for reliable assembly of large BGA packages.
Arria 10 SX FPGAs require multi-rail sequenced power supplies (VCC, VCCP, VCCPT, VCCBAT, VCCIO, VCCPD, VCC_HPS). The HPS core (VCC_HPS) and FPGA core rails must be sequenced per Altera's PowerTree recommendation to prevent in-rush damage. Use the Altera PowerPlay Early Power Estimator (EPE) to budget power dissipation before committing to PCB thermal design.
Estimated: with 320K LE utilization at ~70% toggle rate and transceiver activity, typical junction temperature rise is 25-40C above ambient. Attach a heatsink or use forced-air cooling for designs exceeding 60C ambient. The FCBGA has a typical theta_JA of 8-12 C/W with 4-layer PCB and bottom-side thermal pad; do not skip the thermal interface material under the heatsink.
Do not migrate the 10AS032H4F34E3LG to a Cyclone V SoC without re-running timing closure - the Arria 10 SX fabric is fundamentally different. Ensure the HPS reset and JTAG topology follow Altera's configuration user guide; a missing CFG pin pull-up can prevent device enumeration. Plan for HPS boot time (typically 1-3 seconds under Linux) when sizing user-perceived startup latency.
Compliance Information
RoHS compliant per Altera product page. Not AEC-Q100 qualified - automotive designs require the AEC-Q100 qualified variant. Halogen-free status not stated in the verified data.
