10AX115U4F45E3LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
部品番号: 10AX115U4F45E3LG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7450 | $7,450.00 |
| 10 | $6980 | $69,800.00 |
| 100 | $6420 | $642,000.00 |
| 250 | $5980 | $1,495,000.00 |
| 500 | $5650 | $2,825,000.00 |
10AX115U4F45E3LG 概要
An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure digital logic, memory blocks, DSP slices, and high-speed transceivers after PCB fabrication. FPGAs sit within the programmable logic hierarchy under the broader category of digital semiconductors, and are widely used to implement custom datapath, protocol bridging, signal processing, and ASIC prototyping workloads. The Arria 10 GX family specifically targets applications requiring a balance of high logic density, embedded transceivers, and power efficiency.
Key features include 1,150,000 logic elements (LEs), 68,857,856 bits of embedded memory, 1,518 variable-precision DSP blocks, and 96 transceiver channels supporting backplane, chip-to-chip, and optical-module interfacing. Hard memory controllers, PCIe Gen3 x8 IP cores, and an ARM-based Hard Processor System option further accelerate system integration for compute-intensive workloads.
The architecture combines a programmable fabric with hard IP for PCI Express, memory controllers, and multi-gigabit transceivers, allowing designers to offload computationally heavy DSP and packet-processing tasks from general-purpose CPUs. The 20 nm process node delivers a meaningful power and performance advantage over the prior 28 nm Arria V generation while preserving Quartus Prime design-flow continuity.
Typical applications include high-performance wireline and wireless infrastructure, broadcast video processing, radar and electronic-warfare signal processing, medical imaging, and ASIC prototyping. The combination of high-density logic, abundant transceivers, and hard PCIe cores suits line cards, baseband units, and test equipment.
When designing with this part, carefully budget transceiver reference-clock quality, PCB stack-up loss budgets, and thermal management for the 1932-ball FCBGA. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure, and validate signal integrity with IBIS-AMI models for every high-speed link.
This page synthesizes distributor stock, parametric alternatives, and practical design considerations not found in the manufacturer datasheet, giving engineers a single decision-ready view of the 10AX115U4F45E3LG.
ドロップイン代替品: 10AX115U4F45E3LG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX115U4F45E3LG （同一形状・フットプリント） — 相違点: Package, Process Node, Max Transceiver Data Rate, Speed Grade, Transceiver Data Rate.
クイック比較ツール — 並列比較する代替部品を選択:
10AX115U4F45E3SG
✅ ドロップイン✓ 在庫あり
$5200 / 個
データシートを見る →10AX115U4F45I3LG
✅ ドロップイン✓ 在庫あり
$5920 / 個
データシートを見る →10AX115U4F45I3SG
✅ ドロップイン✓ 在庫あり
$7400 / 個
データシートを見る →10AX115U3F45E2LG
✅ ドロップイン✓ 在庫あり
$8500 / 個
データシートを見る →10AX115U2F45E1SG
✅ ドロップイン✓ 在庫あり
$13900 / 個
データシートを見る →10AX115U1F45E1SG
✅ ドロップイン✓ 在庫あり
$5680 / 個
データシートを見る →10AX115U4F45E3LG 最大定格＆電気的特性
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| User I/Os | 480 |
| パッケージ | 1932-ball FCBGA |
| Process Node | 20 nm TSMC |
| Transceiver Channels | Up to 96 |
| Max Transceiver Data Rate | 17.4 Gbps |
| DSP Blocks | 1,518 (variable-precision) |
| Hard PCIe Gen3 Cores | Yes (x8 capable) |
| Hard Memory Controllers | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| Speed Grade | E3 (fastest commercial) |
| Temperature Grade | L (extended commercial) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount (BGA) |
10AX115U4F45E3LG 1932-ball fcbga ピン配置ガイド
10AX115U4F45E3LG (1932-ball fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX115U4F45E3LG.
詳細は データシート をご参照ください。
主な用途
10AX115U4F45E3LG の用途: 7 件s: Wireline Telecom Line Cards, Wireless Baseband and Fronthaul, ASIC Prototyping and Emulation, Broadcast Video Processing, Test and Measurement Equipment, Industrial Imaging and Machine Vision, Radar and Electronic Warfare.
Wireline Telecom Line Cards
The 10AX115U4F45E3LG's 1.15M logic elements and 96 transceiver channels at 17.4 Gbps make it ideal for high-capacity line cards in OTN, Ethernet, and CPRI fronthaul platforms. The hard PCIe Gen3 x8 cores simplify backplane connectivity to host CPUs or NPUs, while the hard memory controllers support DDR4 interfaces for deep packet buffering. Compared with a Stratix 10, the Arria 10 GX delivers this performance at substantially lower power, suiting dense multi-rack deployments.
おすすめ
Wireless Baseband and Fronthaul
Wireless baseband and fronthaul units benefit from the 10AX115U4F45E3LG's CPRI and OBSAI transceiver support at up to 17.4 Gbps, combined with 1,518 variable-precision DSP blocks for channel estimation, FFT/iFFT, and digital predistortion. The 68,857,856 bits of embedded memory enable large buffer pools for HARQ processing. Designers can scale channel density by adjusting transceiver count while reusing the same PCB, leveraging the 1932-ball FCBGA's full pin exposure.
おすすめ
ASIC Prototyping and Emulation
The 10AX115U4F45E3LG is widely deployed for ASIC and SoC prototyping because its 1.15M logic elements, abundant DSP, and 96 transceivers emulate a complex ASIC's datapath, control logic, and serial I/O in real time. Quartus Prime's incremental compile flow supports rapid design partitioning across multiple FPGAs. The 1932-ball FCBGA's thermal envelope and signal-integrity margins require careful PCB stack-up and cooling design, per Intel's prototyping methodology guides.
おすすめ
Broadcast Video Processing
Broadcast video equipment such as routers, multiviewers, and contribution encoders rely on the 10AX115U4F45E3LG for SDI aggregation up to 12G-SDI, frame-store buffering, and on-the-fly color-space conversion. The 68 Mbits of embedded memory allow multi-frame buffering at 4K resolutions, while 1,518 DSP blocks accelerate scaling and deinterlacing filters. With hard PCIe and DDR4 controllers, designers reduce external component count versus soft IP-only approaches.
おすすめ
Test and Measurement Equipment
The 10AX115U4F45E3LG's 96 transceivers at 17.4 Gbps and 480 user I/Os are well matched to high-channel-count oscilloscopes, BERTs, and protocol analyzers. Designers use the hard PCIe cores for host data upload at line rate, and abundant DSP blocks for eye-diagram analysis and de-embedding. The 1932-ball FCBGA pinout enables direct connection to front-end ADCs/DACs without external muxes, reducing measurement path loss and improving signal fidelity.
おすすめ
Industrial Imaging and Machine Vision
Industrial machine vision systems leverage the 10AX115U4F45E3LG for multi-sensor aggregation through high-speed links such as CoaXPress, Camera Link, and 10GigE Vision. The 1,518 variable-precision DSP blocks accelerate Bayer demosaicing, color matrix, and edge-detection algorithms in real time. With 480 user I/Os, the FPGA can interface directly to sensors, encoders, and GPIO without external bridge chips, simplifying industrial PC and PLC integration.
おすすめ
Radar and Electronic Warfare
Defence and aerospace radar/electronic-warfare subsystems use the 10AX115U4F45E3LG for wideband sampling, beamforming, and pulse compression. The 1.15M logic elements and 1,518 DSP blocks support thousands of simultaneous beamformer taps, while the 96 transceiver channels aggregate multiple antenna feeds at high sample rate. Designers planning SWaP-constrained platforms can move to the I3 temperature variant of the same package for harsh-environment qualification.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX115U4F45E3LG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX115U4F45E3SG | 10AX115U4F45I3LG | 10AX115U4F45I3SG | 10AX115U3F45E2LG | 10AX115U2F45E1SG | 10AX115U1F45E1SG |
|---|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | E3 | E3 | I3 | I3 | E2 | E1 | E1 |
| Temperature Grade | L (Extended Commercial) | L (Extended Commercial) | I (Industrial) | I (Industrial) | L (Extended Commercial) | L (Extended Commercial) | L (Extended Commercial) |
| Transceiver Tier | U4 (96 channels, 17.4 Gbps) | U4 (96 channels) | U4 (96 channels) | U4 (96 channels) | U3 (reduced) | U2 (reduced) | U1 (minimum) |
| Embedded Memory Bits | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/Os | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
主な差別化要因
- Highest-density Arria 10 GX with 96 transceivers at 17.4 Gbps （vs 10AX115U3F45E2LG)
- E3 speed grade provides the tightest timing margin in the family （vs 10AX115U4F45I3LG)
- Hard PCIe Gen3 x8 and DDR4 memory controllers reduce logic usage （vs Stratix 10 family)
設計ノート
Estimated: A 1932-ball FCBGA Arria 10 GX device at full utilization can dissipate 25-35 W, depending on toggle rate and transceiver activity. Designers should use Intel's PowerPlay Early Power Estimator to model thermal envelope, and provide a thermal via array beneath the exposed die pad and a high-performance heatsink. Junction temperature must remain below 100 C in the L grade. Validate with a thermal probe on prototype builds before committing the production layout.
Follow Intel's Arria 10 PCB Design Guidelines for stack-up, via-in-pad recommendations, and impedance control. The 17.4 Gbps transceivers require low-loss PCB material (e.g., Megtron 6, FR4-408HR) with matched 100-ohm differential pairs, length-matched within 5 mil across each lane, and AC-coupling capacitors placed close to the transmitter. Reference-clock jitter must meet the requirements in the Arria 10 device datasheet - budget 100 fs RMS jitter for 10 Gbps links.
Decouple power rails with a mix of bulk, mid-range, and high-frequency capacitors placed as close as possible to the BGA balls. Use short, wide power-trace paths and stitch the reference planes beneath the device. Route high-speed transceivers on the top layer or buried microstrip layers to minimize vias. Separate analog and digital grounds where possible, joining at a single point near the FPGA. Validate the layout with signal-integrity simulation before tape-out.
Do not assume all Arria 10 device options are pin-compatible; verify the F45 package pin-out file for the specific order code (E3LG, E3SG, I3LG, etc.). Do not underestimate configuration time - large bitstreams can take hundreds of milliseconds to load through PCIe or fast passive parallel. Confirm configuration scheme (e.g., EPCQ-L flash) availability and write-protection during production programming. Finally, always populate MSL-handling precautions per JEDEC J-STD-033 for the FCBGA's moisture sensitivity level.
コンプライアンス情報
RoHS and lead-free compliance per Intel product page. AEC-Q100 not applicable - the Arria 10 GX is not automotive-qualified. Halogen-free status not explicitly stated in provided data; refer to the Arria 10 material declaration documents.