10AX115U4F45I3LG - Arria 10 GX FPGA 1150K LE 1932-FCBGA | Intel
MPN: 10AX115U4F45I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $7820 | $78,200.00 |
| 100 | $7050 | $705,000.00 |
| 500 | $6480 | $3,240,000.00 |
| 1,000 | $5920 | $5,920,000.00 |
Drop-in alternatives for 10AX115U4F45I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U4F45I3SG
✅ Drop-In✓ In Stock
$7400 / Unit
View Datasheet →10AX115U4F45E3LG
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$5650 / Unit
View Datasheet →10AX115U4F45E3SG
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$5200 / Unit
View Datasheet →10AX115S4F45I3LG
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$10000 / Unit
View Datasheet →10AX115N4F45I3LG
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$7100 / Unit
View Datasheet →10AX090U4F45I3LG
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$7450 / Unit
View Datasheet →10AX115U4F45I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 |
| Embedded 18x18 Multipliers | 3,036 |
| Variable-Precision DSP Blocks | 1,518 |
| Maximum User I/O | 480 |
| Maximum Transceivers | 96 |
| Transceiver Data Rate | Up to 14.4 Gbps |
| PLLs | 24 |
| Process Technology | TSMC 20 nm |
| Core Voltage (Vcc) | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Package | 1932-ball FCBGA (F45), 45 x 45 mm, 1.0 mm pitch |
| RoHS Status | Compliant |
10AX115U4F45I3LG 1932-ball fcbga (f45), 45 x 45 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10AX115U4F45I3LG (1932-ball fcbga (f45), 45 x 45 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U4F45I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U4F45I3LG is suitable for 6 applications: 100G Ethernet Line Card / Network Switch, 4K/8K Video Broadcast Infrastructure, Wireless Baseband and CPRI Aggregation, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator (CT / MRI / Ultrasound), High-Performance Compute Prototyping and ASIC Emulation.
100G Ethernet Line Card / Network Switch
The 10AX115U4F45I3LG is well suited to 100G Ethernet line-card design thanks to its 96 transceivers at 14.4 Gbps and the hardened 100G MAC and PCS IP. In a typical line card, the FPGA receives 100G traffic via 4x25G or 10x10G optical interfaces, performs packet classification, MACSec encryption at up to 100G, and forwards to a switch ASIC over a 100G or 400G uplink. The 1,150,000 logic elements provide ample room for traffic manager and look-up engine logic, while the 1,518 variable-precision DSP blocks accelerate header parsing and encryption. Unlike smaller Arria 10 devices, the 10AX115 has sufficient logic density to combine multiple 100G ports with the entire packet-processing pipeline on a single device, reducing BOM cost and power.
Recommended
4K/8K Video Broadcast Infrastructure
The 10AX115U4F45I3LG supports 4K and 8K video broadcast and production workflows where multi-channel 12G-SDI and IP-based ST 2110 transport must be processed in real time. The 96 transceivers at 14.4 Gbps can carry multiple uncompressed 12G-SDI streams or 25G Ethernet ST 2110 channels, while the 1,518 DSP blocks handle real-time scaling, color space conversion, HDR tone mapping, and deinterlacing at full 8K resolution. The 68.86 Mbit of embedded memory provides frame buffering and lookup tables for color correction. Compared with ASSP broadcast SoCs, the Arria 10 GX allows broadcast OEMs to differentiate through proprietary processing IP and to evolve with changing codec standards.
Recommended
Wireless Baseband and CPRI Aggregation
In LTE and 5G NR fronthaul and baseband processing, the 10AX115U4F45I3LG provides the logic density and transceiver count to aggregate multiple CPRI or eCPRI links while running PHY-layer DSP. The 96 transceivers can carry up to 24 CPRI option 9 (9.8 Gbps) links or 48 CPRI option 7 (6.1 Gbps) links from remote radio heads, while the DSP blocks perform FFT/iFFT, channel estimation, and digital pre-distortion for the baseband. The industrial temperature range makes the part suitable for outdoor baseband units. The 1,150,000 logic elements allow the full PHY plus a small MAC to be implemented on a single device, reducing the bill of materials in centralized-RAN deployments.
Recommended
Radar and Electronic Warfare Signal Processing
Radar and electronic-warfare systems demand wideband ADC capture, real-time DSP, and high-speed backhaul, all of which the 10AX115U4F45I3LG delivers in a single package. The 96 transceivers accept multi-channel ADC outputs at 10 Gbps and forward pre-processed data to a back-end processor over 100G Ethernet, while the 1,518 DSP blocks perform pulse compression, MTI filtering, and beamforming across thousands of antenna elements. The 68.86 Mbit of embedded memory holds real-time aperture data. Compared with GPU-based processing, the FPGA delivers deterministic latency and lower power for time-critical EW applications, and the -40C to +100C industrial temperature range supports ground-vehicle and shipboard deployment.
Recommended
Medical Imaging Accelerator (CT / MRI / Ultrasound)
The 10AX115U4F45I3LG is used in premium medical imaging systems including CT scanners, MRI receivers, and high-end ultrasound to perform back-projection, FFT, and beamforming in real time at low power. The 1,518 variable-precision DSP blocks deliver approximately 1.5 TFLOPs of single-precision performance, sufficient to reconstruct 512-slice CT volumes in real time, while the 96 transceivers accept raw data from hundreds of ultrasound or MRI receiver channels. The 1,150,000 logic elements allow the entire image-processing pipeline, from raw sample to display-ready image, to be implemented on a single FPGA, shortening time-to-market for medical OEMs and enabling field upgrades as new algorithms are validated.
Recommended
High-Performance Compute Prototyping and ASIC Emulation
Data-center ASICs and custom accelerators are prototyped and emulated in the 10AX115U4F45I3LG because it offers 1,150,000 logic elements, 3,036 hardware multipliers, and 480 user I/O in a single device. Emulation platforms stack multiple FPGAs to model billion-gate ASICs, while the F45 package's 480 I/O support high-speed chip-to-chip links. The 0.9 V core voltage and Intel's proven Quartus Prime toolchain deliver 2-3x faster compile times than competing FPGA families. The 10AX115U4F45I3LG is frequently used as the 'core' FPGA in multi-FPGA emulation boards because its density allows the largest single-ASIC partition to be mapped, reducing partition count and overall compile time.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U4F45I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U4F45I3SG | 10AX115U4F45E3LG | 10AX115U4F45E3SG | 10AX115S4F45I3LG | 10AX115N4F45I3LG | 10AX090U4F45I3LG |
|---|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,568,000 (-22%) |
| Maximum Transceivers | 96 | 96 | 96 | 96 | 72 (-25%) | 0 (no transceivers) | 96 |
| Transceiver Data Rate | 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | N/A (no transceivers) | 14.4 Gbps |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,200 (-21%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +125C) | Extended (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Packing Format | Tape-and-Reel (L) | Tray (G) | Tape-and-Reel (L) | Tray (G) | Tape-and-Reel (L) | Tape-and-Reel (L) | Tape-and-Reel (L) |
Key Differentiators
- Highest-density 10AX115 variant with full 96-transceiver complement (vs 10AX090U4F45I3LG)
- Industrial vs Extended temperature grade flexibility within F45 (vs 10AX115U4F45E3LG)
- Identical silicon, alternative packing for production volume (vs 10AX115U4F45I3SG)
Design Notes
The 1932-ball F45 FCBGA with 1.0 mm ball pitch requires an HDI PCB stackup with stacked microvias for signal and power escape. Plan the stackup during schematic capture, not after layout, because a 1.0 mm BGA cannot be escaped on a conventional 6-layer board with through vias. Use a minimum 8-layer HDI stackup (4-2-4 or 5-2-5) with 0.5 oz copper in core and 1 oz in outer layers; the FPGA core region typically requires 4-6 dedicated ground and power planes for power integrity. Estimated: at 14.4 Gbps transceiver data rate, total loss budget through the PCB + package + connector must remain below 18 dB, including approximately 6 dB loss in the package itself.
The 10AX115U4F45I3LG requires multiple power rails: 0.9 V core, 0.95 V transceiver supply, 1.8 V auxiliary, 1.2 V/2.5 V/3.0 V I/O banks, and a 1.8 V or 3.3 V configuration supply. Use a dedicated power management controller such as the Intel-recommended Enpirion or similar PowerSoC, with the sequencing shown in the Arria 10 Power Management User Guide. Estimated: at typical utilization the part draws 25-40 W on the 0.9 V core; total board power with 50% transceiver utilization is 40-60 W, requiring a buck converter capable of at least 50 A on the core rail with 1% accuracy.
At 40-60 W total board power, the 10AX115U4F45I3LG requires active cooling. With the 1932-ball F45 FCBGA package, the junction-to-ambient thermal resistance depends heavily on PCB copper area and heatsink design; with a 1 square inch copper pour on the top layer and a low-profile pin-fin heatsink, theta_JA is approximately 1.0-1.5 C/W. Estimated: at 40 W total power, junction temperature rise above ambient is approximately 40-60 C, so for industrial operation up to 100 C ambient the heatsink must keep junction below 100 C, requiring either 1-2 m/s airflow or a large aluminum heatsink. Use the Arria 10 thermal estimator spreadsheet during the design phase.
Three pitfalls are common when designing with the 10AX115U4F45I3LG. First, do not omit the configuration voltage rail or use the wrong pull-up - the FPGA will not configure and the JTAG programmer will appear to hang. Second, do not reuse the Quartus Prime pinout from a previous design without re-running pin-aware fitter; even within the same F45 package, the ball map depends on the speed grade and tier. Third, transceiver reference clock jitter must remain below 300 fs RMS for 14.4 Gbps operation; low-cost crystal oscillators will not meet this - use a dedicated clock generator IC with sub-200 fs RMS jitter.
Compliance Information
RoHS and REACH compliant per the Altera/Intel product page. AEC-Q100 not applicable - this is an FPGA, not a discrete automotive IC. For automotive under-hood, choose the E3 temperature grade variant.
