10AX115U4F45E3SG - Arria 10 GX 1150K LE FPGA | Intel | 1932-FCBGA
MPN: 10AX115U4F45E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7800 | $7,800.00 |
| 10 | $7200 | $72,000.00 |
| 100 | $6500 | $650,000.00 |
| 500 | $5800 | $2,900,000.00 |
| 1,000 | $5200 | $5,200,000.00 |
10AX115U4F45E3SG Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (LBs/ALMs), programmable interconnect, dedicated DSP blocks, block RAM (BRAM/M20K), high-speed transceivers, and clock management PLLs. FPGAs sit at the apex of digital IC complexity: above microcontrollers in raw parallel compute and below ASICs in per-unit cost at high volumes. They are widely used for hardware-accelerated signal processing, packet processing, video pipelines, and prototyping of ASICs.
Key features of the 10AX115U4F45E3SG include 1,150K logic elements, 68.86 Mbits embedded memory (BRAM/M20K), 3,026 DSP blocks (estimated from family), 24 transceiver channels at up to 17.4 Gbps, 480 GPIO across the F45 (45mm flip-chip BGA) package, 1.0 V core (VCC) with 0.9 V internal linear regulation per the datasheet, and an enhanced 20nm process node. The 1932-ball FCBGA package supports high pin count and is suitable for high-bandwidth designs requiring many serial links and parallel I/O.
From an architectural perspective, the device integrates hardened PCI Express Gen3 controllers, hard memory controllers (DDR4/DDR3 with ECC), and configurable fractional PLLs. This architectural blending reduces soft-logic utilization and lowers power per operation. Per the manufacturer datasheet, the operating temperature range of the E3 speed grade at 0.85V VCC is 0C to 100C (junction), and the device is built on TSMC's 20nm process.
Typical applications include 100G/400G optical transport platforms, LTE/5G baseband processing, military radar and electronic warfare, medical imaging, and high-end video broadcast equipment. The mid-range Arria 10 GX is preferred over Cyclone V for transceiver-heavy designs and over Stratix 10 when cost-per-channel matters more than absolute density.
When designing with the 10AX115U4F45E3SG, ensure multi-layer PCB stack-up (at least 12 layers for signal integrity on 17.4 Gbps links) and use Intel Quartus Prime Pro for synthesis, place-and-route, and timing closure. The 1932-BGA requires X-ray inspection or careful reflow profiling due to 1mm pitch.
This page synthesizes distributor pricing, drop-in alternatives from the Arria 10 family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for 10AX115U4F45E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AX115U4F45E3SG (same form factor and footprint) — differing in Package, Speed Grade, Process Node, Family, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U4F45E3LG
✅ Drop-In✓ In Stock
$5650 / Unit
View Datasheet →10AX115U4F45I3SG
✅ Drop-In✓ In Stock
$7400 / Unit
View Datasheet →10AX115U4F45I3LG
✅ Drop-In✓ In Stock
$5920 / Unit
View Datasheet →10AX115S4F45E3SG
✅ Drop-In✓ In Stock
$3210 / Unit
View Datasheet →10AX115N4F45E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115U3F45E2SG
✅ Drop-In✓ In Stock
$5800 / Unit
View Datasheet →10AX090U4F45E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115U4F45E3SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/O Count | 480 |
| Package Type | 1932-BBGA, FCBGA (F45) |
| Package Dimensions | 45 mm x 45 mm |
| Core Voltage (VCC) | 0.85 V / 0.9 V |
| Supply Voltage Nominal | 0.9 V |
| Process Node | 20 nm (TSMC) |
| Speed Grade | E3 |
| Operating Temperature Range | 0C to 100C (TJ) |
| Transceivers | Up to 24 channels at 17.4 Gbps |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX115U4F45E3SG 45 mm x 45 mm Pin Configuration Guide
Pin configuration for 10AX115U4F45E3SG (45 mm x 45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U4F45E3SG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AX115U4F45E3SG is suitable for 6 applications: 100G/400G Optical Transport Networks, 5G Baseband and Fronthaul Processing, Military Radar and Electronic Warfare, 4K/UHD Video Broadcast Equipment, Medical Imaging Systems (CT, MRI, Ultrasound), High-Performance Compute Acceleration Cards.
100G/400G Optical Transport Networks
The 10AX115U4F45E3SG is well-matched to 100G and 400G optical transport platforms because it integrates 24 transceivers at up to 17.4 Gbps, which can be bonded into 4x or 10x lanes for OTU4 (111.8 Gbps) and OTUCn links. Its 1,150K logic elements and 68.86 Mbits of M20K block RAM provide ample fabric and packet buffering for OTN framer and GFP mapping. Designers typically place the device between 100G/400G optical modules (QSFP28/QSFP-DD) and a switch fabric ASIC, using hardened PCS lanes to reduce soft-logic footprint.
Recommended
5G Baseband and Fronthaul Processing
In 4G/5G base stations the 10AX115U4F45E3SG provides hundreds of GMACs of fixed-point throughput through 3,000+ DSP blocks for PHY-layer channel estimation, FFT/IFFT, and digital predistortion. Its 17.4 Gbps transceivers natively support CPRI v7.0 and eCPRI rates for fronthaul and midhaul connections. The 1932-BGA package is suited to compact radio units where 24 transceivers plus 480 GPIO feed antenna arrays and backhaul. Industrial-temperature SKUs from the same family extend deployment to macro-cell outdoor enclosures.
Recommended
Military Radar and Electronic Warfare
The Arria 10 GX architecture provides hardened floating-point DSP support, thousands of parallel compute lanes, and secure configuration bitstream features that suit radar and electronic-warfare systems. The 10AX115U4F45E3SG's 24 transceivers connect to ADC/DAC JESD204B/C interfaces running at up to 12.5 Gbps, while the 1,150K logic elements implement pulse compression, beamforming weights, and adaptive jamming cancellation. The -40C to 100C operating range (industrial SKUs) and design security features make it suitable for demanding defense programs.
Recommended
4K/UHD Video Broadcast Equipment
The 10AX115U4F45E3SG supports 4K/UHD video processing pipelines by combining 1,150K logic elements with a hardened memory controller block and 24 high-speed transceivers. It can ingest 12G-SDI streams (4x at 3 Gbps or 1x at 12 Gbps) via SDI IP cores and process them through scaling, HDR conversion, and frame-rate conversion fabrics. Its 68.86 Mbits of block RAM provide sufficient frame buffering for live broadcast switching and graphics overlay. Production broadcasters and contribution encoders use Arria 10 GX to bridge SDI to SMPTE 2110 IP infrastructures.
Recommended
Medical Imaging Systems (CT, MRI, Ultrasound)
In CT and MRI scanners the 10AX115U4F45E3SG processes high-resolution image data using thousands of parallel DSP slices. The 1,150K logic elements deliver the throughput needed for back-projection, image reconstruction, and adaptive filtering at clinical frame rates. PCIe Gen3 hard IP connects the FPGA directly to host CPUs, while the 68.86 Mbits of block RAM cache raw detector channels during reconstruction. The 1932-BGA package supports compact board layouts in cart-based or ceiling-mounted imaging modalities.
Recommended
High-Performance Compute Acceleration Cards
The 10AX115U4F45E3SG is used as a PCIe Gen3 accelerator on compute boards to offload workloads such as financial Monte Carlo, genomic alignment, and machine-learning inference. Its hardened PCIe Gen3 x8 controller plus 24 transceivers enable low-latency DMA and host-to-FPGA streaming, while the 1,150K logic elements and thousands of DSP blocks deliver floating-point performance competitive with mid-range GPUs on specific kernels. With 480 GPIO the device also exposes FPGA-to-FPGA links and high-bandwidth memory (HBM) interfaces for data-center workloads.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U4F45E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U4F45E3LG | 10AX115U4F45I3SG | 10AX115U4F45I3LG | 10AX115S4F45E3SG |
|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| Transceivers | Up to 24 @ 17.4 Gbps | Up to 24 @ 17.4 Gbps | Up to 24 @ 17.4 Gbps | Up to 24 @ 17.4 Gbps | 0 (transceiver-free variant) |
| Speed Grade | E3 (commercial) | E3 (commercial) | I3 (industrial) | I3 (industrial) | E3 (commercial) |
| Operating Temperature | 0C to 100C (TJ) | 0C to 100C (TJ) | -40C to 100C (TJ) | -40C to 100C (TJ) | 0C to 100C (TJ) |
| User I/O Count | 480 | 480 | 480 | 480 | 480 |
| Lead-free / Halogen-free | Pb-free (G) | Pb-free + Halogen-free (LG) | Pb-free (G) | Pb-free + Halogen-free (LG) | Pb-free (G) |
Key Differentiators
- Highest-density F45-package Arria 10 GX with all 24 transceivers exposed (vs 10AX115S4F45E3SG)
- Commercial E3 speed grade for higher Fmax on logic and DSP paths (vs 10AX115U3F45E2SG)
- Same F45 pinout as lower-density 10AX090U4F45E3SG for design portability (vs 10AX090U4F45E3SG)
Design Notes
The 1932-BGA F45 package with 1 mm ball pitch demands ENIG surface finish, controlled-impedance traces (100 ohm differential for transceivers, 50 ohm single-ended for GPIO), and at least a 12-layer PCB stack-up for 17.4 Gbps channel compliance. Use buried vias with back-drilling to reduce stub-induced reflections on long transceiver routes. Apply the Intel Arria 10 GX pin connection guidelines for unused-pin termination and shared reference-plane recommendations.
Estimated: at full transceiver utilization (24 lanes at 17.4 Gbps), internal logic at 80% utilization, and ambient airflow of 1 m/s, the 1932-FCBGA package typically dissipates 25-35 W. Reference the Arria 10 GX power calculator and derate junction temperature to stay below 100C (TJ max for E3 grade). A heat spreader or heatsink with thermal interface material is recommended; airflow of at least 2 m/s over the device is required for reliable 100G-class operation.
Do not confuse the 10AX115U (1150K LE, with transceivers), 10AX115S (1150K LE, transceiver-free), and 10AX115N (1150K LE, no transceivers, reduced DSP) variants - they share the same F45 package and pinout but have different logic fabric and IP availability. The 'E' suffix denotes commercial (0C to 100C) and 'I' denotes industrial (-40C to 100C) temperature grades. Confirm Quartus Prime device selection matches the exact order code before tape-out to avoid hardware/software mismatches.
Compliance Information
RoHS compliant per distributor listings (DigiKey, Richardson Electronics). Lead-free confirmed by 'G' suffix in order code. Halogen-free not explicitly stated for this MPN - use 10AX115U4F45E3LG for halogen-free variant. AEC-Q100 is not applicable for FPGAs.
