10M08DCF256C8G - MAX 10 FPGA, 8K LE, 256-LBGA | Intel / Altera
部品番号: 10M08DCF256C8G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.07 | $4.07 |
| 10 | $3.66 | $36.60 |
| 100 | $3.25 | $325.00 |
| 500 | $2.86 | $1,430.00 |
| 1,000 | $2.55 | $2,550.00 |
| 3,000 | $2.28 | $6,840.00 |
10M08DCF256C8G 概要
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LUTs, flip-flops, DSP blocks, block RAM) connected by a programmable routing fabric. Unlike an ASIC, an FPGA's function is defined at compile time and re-loaded on every power-up, making it ideal for prototyping, low-volume production, and designs that must evolve in the field. Within the broader taxonomy, the MAX 10 sits in the low-power, non-volatile FPGA category: FPGA -> non-volatile FPGA -> CPLD-replacement FPGA -> MAX 10 family -> Intel FPGA portfolio. This positioning makes it well suited as a bridge between traditional CPLDs and higher-density Cyclone series FPGAs.
Key features include 8K logic elements, 378 Kbits of user flash memory, 8 dedicated 18x18 multipliers, two I/O banks with LVDS support, and an integrated ADC block. The device operates across the industrial temperature range (-40C to +100C ambient for the C8 speed grade) and supports core voltages of 1.2 V with multi-voltage I/O banks (1.2 V to 3.3 V) for direct interface to legacy 5 V-tolerant peripherals via resistor dividers.
Architecturally, MAX 10 FPGAs embed configuration flash on-die, eliminating the need for a separate boot memory and reducing bill-of-material cost. Designers access the device through the Intel Quartus Prime design software, which supports schematic, VHDL, Verilog, and SystemVerilog entry. Configuration is via JTAG, AS (Active Serial), or internal flash load modes. The C8 speed grade is the commercial temperature grade at the slowest speed bin, which keeps unit cost low while still supporting design frequencies up to approximately 200 MHz for typical logic paths.
Typical applications include industrial motor and motion control, factory automation I/O expansion, video bridging and display controllers, low-cost protocol bridging (UART/SPI/I2C to Ethernet), portable test and measurement, and consumer IoT edge nodes. The integrated ADC also makes the part attractive for sensor aggregation and battery-management front-ends in space-constrained embedded designs.
When designing with the 10M08DCF256C8G, pay close attention to the 256-ball BGA fanout: at 1.0 mm pitch, four-layer PCB manufacturing with microvias is recommended. Use the Quartus Prime pin planner to assign I/O bank voltages before finalizing the schematic, and decouple every VCCINT/VCCA/VCCIO rail with 0.1 uF plus 10 uF capacitors placed within 5 mm of the ball.
This page synthesizes current distributor pricing, same-package alternatives from the MAX 10 family, and practical PCB design notes that are not aggregated on any single distributor or manufacturer page.
ドロップイン代替品: 10M08DCF256C8G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M08DCF256C8G （同一形状・フットプリント） — 相違点: Package, Process Technology, Operating Temperature, Speed Grade, Configuration Memory.
クイック比較ツール — 並列比較する代替部品を選択:
10M08DCF256A7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$15.2 / 個
データシートを見る →10M08DCF256I7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$12.2 / 個
データシートを見る →10M08DAF256C8G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$15.4 / 個
データシートを見る →10M08DAF256C7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.95 / 個
データシートを見る →10M08DAF256A7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$18.95 / 個
データシートを見る →10M08DCF256C8G 最大定格＆電気的特性
| Series | MAX 10 |
| Logic Elements | 8,000 |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) |
| User I/O Count | 178 |
| パッケージ | 256-LBGA (F256, FineLine BGA) |
| Pitch | 1.0 mm |
| Speed Grade | C8 (commercial, slowest speed bin) |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) |
| Configuration | Internal flash (instant-on, non-volatile) |
| ADC | Dual 12-bit SAR, up to 17 analog inputs |
| 18x18 Multipliers | 8 |
| PLLs | 2 |
| Global Clock Networks | 4 |
| Process Technology | TSMC 55 nm embedded flash CMOS |
| 動作温度 | 0C to +85C (commercial) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (168 hours) |
10M08DCF256C8G 256-lbga (f256, fineline bga) ピン配置ガイド
10M08DCF256C8G (256-lbga (f256, fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M08DCF256C8G.
詳細は データシート をご参照ください。
主な用途
10M08DCF256C8G の用途: 6 件s: Industrial Motor and Motion Control, Factory Automation I/O Expansion, Video Bridging and Display Controllers, Protocol Bridging (UART/SPI/I2C to Ethernet), Portable Test and Measurement, IoT Edge Sensor Nodes.
Industrial Motor and Motion Control
The 10M08DCF256C8G fits industrial motor and motion control systems because its 8,000 logic elements and 8 dedicated 18x18 multipliers deliver the throughput needed for closed-loop current control and resolver-to-digital conversion while the on-chip 12-bit ADC samples motor phase currents synchronously to the PWM. At 178 user I/Os the device accepts multiple encoder inputs, limit switches, and gate-drive enable lines without external I/O expanders, and the LVDS-capable banks reduce wiring complexity for high-speed feedback. The integrated flash eliminates external boot memory, which lowers PCB area and BOM cost in space-constrained servo-drive enclosures.
おすすめ
Factory Automation I/O Expansion
In factory automation backplanes, the 10M08DCF256C8G acts as a smart I/O aggregator that converts legacy fieldbus signals (24 V digital, 0-10 V analog, RS-485) into industrial Ethernet frames. The 8K LE budget accommodates soft-core Modbus TCP and EtherNet/IP stacks alongside deterministic glue logic, while the 387 Kbits of embedded memory buffer packet bursts during network congestion. Its dual-bank I/O supports both 3.3 V logic and 5 V-tolerant peripherals via resistor dividers, removing the need for level shifters on the backplane.
おすすめ
Video Bridging and Display Controllers
For video bridging between MIPI, LVDS, RGB, and HDMI sources, the 10M08DCF256C8G delivers the LVDS I/O bandwidth and 8 hardware multipliers required for color-space conversion and limited scaler functions. Designers typically instantiate a soft MIPI D-PHY receive bridge and route the recovered pixels through the FPGA to an LVDS display output. The 378 Kbits of user flash stores gamma tables and EDID data on power-up, removing the need for an external EEPROM. The 178 user I/Os comfortably absorb parallel RGB888 plus control signals.
おすすめ
Protocol Bridging (UART/SPI/I2C to Ethernet)
The 10M08DCF256C8G is well matched to compact protocol bridges that translate between legacy microcontroller buses and 10/100 Ethernet. Its 8K logic elements host a soft MAC, a lightweight TCP/IP stack, and several UART/SPI/I2C slave controllers concurrently, while the dual 12-bit ADC monitors the supply rail for PoE detection. Designers can use the on-chip user flash to store MAC addresses, certificates, and configuration web pages, eliminating external EEPROM and reducing BOM. The F256 BGA footprint keeps the bridge module under 25 mm square.
おすすめ
Portable Test and Measurement
Portable test instruments use the 10M08DCF256C8G to implement waveform synthesis, signal conditioning, and user-interface glue logic in a single chip. The integrated 12-bit ADC at 1 MSPS captures analog signals directly, while the FPGA fabric generates arbitrary stimulus patterns and runs statistical analysis in hardware. Non-volatile flash configuration means the instrument boots to a known state instantly, which is critical for field calibration workflows. The commercial C8 grade keeps unit cost low for high-volume product SKUs.
おすすめ
IoT Edge Sensor Nodes
In battery-friendly IoT edge nodes the 10M08DCF256C8G performs sensor fusion, anomaly detection, and low-power wake-up logic before forwarding data to a host MCU. The MAX 10's instant-on flash configuration allows the device to wake from a deep-sleep host, gather a burst of samples, run on-FPGA inference, and return results in under 10 ms - significantly reducing radio-on time. Its dual I/O banks handle both 1.8 V sensors and 3.3 V radios on the same board, and the ADC can monitor battery voltage directly without a separate fuel gauge IC.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M08DCF256C8G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M08DCF256A7G | 10M08DCF256I7G | 10M08DAF256C8G | 10M08DAF256C7G | 10M08DAF256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| Embedded Memory (bits) | 387,072 | 387,072 | 387,072 | 387,072 | 387,072 | 387,072 |
| User I/O | 178 | 178 | 178 | 178 | 178 | 178 |
| Speed Grade | C8 (slowest commercial) | A7 (fastest) | I7 (industrial) | C8 (commercial, A-variant) | C7 (A-variant, faster) | A7 (A-variant, fastest) |
| Temperature Grade | 0C to +85C (commercial) | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| ADC | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Enhanced 12-bit ADC (A-variant) | Enhanced 12-bit ADC (A-variant) | Enhanced 12-bit ADC (A-variant) |
| Typical Unit Price (qty 100) | $3.25 | $3.90 - $4.20 | $4.40 - $4.80 | $5.10 - $5.60 | $5.20 - $5.70 | $5.60 - $6.10 |
主な差別化要因
- Instant-on non-volatile configuration without external boot memory （vs Lattice iCE40HX1K-VQ100)
- Higher logic density in the same BGA footprint （vs 10M04DCF256C8G)
- Integrated dual 12-bit ADC with up to 17 analog inputs （vs Xilinx Spartan-6 LX9)
設計ノート
Estimated: the F256 BGA at 1.0 mm pitch requires a 4-layer PCB stack-up with microvias (laser-drilled, 0.1 mm diameter) or via-in-pad for the inner rows. Route all signals on the top layer through microvias to inner layers; keep the BGA escape region clear of any plane cuts. Intel's MAX 10 hardware reference design provides a recommended footprint with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter. Reflow profile must follow JEDEC J-STD-020 for MSL-3 packages, with peak temperature no higher than 245C.
The MAX 10 requires separate VCCINT (1.2 V core), VCCA (2.5 V analog supply for the ADC), and per-bank VCCIO rails. Decouple every VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the ball, plus one 10 uF bulk capacitor per rail. VCCA must be filtered with a ferrite bead and 10 uF + 0.1 uF to keep ADC noise below 1 LSB. VCCPD (1.2 V) and VCCBAT (battery backup for the security key) also require dedicated decoupling; consult the MAX 10 pin connection guidelines for the exact pin list on the F256 package.
Do not leave the JTAG TCK pin floating - it will pick up noise and cause spurious configuration attempts. Tie TCK to GND through a 1 kohm pull-down or to VCCIO through a 4.7 kohm pull-up, depending on your JTAG chain topology. Similarly, the nCONFIG and nSTATUS pins require 4.7 kohm pull-ups to VCCIO. Designers frequently forget to enable the CONFIG_IO pull-ups in the Quartus device options, which causes intermittent configuration failures on power-up. Always generate and review the .pin file before board tape-out.
コンプライアンス情報
RoHS and REACH compliance per Intel MAX 10 product declaration. Not AEC-Q100 qualified - the part is intended for industrial and consumer applications; AEC-Q100 variants are not offered in the MAX 10 family.
