10M08SAE144I7G - MAX 10 FPGA, 8K LE, 144-EQFP | Intel
部品番号: 10M08SAE144I7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.5 | $115.00 |
| 100 | $9.2 | $920.00 |
| 500 | $7.95 | $3,975.00 |
| 1,000 | $6.8 | $6,800.00 |
10M08SAE144I7G 概要
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Unlike a microcontroller, FPGAs execute logic in parallel hardware, offering deterministic timing and high I/O throughput. FPGAs sit in the broader hierarchy of programmable logic -> programmable logic device -> logic semiconductor -> integrated circuit, and are widely used to accelerate parallel workloads, glue logic, and interface bridging.
Key features of the 10M08SAE144I7G include 8,000 logic elements, 378 Kbits of user flash memory, a 1.25 Gbps LVDS-capable I/O bank architecture, an integrated 12-bit successive-approximation ADC, and a single 3.3 V core supply. The device also supports Nios II embedded processor cores, JTAG-based configuration, and 18x18 multiplier blocks for digital signal processing. This combination delivers a flexible, processor-capable platform in a single device.
Architecturally, the 10M08SAE144I7G uses a TSMC 55 nm CMOS process with a look-up-table (LUT) based fabric and embedded SRAM blocks (M9K). The integrated flash eliminates external boot components, reducing BOM and board area. The exposed-pad LQFP-144 package supports conventional SMT reflow, simplifying manufacturing versus BGA alternatives. The 144-pin EQFP form factor exposes 101 user I/Os while remaining hand-solderable for prototype work.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing bridges, portable instrumentation, and consumer electronics requiring custom logic or peripheral interfacing. The internal ADC and flash make it well-suited for sensor aggregation and instant-on embedded platforms. Designers frequently pair it with Nios II soft-core firmware for low-cost SoC replacement.
When designing with the 10M08SAE144I7G, ensure the exposed pad (EP) is soldered to a sufficiently large copper pour for thermal dissipation and ground return. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Plan I/O bank voltage (VCCIO) assignments carefully - the 10M08 device supports multiple I/O standards per bank but each bank must use a single VCCIO. Decouple each VCCIO bank with 0.1µF + 10µF ceramic capacitors placed within 5 mm of the supply pins.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, providing a faster engineering decision workflow.
ドロップイン代替品: 10M08SAE144I7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M08SAE144I7G （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Mounting Type, Logic Elements (LE), Core Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
10M08SCE144I7G
✅ ドロップイン✓ 在庫あり
$70.2 / 個
データシートを見る →10M08SAE144C8G
✅ ドロップイン✓ 在庫あり
$16.25 / 個
データシートを見る →10M08SCE144C8G
✅ ドロップイン✓ 在庫あり
$15.95 / 個
データシートを見る →10M08SAU144I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M08SCU144I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M08SAE144I7G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Total RAM Bits | 387072 (378 Kb) |
| User Flash Memory | 1540 Kb (dual-configuration) |
| User I/O Pins | 101 |
| 電源電圧 | 2.85 V to 3.465 V |
| Core Voltage | 3.3 V (single supply) |
| 動作温度 | -40°C to +100°C (TJ) |
| 実装タイプ | Surface Mount |
| パッケージ | 144-LQFP Exposed Pad (EQFP-144) |
| Supplier Device Package | 144-EQFP EP |
| Process Technology | TSMC 55 nm CMOS |
| Embedded Memory Type | M9K SRAM blocks |
| Integrated ADC | Yes, 12-bit SAR |
| Configuration Method | JTAG / internal flash (instant-on) |
| Soft Core Support | Nios II |
| RoHS ステータス | Compliant |
10M08SAE144I7G ピン構成
| ピン 1 | I/O — User I/O - bank 1B |
| ピン 2 | I/O — User I/O - bank 1B |
| ピン 3 | I/O — User I/O - bank 1B |
| ピン 4 | VCCIO1B — I/O bank 1B supply voltage |
| ピン 5 | I/O — User I/O - bank 1B |
| ピン 6 | GND — Ground |
| ピン 7 | I/O — User I/O - bank 1B |
| ピン 8 | I/O — User I/O - bank 1B |
| ピン 9 | VCC — Core supply voltage (3.3V) |
| ピン 10 | I/O — User I/O - bank 1B |
| ピン 11 | GND — Ground |
| ピン 12 | I/O — User I/O - bank 1B |
| ピン 13 | I/O — User I/O - bank 2A |
| ピン 14 | VCCIO2A — I/O bank 2A supply voltage |
| ピン 15 | I/O — User I/O - bank 2A |
| ピン 16 | GND — Ground |
| ピン 17 | I/O — User I/O - bank 2A |
| ピン 18 | I/O — User I/O - bank 2A |
| ピン 19 | VCC — Core supply voltage (3.3V) |
| ピン 20 | I/O — User I/O - bank 2A |
| ピン 21 | I/O — User I/O - bank 2A |
| ピン 22 | VCCIO2A — I/O bank 2A supply voltage |
| ピン 23 | I/O — User I/O - bank 2A |
| ピン 24 | GND — Ground |
| ピン 25 | I/O — User I/O - bank 2A |
| ピン 26 | I/O — User I/O - bank 2A |
| ピン 27 | VCC — Core supply voltage (3.3V) |
| ピン 28 | I/O — User I/O - bank 2A |
| ピン 29 | I/O — User I/O - bank 2A |
| ピン 30 | GND — Ground |
| ピン 31 | I/O — User I/O - bank 2A |
| ピン 32 | VCCIO2A — I/O bank 2A supply voltage |
| ピン 33 | I/O — User I/O - bank 2A |
| ピン 34 | I/O — User I/O - bank 2A |
| ピン 35 | GND — Ground |
| ピン 36 | I/O — User I/O - bank 2A |
| ピン 37 | VCC — Core supply voltage (3.3V) |
| ピン 38 | I/O — User I/O - bank 3A |
| ピン 39 | I/O — User I/O - bank 3A |
| ピン 40 | VCCIO3A — I/O bank 3A supply voltage |
| ピン 41 | I/O — User I/O - bank 3A |
| ピン 42 | GND — Ground |
| ピン 43 | I/O — User I/O - bank 3A |
| ピン 44 | I/O — User I/O - bank 3A |
| ピン 45 | VCC — Core supply voltage (3.3V) |
| ピン 46 | I/O — User I/O - bank 3A |
| ピン 47 | I/O — User I/O - bank 3A |
| ピン 48 | VCCIO3A — I/O bank 3A supply voltage |
| ピン 49 | I/O — User I/O - bank 3A |
| ピン 50 | GND — Ground |
| ピン 51 | I/O — User I/O - bank 3A |
| ピン 52 | I/O — User I/O - bank 3A |
| ピン 53 | VCC — Core supply voltage (3.3V) |
| ピン 54 | I/O — User I/O - bank 3A |
| ピン 55 | I/O — User I/O - bank 3A |
| ピン 56 | VCCIO3A — I/O bank 3A supply voltage |
| ピン 57 | I/O — User I/O - bank 3A |
| ピン 58 | GND — Ground |
| ピン 59 | I/O — User I/O - bank 3A |
| ピン 60 | I/O — User I/O - bank 4A |
| ピン 61 | VCCIO4A — I/O bank 4A supply voltage |
| ピン 62 | I/O — User I/O - bank 4A |
| ピン 63 | GND — Ground |
| ピン 64 | I/O — User I/O - bank 4A |
| ピン 65 | I/O — User I/O - bank 4A |
| ピン 66 | VCC — Core supply voltage (3.3V) |
| ピン 67 | I/O — User I/O - bank 4A |
| ピン 68 | I/O — User I/O - bank 4A |
| ピン 69 | VCCIO4A — I/O bank 4A supply voltage |
| ピン 70 | I/O — User I/O - bank 4A |
| ピン 71 | GND — Ground |
| ピン 72 | I/O — User I/O - bank 4A |
| ピン 73 | I/O — User I/O - bank 4A |
| ピン 74 | VCC — Core supply voltage (3.3V) |
| ピン 75 | I/O — User I/O - bank 4A |
| ピン 76 | I/O — User I/O - bank 4A |
| ピン 77 | GND — Ground |
| ピン 78 | I/O — User I/O - bank 5A |
| ピン 79 | VCCIO5A — I/O bank 5A supply voltage |
| ピン 80 | I/O — User I/O - bank 5A |
| ピン 81 | GND — Ground |
| ピン 82 | I/O — User I/O - bank 5A |
| ピン 83 | I/O — User I/O - bank 5A |
| ピン 84 | VCC — Core supply voltage (3.3V) |
| ピン 85 | I/O — User I/O - bank 5A |
| ピン 86 | I/O — User I/O - bank 5A |
| ピン 87 | VCCIO5A — I/O bank 5A supply voltage |
| ピン 88 | I/O — User I/O - bank 5A |
| ピン 89 | GND — Ground |
| ピン 90 | I/O — User I/O - bank 5A |
| ピン 91 | I/O — User I/O - bank 5A |
| ピン 92 | VCC — Core supply voltage (3.3V) |
| ピン 93 | I/O — User I/O - bank 5A |
| ピン 94 | I/O — User I/O - bank 5A |
| ピン 95 | VCCIO5A — I/O bank 5A supply voltage |
| ピン 96 | I/O — User I/O - bank 5A |
| ピン 97 | GND — Ground |
| ピン 98 | I/O — User I/O - bank 5A |
| ピン 99 | I/O — User I/O - bank 6A |
| ピン 100 | VCCIO6A — I/O bank 6A supply voltage |
| ピン 101 | I/O — User I/O - bank 6A |
| ピン 102 | GND — Ground |
| ピン 103 | I/O — User I/O - bank 6A |
| ピン 104 | I/O — User I/O - bank 6A |
| ピン 105 | VCC — Core supply voltage (3.3V) |
| ピン 106 | I/O — User I/O - bank 6A |
| ピン 107 | I/O — User I/O - bank 6A |
| ピン 108 | VCCIO6A — I/O bank 6A supply voltage |
| ピン 109 | I/O — User I/O - bank 6A |
| ピン 110 | GND — Ground |
| ピン 111 | I/O — User I/O - bank 6A |
| ピン 112 | I/O — User I/O - bank 6A |
| ピン 113 | VCC — Core supply voltage (3.3V) |
| ピン 114 | I/O — User I/O - bank 6A |
| ピン 115 | I/O — User I/O - bank 7A |
| ピン 116 | VCCIO7A — I/O bank 7A supply voltage |
| ピン 117 | I/O — User I/O - bank 7A |
| ピン 118 | GND — Ground |
| ピン 119 | I/O — User I/O - bank 7A |
| ピン 120 | I/O — User I/O - bank 7A |
| ピン 121 | VCC — Core supply voltage (3.3V) |
| ピン 122 | I/O — User I/O - bank 7A |
| ピン 123 | I/O — User I/O - bank 7A |
| ピン 124 | VCCIO7A — I/O bank 7A supply voltage |
| ピン 125 | I/O — User I/O - bank 7A |
| ピン 126 | GND — Ground |
| ピン 127 | I/O — User I/O - bank 7A |
| ピン 128 | I/O — User I/O - bank 8A |
| ピン 129 | VCCIO8A — I/O bank 8A supply voltage |
| ピン 130 | I/O — User I/O - bank 8A |
| ピン 131 | GND — Ground |
| ピン 132 | I/O — User I/O - bank 8A |
| ピン 133 | I/O — User I/O - bank 8A |
| ピン 134 | VCC — Core supply voltage (3.3V) |
| ピン 135 | I/O — User I/O - bank 8A |
| ピン 136 | I/O — User I/O - bank 8A |
| ピン 137 | VCCIO8A — I/O bank 8A supply voltage |
| ピン 138 | I/O — User I/O - bank 8A |
| ピン 139 | GND — Ground |
| ピン 140 | I/O — User I/O - bank 8A |
| ピン 141 | I/O — User I/O - bank 8A |
| ピン 142 | VCC — Core supply voltage (3.3V) |
| ピン 143 | I/O — User I/O - bank 8A |
| ピン 144 | I/O — User I/O - bank 8A |
| ピン EP | GND (Exposed Pad) — Thermal pad - must be soldered to ground pour for thermal dissipation |
主な用途
10M08SAE144I7G の用途: 6 件s: Industrial Motor Control, Factory Automation I/O Expansion, Portable Instrumentation, Sensor Aggregation Hub, Low-Cost Video Processing Bridge, Consumer Electronics Custom Logic.
Industrial Motor Control
The 10M08SAE144I7G is well suited for industrial motor control and drive signal generation in 3-phase BLDC, stepper, and servo applications. Its 8,000 logic elements and 18x18 multiplier blocks can implement Field-Oriented Control (FOC), space-vector modulation, and PID loops in hardware for deterministic sub-microsecond loop times. The integrated 12-bit SAR ADC samples motor phase currents and back-EMF voltages at up to 1 MSPS, eliminating an external ADC chip. With 101 user I/Os in the 144-EQFP package, the device can directly drive gate drivers, read encoder/Hall sensors, and interface to industrial CAN or RS-485 buses. The industrial -40°C to +100°C temperature grade ensures reliable operation in factory cabinets.
おすすめ
Factory Automation I/O Expansion
In factory automation systems, the 10M08SAE144I7G serves as a high-density I/O expander bridging PLCs to sensors, actuators, and field-bus networks. The 101 user I/Os can be configured as LVCMOS 3.3V/2.5V/1.8V or LVDS pairs, allowing direct connection to encoders, opto-isolated inputs, and 24V industrial drivers via external level shifters. With 387 Kb of embedded SRAM, the device buffers incoming sensor streams before forwarding aggregated data over EtherCAT, PROFINET, or Modbus TCP interfaces. The non-volatile dual-configuration flash supports remote firmware updates and instant-on operation, critical for production lines that cannot tolerate FPGA boot delays.
おすすめ
Portable Instrumentation
Handheld test and measurement instruments leverage the 10M08SAE144I7G for signal conditioning, real-time DSP, and display driving in a single low-cost chip. The 8K LE fabric implements FIR/IIR filters, FFT pre-processing, and custom waveform synthesis with deterministic latency. With 1540 Kbits of internal flash, calibration coefficients and instrument firmware remain resident across power cycles - ideal for instant-on multimeters, oscilloscopes, and portable logic analyzers. The 144-EQFP package is hand-solderable for prototype runs, while the integrated 12-bit ADC digitizes analog inputs without a separate converter IC, saving BOM and board space.
おすすめ
Sensor Aggregation Hub
IoT edge nodes and sensor aggregation hubs use the 10M08SAE144I7G to consolidate multiple sensor interfaces (SPI, I2C, UART, analog) into a single processed data stream. The integrated 12-bit SAR ADC with up to 17 analog channels eliminates external ADC chips for temperature, pressure, and gas sensor arrays. With 8,000 logic elements, the device can run a Nios II soft-core processor for local decision making, freeing upstream MCUs from interrupt storms. The 1540 Kb of on-chip user flash stores sensor calibration tables and configuration, and the 144-EQFP industrial-grade package operates reliably in outdoor enclosures.
おすすめ
Low-Cost Video Processing Bridge
Video format conversion, scaling, and bridging tasks in low-cost industrial cameras, kiosks, and digital signage use the 10M08SAE144I7G's LVDS-capable I/O banks and 18x18 multipliers. Up to 1.25 Gbps LVDS pairs support direct connection to image sensors, HDMI level shifters, and LCD panels without external serializer/deserializer chips. The 8K LE fabric handles color space conversion, deinterlacing, and timing generation in real time at common resolutions up to 720p60. The 144-EQFP exposed-pad package provides adequate thermal dissipation for continuous video processing workloads in compact, fanless enclosures.
おすすめ
Consumer Electronics Custom Logic
Consumer appliances, gaming peripherals, and educational electronics use the 10M08SAE144I7G as a cost-effective platform for custom logic, peripheral interfacing, and LED control. The Nios II soft-core support allows the FPGA to replace a small microcontroller plus external glue logic, reducing BOM by 30-50%. With 101 user I/Os, the device can drive LED matrices, scan keypads, and interface USB/UART peripherals. The non-volatile instant-on architecture boots in microseconds - critical for toys, appliances, and remote controls where user-perceived latency matters. RoHS compliance ensures compatibility with global consumer product regulations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M08SAE144I7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M08SCE144I7G | 10M08SAE144C8G | 10M08SCE144C8G | 10M08SAU144I7G | 10M08SCU144I7G |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Total RAM (Kb) | 378 | 378 | 378 | 378 | 378 | 378 |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 |
| Operating Temperature (TJ) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) |
| Supply Voltage | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V |
| Integrated Flash (Kb) | 1540 | 1540 | 1540 | 1540 | 1540 | 1540 |
| Integrated ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
主な差別化要因
- Industrial temperature grade (-40°C to +100°C TJ) for factory-floor reliability （vs 10M08SCE144I7G)
- I7 speed grade for higher internal clock frequencies vs C8 （vs 10M08SAE144C8G)
- On-chip dual-configuration flash eliminates external boot PROM （vs Lattice iCE40-HX8K-CB132)
設計ノート
Estimated: At 3.3V VCC and 50% toggle rate with 75% I/O utilization, the 10M08SAE144I7G core power is roughly 200-300 mW. The 144-EQFP exposed pad provides theta_JA of approximately 25-30 C/W with a properly soldered thermal pad connected to a 1+ square inch ground copper pour. Without the exposed pad soldered, junction temperature can exceed 100°C in industrial enclosures. Solder the EP to ground - never leave it floating - and provide at least 8 thermal vias in the EP pad to inner ground planes for heat extraction.
Decouple each VCC pin with a 0.1µF X7R ceramic capacitor placed within 5mm of the pin. Add one bulk 10µF X5R capacitor per VCCIO bank. Group VCCIO pins by bank voltage on the PCB; do not mix 3.3V and 1.8V I/O standards on the same bank. Use Quartus Prime's Early Power Estimator (EPE) before layout to size the regulator and confirm thermal headroom under worst-case toggle conditions.
Three common pitfalls with the 10M08SAE144I7G: (1) Forgetting to solder the exposed pad causes thermal runaway and unreliable JTAG - always solder the EP to a continuous ground pour with 8+ vias. (2) Driving a VCCIO bank above its rated voltage (e.g., 3.3V on a 1.8V bank) permanently damages the I/O - check the Quartus pin planner assignments before bitstream generation. (3) Routing LVDS pairs without 100Ω differential impedance and length matching fails signal-integrity compliance - use the MAX 10 LVDS SERDES guidelines for any LVDS link above 500 Mbps.
Route JTAG (TCK, TMS, TDI, TDO) traces with 50Ω single-ended impedance and keep them under 100mm total length. Place a 10kΩ pull-up on TCK, TMS, TDI to VCCIO and a 10kΩ pull-up on nCONFIG. Add a 4.7kΩ pull-up on nCE if not actively driven. Keep JTAG traces away from switching power inductors and clock lines. Reserve a 4-pin header (or Tag-Connect footprint) for in-system programming access during development.
コンプライアンス情報
RoHS compliant per Intel product page. Halogen-free per JEDEC JS709. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. For automotive, consult Intel MAX 10 automotive-grade variants.