A3P600L-FG484I - ProASIC3L Flash FPGA 600K Gates | Microchip
部品番号: A3P600L-FG484I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.4 | $624.00 |
| 100 | $55.9 | $5,590.00 |
| 500 | $50.2 | $25,100.00 |
| 1,000 | $45.6 | $45,600.00 |
A3P600L-FG484I 概要
A flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration ROM. Because the fabric is inherently nonvolatile and single-chip, ProASIC3L devices are Instant On at power-up, resist configuration readback attacks, and require no boot PROM - a significant advantage over SRAM FPGAs in the voltage regulator / programmable logic hierarchy for cost-sensitive, secure, and space-constrained systems.
Key features include a 1.2 V to 1.5 V core voltage (the L variant targets lowest static and dynamic power), reprogrammable flash fabric, and support for soft ARM cores on the ProASIC3 platform. The device also provides embedded block SRAM, abundant user I/O with flexible standards, and dramatic dynamic and static power savings versus earlier generations as documented in the manufacturer datasheet.
Technically, the A3P600L is fabricated on a 130 nm flash process. The VersaTile-based architecture allows each tile to act as logic, combinational cell, or embedded memory, giving high utilization without routing penalties. The industrial-grade I suffix supports extended temperature operation typical of factory and communications environments.
Typical applications include industrial automation controllers, communications line cards, portable and battery-powered instrumentation, and secure single-chip glueless system logic where instant-on behavior is mandatory.
Design consideration: budget the 1.2 V core rail carefully - the L-series trades peak fabric speed for static power reduction, so timing-critical paths should be verified with Microchip Libero timing analysis.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3P600L-FG484I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P600L-FG484I （同一形状・フットプリント） — 相違点: Package, Technology, Family, Configuration, Core Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
A3P600L-FGG484I
✅ ドロップイン✓ 在庫あり
$41.35 / 個
データシートを見る →A3P600L-1FGG484I
✅ ドロップイン✓ 在庫あり
$17.1 / 個
データシートを見る →A3P600L-1FG484
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$58.9 / 個
データシートを見る →A3P600L-FG484
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$85.9 / 個
データシートを見る →A3P600L-1FGG484I
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$17.1 / 個
データシートを見る →A3P600L-FG484I 最大定格＆電気的特性
| Family | ProASIC3L |
| System Gates | 600000 |
| Logic Cells | 13824 |
| User I/O | 235 |
| Core Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm flash CMOS |
| パッケージ | 484-ball FBGA (FG484) |
| Package Dimensions | 23 x 23 mm, 1.0 mm ball pitch |
| Package Height | 2.23 mm |
| 実装タイプ | Surface Mount |
| Configuration Memory | Nonvolatile flash, single-chip, Instant On |
| Temperature Grade | I (Industrial) |
| Reprogrammability | Yes, in-system reprogrammable flash fabric |
A3P600L-FG484I 2.23 mm ピン配置ガイド
A3P600L-FG484I (2.23 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3P600L-FG484I.
詳細は データシート をご参照ください。
主な用途
A3P600L-FG484I の用途: 6 件s: Industrial Automation Controllers, Secure Single-Chip System Logic, Portable and Battery-Powered Instruments, Communications Line Cards, Aerospace and Defense Prototyping, Medical Diagnostic Equipment.
Industrial Automation Controllers
The A3P600L-FG484I fits industrial automation controllers where deterministic, instant-on logic must be available the moment 24 V backplane power appears. Its nonvolatile flash fabric eliminates boot time and configuration storage failure modes common in SRAM FPGAs, while the industrial I temperature rating supports control-cabinet thermal envelopes. The 235 user I/O absorb the mixed-voltage sensor, encoder, and actuator interfaces typical of PLC and motion-control cards, and the L-series 1.2 V to 1.5 V core lowers continuous dissipation in always-on monitoring logic. Because configuration is flash-based and readback-protected, proprietary motion profiles and control algorithms remain secure on the factory floor.
おすすめ
Secure Single-Chip System Logic
Security-conscious designs use the A3P600L-FG484I as a single-chip replacement for FPGA-plus-boot-PROM pairs. SRAM FPGAs expose a vulnerable window between power-up and configuration load during which bitstream interception attacks are possible; the ProASIC3L flash fabric is nonvolatile and does not stream a bitstream at startup, closing that window entirely per the Microchip ProASIC3 datasheet. The 600K-gate density accommodates interface bridging, cryptographic wrappers, and anti-tamper state machines together on one die, and the 484-FBGA package keeps the secure footprint compact at 23 x 23 mm for defense and networking hardware requiring supply-chain traceability.
おすすめ
Portable and Battery-Powered Instruments
Portable instrumentation benefits directly from the L-series static power reduction that Microchip describes as dramatic dynamic and static power savings. The A3P600L-FG484I holds configuration through power cycling, so field instruments resume measurement logic instantly when the operator presses power - no boot sequence delays. The 1.2 V to 1.5 V core allows designers to trade performance for power by selecting the lowest legal core voltage, extending battery runtime in handheld spectrum analyzers, environmental monitors, and medical diagnostic probes. The 235 I/O support display, touch, and sensor-bank interfaces without external expansion logic on a two-chip board.
おすすめ
Communications Line Cards
Telecom and datacom line cards use the A3P600L-FG484I for framing, glueless bus bridging, and backplane interface logic. The 600K-gate fabric with 13,824 logic cells implements multiple protocol engines, while the 484-ball FBGA provides the ball count needed for wide parallel backplanes at 1.0 mm pitch, easing routing on standard 8-layer cards. Instant-on configuration lets a line card enumerate on the backplane as soon as power is stable - required by carrier-grade hot-swap sequencing. The industrial rating covers outside-plant equipment, and flash retention eliminates the field-failure mode of corrupted external boot flash in remote installations.
おすすめ
Aerospace and Defense Prototyping
The ProASIC3 family has a long heritage in aerospace and defense program prototyping, and the A3P600L-FG484I serves as a low-power development vehicle for flash-FPGA designs before radiation-hardened migration. Nonvolatile configuration survives the power interruptions frequent on test benches, readback-protected flash protects algorithm IP during the demonstration phase, and the 235 I/O support rapid instrumentation payload integration. Libero SoC design projects port directly across ProASIC3 density and package grades, so a prototype validated on the 600K device scales to A3P1000 derivatives without HDL rework - reducing program risk and schedule on fixed-budget defense development contracts.
おすすめ
Medical Diagnostic Equipment
Benchtop medical diagnostic equipment, including clinical analyzers and imaging front ends, uses the A3P600L-FG484I for sensor-timing generation, data-path buffering, and safety interlock logic. The instant-on flash fabric guarantees that safety interlocks assert before any measurement cycle can start, supporting IEC-driven design reviews, while the low L-series static power keeps enclosure fanless and quiet in clinical settings. The 235 user I/O integrate analog-front-end control buses, motor drivers, and host interfaces on one programmable device, and the 484-FBGA industrial-grade ballout supports long-lifecycle designs where medical platforms demand 7-10 year component availability from the Microchip FPGA product line.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P600L-FG484I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P600L-FGG484I | A3P600L-1FGG484I | A3P600L-1FG484 | A3P600L-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 235 | 235 | 235 | 235 | 235 |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | Standard |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Configuration Memory | Nonvolatile flash, Instant On | Nonvolatile flash, Instant On | Nonvolatile flash, Instant On | Nonvolatile flash, Instant On | Nonvolatile flash, Instant On |
主な差別化要因
- Lowest-power L-series core （vs A3P600-FG484 (standard ProASIC3))
- Identical cost-free timing upgrade path （vs A3P600L-1FGG484I)
- Lead-free ball option without redesign （vs A3P600L-FGG484I)
設計ノート
Estimated: the core rail current of a 600K-gate ProASIC3L depends heavily on toggle rate; at the 1.2 V minimum core setting static power is minimized but timing margin shrinks. Regulate the 1.2 V to 1.5 V core with a wide-adjustable buck such as the TPS548B28 and use the Libero SmartPower estimator on your final routed netlist - not early synthesis estimates - to size the core converter. Never exceed the datasheet maximum core voltage; L-series devices are binned for low static power and the margin budget is tighter than standard ProASIC3 parts.
The 484-ball FBGA uses a 1.0 mm ball pitch on a 23 x 23 mm body, which routes comfortably with via-in-pad on a 0.8 mm drill grid. Plan at least one full internal layer for the 1.2 V core plane plus a second solid ground plane adjacent to it; the FG484 power and ground balls are distributed across the array, so a segmented power plane degrades I/O signal integrity. Decouple each VCC bank ball cluster with 0.1 uF ceramics placed within 2 mm of the via, and bulk-decouple the core with at least 47 uF near the regulator.
Two frequent mistakes: (1) substituting A3P600 (no L) footprints - core supply expectations differ between standard and L variants, so always confirm the exact ordering code before artwork release; (2) ignoring speed grade in early timing closure - designs that pass at the -1 grade may fail at the standard grade, so run Libero static timing analysis at the purchased speed grade, not the fastest family member. Also verify ball assignments with the Libero I/O constraint report before layout, as I/O bank rules restrict which 484 balls support which voltage standards.
コンプライアンス情報
Compliance data was not present in the provided web data. The FGG484 suffix generally denotes lead-free ball metallurgy within the Microchip ProASIC3 family; confirm RoHS/REACH certificates on the Microchip product page before procurement.